CN115255622B - Film punching high-precision large-breadth processing system and method - Google Patents
Film punching high-precision large-breadth processing system and methodInfo
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- CN115255622B CN115255622B CN202210748446.7A CN202210748446A CN115255622B CN 115255622 B CN115255622 B CN 115255622B CN 202210748446 A CN202210748446 A CN 202210748446A CN 115255622 B CN115255622 B CN 115255622B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
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Abstract
本发明公开一种膜材打孔高精度大幅面加工系统及方法，系统沿激光器光路依次设有：激光器、扩束镜、5组反射镜、振镜、透镜、载物平台；还包括辅助装置和控制装置。辅助装置包含卷绕机、抽尘、吸附、红外测高组件，卷绕机用于传送物料放卷和收卷、抽尘组件用于去除加工过程中产生的粉尘、吸附组件用于吸附加工样品和去除残渣、红外测高用于监测载物平台的水平；控制装置包含视觉定位、两路飞行光路、两个升降轴、加工软件，视觉定位用于定位图档加工位置，两路飞行光路用于实现图档大幅面拼接，两个升降轴一个用于控制加工过程焦点，一个用于控制卷绕机传输物料时载物平台的升降，加工软件用于加载大幅面CAD图档进行自动分割加工。
The present invention discloses a high-precision, large-format processing system and method for punching membrane materials. The system is equipped with the following components along the laser optical path: a laser, a beam expander, five groups of reflectors, a galvanometer, a lens, and a loading platform; it also includes auxiliary devices and a control device. The auxiliary devices include a winder, a dust extraction component, an adsorption component, and an infrared height measurement component. The winder is used to convey the unwinding and rewinding of materials; the dust extraction component is used to remove dust generated during the processing; the adsorption component is used to adsorb the processing sample and remove residue; and the infrared height measurement is used to monitor the level of the loading platform. The control device includes visual positioning, two flying optical paths, two lifting axes, and processing software. The visual positioning is used to locate the processing position of the drawing; the two flying optical paths are used to achieve large-format splicing of the drawings; one of the two lifting axes is used to control the focus of the processing process, and the other is used to control the lifting and lowering of the loading platform when the winder is conveying materials. The processing software is used to load large-format CAD drawings for automatic segmentation processing.
Description
Technical Field
The invention belongs to the technical field of laser processing, in particular to a film punching high-precision large-format processing system and method, which are suitable for processing various film materials in a large format, are mainly applied to processing flexible materials in a large format in a high-precision manner required by the 3C industry, are not limited to punching, and are easy to score, notch and the like.
Background
PI films, i.e., polyimide films, are currently the best performing film insulating materials in the world, and are widely used in the microelectronics field. Because of the high oil resistance, high heat resistance, low dielectric loss and other excellent properties, the modified polyurethane resin is commonly used as cable insulating materials, heat insulating materials, recording carrier materials and the like, and is particularly applied to flexible circuit boards.
The traditional flexible circuit board is characterized in that after copper is coated on the surface of a PI film, process operations such as drilling, etching and the like are performed, a large amount of residues after copper coating are generated in the process, so that waste of metal raw materials is caused, and the production cost is increased. In addition, the traditional process of firstly covering copper and then processing is to etch the copper foil to form a hole pattern, and then respectively remove copper covering on the upper surface and the lower surface of the insulating layer to form a through hole according to the requirement, which can cause precision deviation of the upper position and the lower position of the through hole, thereby restricting the size of the hole diameter of the drilled hole and being unfavorable for processing the micron-sized holes.
In addition, the PI film is extremely thin, the thickness commonly used in industry is only 12-75 um, and the traditional machine processing is generally that a processing platform links with the laser light-emitting, so that the surface of the film material is extremely easy to scratch, the film material is scrapped, and the subsequent process is affected.
In the existing laser processing, large-format processing is limited by the effective processing format of a lens used by a platform, and large-format processing needs to be realized through splicing under the condition that the effective processing format of the lens is exceeded, for example, a large-format splicing marking machine disclosed by Chinese patent application No. CN113664378A in 2021, 11 and 19 is disclosed, large-format splicing is realized through sliding of a mobile laser main body and a bearing, an artificial sliding machine is needed, and large errors exist at the splicing position of a large-format picture file, so that the large-format splicing marking machine is not suitable for high-precision integrated automatic production.
Therefore, it is desirable to provide a processing system that can process micro-scale holes in an extremely thin film material, does not scratch the surface of the film material, and can realize high-precision large-format automated processing.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a film punching high-precision large-breadth processing system and a film punching high-precision large-breadth processing method, which are used for solving at least one technical problem.
According to one aspect of the specification, the invention provides a film punching high-precision large-format processing system, which comprises a laser device, an auxiliary device and a control device, wherein,
The laser device comprises a laser, a beam expander, a reflecting mirror group, a vibrating mirror, a lens and a lens, wherein the laser is used for generating laser pulses, the beam expander is used for expanding the pulse spot size generated by the laser, the reflecting mirror group is used for turning back a light path, the vibrating mirror is used for controlling image processing within the single breadth range of a film sample, and the lens is used for focusing laser beams coming out of the vibrating mirror and incident on the film sample;
The auxiliary device comprises a winding machine, a dust extraction component, an adsorption component, an infrared height measurement component, a vibration mirror, a linear motor, a vibration mirror, a film sample fixing device and a control device, wherein the winding machine is used for conveying and winding film materials;
The control device comprises a visual positioning component, two flight light paths, a Z-direction lifting shaft, a U-axis and processing software, wherein the visual positioning component is used for positioning a picture processing position, the two flight light paths are used for automatically running to a next single-frame picture processing position according to a system path to process after a single-frame picture is processed by a vibrating mirror, so that large-frame picture splicing is realized, the Z-direction lifting shaft is linked with a Y-axis of a linear motor and used for controlling a light beam focusing focus in a processing process, the U-axis is used for controlling lifting of a carrying platform when a winding machine transmits a film material, and the processing software is used for loading the large-frame CAD picture and automatically dividing the large-frame CAD picture into a plurality of single-frame large-frame picture.
Before starting processing, the technical scheme is that a laser path is adjusted to enable laser pulses to be focused on the surface of a sample and to process a pattern file within a single range of a film sample, then the film sample is fixed to enable the film sample not to move in the processing process and avoid scratching the surface of the film, then a large-format pattern file is poured into the film sample to obtain a single processed format pattern file through format cutting, the processing coordinates of the pattern file are obtained through matching of a visual positioning component and processing software, when the laser processing is performed, a U-axis carries a carrying platform to be moved to a processing position, the film material is automatically adsorbed, a laser beam can be processed along the path of the pattern file, after one single-format pattern file is processed, the laser beam can be automatically moved to the single-format pattern file position of the next array to be processed until all the pattern files are processed, at the moment, the U-axis carries the carrying platform to descend, adsorption is automatically disconnected, the right end of a winding machine receives a complete format film material length, and then the left end of the winding machine feeds a complete format film material length to enter the next automatic processing system to be circulated.
According to the technical scheme, through the mutual matching of the laser device, the auxiliary device and the control device, the large-breadth automatic processing of the film is realized under the conditions that the surface of the film is not scratched and an additional sliding machine is not needed, and the large-breadth splicing precision is ensured through two paths of flight light paths.
Above-mentioned technical scheme is when laser processing, and it is fixed to accomplish the vacuum adsorption of residue absorption and membrane material sample through the adsorption component, takes away upper portion dust through the dust extraction device to eliminate the influence of material residue and dust to the processing effect in the course of working, simultaneously, still monitor the level of whole breadth through infrared height measurement subassembly, guarantee breadth machining precision.
The reflecting mirror group comprises a first reflecting mirror and a second reflecting mirror which are arranged on a machine base and used for controlling a Y-direction flying light path, a third reflecting mirror which is arranged on a Y-axis of a linear motor and used for controlling an X-direction flying light path, a fourth reflecting mirror which is arranged on an X-axis of the linear motor and synchronously moves along with the X-axis, and a fifth reflecting mirror which is arranged on a Z-direction lifting axis and synchronously moves along with the Z-direction lifting axis.
The first reflecting mirror and the second reflecting mirror are arranged in a two-dimensional adjusting mirror bracket, and screws are arranged in the mirror bracket, so that the up-down, left-right directions of the reflecting mirror can be adjusted. The mirror frame of the first and second mirrors is fixed on the machine base.
The technical scheme is that two paths of flight light paths are formed, one path is a Y-direction flight light path, and the other path is an X-direction flight light path, wherein the X-direction and the Y-direction are the same as the X-axis and the Y-axis directions of the linear motor. In the whole processing process of the film material, the film material sample is motionless, large-format splicing processing is realized through two paths of flight light paths, and compared with the prior processing platform and laser light-emitting linkage for realizing large-format splicing, the processing platform is solved, the problem that the surface of the film material is extremely easy to scratch due to the linkage of the vibrating mirror is solved, and the scratch loss of the surface of the film material in the processing process of the film material is avoided.
As a further technical scheme, a fine adjustment guide rail is arranged on the mirror base of the third reflecting mirror and used for realizing six-direction adjustment together with the mirror base. The screw in the mirror base can control the up, down, left and right directions, and the guide rail can control the front direction and the rear direction.
Only the three reflectors are provided with the fine-tuning guide rails, and because the three reflectors control the X-direction flying light path to be parallel to the X axis, the adjustment of six directions of a single reflector through the lens base is difficult to realize, so that the three reflectors are realized together by adding the fine-tuning guide rails.
The light paths of the reflector IV and the reflector V need to be controlled to be perpendicular to the machining platform of the machine, and the reflector V almost does not need to move after the focal point of the platform is determined.
The third reflector, the fourth reflector and the fifth reflector are all arranged on the mirror bracket, and the mirror bracket is arranged on the shaft.
As a further technical scheme, the X axis and the Y axis of the linear motor are parallel to the surface of the carrying platform, the Z-direction lifting axis and the U axis are perpendicular to the surface of the carrying platform, the U axis is arranged below the carrying platform, the Z-direction lifting axis is arranged above the carrying platform, and the U axis is parallel to the Z-direction lifting axis.
Specifically, the X axis and the Y axis of the linear motor are parallel to the surface of the carrying platform, so that when the linear motor drives the vibrating mirror to move along the X direction and the Y direction, the processing of the film sample on the carrying platform is realized. The Z-direction lifting shaft is perpendicular to the surface of the carrying platform and is arranged above the carrying platform, so that the linear motor can conveniently drive the linear motor to move up and down, and the reflecting mirror arranged on the linear motor can be driven to move up and down, so that the focusing focus of a light beam in the processing process can be controlled. The U-axis is perpendicular to the surface of the carrying platform and is arranged below the carrying platform, so that the linear motor can conveniently drive the linear motor to move up and down, and the lifting of the carrying platform when the winding machine conveys materials is controlled.
As a further technical scheme, the reflecting mirror five, the vibrating mirror, the lens, the infrared height measuring assembly, the visual positioning assembly and the dust extraction assembly are all arranged on the fixture, and the fixture is linked with the X axis and the Y axis of the linear motor and synchronously moves along with the Z-direction lifting axis.
And when the tool clamp is driven to move along the X direction, the Y direction or the Z direction by the linear motor, the parts are moved along the X direction, the Y direction or the Z direction as a whole. In the processing process, the infrared height measurement following system is linked, the height and levelness of the processing platform can be monitored at any time in real time, and if the error is too large, the error can be directly fed back to the system.
Because PI membrane has stronger electrostatic adsorption effect, the processing process residue can cover in follow-up unprocessed region if not in time taking away, causes the hole to block up, consequently installs the dust extraction on frock clamp, can follow the linkage of galvanometer, in time takes away dust and residue in the course of working.
As a further technical scheme, the adsorption component comprises a jig, wherein the central area of the jig is fully distributed with array holes, and the diameter of each hole is larger than that of a circle in a processing drawing.
The central area of the jig of the adsorption component is fully distributed with holes of an array, the diameter of the holes is larger than that of a circle in a processing drawing file, the holes are honeycomb-shaped, suction force can be effectively and uniformly distributed, a closed vacuum system is formed after a sample is placed on the suction force and the upper carrying platform, and a cavity with a certain closed range is arranged between the carrying platform and the honeycomb-shaped plate. On the one hand, the design is favorable for the produced film material residues or heavy residues such as copper foil metals to fall into the cavity and be taken away, so that the processing materials are not limited to PI films, and on the other hand, the design plays a role in uniformly distributing, adsorbing, supporting and fixing the extremely soft PI film materials, prevents the local area from being too strong in suction force, causes the film material to be sunken, and influences the precision and the technological effect. And the dust extraction above the vibrating mirror only plays a role in taking away dust in the air.
As a further technical scheme, the laser has the pulse width of 100 fs-10 ps, the wavelength of 355-1064 nm, the speed of a vibrating mirror of 0-20000 mm/s, the precision of +/-2.5 um, a lens which is a telecentric lens, the single-plane flatness focal depth range of 0.1mm, and the spot diameter of laser pulse of 3-20 um.
Further, the levelness of the whole width of the carrying platform is in the range of 20um, so that the processing precision of the whole width is ensured.
Furthermore, the reflecting mirror adjusting mirror seat on the flying light path can resist the stress generated in the running process of the motion control system, and the light path is not deviated. In the processing process of the third reflecting mirror, the fourth reflecting mirror and the fifth reflecting mirror, the mirror seat of the third reflecting mirror needs to move so as to resist the stress generated by the motion control system.
The mirror bases of the first and second mirrors are fixed on the fixture for adjusting the Y-axis light path, and the mirror bases are common mirror bases because the mirror bases do not need to move in the processing process.
The technical scheme ensures the high-precision splicing effect of the large-format image file through system configuration. The integrated automatic production is realized by combining software control through the selected configuration of the laser, the vibrating mirror, the lens, the laser spot, the whole-breadth levelness of the object carrying platform and the mirror adjusting frame, and the high-precision automatic splicing processing of large-breadth image files is realized.
According to an aspect of the present invention, a method for processing a film with high precision and large format is provided, and the method is implemented by using the system, and includes:
the optical path of the laser is adjusted, so that the laser beam is focused on the surface of the film material, and the lifting and lowering positions of the Z-direction lifting shaft and the U-axis are respectively adjusted;
Fixing the film material on a feeding machine at the left end of a winding machine, adjusting the position, enabling the film material to pass through a machine table and be positioned above a carrying platform, and fixing the other end of the film material on a receiving machine at the right end of the winding machine;
leading in a large-format CAD drawing file, inputting a lens format value, and automatically dividing the large-format CAD drawing file according to the lens format to form n1xn2 array drawing files;
capturing the position coordinate of the first image file and the offset angle of the whole image file, inputting the position coordinate and the offset angle of the whole image file into processing software, and obtaining the processing coordinates of the rest image files;
starting processing, lifting the U-axis carrying platform to a processing position, and automatically adsorbing the membrane material;
Processing the laser beam along a picture file path, and automatically running to a single-picture file position of the next array to process through two paths of flight light paths after finishing processing a single-picture file until all picture files are processed;
the U-shaft carries the carrying platform to descend, adsorption is automatically disconnected, and the right end of the winding machine receives a complete web mask material length.
After finishing the processing of the length of the complete breadth mask material, feeding the length of the complete breadth mask material to the carrying platform at the left end of the winding machine, and automatically entering the next processing system for circulation.
According to the technical scheme, after the laser light path is adjusted, the film material to be processed is fixed, the film material is not moved in the processing process, the surface of the film material is prevented from being scratched, after the single-panel processing of the image file is finished, the image file is automatically operated to the next single-panel image file processing position for processing through the two paths of flying light paths according to the system path, large-format splicing of the image file is realized under the condition that a sliding machine platform is not needed, the splicing precision is ensured, and the lifting of the carrying platform is controlled through the U shaft, so that the automatic rolling of the processed material is realized.
In the technical scheme, the holes in the carrying platform jig are consistent with the drawing files, the residue part generated in the processing process can fall into the adsorption jig below through the holes of the carrying platform to be taken away, and meanwhile, dust generated in the processing process can be timely taken away along with the dust extraction component above the carrying platform.
The focusing light spot formed by the objective lens acts on the surface of the film sample on the carrying platform, the laser beam is processed in a single lens breadth along a picture file path, the laser beam can sequentially move to the next processing position after the single lens breadth is processed, residues and dust are generated and taken away by a hole below the adsorption platform and a dust extraction system above the carrying platform, and the influence of secondary burn on the hole edge effect is avoided.
As a further technical scheme, when the software is processed to divide the image files, if the size cannot be multiplied by an integer, the overall width of the n1xn2 array image files obtained by automatic division is slightly larger than the input CAD image file width, but the effective size of the processed overall image files is the same.
As a further technical scheme, the drawing file formed after the automatic segmentation of the processing software is required to be provided with laser processing parameters including laser power, frequency, galvanometer scanning speed, jump speed, on/Guan Guangyan time and processing times at a drawing file marking interface.
Compared with the prior art, the invention has the beneficial effects that:
(1) According to the invention, through the mutual matching of the laser device, the auxiliary device and the control device, the large-breadth automatic processing of the film material is realized under the conditions that the surface of the film material is not scratched and an additional sliding machine is not needed, and the large-breadth splicing precision is ensured through two paths of flight light paths.
(2) According to the invention, while laser processing is performed, the adsorption component is used for completing the residue adsorption and the vacuum adsorption fixation of a film sample, and the dust on the upper part is pumped away by the dust pumping device, so that the influence of material residues and dust on the processing effect in the processing process is eliminated, and meanwhile, the level of the whole breadth is monitored by the infrared height measuring component, so that the processing precision of the breadth is ensured.
(3) According to the invention, through the design of the adsorption component, on one hand, the generated film material residues or heavy residues such as copper foil metals and the like are facilitated to fall into the cavity to be taken away, so that the processing materials are not limited to PI films, and on the other hand, the adsorption supporting and fixing effects are uniformly distributed on the extremely soft PI film materials, so that the phenomenon that the film materials are sunken due to too strong suction force in local areas is prevented, and the precision and the technological effect are influenced.
Drawings
Fig. 1 is a schematic structural diagram of a film punching high-precision large-format processing system in an embodiment of the invention.
FIG. 2 is a diagram of a PI film 30um Kong Xianwei mirror magnification 100 in an embodiment of the invention;
FIG. 3 is a diagram of a PI film 50um Kong Xianwei mirror magnified 100X in an embodiment of the invention;
FIG. 4 is a diagram of a PI film 75um Kong Xianwei mirror magnified 100X according to an embodiment of the present invention;
FIG. 5 is a diagram of a PI film 100um Kong Xianwei mirror magnification 100X in an embodiment of the invention;
FIG. 6 is a schematic diagram of a PI film 2mm Kong Xianwei mirror magnification 20 in an embodiment of the invention;
FIG. 7 is a schematic diagram of a PI film surface scratch microscope in an embodiment of the invention.
The laser device comprises a laser device 1, a beam expander 2, a vibrating mirror 3, a lens 4, a film material 5, a carrying platform 6, an adsorption component 8, a U-axis 9, an infrared height measuring component 10, a CCD camera positioning system 11, a dust extraction component 12, a winding machine roll-up system 13, a winding machine roll-up system 14, a fixture 15, a first reflector 16, a second reflector 17, a third reflector 18, a fourth reflector 19 and a fifth reflector.
Detailed Description
The following description of the embodiments of the present invention will be made in detail and with reference to the accompanying drawings, wherein it is apparent that the embodiments described are only some, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
In the description of the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, or communicable with each other, directly connected, indirectly connected via an intermediary, or in communication between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
As shown in fig. 1, the invention provides a film punching high-precision large-format processing system, which sequentially comprises a laser 1, a beam expander 2, a first reflecting mirror 15, a second reflecting mirror 16, a third reflecting mirror 17, a fourth reflecting mirror 18, a fifth reflecting mirror 19, a vibrating mirror 3, a lens 4, a carrying platform 6, an adsorption component 7, a U shaft 8, an infrared height measuring component 9, a CCD camera positioning system 10, a dust extraction component 11, a winding machine feeding and winding system 12, a winding machine winding system 13 and a tool clamp 14 along a light path propagation path.
In the above system, the exit beam of the laser 1 is coaxial with the beam expander 2.
The first reflecting mirror 15 and the second reflecting mirror 16 are fixed on the base of the machine table, and the Y-axis flying light path is debugged.
The third reflecting mirror 17 is installed on the Y axis of the linear motor and can run along with the Y axis to form a first path of flying light path.
The mirror base of the third reflecting mirror 17 is provided with a fine-tuning guide rail, and 4 direction adjustment can be realized together with the mirror base and the fine-tuning guide rail is used for debugging an X-axis flight light path.
The fourth mirror 18 is mounted on the X-axis and is operable with the X-axis.
The five reflectors 19, the vibrating mirror 3, the lens 4, the infrared height measuring assembly 9, the CCD camera positioning system 10 and the dust extraction assembly 11 are all arranged on the fixture 14, the fixture 14 is arranged on the Z axis and can move up and down, the Z axis is arranged on the X axis and can be linked with the X axis and the Y axis, the X axis and the Y axis are parallel to the surface of the carrying platform 6, and the Z axis and the U axis are perpendicular to the surface of the carrying platform 6.
Specifically, the winder 11 located at the left end of the machine platform is used for conveying materials, the materials pass through the processing platform to the right-end winder 12 through the left-end winder, and after a whole-width sample is processed, the right-end winder 12 winds the materials again. Winding and counter-winding by a winding machine are of the prior art and will not be described in detail here.
The dust extraction component 11 moves along with the vibrating mirror, and timely extracts floating dust generated in the processing process. The adsorption component 7 is positioned below the carrying platform 6, takes away residues generated in the processing process, and plays a certain role in vacuum adsorption and fixation of the membrane material. The infrared height measurement assembly 9 is arranged beside the vibrating mirror and can move along with the X, Y shaft, and is used for monitoring the whole-width level of the carrying platform.
Specifically, the visual positioning component is used for positioning a graphic mark processing position, and after the CCD camera visual positioning system automatically captures the graphic mark point, the formed graphic starting point coordinates and the processing angle of the whole graphic and the carrying platform can be automatically imported into a processing software processing interface.
The two paths of flight light paths are used for realizing large-format splicing of image files, the large-format image files can be automatically divided into a plurality of effective single vibrating mirror image files in processing software, and after the vibrating mirrors process one single-format image file, the flight light paths can automatically run to the next single-format image file processing position for processing according to the system path.
The Z-direction lifting shaft is arranged above the carrying platform and is linked with the Y-axis, and the Z-direction lifting shaft is used for controlling a light beam focusing focus in the processing process.
The U-axis arranged below the carrying platform controls the lifting of the carrying platform when the winding machine transmits materials, the drawing file is processed when the carrying platform is lifted, and the winding machine winds and takes away the processed materials when the carrying platform is lowered.
The processing software is used for loading the large-format CAD drawing file to carry out automatic segmentation processing and control the automation process of the whole platform.
In this embodiment, set up adsorption component and shake mirror synchronous operation's dust extraction subassembly, both have in time to remove dust residue effect, but distinguish. The central area of the jig of the adsorption component is fully provided with holes of an array, the diameter of the holes is larger than that of a circle in a processing drawing file, the holes are honeycomb-shaped, suction force can be effectively and uniformly distributed, a closed vacuum system is formed after a sample is placed on the upper carrying platform, a cavity with a certain closed range is arranged between the carrying platform and a honeycomb plate, the design is favorable for falling heavy residues such as generated film material residues or copper foil metals into the cavity to be taken away on one hand, the processing materials are not limited to PI films, on the other hand, the ultra-soft PI film materials are uniformly distributed, adsorbed, supported and fixed, the suction force of a local area is prevented from being too strong, the film material is prevented from being sunken, and the precision and the technological effect are influenced. And the dust extraction component above the vibrating mirror only plays a role in taking away dust in the air.
In the embodiment, the laser adopts ultraviolet skin second equipment, the pulse width is 10ps, the wavelength is 355nm, the frequency is 100-2000 khz, the power is 0-25W, a focusing light spot formed at a focus of laser is 4-10 um, the speed of a high-precision digital galvanometer selected by the galvanometer is 0-20000 mm/s, the precision is +/-2.5 um, the lens is a telecentric lens, the focal depth range of the planeness in a single plane is 0.1mm, the levelness of the whole plane of the object carrying platform is 20um, the range of the two paths of flying light paths is 300x600mm, and the pressure of a dust pumping and adsorbing system is 0-40 Mpa.
Before starting processing, the laser path is adjusted to enable laser pulse to be focused on the surface of a sample and to process a pattern file within a single breadth range of the film sample, then the film sample is fixed and is prevented from moving in the processing process, the surface of the film is prevented from being scratched (PI film surface scratch shown in figure 7), then a large-breadth pattern file is poured into the film, a single processing breadth pattern file is obtained through breadth cutting, pattern file processing coordinates are obtained through cooperation of a visual positioning component and processing software, when laser processing is carried out, a U-shaft carries a carrying platform to be operated to a processing position, the film is automatically adsorbed, the laser beam can process along the pattern file path, after one single-breadth pattern file is processed, the laser beam can be automatically operated to the single-breadth pattern file position of a next array to be processed until all pattern files are processed, at the moment, the U-shaft carries the carrying platform to descend, adsorption is automatically disconnected, the right end of a complete breadth pattern file is received by the winding machine, and then the left end of the winding machine feeds a complete breadth pattern file length to enter a next automatic processing system circulation.
Corresponding to the processing system, the invention also provides a high-precision large-format processing method for punching the film material, which is characterized in that the PI film thickness is 75um, the picture file format is 250x520mm, the single lens processing format is 43x43mm, and the specific processing method is as follows:
Checking machining software of a machine, returning all motion control systems to zero, adjusting optical paths until the two paths of flying optical paths are within a range of X, Y shafts of 300x600mm, wherein the barycenter coordinates of focusing light spots below the lens are smaller than 100um;
Opening an infrared height measurement system, randomly sliding in the breadth of the carrying platform, and adjusting the height of the carrying platform until the levelness of the whole breadth of the carrying platform is within 20 um;
Thirdly, the film material is arranged at the roll feeding end of the winding machine and then passes through the machine platform to be spread on the carrying platform, and then is fixed at the roll feeding end of the winding machine, the adsorption and dust extraction assembly is opened, the pressure is set to be 0.4Mpa, U, Z axis parameters are set, so that the laser beam focus is focused on the surface of the film material, namely U1 and Z1 respectively, and the U axis parameters are U2 when the winding machine is used for winding;
And fourthly, opening processing software, importing 250x520mm CAD drawing files to be processed, and clicking software interface segmentation to automatically segment the CAD drawing files into 6x13 array drawing files. The software dividing drawing file is divided according to the single processing breadth 43x43mm of the lens, and the size of the divided drawing file is 6x43 = 258mm, 13x43 = 559mm, namely 258x559 is named and slightly larger than that of the CAD drawing file. Here, the lens can be self-distributed according to the difference of the lens format and the difference of the CAD drawing file size, as long as the size of the division is larger than the CAD drawing file size. And opening the CCD, automatically capturing Mark points on the image by a CCD vision system, inputting the coordinates of the first single format of the divided image, and automatically generating the coordinates of 6x13 image files of the array.
Inputting processing parameters into a segmented marking picture interface loaded on a processing software interface, wherein the light output power of a laser is 4W, the frequency is 2000khz, the scanning speed of a vibrating mirror is 1000mm/s, the jump speed is 500mm/s, the on/off time delay is 70/150us, and the processing times are 2 times;
Clicking a processing button of a processing software control interface, automatically inputting a PI film material with CAD breadth length by a winding machine, automatically rising a U shaft to a U1 position, automatically opening an adsorption system, automatically moving the Z shaft to the Z1 position, automatically moving a X, Y shaft to a first single-breadth picture file position which is automatically divided, automatically processing a laser to light along a picture file path, automatically processing a X, Y shaft to a second single-breadth picture file position which is automatically divided after the first single-breadth picture file is processed, automatically processing the laser to light, sequentially pushing inwards until all the picture files of the array are processed, namely, after the processing of a complete CAD large-breadth picture file is completed, automatically disconnecting the adsorption system, automatically lowering the U shaft to the U2 position, and automatically winding the PI film material with CAD breadth length by a winding machine winding system, thereby completing the automatic processing of the CAD large-breadth picture file. The feeding end of the winder then continues to feed PI film material of a CAD web length into the next system cycle. And (3) taking down the complete processed membrane material until the whole processing of the membrane material is completed.
The microscopic schematic diagrams of the hole diameters of the local areas of the PI film with the thickness of 75um processed at this time are shown in figures 2-6, wherein the hole diameters of the local areas are 30um, 50um, 75um, 100um and 2mm.
It should be noted that the above-mentioned embodiments are merely for illustrating the technical solution of the present invention, and not for limiting the same, and although the present invention has been described in detail with reference to the above-mentioned embodiments, it should be understood by those skilled in the art that the technical solution described in the above-mentioned embodiments may be modified or some or all of the technical features may be equivalently replaced, and these modifications or substitutions do not deviate from the essence of the corresponding technical solution from the technical solution of the embodiment of the present invention.
Claims (9)
1. A high-precision large-format processing system for film perforation is characterized by comprising a laser device, an auxiliary device and a control device, wherein,
The laser device comprises a laser, a beam expander, a reflector group, a vibrating mirror, a lens, a reflector group and a reflector group, wherein the laser is used for generating laser pulses, the beam expander is used for expanding the pulse spot size generated by the laser, the reflector group is used for turning back a light path, the vibrating mirror is used for controlling image processing within a single breadth range of a film sample, the lens is used for focusing laser beams coming out of the vibrating mirror and incidence on the film sample, the reflector group comprises a reflector I and a reflector II which are arranged on a machine base and used for controlling a Y-direction flight light path, the reflector III is arranged on a Y-axis of a linear motor and used for controlling an X-direction flight light path, the reflector IV is arranged on the X-axis of the linear motor and synchronously moves along with the X-axis, the reflector V-direction lifting axis is arranged on a Z-direction lifting axis and synchronously moves along with the Z-direction lifting axis, one path is a Y-direction flight light path, and the other path is an X-direction flight light path, and the film sample is motionless in the whole breadth processing process of the film;
The auxiliary device comprises a winding machine, a dust extraction component, an adsorption component, an infrared height measurement component, a vibration mirror, a linear motor, a vibration mirror, a film sample fixing device and a control device, wherein the winding machine is used for conveying and winding film materials;
The control device comprises a visual positioning component, two flight light paths, a Z-direction lifting shaft, a U-axis and processing software, wherein the visual positioning component is used for positioning a picture processing position, the two flight light paths are used for automatically running to a next single-frame picture processing position according to a system path to process after a single-frame picture is processed by a vibrating mirror, so that large-frame picture splicing is realized, the Z-direction lifting shaft is linked with a Y-axis of a linear motor and used for controlling a light beam focusing focus in a processing process, the U-axis is used for controlling lifting of a carrying platform when a winding machine transmits a film material, and the processing software is used for loading the large-frame CAD picture and automatically dividing the large-frame CAD picture into a plurality of single-frame large-frame picture.
2. The film perforation high-precision large-format processing system according to claim 1, wherein a fine adjustment guide rail is arranged on a mirror base of the third reflecting mirror and is used for realizing four-direction adjustment together with the mirror base.
3. The high-precision large-format processing system for film perforation is characterized in that an X axis and a Y axis of a linear motor are parallel to the surface of a carrying platform, a Z-direction lifting axis and a U axis are perpendicular to the surface of the carrying platform, the U axis is arranged below the carrying platform, the Z-direction lifting axis is arranged above the carrying platform, and the U axis is parallel to the Z-direction lifting axis.
4. The high-precision large-format processing system for film perforation according to claim 1, wherein the five reflecting mirrors, the vibrating mirrors, the lenses, the infrared height measuring assembly, the visual positioning assembly and the dust drawing assembly are all arranged on a fixture, and the fixture is in linkage with an X axis and a Y axis of a linear motor and synchronously moves along with a Z-direction lifting axis.
5. The high-precision large-format processing system for film perforation according to claim 1, wherein the adsorption assembly comprises a jig, the central area of the jig is fully distributed with array holes, and the diameter of the holes is larger than that of circles in processing figures.
6. The high-precision large-format processing system for film perforation is characterized in that a pulse width of a laser is 100 fs-10 ps, a wavelength of the laser is 355-1064 nm, a speed of a vibrating mirror is 0-20000 mm/s, precision is +/-2.5 um, a lens is a telecentric lens, a single-plane-in-plane focal depth range is 0.1mm, and a spot diameter of a laser pulse is 3-20 um.
7. A method for processing a film material with high precision and large format by using the system of any one of claims 1-6, characterized in that the method comprises the following steps:
the optical path of the laser is adjusted, so that the laser beam is focused on the surface of the film material, and the lifting and lowering positions of the Z-direction lifting shaft and the U-axis are respectively adjusted;
Fixing the film material on a feeding machine at the left end of a winding machine, adjusting the position, enabling the film material to pass through a machine table and be positioned above a carrying platform, and fixing the other end of the film material on a receiving machine at the right end of the winding machine;
leading in a large-format CAD drawing file, inputting a lens format value, and automatically dividing the large-format CAD drawing file according to the lens format to form n1xn2 array drawing files;
capturing the position coordinate of the first image file and the offset angle of the whole image file, inputting the position coordinate and the offset angle of the whole image file into processing software, and obtaining the processing coordinates of the rest image files;
starting processing, lifting the U-axis carrying platform to a processing position, and automatically adsorbing the membrane material;
Processing the laser beam along a picture file path, and automatically running to a single-picture file position of the next array to process through two paths of flight light paths after finishing processing a single-picture file until all picture files are processed;
the U-shaft carries the carrying platform to descend, adsorption is automatically disconnected, and the right end of the winding machine receives a complete web mask material length.
8. The method for processing the film perforation high-precision large format according to claim 7, wherein when processing software divides the image files, if the size cannot be multiplied by an integer, the overall format of n1xn2 array image files obtained by automatic division is slightly larger than the format of the input CAD image files, but the effective sizes of the processed overall image files are the same.
9. The method for processing the film perforation high-precision large format according to claim 7, wherein the drawing file formed after the automatic segmentation of the processing software is provided with laser processing parameters including laser power, frequency, scanning speed of a vibrating mirror, jump speed, on/Guan Guangyan time and processing times at a drawing file marking interface.
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| CN119794555A (en) * | 2024-12-30 | 2025-04-11 | 中国科学院宁波材料技术与工程研究所 | A method and device for improving processing efficiency of ultra-high-speed scanning galvanometer |
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| CN113664378A (en) * | 2020-05-15 | 2021-11-19 | 无锡天光自动化科技有限公司 | Large-breadth splicing laser marking machine |
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| CN102626834A (en) * | 2012-05-07 | 2012-08-08 | 上海市激光技术研究所 | Dual-pickup-head laser fast cutting device used for different formats and application method |
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