CN115903300B - Backlight plate and manufacturing method thereof - Google Patents
Backlight plate and manufacturing method thereof Download PDFInfo
- Publication number
- CN115903300B CN115903300B CN202110947878.6A CN202110947878A CN115903300B CN 115903300 B CN115903300 B CN 115903300B CN 202110947878 A CN202110947878 A CN 202110947878A CN 115903300 B CN115903300 B CN 115903300B
- Authority
- CN
- China
- Prior art keywords
- circuit substrate
- transparent film
- backlight
- solder mask
- connection pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 229910000679 solder Inorganic materials 0.000 claims abstract description 54
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 238000005538 encapsulation Methods 0.000 claims abstract description 16
- 239000003292 glue Substances 0.000 claims abstract description 8
- 238000005253 cladding Methods 0.000 claims abstract description 3
- 230000005611 electricity Effects 0.000 claims abstract description 3
- 238000004806 packaging method and process Methods 0.000 claims description 8
- 239000002120 nanofilm Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- -1 polyethylene terephthalate Polymers 0.000 claims description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 4
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 238000002834 transmittance Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 54
- 239000010408 film Substances 0.000 description 22
- 239000000463 material Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000002310 reflectometry Methods 0.000 description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- MPDDTAJMJCESGV-CTUHWIOQSA-M (3r,5r)-7-[2-(4-fluorophenyl)-5-[methyl-[(1r)-1-phenylethyl]carbamoyl]-4-propan-2-ylpyrazol-3-yl]-3,5-dihydroxyheptanoate Chemical compound C1([C@@H](C)N(C)C(=O)C2=NN(C(CC[C@@H](O)C[C@@H](O)CC([O-])=O)=C2C(C)C)C=2C=CC(F)=CC=2)=CC=CC=C1 MPDDTAJMJCESGV-CTUHWIOQSA-M 0.000 description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000001579 optical reflectometry Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Planar Illumination Modules (AREA)
Abstract
The utility model provides a backlight plate, includes circuit board, encapsulation glue and at least one light emitting component, the circuit board include circuit substrate with set up in circuit substrate's solder mask, circuit substrate includes the connection pad, the solder mask corresponds the connection pad is equipped with the windowing in order to expose the connection pad, light emitting component corresponds the windowing set up and with the connection pad electricity is connected, backlight plate still includes the transparent film, the transparent film cladding and bond in the solder mask deviate from circuit substrate's surface and the inner wall of windowing, encapsulation glue covers the transparent film and encapsulation light emitting component. The backlight panel can avoid the Mura phenomenon. The application also provides a manufacturing method of the backlight plate.
Description
Technical Field
The application relates to a backlight plate and a manufacturing method thereof.
Background
In the field of Light Emitting Diode (LED) backlight plates, as the sub-millimeter light emitting diode (Mini LED) and the micron light emitting diode (mircoLED) are raised, the LED is smaller in size and larger in number, and the same drive the solder mask window in the backlight plate is smaller and smaller in distance, the cover film, white thermosetting ink and other non-developing solder mask used by the conventional solder mask layer cannot meet the current solder mask small window (< 500 um), so that the white developing solder mask material is required. In the prior art, substances such as a photoinitiator and a curing agent containing P, S, N are usually added into a white development type anti-welding material, and when the LED packaging adhesive is arranged, the substances often cause incomplete curing of the LED packaging adhesive, so that LED luminescence is uneven, and finally, the phenomenon of uneven brightness of a display, namely Mura phenomenon, is generated.
Disclosure of Invention
In view of this, it is necessary to provide a backlight plate capable of avoiding the Mura phenomenon.
Also provided is a method for manufacturing a backlight panel capable of avoiding the Mura phenomenon.
The utility model provides a backlight plate, includes circuit board, encapsulation glue and at least one light emitting component, the circuit board include circuit substrate with set up in circuit substrate's solder mask, circuit substrate includes the connection pad, the solder mask corresponds the connection pad is equipped with the windowing in order to expose the connection pad, light emitting component corresponds the windowing set up and with the connection pad electricity is connected, backlight plate still includes the transparent film, the transparent film cladding and bond in the solder mask deviate from circuit substrate's surface and the inner wall of windowing, encapsulation glue covers the transparent film and encapsulation light emitting component.
A method for manufacturing a backlight plate comprises the following steps:
providing a circuit substrate, wherein the circuit substrate comprises a connecting pad;
A solder mask layer is arranged on the circuit substrate, and a window is arranged on the solder mask layer corresponding to the connecting pad so as to expose the connecting pad;
The transparent film is coated and adhered on the surface of the solder mask layer, which is away from the circuit substrate, and the inner wall of the window so as to form an opening corresponding to the window; and
And arranging a light-emitting element corresponding to the opening to be electrically connected with the connecting pad, and covering the transparent film through packaging glue and packaging the light-emitting element.
According to the backlight plate and the manufacturing method thereof, the transparent film can isolate the solder mask layer from the packaging adhesive on the premise of not affecting the reflectivity of the solder mask layer, so that incomplete curing of the packaging adhesive due to the problem of the solder mask layer material is avoided, and the Mura phenomenon is avoided.
Drawings
Fig. 1 is a schematic cross-sectional view of a backlight plate according to an embodiment of the present application.
Fig. 2 is a schematic cross-sectional view of a circuit substrate according to an embodiment of the present application.
Fig. 3 is a schematic cross-sectional view of a solder mask layer formed on the circuit substrate shown in fig. 2.
Fig. 4 is a schematic cross-sectional view of a transparent film provided on the solder mask layer shown in fig. 3.
Description of the main reference signs
The application will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
Some embodiments of the present application are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.
Referring to fig. 1, a backlight board 100 according to an embodiment of the application includes a circuit board 10, a transparent film 30, an encapsulation compound 50 and at least one light emitting device 70. The circuit board 10 includes a circuit substrate 11 and a solder resist layer 13 provided on the circuit substrate 11. The circuit substrate 11 includes a connection pad 110, and the solder mask layer 13 is provided with a window 130 corresponding to the connection pad 110 to expose the connection pad 110. The light emitting element 70 is disposed corresponding to the window 130 and electrically connected to the connection pad 110. The transparent film 30 is coated on and adhered to the surface of the solder mask layer 13 facing away from the circuit substrate 11 and the inner wall of the window 130. The encapsulation compound 50 covers the transparent film 30 and encapsulates the light emitting element 70.
The transparent film 30 can also isolate the solder mask layer 13 from the encapsulation adhesive 50 without affecting the reflectivity of the solder mask layer 13, so as to avoid incomplete curing of the encapsulation adhesive 50 due to the problem of the material of the solder mask layer 13, and further avoid Mura phenomenon.
The circuit substrate 11 may be a single-layer circuit substrate, a double-layer circuit substrate, or a multi-layer circuit substrate. In the present embodiment, the circuit board 11 is described as a two-layer circuit board.
Specifically, the circuit substrate 11 includes a first wiring layer 111, a dielectric layer 113, and a second wiring layer 115, which are sequentially stacked. The first circuit layer 111 includes a connection pad 110. The solder mask layer 13 is bonded to a side of the dielectric layer 113 facing away from the second circuit layer 115 and covers the first circuit layer 111. The connection pad 110 is exposed from the window 130 of the solder mask layer 13.
In some embodiments, the width of the window 130 may gradually increase from a side facing away from the dielectric layer 113 toward a side near the dielectric layer 113.
The solder mask layer 13 may be formed by, but not limited to, applying a white developing solder mask ink and baking and curing. The white developing solder resist ink includes a solder resist ink and a light diffusing material (such as titanium dioxide particles or barium titanate particles) mixed in the solder resist ink. The light diffusion material is used for increasing the light reflectivity of the white development solder resist ink.
Preferably, the transmittance of the transparent film 30 is greater than or equal to 95.8%, thereby further reducing the influence on the reflectivity of the backlight. In some embodiments, the transparent film 30 may be, but is not limited to, a polyimide film, a polyethylene terephthalate film, or a surface low reflection nanofilm (SLR nanofilm).
The transparent film 30 forms an opening 31 corresponding to the window 130. In some embodiments, the openings 31 are uniform in width at different depths. When the width of the window 130 may gradually increase from the side facing away from the dielectric layer 113 toward the side near the dielectric layer 113, and the widths of the openings 31 at different depths are uniform, the adhesion of the transparent film 30 on the solder mask layer 13 may be effectively increased.
Preferably, the light emitting element 70 does not protrude beyond the opening 31 in the depth direction of the opening 31. More preferably, the light emitting element 70 does not protrude beyond the window 130 in the depth direction of the window 130.
The light emitting element 70 may be, but is not limited to, an LED.
Referring to fig. 1 to 4, a method for manufacturing a backlight plate according to an embodiment of the application includes the following steps:
In step S1, referring to fig. 2, a circuit substrate 11 is provided. The circuit substrate 11 includes connection pads 110.
The circuit substrate 11 may be a single-layer circuit substrate, a double-layer circuit substrate, or a multi-layer circuit substrate. In the present embodiment, the circuit board 11 is described as a two-layer circuit board.
Specifically, the circuit substrate 11 includes a first wiring layer 111, a dielectric layer 113, and a second wiring layer 115, which are sequentially stacked. The first circuit layer 111 includes a connection pad 110.
In step S2, referring to fig. 3, a solder mask layer 13 is disposed on the circuit substrate 11, and a window 130 is provided on the solder mask layer 13 corresponding to the connection pad 110 to expose the connection pad 110, so as to obtain the circuit board 10.
In this embodiment, the solder mask layer 13 is bonded to a side of the dielectric layer 113 facing away from the second circuit layer 115 and covers the first circuit layer 111. The connection pad 110 is exposed from the window 130 of the solder mask layer 13.
In some embodiments, the width of the window 130 may gradually increase from a side facing away from the dielectric layer 113 toward a side near the dielectric layer 113.
The solder mask layer 13 may be formed by, but not limited to, applying a white developing solder mask ink and baking and curing. The white developing solder resist ink includes a solder resist ink and a light diffusing material (such as titanium dioxide particles or barium titanate particles) mixed in the solder resist ink. The light diffusion material is used for increasing the light reflectivity of the white development solder resist ink.
In step S3, referring to fig. 4, a transparent film 30 is disposed to cover and adhere to the surface of the solder mask layer 13 facing away from the circuit substrate 11 and the inner wall of the window 130, so as to form an opening 31 corresponding to the window 130.
Preferably, the transmittance of the transparent film 30 is greater than or equal to 95.8%, thereby further reducing the influence on the reflectivity of the backlight. In some embodiments, the transparent film 30 may be, but is not limited to, a polyimide film, a polyethylene terephthalate film, or a surface low reflection nanofilm (SLR nanofilm).
In some embodiments, the openings 31 are uniform in width at different depths.
In step S4, referring to fig. 1, a light emitting device 70 is disposed corresponding to the opening 31 to electrically connect with the connection pad 110, and the transparent film 30 is covered by the encapsulation compound 50 to encapsulate the light emitting device 70.
Preferably, the light emitting element 70 does not protrude beyond the opening 31 in the depth direction of the opening 31. More preferably, the light emitting element 70 does not protrude beyond the window 130 in the depth direction of the window 130.
The light emitting element 70 may be, but is not limited to, an LED.
In the backlight plate and the manufacturing method thereof, the transparent film 30 can isolate the solder mask layer 13 from the encapsulation adhesive 50 on the premise of not affecting the reflectivity of the solder mask layer 13, so that incomplete curing of the encapsulation adhesive 50 due to the problem of the material of the solder mask layer 13 is avoided, and further, the Mura phenomenon is avoided.
The present application is not limited to the above-mentioned embodiments, but is capable of other and obvious modifications and equivalents of the above-mentioned embodiments, which will be apparent to those skilled in the art from consideration of the present application without departing from the scope of the present application.
Claims (10)
1. The utility model provides a backlight, includes circuit board, encapsulation glue and at least one light emitting component, the circuit board include circuit substrate with set up in circuit substrate's solder mask, circuit substrate includes the connection pad, the solder mask corresponds the connection pad is equipped with the windowing in order to expose the connection pad, light emitting component corresponds the windowing set up and with the connection pad electricity is connected, its characterized in that, backlight still includes the transparent film, the transparent film cladding and bond in the surface of solder mask deviating from circuit substrate and the inner wall of windowing, encapsulation glue covers the transparent film and encapsulation light emitting component.
2. The backlight of claim 1, wherein the transparent film has a light transmittance of greater than or equal to 95.8%.
3. The backlight of claim 2, wherein the transparent film is a polyimide film, a polyethylene terephthalate film, or an SLR nanofilm.
4. The backlight of claim 1, wherein the width of the window increases gradually from a side facing away from the circuit substrate toward a side closer to the circuit substrate.
5. The backlight of claim 4, wherein the transparent film forms openings corresponding to the fenestrations, the openings having uniform widths at different depths.
6. A method for manufacturing a backlight plate comprises the following steps:
providing a circuit substrate, wherein the circuit substrate comprises a connecting pad;
A solder mask layer is arranged on the circuit substrate, and a window is arranged on the solder mask layer corresponding to the connecting pad so as to expose the connecting pad;
The transparent film is coated and adhered on the surface of the solder mask layer, which is away from the circuit substrate, and the inner wall of the window so as to form an opening corresponding to the window; and
And arranging a light-emitting element corresponding to the opening to be electrically connected with the connecting pad, and covering the transparent film through packaging glue and packaging the light-emitting element.
7. The method of manufacturing a backlight of claim 6, wherein the transparent film has a light transmittance of 95.8% or more.
8. The method of manufacturing a backlight of claim 7, wherein the transparent film is a polyimide film, a polyethylene terephthalate film, or an SLR nanofilm.
9. The method of claim 6, wherein the width of the window increases gradually from a side facing away from the circuit substrate toward a side closer to the circuit substrate.
10. The method of manufacturing a backlight of claim 9, wherein the openings are uniform in width at different depths.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110947878.6A CN115903300B (en) | 2021-08-18 | 2021-08-18 | Backlight plate and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110947878.6A CN115903300B (en) | 2021-08-18 | 2021-08-18 | Backlight plate and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115903300A CN115903300A (en) | 2023-04-04 |
| CN115903300B true CN115903300B (en) | 2024-06-07 |
Family
ID=86473133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110947878.6A Active CN115903300B (en) | 2021-08-18 | 2021-08-18 | Backlight plate and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115903300B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119383845A (en) * | 2023-07-25 | 2025-01-28 | 鹏鼎控股(深圳)股份有限公司 | Circuit board processing technology, circuit board and battery module using the circuit board |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101772274A (en) * | 2009-01-04 | 2010-07-07 | 欣兴电子股份有限公司 | Surface electroplating method of circuit substrate |
| KR20130039808A (en) * | 2011-10-13 | 2013-04-23 | 엘지이노텍 주식회사 | Led package of indirect illumination and method of manufacturing thereof, and illuminator using the same |
| CN203941945U (en) * | 2014-06-27 | 2014-11-12 | 李桂华 | A kind of multilayer specular aluminium COB base plate for packaging |
| CN104202925A (en) * | 2014-06-19 | 2014-12-10 | 四川普瑞森电子有限公司 | Multi-layer circuit board manufacturing method |
| CN106816388A (en) * | 2015-12-02 | 2017-06-09 | 南茂科技股份有限公司 | Semiconductor package structure and manufacturing method thereof |
| CN107527928A (en) * | 2016-06-21 | 2017-12-29 | 胜丽国际股份有限公司 | Optical assembly packaging structure |
| JP2019095719A (en) * | 2017-11-28 | 2019-06-20 | 住友ベークライト株式会社 | Method for manufacturing wiring board and method for manufacturing semiconductor device |
| TW201931964A (en) * | 2017-12-18 | 2019-08-01 | 王忠寶 | A structure of a Printing Circuit Board and a carrier and methods of manufacturing semiconductor package |
| CN111211116A (en) * | 2018-11-21 | 2020-05-29 | 欣兴电子股份有限公司 | Light-emitting diode package and method of making the same |
| CN111326640A (en) * | 2018-12-13 | 2020-06-23 | 同泰电子科技股份有限公司 | Method for forming window on light-emitting diode carrier plate |
| CN111640848A (en) * | 2020-06-01 | 2020-09-08 | 江西兆驰光元科技股份有限公司 | LED display device, preparation method thereof, and display device |
| CN112314061A (en) * | 2019-05-30 | 2021-02-02 | 宏恒胜电子科技（淮安）有限公司 | Circuit board, preparation method and backlight plate |
| CN112490344A (en) * | 2019-09-11 | 2021-03-12 | 光宝光电(常州)有限公司 | Light emitting package structure, manufacturing method thereof and composite substrate |
| CN112992839A (en) * | 2021-02-05 | 2021-06-18 | 何雨桐 | Lead frame for chip packaging and preparation method |
-
2021
- 2021-08-18 CN CN202110947878.6A patent/CN115903300B/en active Active
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101772274A (en) * | 2009-01-04 | 2010-07-07 | 欣兴电子股份有限公司 | Surface electroplating method of circuit substrate |
| KR20130039808A (en) * | 2011-10-13 | 2013-04-23 | 엘지이노텍 주식회사 | Led package of indirect illumination and method of manufacturing thereof, and illuminator using the same |
| CN104202925A (en) * | 2014-06-19 | 2014-12-10 | 四川普瑞森电子有限公司 | Multi-layer circuit board manufacturing method |
| CN203941945U (en) * | 2014-06-27 | 2014-11-12 | 李桂华 | A kind of multilayer specular aluminium COB base plate for packaging |
| CN106816388A (en) * | 2015-12-02 | 2017-06-09 | 南茂科技股份有限公司 | Semiconductor package structure and manufacturing method thereof |
| CN107527928A (en) * | 2016-06-21 | 2017-12-29 | 胜丽国际股份有限公司 | Optical assembly packaging structure |
| JP2019095719A (en) * | 2017-11-28 | 2019-06-20 | 住友ベークライト株式会社 | Method for manufacturing wiring board and method for manufacturing semiconductor device |
| TW201931964A (en) * | 2017-12-18 | 2019-08-01 | 王忠寶 | A structure of a Printing Circuit Board and a carrier and methods of manufacturing semiconductor package |
| CN111211116A (en) * | 2018-11-21 | 2020-05-29 | 欣兴电子股份有限公司 | Light-emitting diode package and method of making the same |
| CN111326640A (en) * | 2018-12-13 | 2020-06-23 | 同泰电子科技股份有限公司 | Method for forming window on light-emitting diode carrier plate |
| CN112314061A (en) * | 2019-05-30 | 2021-02-02 | 宏恒胜电子科技（淮安）有限公司 | Circuit board, preparation method and backlight plate |
| CN112490344A (en) * | 2019-09-11 | 2021-03-12 | 光宝光电(常州)有限公司 | Light emitting package structure, manufacturing method thereof and composite substrate |
| CN111640848A (en) * | 2020-06-01 | 2020-09-08 | 江西兆驰光元科技股份有限公司 | LED display device, preparation method thereof, and display device |
| CN112992839A (en) * | 2021-02-05 | 2021-06-18 | 何雨桐 | Lead frame for chip packaging and preparation method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115903300A (en) | 2023-04-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20250271699A1 (en) | Backplane and method for manufacturing the same, and display device | |
| TWI704546B (en) | Display device and manufacturing method thereof | |
| US11600799B2 (en) | Display device | |
| CN103325776A (en) | Light emitting device | |
| CN118915352A (en) | Light emitting device and liquid crystal display device | |
| CN115903106B (en) | Reflective sheet, light-emitting substrate, and display device | |
| CN114460776B (en) | Display device and backlight module | |
| CN118476025A (en) | Packaging structure, display substrate, manufacturing method of display substrate and display device | |
| CN112987397B (en) | Driving backboard and display device | |
| CN114914266A (en) | Display panel, display device and preparation method of display panel | |
| CN115903300B (en) | Backlight plate and manufacturing method thereof | |
| KR20220131491A (en) | Display substrate, manufacturing method thereof, and display device | |
| CN114447183B (en) | Display Module | |
| CN108458280A (en) | Backlight assembly and its assemble method, display device | |
| US20250160075A1 (en) | Backlight module and manufacturing method therefor, and display apparatus | |
| CN113498293B (en) | Electronic device with a detachable cover | |
| JP2003344851A (en) | Liquid crystal display device | |
| TWI779558B (en) | Display device and manufacturing method of the same | |
| CN108614371A (en) | Display device and its manufacturing method | |
| TW202334576A (en) | Backlight module | |
| CN113133194B (en) | Circuit board, manufacturing method thereof and display screen | |
| CN114695621B (en) | Manufacturing method of display module and display module | |
| CN216648302U (en) | Backlight panel and display device | |
| CN114823779B (en) | Splicing display screen | |
| CN218350653U (en) | Backlight module and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant |