CN115486812A - Covers, Electronics & Wearables - Google Patents

Abstract

The application relates to a lid, electronic equipment and wearable equipment, and the lid includes base plate and electrode layer, and the material of base plate is plastics, and the heat altered shape temperature of base plate is greater than 150 ℃. The electrode layer is attached to the surface of the substrate, and the material of the electrode layer is at least one selected from Cr, W, crW, crSiCN, crWSiC, WC and WSiC. Above lid, can be applied to wearable equipment, and the electrode layer can be used to detect the electrode as the ECG. The substrate can be formed by adopting an injection molding process, the cost is low, the forming is simple, and the color can be diversified. Because the thermal deformation temperature of the substrate is more than 150 ℃ and the specific material is selected as the electrode layer, the electrode layer can be easily formed on the surface of the substrate by adopting processes such as physical vapor deposition and the like, and is reliably connected with the substrate and meets the performance requirement of the ECG detection electrode, thereby reducing the processing difficulty of the cover body and improving the design flexibility and product expressive force of the cover body.

Description

Covers, Electronics & Wearables

technical field

The present application relates to the technical field of wearable devices, in particular to a cover, electronic devices and wearable devices.

Background technique

Wearable devices (smart watches, smart bracelets, etc.) can generally be equipped with physiological sensors (heart rate sensors, electrocardiogram sensors, etc.) to detect physiological parameters of users and provide health guidance functions. In related technologies, wearable devices with electrocardiogram (ECG, electrocardiogram) detection function generally have an electrode layer on the cover body for detecting the user's electrocardiogram data. The material of the cover body is generally ceramic, glass or sapphire, and the cost of the cover body is relatively high. High and the processing technology of the electrode layer is complicated.

Contents of the invention

The first aspect of the embodiment of the present application discloses a cover body, so as to simplify the processing of the cover body of the wearable device and save costs.

A cover comprising:

A substrate, the substrate is made of plastic, and the heat distortion temperature of the substrate is greater than 150°C; and

The electrode layer is attached to the surface of the substrate, and the material of the electrode layer is selected from at least one of Cr, W, CrW, CrSiCN, CrWSiC, WC and WSiC.

The above cover body can be applied to wearable devices, and the electrode layer can be used as an ECG detection electrode. The material of the substrate is plastic and the thermal deformation temperature of the substrate is greater than 150°C. The substrate can be molded by injection molding, which has low cost and simple molding, and the colors can also be diversified. Since the heat distortion temperature of the substrate is greater than 150°C and a specific type of material is selected as the electrode layer, the electrode layer can be easily formed on the surface of the substrate by physical vapor deposition and other processes, and forms a reliable connection with the substrate and meets the requirements of ECG detection electrodes. Performance requirements, thereby reducing the processing difficulty of the cover body, improving the flexibility of the cover body design and product expression.

The second aspect of the embodiment of the present application discloses an electronic device, so as to simplify the processing of the cover body of the wearable device and save costs.

An electronic device includes a rear case, the rear case includes a body and the above-mentioned cover body, the cover body is connected to the body and at least part of the electrode layer is exposed to the outside of the electronic device.

In the above electronic device, the electrode layer of the cover can be used as an ECG detection electrode. The material of the substrate is plastic and the thermal deformation temperature of the substrate is greater than 150°C. The substrate can be molded by injection molding, which has low cost and simple molding, and the colors can also be diversified. Since the heat distortion temperature of the substrate is greater than 150°C and a specific type of material is selected as the electrode layer, the electrode layer can be easily formed on the surface of the substrate by physical vapor deposition and other processes, and forms a reliable connection with the substrate and meets the requirements of ECG detection electrodes. Performance requirements, thereby reducing the processing difficulty of the cover body, improving the flexibility of the cover body design and product expression.

The third aspect of the embodiment of the present application discloses a wearable device, so as to simplify the processing of the cover body of the wearable device and save costs.

A wearable device includes a strap and the above-mentioned electronic device, the strap is connected to the middle frame and is used to wear the electronic device on the user's wrist.

In the above wearable device, the electrode layer of the cover can be used as an ECG detection electrode. The material of the substrate is plastic and the thermal deformation temperature of the substrate is greater than 150°C. The substrate can be molded by injection molding, which has low cost and simple molding, and the colors can also be diversified. Since the heat distortion temperature of the substrate is greater than 150°C and a specific type of material is selected as the electrode layer, the electrode layer can be easily formed on the surface of the substrate by physical vapor deposition and other processes, and forms a reliable connection with the substrate and meets the requirements of ECG detection electrodes. Performance requirements, thereby reducing the processing difficulty of the cover body, improving the flexibility of the cover body design and product expression.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present application. Those skilled in the art can also obtain other drawings based on these drawings without creative work.

Fig. 1 is a schematic diagram of a wearable device of an embodiment;

FIG. 2 is a schematic diagram of an electronic device of a wearable device according to an embodiment;

FIG. 3 is an exploded view of a rear case of an electronic device according to an embodiment;

4 is a schematic diagram of a cover of an electronic device according to an embodiment;

FIG. 5 is an exploded view of a cover of an electronic device according to an embodiment.

Reference signs:

10, wearable device 100, electronic device 103, card slot

110, middle frame 120, display module 130, rear case

131, body 133, cover 1331, substrate

1331a, inner surface 1331b, outer surface 1333, electrode layer

13331, the first film layer 13333, the second film layer 13335, the third film layer

135. Detection window 200. Strap

detailed description

In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Preferred embodiments of the application are shown in the accompanying drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the application more thorough and comprehensive.

Referring to FIG. 1 , in some embodiments, a wearable device 10 includes an electronic device 100 and a strap 200 , the strap 200 is mounted on the electronic device 100 and the electronic device 100 can be worn on the user's wrist through the strap 200 . Referring to FIG. 2, the electronic device 100 includes a middle frame 110, which is hollow and used to provide structural rigidity for the entire electronic device 100. The middle frame 110 has a storage cavity (not shown), and the electronic device 100 can be arranged in the storage cavity. Circuit board (not shown), battery (not shown) and other electronic components. The middle frame 110 can be made of non-metallic materials such as plastic, rubber, silica gel, wood, ceramics or glass, and the middle frame 110 can also be made of metal materials such as stainless steel, aluminum alloy or magnesium alloy. The middle frame 110 can also be a metal injection molded part, that is, the metal material is used to ensure the structural rigidity of the middle frame 110, and the inner surface of the metal body is formed by injection molding with protrusions, grooves, threaded holes and other structures for assembly and positioning.

In some embodiments, the wearable device 10 is a smart watch, and the electronic device 100 includes electronic components such as a battery, a circuit board, a display module 120, and a biosensor. The circuit board can integrate a processor, a storage unit, The electronic components such as the communication module, and the battery can supply power for the circuit board, the display module 120 and other electronic components. The display module 120 covers one end of the storage cavity and is connected to the middle frame 110, which can be used to display information and provide an interactive interface for the user. The display module 120 may further include a display screen and a cover plate covering the display screen. The display screen may be an LCD (Liquid Crystal Display, Liquid Crystal Display) screen or an OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) screen, etc., and the cover plate may be It is a glass cover plate or a sapphire cover plate or the like. The cover plate is transparent and has relatively high light transmittance, for example, the light transmittance of the cover plate is above 80%. The display module 120 may have a touch function, but the touch function is not required, and the display module 120 is not required either.

Further, referring to FIG. 3 , the electronic device 100 may include a rear shell 130 connected to the middle frame 110 , after the wearable device 10 is worn on the user's wrist, at least part of the surface of the rear shell 130 fits the user's wrist. In the embodiment in which the electronic device 100 includes the display module 120 , the rear case 130 is disposed at two ends of the middle frame 110 opposite to the display module 120 and covers the two ends of the receiving cavity respectively. The rear case 130 may include a body 131 and a cover 133 connected to the body 131 . The material of the cover 133 may be different from that of the body 131 . For example, the cover 133 may be made of plastic, and the body 131 may be made of metal. The cover body 133 may be provided with a detection window 135 for a biosensor such as a heart rate sensor or a blood oxygen sensor. The electronic device 100 may include more than two types of biosensors, and the biosensors may be used to detect biological data such as electrocardiogram, heart rate, respiration rate, blood pressure, or body fat. For example, the electronic device 100 may include an electrocardiogram sensor disposed in the receiving cavity, and the electrocardiogram sensor is integrated on the circuit board for measuring the user's electrocardiogram data. In some embodiments, biosensors can also be used to detect motion states such as for counting steps. In other implementation manners, the wearable device 10 may be a smart bracelet or the like.

Continuing to refer to FIG. 2 , the middle frame 110 is roughly in the shape of a rectangular frame, and the four corners of the rectangle can be chamfered to form arc transitions so that the wearable device 10 has better appearance characteristics. In other embodiments, the middle frame 110 may also be in the shape of a circular frame. The side of the middle frame 110, that is, the surface facing away from the storage cavity, can be provided with a matching structure for installing the strap 200, and the strap 200 can form a reliable connection with the middle frame 110 through the matching structure of the middle frame 110, so that the electronic device 100 can be reliably worn securely to the user's wrist. In some embodiments, the strap 200 can be easily detached from the middle frame 110 so that the user can replace the strap 200 conveniently. For example, the user can purchase straps 200 of various styles, and replace the straps 200 according to usage scenarios, so as to improve the convenience of use. For example, the user can use more formal straps 200 on formal occasions, and use casual-style straps 200 on recreational occasions.

Continuing to refer to FIG. 1 , in some embodiments, the strap 200 includes two sections, and the opposite ends of the electronic device 100 are respectively provided with card slots 103 , and each of the two straps 220 has one end connected to the electronic device 100 , and the two straps 220 The end of 220 facing away from the electronic device 100 can be fastened together to form a receiving space, so that the electronic device 100 can be worn on the user's wrist through the strap 200 . In other embodiments, the strap 200 may be a one-piece structure, one end of the strap 200 is connected to one end of the electronic device 100, and the other end of the electronic device 100 may be provided with a buckle through which the strap passes. The free end of the strap can pass through the buckle and be fixed to other positions of the strap to form a storage space, and the size of the storage space is easy to adjust for the convenience of the user to wear.

Referring to FIGS. 4 and 5 , in some embodiments, the cover body 133 includes a substrate 1331 and an electrode layer 1333 attached to the substrate 1331 . The substrate 1331 is made of plastic. For example, the material of the substrate 1331 may be selected from at least one of PEI (Polyetherimide, polyetherimide), nylon, and PEEK (polyetheretherketone, polyetheretherketone). The substrate 1331 may be injection molded. The heat distortion temperature of the substrate 1331 is greater than 150°C, the electrode layer 1333 is attached to the surface of the substrate 1331, and the material of the electrode layer 1333 is selected from Cr (chromium), W (tungsten), CrW (chromium tungsten compound), CrSiCN (chromium silicon carbon nitrogen compound), CrWSiC (chromium tungsten silicon carbide), WC (tungsten carbide) and WSiC (tungsten silicon carbide).

The electrode layer 1333 can be used as an ECG detection electrode, and at least part of the electrode layer 1333 is exposed to the outside of the electronic device 100 . After the wearable device 10 is well worn on the user's wrist, the electrode layer 1333 can contact the user's skin to detect bioelectrical signals on the surface of the human body, combined with the electrocardiogram sensor of the electronic device 100, it can be used to measure the user's electrocardiogram data . The material of the substrate 1331 is plastic and the thermal deformation temperature of the substrate 1331 is greater than 150°C. The substrate 1331 can be molded by injection molding to obtain relatively accurate dimensions, avoiding complicated processing techniques such as turning and grinding, thereby saving the processing of the cover 133 cost, and the color of the substrate 1331 can also be diversified.

In related technologies, the physical vapor deposition (Physical Vapor Deposition, PVD) process has the advantages of simple processing, environmental protection, no pollution, less consumables, uniform and dense film formation, and strong bonding with the substrate. next. In the solution disclosed in this application, since the thermal deformation temperature of the substrate 1331 is greater than 150°C and the material of the electrode layer 1333 is selected from at least one of Cr, W, CrW, CrSiCN, CrWSiC, WC, and WSiC, the thermal deformation of the substrate 1331 The temperature can meet the requirements of the PVD process. The electrode layer 1333 of the above-mentioned specific material can be deposited on the surface of the substrate 1331 relatively easily by the PVD process, and form a reliable connection with the substrate 1331 and meet the performance requirements of the ECG detection electrode, thereby reducing the cover body. The processing difficulty of 133 improves the flexibility and product expression of the cover 133 design.

In the related art, the electrode layer 1333 of the electronic device 100 of the wearable device 10 is generally formed on ceramics, glass or sapphire. The price of raw materials of ceramics, glass and sapphire is relatively high, and the processing technology is complicated, the manufacturing yield is low, and the color It is also relatively simple, causing the overall cost of the cover body 133 to be relatively high, which reduces product competitiveness. It is difficult for the electrode layer formed on the plastic surface by other processes such as electroplating and printing to meet the adhesion and/or wear resistance requirements of the ECG detection electrodes.

The cover body 133 of the electronic device 100 of the wearable device 10 disclosed in this application forms an electrode layer 1333 on a plastic substrate 1331 with a heat distortion temperature greater than 150° C. through PVD technology. Since the plastic can be molded by injection molding, the processing technology is relatively simple. , the yield rate of the finished product is high, and the colors can also be diversified, so the manufacturing cost of the cover body 133 can be greatly reduced, and the appearance expressiveness of the electronic device 100 can be improved to enhance the competitiveness of the product.

Referring to FIG. 5 , in some embodiments, the electrode layer 1333 includes at least two stacked film layers, and the material of the outermost film layer is selected from at least one of W, WC, Cr and WSiC. In other words, the electrode layer 1333 may include two stacked film layers, or three stacked film layers or more than four stacked film layers, and the material of the outermost film layer is selected from W, WC, Cr and WSiC. At least one, so that the outermost layer of the electrode layer 1333 has relatively good wear resistance and corrosion resistance while ensuring electrical conductivity, so as to better protect the inner layer of the film layer and improve the electrode layer 1333 reliability and service life. It should be noted that, the material of the outermost layer of the electrode layer 1333 is not limited to the materials indicated above, and can also be other materials, which can be set as required.

In some embodiments, the electrode layer 1333 includes a first film layer 13331 , a second film layer 13333 and a third film layer 13335 which are sequentially stacked. The first film layer 13331 , the second film layer 13333 and the third film layer 13335 are respectively Formed by PVD process, and the first film layer 13331 is attached to the surface of the substrate 1331, the material of the first film layer 13331 is selected from Cr or W, and the material of the second film layer 13333 is selected from at least one of CrW, CrSiCN and CrWSiC The third film layer 13335 is the outermost layer of the electrode layer 1333, and the material of the third film layer 13335 is selected from at least one of W, WC, Cr and WSiC. The first film layer 13331, the second film layer 13333 and the third film layer 13335 with high density can be obtained by using the PVD process, so that the electrode layer has better mechanical properties (structural strength, wear resistance, etc.) and electrical properties ( resistance, etc.).

In this embodiment, the first film layer 13331 can have relatively good electrical conductivity and ductility, and have a relatively high bonding force with the plastic substrate 1331, so that the connection structure between the electrode layer 1333 and the substrate 1331 more reliable. The second film layer 13333, as a transition layer between the first film layer 13331 and the third film layer 13335, can be used to ensure the bonding force between the first film layer 13331 and the second film layer 13333, and ensure the conductivity of the electrode layer 1333 sex. It should be noted that the materials of the first film layer 13331 and the second film layer 13333 of the electrode layer 1333 are not limited to the above-mentioned materials, and can also be other materials, which can be set as required.

In some embodiments, the density of the second film layer 13333 is less than that of the first film layer 13331 . The density of the first film layer 13331 is higher, so that the first film layer 13331 has better adhesion, while the density of the second film layer 13333 is lower than that of the first film layer 13331, the deposition speed of the second film layer 13333 is faster and With relatively small stress, the overall internal stress of the electrode layer 1333 can be reduced to prevent the electrode layer 1333 from cracking. It should be noted that the density of the second film layer 13333 is not limited to be less than the density of the first film layer 13331, the density of the second film layer 13333 can also be equal to the density of the first film layer 13331, the second film layer 13333 The density of can also be greater than the density of the first film layer 13331. It can be set according to actual needs.

The substrate 1331 has an inner surface 1331a and an outer surface 1331b opposite to each other. The outer surface 1331b is located on the side of the cover 133 facing away from the storage chamber, that is, the outer surface 1331b of the substrate 1331 can be simply understood as the side of the substrate 1331 facing away from the electronic device 100 The internal surface of the surface that can be partially exposed to the outside world to enable the user to touch the surface. In some embodiments, the electrode layer 1333 extends from the outer surface 1331b around the edge of the substrate 1331 to the inner surface 1331a, and is electrically connected to the circuit board in the receiving cavity. For example, the first film layer 13331 of the electrode layer 1333 can go around the edge of the substrate 1331 and extend the inner surface 1331a of the substrate 1331. The first film layer 13331 abutting against the inner surface 1331 a side makes the electrode layer 1333 conduct with the circuit board. As another example, both the first film layer 13331 and the second film layer 13333 of the electrode layer 1333 go around the edge of the substrate 1331 and extend to the surface of the substrate 1331 , and conduct with the connection structure provided on the circuit board. For another example, the first film layer 13331, the second film layer 13333 and the third film layer 13335 of the electrode layer 1333 all bypass the edge of the substrate 1331 and extend to the inner surface 1331a of the substrate 1331, that is, the entire electrode layer 1333 bypasses the substrate 1331 The edge extends to the inner surface 1331a of the substrate 1331, and conducts with the connection structure provided on the circuit board.

In other embodiments, the substrate 1331 is provided with a through hole, and the through hole extends from the outer surface 1331b to the inner surface 1331a. The electrode layer 1333 such as the first film layer 13331 may extend to the inner surface 1331a along the wall of the through hole, and conduct with connection structures such as elastic contact pins or metal shrapnel provided on the circuit board. Of course, the first film layer 13331 and the second film layer 13333, or the entire electrode layer 1333 may extend to the inner surface 1331a of the substrate 1331 along the through hole, and conduct with the connection structure provided on the circuit board.

Of course, in the embodiment where the substrate 1331 has a through hole, in order to simplify the processing of the electrode layer 1333 in the through hole and improve the reliability of the circuit connection, a conductive column can be arranged in the through hole, and the conductive column is used to make the conductive layer of the outer surface 1331b conduction with the connection structure provided on the circuit board. The conductive pillars can be copper pillars or other alloy parts, which can pass through the through holes and have an interference fit with the through holes. The electrode layer 1333 covers the conductive pillars and conducts with the conductive pillars. The conductive pillars extend to the inner surface 1331a, and then can pass through The conductive posts realize the electrical connection between the electrode layer 1333 and the circuit board.

In some embodiments, the electrode layer 1333 has a thickness ranging from 1.5 μm to 3.6 μm, and the first film layer 13331 , the second film layer 13333 , and the third film layer 13335 have a thickness ranging from 0.5 μm to 1.2 μm. For example, the thickness of the entire electrode layer 1333 may be 1.8 μm, or 2.0 μm, or 2.5 μm, or 3.0 μm, or 3.5 μm. The thickness of the first film layer 13331 may be 0.6 μm, or 0.8 μm, or 1.0 μm, etc. The thickness of the second film layer 13333 can be 0.6 μm, or 0.8 μm, or 1.0 μm, etc. The thickness of the third film layer 13335 may be 0.6 μm, or 0.8 μm, or 1.0 μm, etc.

This setting can make the electrode layer 1333 have a lower thickness, and can ensure the mechanical properties (adhesion, structural strength, wear resistance, etc.) and electrical properties (impedance, etc.) of the electrode layer 1333 . It can be understood that the thickness of any two of the first film layer 13331 , the second film layer 13333 , and the third film layer 13335 may be approximately equal or significantly different. It should be noted that the thickness of the electrode layer 1333 is not limited to the thickness specified above, and may also be other thicknesses, which may be set as required.

Continuing to refer to FIG. 4 and FIG. 5, in this embodiment, the substrate 1331 is roughly in the shape of a circular block, the electrode layer 1333 extends along the edge of the substrate 1331, and the electrode layers 1333 are arranged at two intervals, and the two electrode layers 1333 can be about The space between the two is arranged on the substrate 1331 in an axis-symmetrical manner. The detection window 135 of the substrate 1331 is located in the area surrounded by the two electrode layers 1333 .

In addition, with reference to FIG. 4 and FIG. 5 , the present application also provides a method for preparing the cover 133 of the above embodiment, which can manufacture the cover 133 of the wearable device 10 with lower cost and better mechanical and electrical properties. The preparation method comprises steps S110-S130:

S110, providing a substrate 1331, the substrate 1331 has an outer surface 1331b and an inner surface 1331a oppositely arranged.

The specific structure and material of the substrate 1331 are detailed above. For example, the material of the substrate 1331 can be selected from at least one of PEI, nylon, and PEEK, and the substrate 1331 is injection molded, which will not be repeated here.

S120 , roughening a part of the outer surface 1331b of the substrate 1331 .

The roughening treatment may be a chemical etching process or a laser engraving process. This arrangement can improve the adhesion of the electrode layer 1333 on the substrate 1331 . Further, the surface roughness of the part of the outer surface 1331b after the roughening treatment may be 0.2 μm˜0.3 μm. It should be noted that the roughening treatment method is not limited to the above process, and other roughening treatment methods may also be used. It should be noted that the step of roughening the outer surface 1331b of the substrate 1331 can be omitted.

S130 , forming an electrode layer 1333 on the outer surface 1331b by using a PVD process, and the electrode layer 1333 includes at least two laminated film layers.

It should be noted that the specific structure and arrangement of the electrode layer 1333 can be found in the above, and will not be repeated here.

The following is the specific embodiment part.

Unless otherwise specified, in the following embodiments, the cover 133 is the cover 133 of the electronic device 100 of the wearable device 10 . The material of the substrate 1331 is PEI.

Example 1

The structure of the cover body 133 of this embodiment is shown in FIG. 4 and FIG. 5 . The preparation process of the cover body 133 of the present embodiment is as follows:

(1) The substrate 1331 is provided, and the substrate 1331 has an outer surface 1331b and an inner surface 1331a disposed opposite to each other.

(2) Form the first film layer 13331 of the electrode layer 1333 on the outer surface 1331b by PVD process, the material of the first film layer 13331 is Cr, the thickness is 0.514 μm, and the deposition temperature is 150°C.

(3) Form the second film layer 13333 on the side of the first film layer 13331 away from the outer surface 1331b by PVD process, the material of the second film layer 13333 is CrW, the thickness is 0.514 μm, and the deposition temperature is 150°C.

(4) The third film layer 13335 is formed on the side of the second film layer 13333 away from the first film layer 13331 by PVD process, the material of the third film layer 13335 is W, the thickness is 0.515 μm, and the deposition temperature is 150°C .

Example 2

The structure of the cover body 133 of this embodiment is shown in FIG. 4 and FIG. 5 . The preparation process of the cover body 133 of the present embodiment is as follows:

(1) The substrate 1331 is provided, and the substrate 1331 has an outer surface 1331b and an inner surface 1331a disposed opposite to each other.

(2) Form the first film layer 13331 of the electrode layer 1333 on the outer surface 1331b by PVD process, the material of the first film layer 13331 is Cr, the thickness is 0.898 μm, and the deposition temperature is 150° C.

(3) Form the second film layer 13333 on the side of the first film layer 13331 away from the outer surface 1331b by PVD process, the material of the second film layer 13333 is CrW, the thickness is 0.898 μm, and the deposition temperature is 150°C.

(4) The third film layer 13335 is formed on the side of the second film layer 13333 away from the first film layer 13331 by PVD process, the material of the third film layer 13335 is W, the thickness is 0.897 μm, and the deposition temperature is 150°C .

Example 3

The structure of the cover body 133 of this embodiment is shown in FIG. 4 and FIG. 5 . The preparation process of the cover body 133 of the present embodiment is as follows:

(1) The substrate 1331 is provided, and the substrate 1331 has an outer surface 1331b and an inner surface 1331a disposed opposite to each other.

(2) Form the first film layer 13331 of the electrode layer 1333 on the outer surface 1331b by PVD process, the material of the first film layer 13331 is Cr, the thickness is 0.848μm, and the deposition temperature is 150°C.

(3) Form the second film layer 13333 on the side of the first film layer 13331 away from the outer surface 1331b by PVD process, the material of the second film layer 13333 is CrW, the thickness is 0.848 μm, and the deposition temperature is 150°C.

(4) The third film layer 13335 is formed on the side of the second film layer 13333 away from the first film layer 13331 by PVD process, the material of the third film layer 13335 is WC, the thickness is 0.847 μm, and the deposition temperature is 150°C .

Example 4

The structure of the cover body 133 of this embodiment is shown in FIG. 4 and FIG. 5 . The preparation process of the cover body 133 of the present embodiment is as follows:

(1) The substrate 1331 is provided, and the substrate 1331 has an outer surface 1331b and an inner surface 1331a disposed opposite to each other.

(2) Form the first film layer 13331 of the electrode layer 1333 on the outer surface 1331b by PVD process, the material of the first film layer 13331 is Cr, the thickness is 1.067μm, and the deposition temperature is 150°C.

(3) Form the second film layer 13333 on the side of the first film layer 13331 away from the outer surface 1331b by PVD process, the material of the second film layer 13333 is CrSiCN, the thickness is 1.067 μm, and the deposition temperature is 150°C.

(4) The third film layer 13335 is formed on the side of the second film layer 13333 away from the first film layer 13331 by PVD process, the material of the third film layer 13335 is Cr, the thickness is 1.067 μm, and the deposition temperature is 150°C .

Example 5

The structure of the cover body 133 of this embodiment is shown in FIG. 4 and FIG. 5 . The preparation process of the cover body 133 of the present embodiment is as follows:

(1) The substrate 1331 is provided, and the substrate 1331 has an outer surface 1331b and an inner surface 1331a disposed opposite to each other.

(2) Form the first film layer 13331 of the electrode layer 1333 on the outer surface 1331b by PVD process, the material of the first film layer 13331 is Cr, the thickness is 0.936 μm, and the deposition temperature is 150° C.

(3) Form the second film layer 13333 on the side of the first film layer 13331 away from the outer surface 1331b by PVD process, the material of the second film layer 13333 is CrWSiC, the thickness is 0.936 μm, and the deposition temperature is 150°C.

(4) The third film layer 13335 is formed on the side of the second film layer 13333 away from the first film layer 13331 by PVD process, the material of the third film layer 13335 is WSiC, the thickness is 0.936 μm, and the deposition temperature is 150°C .

Example 6

The structure of the cover body 133 of this embodiment is shown in FIG. 4 and FIG. 5 . The preparation process of the cover body 133 of the present embodiment is as follows:

(1) The substrate 1331 is provided, and the substrate 1331 has an outer surface 1331b and an inner surface 1331a disposed opposite to each other.

(2) Form the first film layer 13331 of the electrode layer 1333 on the outer surface 1331b by PVD process, the material of the first film layer 13331 is W, the thickness is 0.936 μm, and the deposition temperature is 150°C.

(3) Form the second film layer 13333 on the side of the first film layer 13331 away from the outer surface 1331b by PVD process, the material of the second film layer 13333 is CrWSiC, the thickness is 0.936 μm, and the deposition temperature is 150°C.

(4) The third film layer 13335 is formed on the side of the second film layer 13333 away from the first film layer 13331 by PVD process, the material of the third film layer 13335 is WSiC, the thickness is 0.936 μm, and the deposition temperature is 150°C .

Example 7

The preparation process of the cover body 133 of this embodiment is roughly the same as that of Embodiment 1, except that:

In steps (2), (3) and (4), the materials of the first film layer 13331 , the second film layer 13333 and the third film layer 13335 are all Cr.

Comparative example 1

The preparation process of the cover body 133 of this comparative example is roughly the same as that of Example 1, except that:

The material of the substrate 1331 is PC (Polycarbonate, polycarbonate), and the heat deflection temperature is about 100° C., that is, the heat deflection temperature of the substrate 1331 is less than 150° C. In steps (2), (3) and (4), since the substrate 1331 is easily deformed under the original PVD process conditions, the first film layer 13331, the second film layer 13333 and the third film layer 13335 are formed on the substrate 1331 by an electroplating process. surface, the electroplating process temperature is 60°C.

Comparative example 2

The preparation process of the cover body 133 of this comparative example is roughly the same as that of Example 1, except that:

In steps (2), (3) and (4), the materials of the first film layer 13331 , the second film layer 13333 and the third film layer 13335 are all titanium.

Comparative example 3

The preparation process of the cover body 133 of this comparative example is roughly the same as that of Example 1, except that:

In steps (2), (3) and (4), the first film layer 13331 , the second film layer 13333 and the third film layer 13335 are all made of Cr, and are formed on the substrate 1331 by a water plating process.

test:

The adhesion, wear resistance, thermal stability, corrosion resistance and impedance of the electrode layer 1333 of the cover body 133 of Examples 1-7 and Comparative Examples 1-3 were measured. Table 1 shows the test results of adhesion, wear resistance, ring test (thermal stability, corrosion resistance, etc.) and impedance of the electrode layer 1333 in the cover body 133 of Examples 1-7 and Comparative Examples 1-3. In Table 1, the purpose of the ring test is to test the thermal stability and corrosion resistance of the electrode layer 1333. The thermal stability test may specifically include high and low temperature resistance tests and temperature shock resistance (that is, rapid temperature changes). Corrosion resistance tests may include salt spray tests, artificial sweat tests, etc.

Among them, the "boiling at 80°C for 60 minutes" test is used to test the adhesion of the cover 133 on the electrode layer 1333, and the qualified standard is that the electrode layer 1333 has no cracks or falls off after the test;

The "RCA (load 175g)" test uses the American Norman Tool RCA tape abrasion tester to test the wear resistance of the electrode layer 1333 of the cover body 133. The qualified standard is that the electrode layer 1333 has no wear and tear after more than 200 tests. exposing the substrate 1331;

The "CS10 rubber (load 500g)" test uses a CS10 rubber with the American Taber testing machine to test the wear resistance of the electrode layer 1333 of the cover 133. Since the material of the substrate 1331 in this application is plastic, the surface hardness is relatively low. The substrate 1331 generally does not use this test method to test the wear resistance of the coating, but the test results can be used for reference;

The "red-head rubber (500g load)" test uses the red-head rubber and the American Taber testing machine to test the wear resistance of the electrode layer 1333 of the cover 133. The qualified standard is that the electrode layer 1333 has no abrasion and does not expose the substrate 1331 after the test.

The test results are shown in Table 1. Table 1 shows the test results of the adhesion, wear resistance, ring test and impedance of the electrode layer 1333 of the cover body 133 of Examples 1-7 and Comparative Examples 1-3.

Table 1

It can be seen from Table 1 that the adhesion of the electrode layer 1333 of the cover body 133 in Examples 1-7 is all acceptable, indicating that the electrode layer 1333 of the cover body 133 prepared in the above embodiment has better adhesion force. The wear resistance (RCA test, red-head rubber test) of Examples 1-7 are all qualified, indicating that the electrode layer 1333 of the cover body 133 in the above embodiment has better wear resistance. The results of the loop test (thermal stability test and corrosion resistance test) of Examples 1-7 are all qualified, indicating that the electrode layer 1333 in the above embodiment has better thermal stability and corrosion resistance. The impedance of the electrode layer 1333 of the cover 133 in Examples 1 to 7 is all less than 100Ω, indicating that the electrode layer 1333 of the cover 133 prepared in the above embodiment has good electrical conductivity and can meet the requirements of ECG detection electrodes. Furthermore, it can be seen from Table 1 that the adhesion and wear resistance of the cover body 133 of Examples 1-7 are significantly better than those of Comparative Example 1, Comparative Example 2 and Comparative Example 3.

The various technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the various technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the present application, and the description thereof is relatively specific and detailed, but should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of protection of the patent application should be based on the appended claims.

Claims (11)

1. A cover, comprising:

the substrate is made of plastics, and the thermal deformation temperature of the substrate is greater than 150 ℃; and

and the electrode layer is attached to the surface of the substrate, and the material of the electrode layer is at least one selected from Cr, W, crW, crSiCN, crWSiC, WC and WSiC.

2. The cover according to claim 1, wherein said electrode layer comprises at least two laminated layers, and the material of said outermost layer is at least one selected from the group consisting of W, WC, cr and WSiC.

3. The cover according to claim 2, wherein the electrode layer comprises a first film layer, a second film layer and a third film layer stacked in this order, the first film layer is attached to the surface of the substrate, the first film layer is made of a material selected from Cr or W, the second film layer is made of a material selected from at least one of CrW, crSiCN and CrWSiC, and the third film layer is an outermost layer of the electrode layer.

4. The cover of claim 3, wherein the thickness of the electrode layer is in the range of 1.5 μm to 3.6 μm;

and/or the thickness range of the first film layer is 0.5-1.2 μm;

and/or the thickness range of the second film layer is 0.5-1.2 μm;

and/or the thickness of the third film layer ranges from 0.5 mu m to 1.2 mu m.

5. The cover of claim 1 wherein said electrode layer is a PVD coating.

6. The cover of any of claims 1-5, wherein the substrate has an inner surface and an outer surface, and the electrode layer extends from the outer surface around the edge of the substrate and to the inner surface.

7. The cover according to any of claims 1-5, wherein said substrate has an inner surface and an outer surface, said substrate defines a through hole, and said electrode layer extends from said outer surface to said inner surface along a wall of said through hole; or, a conductive column is arranged in the through hole, the conductive column is conducted with the electrode layer on the outer surface, and the conductive column extends to the inner surface.

8. The cover according to any one of claims 1 to 5, wherein the material of the substrate is at least one selected from the group consisting of PEI, nylon and PEEK;

and/or, the substrate is injection molded.

9. An electronic device comprising a rear case, wherein the rear case comprises a body and a cover according to any one of claims 1 to 8, the cover is connected to the body and at least a portion of the electrode layer is exposed to the outside of the electronic device.

10. The electronic device of claim 9, further comprising a middle frame and an electrocardiogram sensor, wherein the middle frame has a receiving cavity, the body is connected to the middle frame and covers one end of the receiving cavity, and the electrocardiogram sensor is disposed in the receiving cavity and electrically connected to the electrode layer for measuring an electrocardiogram.

11. A wearable device comprising the electronic device of claim 9 or 10 and a strap connected to the electronic device and configured to wear the electronic device to a wrist of a user.

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