CN115506000A - Noble metal ion exchanger - Google Patents
Noble metal ion exchanger Download PDFInfo
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- CN115506000A CN115506000A CN202211298392.5A CN202211298392A CN115506000A CN 115506000 A CN115506000 A CN 115506000A CN 202211298392 A CN202211298392 A CN 202211298392A CN 115506000 A CN115506000 A CN 115506000A
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- 229910000510 noble metal Inorganic materials 0.000 title claims abstract description 34
- 238000009713 electroplating Methods 0.000 claims abstract description 41
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000003513 alkali Substances 0.000 claims abstract description 28
- 150000002500 ions Chemical class 0.000 claims abstract description 17
- 229910052709 silver Inorganic materials 0.000 claims abstract description 9
- 239000004332 silver Substances 0.000 claims abstract description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052737 gold Inorganic materials 0.000 claims abstract description 8
- 239000010931 gold Substances 0.000 claims abstract description 8
- 239000012528 membrane Substances 0.000 claims abstract description 6
- 150000001450 anions Chemical class 0.000 claims abstract description 5
- 239000000243 solution Substances 0.000 claims description 59
- 238000005868 electrolysis reaction Methods 0.000 claims description 17
- 239000012670 alkaline solution Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 5
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 4
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 claims description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 2
- 239000010970 precious metal Substances 0.000 abstract description 29
- 150000003839 salts Chemical class 0.000 abstract description 17
- 238000000034 method Methods 0.000 abstract description 7
- 229910021645 metal ion Inorganic materials 0.000 abstract description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 238000007747 plating Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 3
- 231100000331 toxic Toxicity 0.000 description 3
- 230000002588 toxic effect Effects 0.000 description 3
- 238000000576 coating method Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- HKSGQTYSSZOJOA-UHFFFAOYSA-N potassium argentocyanide Chemical compound [K+].[Ag+].N#[C-].N#[C-] HKSGQTYSSZOJOA-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- AKCNZSFBROVXTJ-UHFFFAOYSA-N [Au](C#N)(C#N)C#N.[K].[Au] Chemical compound [Au](C#N)(C#N)C#N.[K].[Au] AKCNZSFBROVXTJ-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 231100000481 chemical toxicant Toxicity 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 231100000572 poisoning Toxicity 0.000 description 1
- 230000000607 poisoning effect Effects 0.000 description 1
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- SDKPSXWGRWWLKR-UHFFFAOYSA-M sodium;9,10-dioxoanthracene-1-sulfonate Chemical compound [Na+].O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2S(=O)(=O)[O-] SDKPSXWGRWWLKR-UHFFFAOYSA-M 0.000 description 1
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
本发明涉及一种贵金属离子交换机。其特征在于：所述阳极室(1)与阴极室(2)之间设有阴离子电解膜(6)，所述阳极(4)电连接贵金属块(7)；所述阳极室(1)内盛装有氰化物溶液(8)，贵金属块(7)浸没于氰化物溶液(8)内，所述阴极室(2)内盛装有碱溶液(9)。本发明能够持续电解化合生成有氰贵金属盐，比如：电镀金用的主盐‑氰化金钾和电镀银用的主盐‑氰化银钾，该设备与电镀槽液连通形成循环电解，能够对电镀液中消耗的贵金属离子进行连续自动补加，使电镀液中的贵金属离子浓度达到所需最佳工艺范围，也解决了人工向电镀液中添加有氰贵金属盐易中毒，存在较大的人身安全隐患的问题，为电镀产品质量的稳定提供了有力的保障。
The invention relates to a noble metal ion exchanger. It is characterized in that: an anion electrolytic membrane (6) is provided between the anode chamber (1) and the cathode chamber (2), and the anode (4) is electrically connected to the noble metal block (7); the inside of the anode chamber (1) A cyanide solution (8) is contained, the precious metal block (7) is immersed in the cyanide solution (8), and an alkali solution (9) is contained in the cathode chamber (2). The present invention can continuously electrolytically combine to generate cyanide-noble metal salts, such as: main salt-potassium gold cyanide for electroplating gold and main salt-potassium silver cyanide for electroplating silver. Continuously and automatically replenish the precious metal ions consumed in the electroplating solution, so that the concentration of precious metal ions in the electroplating solution reaches the required optimum process range, and also solves the problem of manual addition of cyanide-precious metal salts to the electroplating solution, which is easy to be poisoned and has a large The problem of personal safety hazards provides a strong guarantee for the stability of the quality of electroplating products.
Description
技术领域technical field
本发明涉及一种电镀液中贵金属离子补偿装置，具体涉及一种贵金属离子交换机。The invention relates to a noble metal ion compensation device in an electroplating solution, in particular to a noble metal ion exchanger.
背景技术Background technique
电镀是利用电解原理在零部件表面上镀上一薄层其它金属或合金的过程，镀层附着在零部件表面起到防锈蚀、提高耐磨性、导电性及美化外观等作用。近年来，贵金属电镀广泛应用在电气与电子工业中，贵金属电镀对印刷电路板、芯片针脚、引线框架等电子元器件性能起关键作用，芯片的电极材料、集成线路板导线镀层、LED发光芯片等也都需要通过金、铂、银等贵金属电镀材料进行电镀工艺处理；其中镀金和镀银比较常见，镀金和镀银时常用的电镀液（槽液）为氰化金钾和氰化银钾，俗称“金盐”和“银盐”。目前，电镀液是将氰化贵金属盐按一定比例和氰化钾络合后加入到槽液中进行配制，在电镀过程中，随着贵金属离子的不断消耗，而阳极被电解对槽液贵金属盐的补充又不足，所以电镀液中贵金属盐的浓度也逐渐降低，电镀液中贵金属盐的浓度过低会影响电镀的速度和电镀层质量，因此，需要人工频繁添加氰化贵金属盐以使电镀液中贵金属离子的浓度保持在一定的范围内，以确保生产按正常电镀工艺运行。由于氰化贵金属盐为剧毒化学物品，毒性极强，人工向电镀液中添加氰化贵金属盐时，若操作、防范不当容易造成中毒，存在较大的人身安全隐患。Electroplating is the process of plating a thin layer of other metals or alloys on the surface of parts using the principle of electrolysis. The coating adheres to the surface of parts to prevent corrosion, improve wear resistance, conductivity and beautify the appearance. In recent years, precious metal electroplating has been widely used in the electrical and electronic industries. Precious metal electroplating plays a key role in the performance of electronic components such as printed circuit boards, chip pins, and lead frames. Chip electrode materials, integrated circuit board wire coatings, LED light-emitting chips, etc. Gold, platinum, silver and other precious metal plating materials are also required for electroplating process; among them, gold plating and silver plating are more common, and the commonly used electroplating solution (bath) for gold plating and silver plating is potassium gold cyanide and potassium silver cyanide. Commonly known as "gold salt" and "silver salt". At present, the electroplating solution is prepared by adding noble metal cyanide salt to the bath solution after complexing with potassium cyanide in a certain proportion. Therefore, the concentration of precious metal salts in the electroplating solution is also gradually reduced. If the concentration of precious metal salts in the electroplating solution is too low, it will affect the speed of electroplating and the quality of the electroplating layer. Therefore, it is necessary to manually add cyanide precious metal salts frequently to make the electroplating solution The concentration of precious metal ions in the medium is kept within a certain range to ensure that the production runs according to the normal electroplating process. Because cyanide noble metal salt is a highly toxic chemical, the toxicity is extremely strong. When manually adding cyanide noble metal salt to the electroplating solution, if the operation and prevention are improper, it is easy to cause poisoning, and there is a great personal safety hazard.
发明内容Contents of the invention
为了有氰贵金属电镀更加完善以及解决人工向电镀液中添加氰化贵金属盐易中毒，存在较大的人身安全隐患的问题。本发明提供了一种贵金属离子交换机，该贵金属离子交换机能够持续电解出贵金属离子，与电镀液槽连通，能够对电镀液中消耗的贵金属离子进行连续自动补偿，使电镀液槽中的贵金属离子浓度达到最佳范围，能够得到高质量的电镀产品，工作人员不用频繁接触剧毒的氰化贵金属盐，杜绝了人身安全隐患。In order to have more perfect cyanide-precious metal electroplating and to solve the problem that artificially adding cyanide-precious metal salts to the electroplating solution is easy to be poisoned, and there is a relatively large personal safety hazard. The present invention provides a noble metal ion exchanger, which can continuously electrolyze noble metal ions, communicate with the electroplating bath, and can continuously and automatically compensate the noble metal ions consumed in the electroplating bath, so that the concentration of noble metal ions in the electroplating bath To achieve the best range, high-quality electroplating products can be obtained, and the staff do not need to frequently contact highly toxic cyanide precious metal salts, which eliminates personal safety hazards.
本发明的技术方案是：一种贵金属离子交换机，包括阳极室、阴极室及直流电解电源，所述阳极室内设有与直流电解电源正极电连接的阳极，阴极室内设有与直流电解电源负极电连接的阴极，所述阳极室与阴极室之间设有阴离子电解膜，所述阳极为钛合金材质，阳极电连接贵金属块；所述阳极室内盛装有氰化物溶液，贵金属块浸没于氰化物溶液内，所述阴极室内盛装有碱溶液，所述阳极室侧壁上设有与电镀液槽相通的氰化物输送管；所述阴极室的下方设有盛装碱溶液的存储槽，所述阴极室与存储槽之间设有阴极室碱溶液输入管和碱溶液回流管，所述存储槽内设有与阴极室碱溶液输入管连通的循环泵，循环泵能够将存储槽内的碱溶液通过阴极室碱溶液输入管输送到阴极室内，阴极室内碱溶液达到一定高度能够通过碱溶液回流管回流到存储槽内。The technical solution of the present invention is: a noble metal ion exchange, including an anode chamber, a cathode chamber and a DC electrolysis power supply, the anode chamber is provided with an anode electrically connected to the positive pole of the DC electrolysis power supply, and the cathode chamber is provided with an anode connected to the negative pole of the DC electrolysis power supply. Connected cathode, an anion electrolytic membrane is provided between the anode chamber and the cathode chamber, the anode is made of titanium alloy, and the anode is electrically connected to the precious metal block; the anode chamber is filled with a cyanide solution, and the precious metal block is immersed in the cyanide solution Inside, the cathode chamber is filled with alkali solution, and the side wall of the anode chamber is provided with a cyanide delivery pipe communicating with the electroplating solution tank; the storage tank for containing the alkali solution is arranged below the cathode chamber, and the cathode chamber Cathode chamber alkali solution input pipe and alkali solution return pipe are provided between the storage tank, and the circulation pump connected with the cathode chamber alkali solution input pipe is arranged in the storage tank, and the circulation pump can pass the alkali solution in the storage tank through the cathode The alkali solution input pipe in the chamber is transported to the cathode chamber, and the alkali solution in the cathode chamber reaches a certain height and can be returned to the storage tank through the alkali solution return pipe.
所述阳极呈笼子状且其内放置贵金属块。The anode is in the shape of a cage and a precious metal block is placed inside it.
所述存储槽外壁设有液面计。The outer wall of the storage tank is provided with a liquid level gauge.
所述贵金属块为金或银。The precious metal block is gold or silver.
所述阳极室上设有阳极室氰化物输入管。The anode chamber is provided with an anode chamber cyanide input pipe.
所述氰化物溶液为氰化钾溶液。The cyanide solution is potassium cyanide solution.
所述碱溶液为氢氧化钾溶液。The alkaline solution is potassium hydroxide solution.
本发明具有如下有益效果：由于采取上述技术方案，工作时直流电解电源通电，阳极室与电镀槽液连通，调节电流的大小控制阳极室内固体贵金属的电解速度，本发明能够持续电解化合生成有氰贵金属盐，比如：电镀金用的主盐-氰化金钾和电镀银用的主盐-氰化银钾，该设备与电镀槽液连通形成循环电解，能够对电镀液中消耗的贵金属离子进行连续自动补加，使电镀液中的贵金属离子浓度达到所需最佳工艺范围，为电镀产品质量的稳定提供了有力的保障，工作人员不用频繁接触剧毒的氰化贵金属盐，杜绝了人身安全隐患。The present invention has the following beneficial effects: due to the adoption of the above technical scheme, the DC electrolysis power supply is energized during work, the anode chamber is connected to the electroplating bath, and the size of the current is adjusted to control the electrolysis speed of the solid noble metal in the anode chamber. Precious metal salts, such as: the main salt for gold electroplating - potassium gold cyanide and the main salt for silver electroplating - potassium silver cyanide. This equipment is connected with the electroplating bath to form a cyclic electrolysis, which can remove the precious metal ions consumed in the electroplating solution. Continuous automatic replenishment makes the concentration of precious metal ions in the electroplating solution reach the required optimum process range, which provides a strong guarantee for the stability of the quality of electroplating products, and the staff do not need to frequently contact highly toxic cyanide precious metal salts, which prevents personal safety Hidden danger.
附图说明Description of drawings
附图1是本发明的结构剖视图。Accompanying drawing 1 is a structural sectional view of the present invention.
附图2是图1的右视图。Accompanying drawing 2 is the right view of Fig. 1.
图中1-阳极室，2-阴极室，3-直流电解电源，4-阳极，5-阴极，6-阴离子电解膜，7-贵金属块，8-氰化物溶液，9-碱溶液，10-氰化物输送管，11-存储槽，12-阴极室碱溶液输入管，13-碱溶液回流管，14-循环泵，15-液面计，16-阳极室氰化物输入管。In the figure 1-anode chamber, 2-cathode chamber, 3-DC electrolysis power supply, 4-anode, 5-cathode, 6-anion electrolytic membrane, 7-noble metal block, 8-cyanide solution, 9-alkaline solution, 10- Cyanide delivery pipe, 11-storage tank, 12-cathode chamber alkali solution input pipe, 13-alkaline solution return pipe, 14-circulation pump, 15-liquid level gauge, 16-anode chamber cyanide input pipe.
具体实施方式detailed description
下面结合附图对本发明作进一步说明：The present invention will be further described below in conjunction with accompanying drawing:
由图1结合图2所示，一种贵金属离子交换机，包括阳极室1、阴极室2及直流电解电源3，所述阳极室1内设有与直流电解电源3正极电连接的阳极4，阴极室2内设有与直流电解电源3负极电连接的阴极5，所述阳极室1与阴极室2之间设有阴离子电解膜6，阴离子电解膜6能够阻隔贵金属阳离子，避免单质贵金属在阴极晰出，所述阳极4为钛合金材质，阳极4电连接贵金属块7；所述阳极室1内盛装有氰化物溶液8，贵金属块7浸没于氰化物溶液8内，所述阴极室2内盛装有碱溶液9，所述阳极室1侧壁上设有与电镀液槽相通的氰化物输送管10；所述阴极室2的下方设有盛装碱溶液9的存储槽11，所述阴极室2与存储槽11之间设有阴极室碱溶液输入管12和碱溶液回流管13，所述存储槽11内设有与阴极室碱溶液输入管12连通的循环泵14，循环泵14能够将存储槽11内的碱溶液9通过阴极室碱溶液输入管12输送到阴极室2内，阴极室2内碱溶液9达到一定高度能够通过碱溶液回流管13回流到存储槽11内。由于采取上述技术方案，工作时直流电解电源3通电，阳极室1内发生电解反应，贵金属块7逐渐融入氰化物溶液8内形成贵金属离子，在阳极室1内生成有氰贵金属溶液，阳极室1与电镀液槽连通，调节电流的大小控制阳极室1内固体贵金属的电解速度，阳极室1与电镀液槽连通，本发明能够持续电解化合生成有氰贵金属盐，比如：电镀金用的主盐-氰化金钾和电镀银用的主盐-氰化银钾，该设备与电镀槽液连通形成循环电解，能够对电镀液中消耗的贵金属离子进行连续自动补加，使电镀液中的贵金属离子浓度达到所需最佳工艺范围，为电镀产品质量的稳定提供了有力的保障，工作人员不用频繁接触剧毒的氰化贵金属盐，杜绝了人身安全隐患。Shown in Fig. 1 in conjunction with Fig. 2, a kind of noble metal ion exchanger comprises anode chamber 1, cathode chamber 2 and DC electrolysis power supply 3, is provided with anode 4 electrically connected with DC electrolysis power supply 3 positive poles in described anode chamber 1, cathode The chamber 2 is provided with a cathode 5 electrically connected to the negative pole of the DC electrolysis power supply 3, and an anion
所述阳极4呈笼子状且其内放置贵金属块7。阳极4为钛合金材质不参与电解反应，而贵金属块7参与电解反应逐渐融入氰化物溶液8内。The anode 4 is in the shape of a cage and a
所述存储槽11外壁设有液面计15。通过液面计15能够直观看到存储槽11碱溶液9的存储量，以便及时补充。A
所述贵金属块7为金或银。The
所述阳极室1上设有阳极室氰化物输入管16。通过阳极室氰化物输入管16可以向阳极室1内补充氰化物。The anode chamber 1 is provided with an anode chamber
所述氰化物溶液8为氰化钾溶液。The
所述碱溶液9为氢氧化钾溶液。The
Claims (7)
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|---|---|---|---|
| CN202211298392.5A CN115506000A (en) | 2022-10-23 | 2022-10-23 | Noble metal ion exchanger |
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| CN115506000A true CN115506000A (en) | 2022-12-23 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102268721A (en) * | 2011-06-27 | 2011-12-07 | 昆山同心表面科技有限公司 | Automatic adding machine for surface treatment |
| CN114438563A (en) * | 2022-02-18 | 2022-05-06 | 崇辉半导体有限公司 | System for automatically supplementing silver ions, silver spraying and plating system and silver spraying and plating process |
| CN218115658U (en) * | 2022-10-23 | 2022-12-23 | 乐清市伦硕科技有限公司 | Noble metal ion exchanger |
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2022
- 2022-10-23 CN CN202211298392.5A patent/CN115506000A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102268721A (en) * | 2011-06-27 | 2011-12-07 | 昆山同心表面科技有限公司 | Automatic adding machine for surface treatment |
| CN114438563A (en) * | 2022-02-18 | 2022-05-06 | 崇辉半导体有限公司 | System for automatically supplementing silver ions, silver spraying and plating system and silver spraying and plating process |
| CN218115658U (en) * | 2022-10-23 | 2022-12-23 | 乐清市伦硕科技有限公司 | Noble metal ion exchanger |
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