CN101617264B - Methods and systems for laser processing continuously moving sheet material - Google Patents
Methods and systems for laser processing continuously moving sheet material Download PDFInfo
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- CN101617264B CN101617264B CN2007800503992A CN200780050399A CN101617264B CN 101617264 B CN101617264 B CN 101617264B CN 2007800503992 A CN2007800503992 A CN 2007800503992A CN 200780050399 A CN200780050399 A CN 200780050399A CN 101617264 B CN101617264 B CN 101617264B
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- 238000000034 method Methods 0.000 title claims abstract description 39
- 239000000463 material Substances 0.000 title abstract description 27
- 239000002184 metal Substances 0.000 claims description 13
- 238000003754 machining Methods 0.000 claims description 12
- 238000005286 illumination Methods 0.000 claims description 8
- 239000012788 optical film Substances 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 description 19
- 239000004033 plastic Substances 0.000 description 7
- 229920003023 plastic Polymers 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 239000007767 bonding agent Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000001413 cellular effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241000446313 Lamella Species 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 244000309464 bull Species 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
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- 238000012804 iterative process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000004973 motor coordination Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
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- 230000009897 systematic effect Effects 0.000 description 1
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Abstract
Systems and methods for laser processing continuously moving sheet material include one or more laser processing heads configured to illuminate the moving sheet material with one or more laser beams. The sheet material may include, for example, an optical film continuously moving from a first roller to a second roller during a laser process. In one embodiment, a vacuum chuck is configured to removably affix a first portion of the moving sheet material thereto. The vacuum chuck controls a velocity of the moving sheet material as the first portion is processed by the one or more laser beams. In one embodiment, a conveyor includes a plurality of vacuum chucks configured to successively affix to different portions of the sheet material during laser processing.
Description
Technical field
The present invention relates generally to Laser Processing.In particular, the present invention relates to be used to process the laser-processing system and the method for the sheeting that moves continuously or launch.
Background technology
Can use various laser that the workpiece of number of different types is carried out Laser Processing to realize kinds of processes.Laser is used in and forms (for example) hole and/or blind path in the single or multiple lift workpiece.Semiconductor wafer processing can comprise the processing of various types of laser micro machinery, and comprise (for example) and rule, cut, hole, remove semiconductor links (fuse), thermal annealing, and/or the thick or film assembly of finishing passivity.
Laser can be used for processing the for example material sheet of plastics or blooming etc.Can big plastics or otpical leaf be cut into than small pieces to be used for such as in the flat-panel monitor that uses at (for example) cellular phone, auto-navigation system, PDA(Personal Digital Assistant), laptop computer, TV and other electronic installation etc.Usually, use mechanical puncher to cut the thin slice of plastics or membrane material.Puncher is very fast, but has reduced effective treatment capacity with the frequent change of mould the many shut down times that are associated with safeguarding.In addition, use the big material sheet of cut to be limited to the straight cuts under the two-forty always.
Summary of the invention
The embodiment that this paper discloses is provided for the system and method for the sheeting that Laser Processing moves.In one embodiment, a kind of system that is used to process mobile sheeting comprises: one or more laser Machining heads, and it is through being configured to one or more laser beam said mobile sheeting that throws light on; And vacuum chuck, it is through being configured to that the first of said mobile sheeting is fixed to its place removedly.Said vacuum chuck is further through being configured to control the speed that is added said mobile sheeting in man-hour when said first by said one or more laser beam.
In another embodiment; A kind of method with laser beam processing sheeting comprises sheeting is moved to second roller from first roller, and chuck is fixed to removedly when first roller moves to second roller first of sheeting in the first of sheeting.Said method further comprises with set rate and moves chuck, and is fixed to when moving chuck the first with laser beam illumination sheeting in the first of sheeting.
In another embodiment; A kind of laser-processing system comprises the member that is used for laser beam illumination sheeting, be used for the said part of fixing with the part of laser beam illumination sheeting the time member, be used for the time and move the said member that is used for the member of fixing with constant rate of speed during the second portion of sheeting with the first of laser beam illumination sheeting, and be used to pass that sheeting is presented in the Laser Processing zone and the member that between the illumination of first and second portion, do not stop.
From the following detailed description of the preferred embodiment of carrying out, will understand additional aspect and advantage referring to accompanying drawing.
Description of drawings
Figure 1A, 1B and 1C explanation are used for the conventional system of processing of films.
Fig. 2,3,4 and 5 is the block diagrams that are used to process the system of sheeting according to some embodiment.
Fig. 6 A and 6B are the block diagrams that is used to process the system of sheeting according to another embodiment.
Embodiment
Laser can be used for processing big sheeting, for example plastics or blooming.The thin slice of plastics or blooming can be used on the flat-panel monitor that (for example) is used for cellular phone, auto-navigation system, PDA(Personal Digital Assistant), laptop computer, TV and other electronic installation.
Use laser system that one volume sheeting (for example, film) is cut into the small pieces that are used for particular monitor size and be called conversion.In conversion process, usually a volume sheeting is launched and is placed on another material to be used for processing.Then collect pieces of sheet material through conversion.When said volume sheeting is (for example) when between a plurality of retes, comprising the light polarizing film of bonding agent, tend to adhere to the material of below through the edge of conversion sheet.In the case, be difficult to usually under the situation that does not reduce throughput rate, pick up through conversion sheet.
In general, conventional converting system wherein uses the patterned blade that is embedded in the flat board to come conversion film based on cross cutting (die cutting) system.In this type systematic, the material of flexible rubber-like is used for roller conveyor to collect through conversion sheet.
A. carry out the beam location with three platforms
Existing referring to graphic, wherein same reference numerals is represented similar elements.For the purpose of clear, first indication counter element of reference number is by the graphic numbering of using first.In following description content, a large amount of specific detail are provided so that thoroughly understand embodiments of the invention.Yet, be understood by those skilled in the art that not have the one or more of said specific detail or to utilize under the situation of other method, assembly or material and put into practice the present invention.In addition, in some cases, detail or describe well-known structure, material or operation not in order to avoid obscure each side of the present invention.In addition, characteristic, structure or the characteristic described in one or more embodiment can any suitable mode make up.
Usually through location under mechanical puncher or conventional laser system of processing and be fixed on some material that the appropriate location processes the film volume for example or the film thin slice that disperses.For instance, Figure 1A, 1B and 1C explanation are used for the conventional system 100 of processing of films 110.Shown in Figure 1A; Film 110 is at first moving (indicated like arrow 112) in the machining area under converting system 114 on the motion stage 113, said converting system 114 comprises galvanometric mechanical puncher or the conventional laser system that has on (or not having) X and the Y platform.
Shown in Figure 1B, after film 110 was positioned in the machining area, converting system 114 was carried out processing (indicated like arrow 116).When converting system 114 comprised mechanical puncher or conventional laser system, the motion stage 113 of carrying film 110 must stop when carrying out in processing (for example, cutting).When needs or when requiring above film 110, locate cutting blade or laser beam with a certain accuracy, converting system 114 possibly carried out Alignment Process before in converting system 114 processing of films 110.Shown in Fig. 1 C, after processing, motion stage 113 will shift out machining area (indicated like arrow 118) through conversion film 110.
Therefore, film 110 is moved to the required time of appropriate location before being included in processing of films 110 T.T. that is used to change, and the required time of processing of films 110.Owing to before processing is carried out, film 110 is moved and is arranged on required time of a certain position and aligning converting system 114 (if essential) required time, treatment capacity is sharply reduced.Therefore, the disclosure of this paper allows to eliminate or reduce the non-process time to improve total treatment capacity.In addition, can reduce maybe be by the machinery and the optical stresses that film are flatly remained on the blooming that the general substep iterative process on the machining area causes with dancer (be positioned at before the machining area with afterwards weight) for disclosure.In addition, in certain embodiments, the continuous flow of material causes the optical anisotropy in the material during the Laser Processing, and it can be favourable.For instance, under the situation of light polarizing film, caused anisotropy is improved picture quality in fact.
Fig. 2,3,4 and 5 is the block diagrams that are used to process the system 200 of sheeting 210 according to some embodiment.System 200 comprises a laser instrument 212, a plurality of vacuum chuck 214 (showing 12) and a translation stage or conveyer 216, and said translation stage or conveyer 216 are through being configured to move the machining area that vacuum chuck 214 passes laser instrument 212.In one embodiment, system 200 also comprises X and Y platform (not shown) to move laser beam 212 with respect to sheeting 210.For instance, X and Y platform can comprise platform system.In addition, or in another embodiment, system 200 can comprise galvanometer (not shown), and it is further aimed at the laser beam from laser instrument 212 with sheeting 210 through being configured to.
Such as preceding text argumentation, sheeting 210 can comprise (for example) plastics or blooming.In one embodiment, sheeting 210 has the thickness between about 1mm and the about 2mm.Yet the embodiment that this paper discloses is not limited thereto thickness range.In fact, system 200 can have in fact less than 1mm and in fact greater than the thickness of material of 2mm through being configured to process.In certain embodiments, system 200 processes sheeting 210 at sheeting 210 when first roller is transferred to second roller.In other embodiments, the discrete patch or the thin slice of system's 200 rapidoprints 210.
No matter sheeting 210 comprises discrete patch and still transfers to second roller from first roller, vacuum chuck 214 is all through being configured to when conveyer 216 moves vacuum chuck 214 with sheeting 210 (indicated like arrow 218) under constant rate of speed fixing sheeting 210 firmly.When conveyer 216 and vacuum chuck 214 moved sheeting 210, laser instrument 212 was shipped to sheeting 210 with laser beam (indicated like arrow 220) from the X of conveyer 216 tops and the galvanometer block on the Y platform.
Coordinate the laser beam location through galvanometer, X and Y platform and conveyer 216.Therefore, comprise the beam delivery time total process time, and do not have required extra time of reregistration or laser instrument 212 times material is repeatedly moved into and shifts out the required time of machining area.
The technician will understand from the disclosure of this paper, and being not all needs galvanometer and/or X and Y platform in each embodiment.For instance, in one embodiment, system 200 comprises the conveyer 216 that is used for moving sheeting 210 to be processed, and moves into the X of the laser beam that is mapped to working surface and the stand of Y platform.And the system that this paper discloses can support additional stage, for example is directed against the Z direction with the adjusting beam focusing or through the big or small platform of collimated beam.
According to an embodiment, compound beam steady arm provides slowly with fast moving so that do not stopping to process sheeting 210 under the situation that beam moves.In one embodiment, whole move can be made up of different moving more than three or three, promptly slow, middling speed and fast moving.Yet it is identical with the rudimentary algorithm of conventional compound beam steady arm that rudimentary algorithm can keep.Gantry velocity can be kept constant or can be kept watch on to be used to regulate the beam location.
The rough alignment of material to be processed can carried out on vacuum chuck 214 before 212 times mobile materials of laser instrument.For instance, Fig. 3 and 4 explanations are positioned at along near the position transducer 310 the point of conveyer 216 (showing two), and vacuum chuck 214 is aimed at sheeting 210 at said some place.In other embodiments, sensor 310 can be installed on each vacuum chuck 214 or around the chuck 214.Sensor 310 can be (for example) charge-coupled device (CCD) (CCD) or in order to sensing sheeting 210 any other sensor with respect to the position of vacuum chuck 214.This type of sensor 310 can be located on X and/or Y direction abreast.
In certain embodiments, isolate small pieces from sheeting 210 with predetermined size.In this type of embodiment, as shown in Figure 4, can be through closing vacuum or coming to reclaim institute's separating sheet 410 so that institute's separating sheet 410 is arranged near admittance pallet 412 from chuck 214 from vacuum chuck 214 through applying positive air pressure slightly.After the separating sheet 410, vacuum chuck 214 can be opened vacuum to aim at another part of crude sheeting 210 in said position by conveyer 216 carryings to a position arranging.In another embodiment; If not relating to, technology do not arrange institute's separating sheet 410, so vacuum chuck 214 can move around (for example, around conveyer 216 circulation); Or can move according to the combination of level and vertical moving, so that vacuum chuck 214 turns back to the original aligned position that vacuum is opened.
In order to improve treatment capacity, also can consider double end or bull system.In this type of embodiment, two statures can become mirror image perpendicular to moving on the Y direction of material stream, can influence any vibration that the steady beam with respect to sheeting 210 moves to reduce.
An example dual head system 500 is showed among Fig. 5.In this instance embodiment, two each AOM 512 that comprise CW laser instrument 510 and be configured to submicrosecond laser power control/shutter of laser path.AOM 512 also is configured to be used for the pulse producer of CW laser instrument 510.In another embodiment, AOM512 is configurable for being used for the pulse-picked device of pulse laser.AOM 512 also can make processing not only can during the constant rate of speed cycle, take place through being configured to regulating impulse energy and repetition rate, and can during acceleration and deceleration periods, take place.
Each laser path can comprise optical device; First mirror 514 for example; Be used for laser beam is passed first lens 516, hole 518 and second lens 519 and second mirror 520 that leads from AOM512; Said second mirror 520 is through being configured to laser beam direction beam splitter 522 or beam trap 524, and this depends on AOM 512 selected deflection angles.In one embodiment, beam splitter 522 leads the part of laser beam through being configured to AOM 512 is provided the PWR MON 523 of laser power control.Each beam splitter 522 also is positioned at the part guiding of laser beam in the corresponding processing head 526 on X, the Y platform (stand) 528.Each processing head 526 is aimed at its corresponding laser beam direction on additional stage work surface 530 sheeting 210.
B. stepless (index free) film converting system
Fig. 6 A and 6B are the block diagrams that is used to process the system 600 of sheeting according to another embodiment.This embodiment provides a kind of and adds the method that be fed to sheeting 210 exactly from first roller 610 second roller 612 man-hour at sheeting 210 by one or more laser Machining heads 614 (showing two).The technician will understand from the disclosure of this paper, and two or more processing heads 614 can aimed on the direction of the flow direction that be parallel to sheeting 210 616 (shown in Fig. 6 A and 6B) and/or on the direction perpendicular to the flow direction 616 of sheeting 210.
The motion that motion, vacuum chuck 618 and X and the Y galvanometer of system 600 through when first roller 610 advances to second roller 612, utilizing X and Y linear stage at sheeting 210 coordinated sheeting 210 provides stepless film conversion.In certain embodiments, system 600 also utilizes the Z platform to coordinate the motion of sheeting 210.
In one embodiment, sheeting 210 moves to second roller 612 from first roller 610 continuously during conversion process.In order to process sheeting 210, system 600 is positioned at respective initial positions with processing head 614 and vacuum chuck 618.Shown in Fig. 6 B, vacuum chuck 628 is opened vacuum (indicated like arrow 624) with against vacuum chuck 618 that the sheet metal of sheeting 210 and carrier 620 is in position temporary fixed.Sheet metal is bored a hole so that allow vacuum chuck 618 to draw sheeting 210 against the sheet metal of carrier 620 through suitable.The platform that underlies then moves vacuum chuck 618 so that present sheeting 210 with given rate and in known position, and feasible X and the Y galvanometer that utilizes X and Y linear stage and processing head 614 possibly realized motor coordination accurately.
When vacuum chuck 618 moved sheeting 210, processing head 614 was opened (or releasing stops) its respective laser beams with 210 of convert thin sheet material.After accomplishing conversion process to one group of conversion pattern, laser beam is closed (or being stopped).Vacuum chuck 618 is then closed vacuum makes the sheet metal and the vacuum chuck of sheeting 210 and carrier 620 open in 618 minutes.In one embodiment, in order to realize the steady disengaging of sheeting 210, blow in the hole that vacuum chuck 618 can pass in the sheet metal of carrier 620.Separately, first roller 610 and/or second roller 612 continue to present sheeting 210, and remain on the carrier 620 through conversion sheet.Carrier 620 then is sent to take-off location (seeing the arrow 622 among Fig. 6 A) with sheeting 210 through conversion sheet.
After the first of the sheeting 210 that is fed to second roller 612 from first roller 610 accomplished conversion, vacuum chuck 618, X and Y platform and X and Y galvanometer were moved back into its respective initial positions to aim at the extra section of sheeting 210 again.
When sheeting 210 was changed, chip that uses between the lamella or bonding agent can adhere to the surface of the sheet metal of carrier 620 unfriendly.Along with system 600 continues the different piece and the carrier 620 of sheeting 210 are fixed to vacuum chuck 618, chip and bonding agent can shift between the different piece of sheeting 210.According to an embodiment, for fear of this pollution transportation, the sheet metal of carrier 620 cleaned before aiming at each part of sheeting 210.
In certain embodiments, first roller 610 and/or second roller 612 do not provide the accurate rate controlled to sheeting 210.In fact, the vacuum chuck 620 that has a linear stage that underlies provides the accurate reference of transition period speed and position.Yet, bad for fear of the speed that provides by roller 610,612 and the speed that provides by vacuum chuck 620 than big-difference, system 600 can comprise rate controller and feedback transducer to control relative speed.Therefore, each part of sheeting 210 can with vacuum chuck 618 rapid alignments.Rate controlled also allows during the whole conversion process of the whole continuous slice of material or volume with constant rate of speed in fact sheeting 210 to be fed to second roller 612 from first roller 610.
In certain embodiments, vacuum chuck 618 provides the unique of sheet metal of carrier 620 to move.In other embodiments, the sheet metal of carrier 620 is driven by other roller (showing four) when not being fixed to vacuum chuck 618.In some this type of embodiment, system 600 comprises suitable rate controlled and feedback with the difference between the speed of the speed of the sheet metal that reduces carrier 620 and vacuum chuck 618.
Be understood by those skilled in the art that, can under the situation that does not break away from ultimate principle of the present invention, make many variations the details of the foregoing description.Therefore, scope of the present invention should only be confirmed by appended claims.
Claims (24)
1. system that is used to process mobile sheeting, said system comprises:
One or more laser Machining heads, it is through being configured to one or more laser beam said mobile sheeting that throws light on; And
Vacuum chuck; It is through being configured to that the first of said mobile sheeting is fixed to its place removedly; Said vacuum chuck further moves through a laser processing zone when said first is processed by said one or more laser beam, to control the speed of said mobile sheeting through configuration; Wherein said mobile sheeting is presented with constant rate of speed in fact, and during Laser Processing, moves continuously.
2. system according to claim 1, wherein, in case Laser Processing begins, said sheeting just moves to second roller from first roller continuously.
3. system according to claim 2, wherein when said first is not fixed to said vacuum chuck, at least one in said first roller and said second roller controlled the said speed of said mobile sheeting.
4. system according to claim 1; Wherein said vacuum chuck is further through being configured to the said first that said first at said mobile sheeting discharges said mobile sheeting after by said one or more laser beam processing, and the second portion of said mobile sheeting is fixed to it removedly sentences by said one or more laser beam and process.
5. system according to claim 1, it further comprises the conveyer that is attached to said vacuum chuck, said conveyer is through being configured to control the speed of said vacuum chuck.
6. system according to claim 5; Wherein said conveyer comprises one or more extra vacuum chucks, and said extra vacuum chuck is fixed to said one or more second portions during one or more second portions that are configured to process with said one or more laser beam said mobile sheeting.
7. system according to claim 6; Wherein said one or more laser beam are separated in flakes with said one or more second portions from said first through being configured to, and in wherein said vacuum chuck and the said extra vacuum chuck at least one is further through being configured to being sent to the admittance pallet through the sheet that separates.
8. system according to claim 1; It further comprises and is positioned at said mobile sheeting and the carrier between the said vacuum chuck; Said vacuum chuck is through being configured to that said carrier is fixed to its place removedly with the said first of said mobile sheeting, said carrier through be configured to after said sheeting is by said one or more laser beam processing, to admit and transmit said sheeting through separating sheet.
9. system according to claim 8, wherein said vacuum chuck further through be configured to positive air pressure be applied to said sheeting said through separating sheet so that it is discharged to the admittance pallet from said carrier.
10. system according to claim 8, wherein said carrier comprises the perforated sheet metal.
11. system according to claim 10, wherein said sheet metal is through being configured to be used to transmit said travelling belt through separating sheet.
12. system according to claim 1, it further comprises motion stage, and said motion stage is through being configured to move said one or more laser Machining heads with respect to said mobile sheeting.
13. system according to claim 1, it further comprises one or more position transducers, the data of said position transducer through being configured to be provided for to make said vacuum chuck to aim at the said first of said mobile sheeting.
14. system according to claim 1, wherein said sheeting comprises blooming.
15. the method with laser beam processing sheeting, said method comprises:
Said sheeting is moved to second roller from first roller;
Chuck is fixed to removedly when said first roller moves to said second roller said first of said sheeting in the first of said sheeting;
Move said chuck with set rate, together with the first of the sheeting that is fixed in chuck, through a laser processing zone; And
When the said first of said sheeting is fixed to said mobile chuck with the throw light on said first of said sheeting of said laser beam.
16. method according to claim 15, it further comprises:
After the said first of said sheeting is by said laser beam processing, discharge the said first of said sheeting from said chuck; And
Do not stopping said sheeting is moved to from said first roller under the situation of said second roller second portion that said chuck is fixed to removedly said sheeting.
17. method according to claim 15, it further comprises and uses the conveyer be attached to said chuck to move said chuck with set rate.
18. method according to claim 17, it further comprises:
One or more extra chucks that use said conveyer to move to be attached to its place; And
Two or more second portions that said two or more extra chucks are fixed to said sheeting removedly when said first roller moves to said second roller at said sheeting are to be used for Laser Processing.
19. method according to claim 15, it further comprises the said sheeting on the said chuck is sent to the admittance pallet through separating sheet.
20. method according to claim 15, it further comprises:
Carrier is removably mounted between the said fixing removedly first of said chuck and said sheeting;
After said first is by said laser beam processing, the said first of said carrier and said sheeting and said chuck are broken away from; And
On said carrier, transmit said sheeting through separating sheet.
21. method according to claim 15, it further comprises with respect to said mobile sheeting and moves laser Machining head.
22. a laser-processing system, it comprises:
Be used for member with laser beam illumination sheeting;
The member that is used for the said part of fixing when the part of the said sheeting that throws light on said laser beam;
Be used for when the first of the said sheeting that throws light on said laser beam and move the said member that is used for the member of fixing with constant rate of speed during the second portion of said sheeting; And
Be used to pass that said sheeting is presented in the Laser Processing zone and the member that between the said illumination of said first and said second portion, do not stop.
23. laser-processing system according to claim 22, it further comprises the member through separating sheet that is used for after said first and said second portion are by said laser beam illumination, transmitting said sheeting.
24. laser-processing system according to claim 23, the wherein said member that is used for fixing is through being configured to the said member that is used to transmit sheeting of fixing.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US88688107P | 2007-01-26 | 2007-01-26 | |
| US60/886,881 | 2007-01-26 | ||
| US11/949,582 US9029731B2 (en) | 2007-01-26 | 2007-12-03 | Methods and systems for laser processing continuously moving sheet material |
| US11/949,582 | 2007-12-03 | ||
| PCT/US2007/086898 WO2008091447A1 (en) | 2007-01-26 | 2007-12-10 | Methods and systems for laser processing continuously moving sheet material |
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| CN101617264A CN101617264A (en) | 2009-12-30 |
| CN101617264B true CN101617264B (en) | 2012-11-21 |
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| CN2007800504302A Active CN101617448B (en) | 2007-01-26 | 2007-12-07 | Method and system for generating pulse trains for materials processing |
| CN2007800503992A Active CN101617264B (en) | 2007-01-26 | 2007-12-10 | Methods and systems for laser processing continuously moving sheet material |
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| TWI594828B (en) | 2009-05-28 | 2017-08-11 | 伊雷克托科學工業股份有限公司 | Acousto-optic deflector applications in laser processing of features in a workpiece, and related laser processing method |
| JP5552373B2 (en) * | 2010-06-02 | 2014-07-16 | 浜松ホトニクス株式会社 | Laser processing method |
| JP6055414B2 (en) * | 2010-10-22 | 2016-12-27 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | Laser processing system and method for beam dithering and skiving |
| DE102010044128A1 (en) * | 2010-11-18 | 2012-05-24 | Bundesdruckerei Gmbh | Laser apparatus and method for processing objects with a controllable in the pulse energy laser |
| TWI473373B (en) | 2012-11-30 | 2015-02-11 | Ind Tech Res Inst | The apparatus of generating pulse train with tunable spacing time |
| CN104332809B (en) * | 2014-08-25 | 2015-08-26 | 深圳市创鑫激光股份有限公司 | Based on the adjustable pulse width pulse optical fiber of acoustooptic switch |
| JP6682148B2 (en) * | 2016-12-13 | 2020-04-15 | 住友重機械工業株式会社 | Laser pulse cutting device and cutting method |
| EP3650805A1 (en) * | 2018-11-07 | 2020-05-13 | Universität Bayreuth | Method and device for in situ process monitoring |
| CN111525385B (en) * | 2020-07-02 | 2020-12-18 | 武汉华锐超快光纤激光技术有限公司 | A femtosecond fiber laser high-precision pulse POD control method and circuit |
| CN111999958B (en) * | 2020-08-25 | 2022-09-16 | 华中科技大学 | A laser beam splitting device and method based on cascade acousto-optic deflection |
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| CN1190047A (en) * | 1997-02-06 | 1998-08-12 | 松下电器产业株式会社 | Laser processing device and laser processing method |
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| US5191466A (en) * | 1991-08-26 | 1993-03-02 | Optrotech Ltd. | High resolution two-directional optical scanner |
| US5909278A (en) * | 1996-07-29 | 1999-06-01 | The Regents Of The University Of California | Time-resolved fluorescence decay measurements for flowing particles |
| JP3945951B2 (en) * | 1999-01-14 | 2007-07-18 | 日立ビアメカニクス株式会社 | Laser processing method and laser processing machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1190047A (en) * | 1997-02-06 | 1998-08-12 | 松下电器产业株式会社 | Laser processing device and laser processing method |
| US6090330A (en) * | 1997-02-06 | 2000-07-18 | Matsushita Electric Industrial Co., Ltd. | Laser processing method |
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| CN101617448B (en) | 2012-05-23 |
| CN101617448A (en) | 2009-12-30 |
| CN101617264A (en) | 2009-12-30 |
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