CN116259637A - Packaging structure for image sensor - Google Patents

Abstract

The invention discloses a packaging structure for an image sensor, which comprises a chip, wherein the chip is adhered to the upper surface of a carrier plate, the chip is connected with the carrier plate through a metal lead, retaining walls are vertically arranged around the carrier plate, an included angle area of a contact surface between the lower end of each retaining wall and the bottom of the carrier plate is a sealing part, and a cover plate is covered on each retaining wall; and a procedure is added on the basis of common PLCC packaging, namely four sealing parts are added in the contact included angle area between the retaining wall and the bottom of the carrier plate, and the joints among the parts are sealed by filling adhesive and solidifying, so that the air tightness of the common PLCC packaging product is improved.

Description

A packaging structure for an image sensor

technical field

The invention relates to a packaging structure for an image sensor, which belongs to the technical field of semiconductors.

Background technique

Image sensors are often used in image imaging, such as photography and videography, which use the photoelectric conversion function of photoelectric devices to convert the light image on the photosensitive surface into electrical signals that are proportional to the light image.

In the terminal environment, prevent water vapor from entering the product, which will cause corrosion to the gold wire soldering point and reduce the service life of the product. Ordinary PLCC products do not have high air tightness. Since the adhesive glue between the retaining wall and the substrate is not air-tight, during the use of the product, water vapor will enter the product from the bonding point between the retaining wall and the substrate, causing corrosion to the bonding point. . A new packaging form is invented to improve the airtightness of ordinary PLCC products after packaging and increase the service life of the products.

Contents of the invention

The invention provides a packaging structure for an image sensor to overcome the defects in the prior art that the image sensor has low airtightness and is easy to corrode the bonding point.

In order to solve the problems of the technologies described above, the present invention provides the following technical solutions:

The invention discloses a packaging structure for an image sensor, which includes a chip, the chip is pasted on the upper surface of a carrier, the chip and the carrier are connected through metal leads, and barriers are vertically arranged around the carrier The wall, the angled area between the lower end of the retaining wall and the contact surface of the bottom of the carrier plate is a sealing part, and the retaining wall is covered with a cover plate.

Further, the cover plate is made of glass and has good light transmission.

Further, the inside of the sealing part is filled with an adhesive, which is used to seal the joints between the components to increase the airtightness.

Further, one end of the metal lead is soldered on the carrier board, and the other end is soldered to the chip, so that the chip communicates with the circuit on the carrier board.

Further, the dimensions of the carrier plate and the cover plate match each other.

Further, the retaining wall is adhered to the cover plate through the adhesive on its upper surface, and the two are completely sealed.

The beneficial effects achieved by the present invention are: on the basis of ordinary PLCC packaging, a process is added, that is, four sealing parts are added in the contact angle area between the retaining wall and the bottom of the carrier board, and the bonding agent is filled and cured to seal the components. The joints between them are closed, which improves the airtightness of ordinary PLCC packaged products.

Description of drawings

The accompanying drawings are used to provide a further understanding of the present invention, and constitute a part of the description, and are used together with the embodiments of the present invention to explain the present invention, and do not constitute a limitation to the present invention. In the attached picture:

Fig. 1 is the overall schematic diagram of the present invention;

Fig. 2 is a schematic cross-sectional view of the present invention.

In the figure: 1. carrier board; 2. retaining wall; 3. cover plate; 4. chip; 5. metal lead; 6. sealing part.

Detailed ways

The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

Example 1

As shown in Figure 1-2, a packaging structure for image sensors includes a chip 4, the chip 4 is pasted on the upper surface of the carrier 1, the chip 4 is connected to the carrier 1 through a metal lead 5, the A retaining wall 2 is vertically arranged around the carrier board 1 , the angled area between the lower end of the retaining wall 2 and the bottom contact surface of the carrier board 1 is a sealing portion 6 , and the retaining wall 2 is covered with a cover plate 3 .

The cover plate 3 is made of glass and has good light transmission.

The sealing portion 6 is filled with an adhesive, which is used to seal the joints between the components to increase the airtightness.

One end of the metal lead 5 is welded on the carrier 1 , and the other end is welded to the chip 4 , so that the chip 4 communicates with the circuit on the carrier 1 .

The sizes of the carrier board 1 and the cover board 3 match each other.

The chip 4 is placed on the carrier 1 , the bottom is coated with an adhesive, and the circuit of the chip 4 and the carrier 1 is connected by a metal lead 5 . Adhesive is applied to the sealing portion 6 at the bottom of the four sides of the retaining wall 2 , and the adhesive is cured to completely seal the retaining wall 2 and the carrier plate 1 . Adhesive is applied to the upper surface of the retaining wall 2, and the cover plate 3 made of glass is placed on the retaining wall 2, and the cover plate 3 and the retaining wall 2 are completely sealed.

Finally, it should be noted that: the above is only a preferred embodiment of the present invention, and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, it still The technical solutions recorded in the foregoing embodiments may be modified, or some technical features thereof may be equivalently replaced. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims (6)

1. A packaging structure for an image sensor, characterized in that it includes a chip, the chip is pasted on the upper surface of the carrier, the chip and the carrier are connected by metal leads, and the surrounding of the carrier is vertically arranged There is a retaining wall, the angled area between the lower end of the retaining wall and the contact surface of the bottom of the carrier plate is a sealing part, and the retaining wall is covered with a cover plate. 2 . The packaging structure for an image sensor according to claim 1 , wherein the cover plate is made of glass and has good light transmittance. 3 . 3. The packaging structure for an image sensor according to claim 1, wherein the sealing part is filled with an adhesive, which is used to seal the joints between the components and increase the airtightness . 4 . The packaging structure for an image sensor according to claim 1 , wherein one end of the metal lead is welded on the carrier board, and the other end is soldered to the chip, so that the chip communicates with the circuit on the carrier board. 5 . The package structure for an image sensor according to claim 1 , wherein the dimensions of the carrier plate and the cover plate match each other. 6 . 6 . The packaging structure for an image sensor according to claim 1 , wherein the retaining wall is adhered to the cover plate through an adhesive on its upper surface, and the two are completely sealed. 7 .

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