CN1152429C - Packaged image sensing chip and packaging method thereof - Google Patents

Abstract

A packaged image sensing chip and a packaging method thereof are provided. In order to provide a packaged semiconductor element and a packaging method thereof, which can realize batch production, low cost, shortened chip signal transmission distance and improved signal transmission quality, the invention provides a packaged image sensing chip, which comprises a chip, a plurality of metal sheets electrically connected with the chip and arranged at intervals, and a transparent colloid covering each metal sheet, the chip arranged on a metal bearing piece and filling gaps; the packaging method comprises the steps of adhering metal sheets at intervals on the adhesive tape, electrically connecting the chips and the first surfaces of the metal sheets, covering and covering a plurality of metal sheets, the chips and transparent colloid filled in gaps among the metal sheets.

Description

Packaging image sensing chip and packaging method thereof

technical field

The invention belongs to packaging semiconductor elements and a packaging method thereof, in particular to packaging an image sensing chip and a packaging method thereof.

Background technique

In order to meet the requirements of heat dissipation and high sealing performance, general image sensor chips use ceramic materials as the substrate for carrying the chip. The periphery of the substrate is formed with cross-shaped pins that conduct with each other, and the chip is placed on the substrate. Then, connect the pins of the chip and the base material with wires, and then cover the chip with light-transmitting glass to complete the packaging of the packaged image sensor chip. In this way, the packaged packaged image sensor chip can be packaged as The pins on the lower surface of the substrate are electrically connected to the circuit board.

This kind of ceramic material is used as the base material for packaging image sensor chips. When processing and molding, attention must be paid to the selection of ceramic material components and the control of processing temperature. If the selection or control is improper, the base material will be deformed or cracked. Furthermore, since the structure of the ceramic base material cannot be cut, it must be packaged in a single package, which cannot be mass-produced, so that the production cost is quite high.

Furthermore, since the pins on the lower surface of the base material are used for electrical connection with the circuit board, the pins must have relatively flat contact surfaces so as not to affect the electrical connection between the base material and the circuit board. However, the conventional pins are formed in a horizontal shape by stamping to serve as the pins on the upper and lower surfaces of the substrate, so it is difficult to obtain relatively flat pins and affect the signal transmission of the image sensor chip. .

In addition, the electrical signal transmission distance formed by the horizontal (匚)-shaped pins is relatively long, which also affects the signal transmission from the chip to the substrate.

Furthermore, when the packaged image sensing chip is packaged, the chip must be covered with light-transmitting glass, so that the optical signal of the chip can be transmitted through the light-transmitting glass, which is inconvenient for packaging.

Contents of the invention

The object of the present invention is to provide a packaged image sensor chip and a packaging method thereof which can be mass-produced, have low cost, shorten the signal transmission distance of the chip, and improve the signal transmission quality.

The packaged image sensing chip of the present invention includes a chip, a plurality of metal sheets and a light-transmitting transparent colloid; the metal sheet has a first surface as a signal input end and a second surface as a signal output end; a plurality of metal sheets are arranged at intervals to form an isolation The gap; the chip set on the metal carrier is electrically connected to the first surface of each metal sheet; the transparent colloid covers the first surface of each metal sheet and the chip, and is filled in the gap between each metal sheet.

The method for packaging an image sensor chip of the present invention includes the following steps:

step one

metal sheet

Arranging a plurality of metal sheets with first and second surfaces at intervals and sticking them on the adhesive tape forming the chip accommodation area, forming isolated gaps between the metal sheets; setting the hollow mold on the adhesive tape, and making the multiple The sheet metal is inside the hollow mold.

step two

Connect chips and metal sheets

placing the chip with multiple welding pads in the accommodating area of the adhesive tape, and electrically connecting the first surface of the metal sheet with the welding pads;

step three

Cover with transparent colloid

Pouring transparent plastic material into the mold to form a transparent colloid that covers multiple metal sheets, chips and fills the gaps between the metal sheets;

step four

Take out the packaged image sensing chip of the present invention

The adhesive tape is torn off, and the packaged image sensing chip of the present invention is taken out from the mold.

in:

The metal sheet is a flat metal sheet.

The wires of the chip are electrically connected to the first surface of the metal sheet by wire bonding.

The chip is set on the carrier; an isolated gap is formed between the carrier and the metal sheet; the transparent colloid covering each metal sheet, wire and chip is filled in the gap between each metal sheet and the carrier, so as to connect each metal sheet to the carrier. The carrier is consolidated and electrically isolated.

The bearing part and each metal sheet are molded integrally by die-casting.

In step 2, the wires formed by wire bonding are connected to the pads of the chip and the first surface of the metal sheet.

The adhesive tape is provided with an accommodating area for placing the carrier.

The bearing part is integrally formed with a plurality of metal sheets.

Because the packaged image sensing chip of the present invention includes a chip, a plurality of metal sheets with first and second surfaces, and a light-transmitting transparent colloid; each metal sheet is arranged at intervals with gaps; The first surface of the sheet forms an electrical connection; the transparent colloid covers the first surface of each metal sheet and the chip, and fills the gap between the metal sheets; the packaging method includes adhering the metal sheet on the adhesive tape at intervals, and electrically connecting the chip. And the first surface of the metal sheet is covered with a plurality of metal sheets, chips and transparent colloid filled in the gaps between the metal sheets. When in use, the signal transmission medium of the chip is made of a thin metal sheet. When the signal of the chip is transmitted to the circuit board, a shorter transmission distance can be obtained to have a better signal transmission effect, and the second metal sheet The surface can form a better electrical contact effect with the circuit board; when packaging, multiple substrates can be molded at the same time, and then cut into a single package image sensor chip to simplify the process; not only can mass production, low cost, but also The purpose of the present invention is achieved by shortening the chip signal transmission distance and improving the signal transmission quality.

Description of drawings

FIG. 1 is a schematic cross-sectional view of the packaged image sensor chip structure of the present invention.

FIG. 2 is a schematic cross-sectional view of Step 1 of the method for packaging an image sensor chip according to the present invention.

FIG. 3 is a schematic cross-sectional view of Step 2 of the method for packaging an image sensor chip according to the present invention.

4 is a schematic cross-sectional view of Step 3 of the method for packaging an image sensor chip according to the present invention.

Detailed ways

As shown in FIG. 1 , the packaged image sensing chip of the present invention includes a plurality of metal sheets 10 , a carrier 20 , a chip 18 disposed on the carrier 20 , and a light-transmitting transparent glue 26 .

The metal sheet 10 has a first surface 12 serving as a signal input end and a second surface 14 serving as a signal output end. The metal sheet 10 is a flat metal sheet.

The supporting part 20 is made of metal material, and it is die-cast integrally with each metal sheet 10. Most of the metal sheets 10 and the supporting parts 20 are arranged at intervals, and isolation is formed between each metal sheet 10 and between each metal sheet 10 and the supporting part 20. The clearance of 24.

Chip 18 is provided with multiple bonding pads 16 .

The chip 18 is arranged on the carrier 20, on which the welding pad 16 is a wire 22 formed by wire bonding (wire bond) to form an electrical connection with the first surface 12 of the metal sheet 10 as the signal input end; the transparent colloid 26 covers each metal Sheets 10, wires 22 and chips 18 are filled between the metal sheets 10 and in the gap 24 between each metal sheet 10 and the carrier 20, so as to consolidate each metal sheet 10 and the carrier 20 and make each metal sheet 10 Electrical isolation is formed between the sheets 10 and between each metal sheet 10 and the carrier 20 ; the second surface 14 of each metal sheet 10 serving as a signal output end is exposed on the bottom surface of the packaged image sensor chip of the present invention.

When in use, the packaged image sensing chip of the present invention is placed on a circuit board, and the second surface 14 of each metal sheet 10 is electrically connected to the circuit board. During operation, the light can be transmitted to the chip 18 through the transparent colloid 26, so that the chip 18 can receive the optical signal, and transmit the signal to the first surface 12 of the metal sheet 10 as the input terminal through its pad 16 and wire 22, and then pass The metal sheet 10 is output as the second surface 14 of the output.

The method for packaging an image sensor chip of the present invention includes the following steps:

step one

metal sheet

As shown in FIG. 2 , first, a plurality of metal sheets 10 having a first surface 12 and a second surface 14 are arranged at intervals and adhered to a tape 28, and the carrier 20 carrying the chip 18 is adhered to the tape 28. In the accommodating area 30 of each metal sheet 10 and between each metal sheet 10 and the carrier 20, an isolated gap 24 is formed; the hollow mold 32 is arranged on the adhesive tape (tape) 28, and a plurality of metal sheets 10 And the carrier 20 is located in the hollow mold 32 .

step two

Connect chips and metal sheets

As shown in Figure 3, the chip 18 that is provided with a plurality of welding pads (bonding pad) 16 is placed on the carrier (carrier) 20 that is arranged on adhesive tape 28 accommodating area 30, forms electrical connection chip then by wire bonding 18 welding pads 16 and wires 22 on the first surface 12 of the metal sheet 10, so as to transmit the signal of the chip 18 to the first surface 12 of the metal sheet 10 as the input end, so as to pass the signal through the second surface 14 of the metal sheet 10 as the output end passed to the circuit board.

step three

Cover with transparent colloid

As shown in Figure 4, the transparent plastic material is poured into the mold 32 to form a plurality of metal sheets 12, wires 22, chips 18 and filling between each metal sheet 10 and between each metal sheet 10 and the carrier 20. The transparent colloid 26 in the gap 24 between.

step four

Take out the packaged image sensing chip of the present invention

Tear off the adhesive tape 28, and take out the packaged image sensing chip of the present invention from the mold 32

As mentioned above, the packaged image sensor chip and its package method of the present invention have the following advantages:

1. By using the thin metal sheet 10 as the signal transmission medium of the chip 18, when the signal of the chip 18 is transmitted to the circuit board, a shorter transmission distance can be obtained, thereby having a better signal transmission effect.

2. The metal sheet 10 has a flat second surface 14, which can form a better electrical contact effect with the circuit board.

3. Multiple substrates can be molded at the same time, and then cut into individual packaged image sensor chips. Therefore, the packaging speed is fast and the production cost can be reduced.

4. The transparent colloid 26 is poured and formed by transparent plastic material, and its raw material cost is lower than that of ceramic material, which can greatly reduce the packaging cost.

5. Using the transparent colloid 26 instead of the transparent glass can simplify the process of covering the transparent glass, and the transparent colloid 26 made of transparent plastic material can be poured to form the base material at the same time, so that the packaging cost is greatly reduced.

Claims (9)

1. A packaged image sensing chip, which includes a chip; it is characterized in that it also includes a plurality of metal sheets and a light-transmitting transparent colloid; the metal sheet has a first surface as a signal input end and a second surface as a signal output end; A plurality of metal sheets are arranged at intervals to form an isolated gap; the chip on the metal carrier is electrically connected to the first surface of each metal sheet; the transparent colloid covers the first surface of each metal sheet and the chip, and is filled in in the gaps between the metal sheets. 2. The packaged image sensor chip according to claim 1, wherein the metal sheet is a flat metal sheet. 3 . The packaged image sensing chip according to claim 1 , wherein the chip is electrically connected to the first surface of the metal sheet through wires formed by wire bonding. 4. The packaged image sensor chip according to claim 1, characterized in that an isolated gap is formed between the carrier and the metal sheet; transparent colloid covering each metal sheet, wire and chip is filled between each metal sheet and the metal sheet. In the gap between the supporting parts, each metal sheet is consolidated with the supporting parts and forms electrical isolation. 5 . The packaged image sensor chip according to claim 4 , wherein the carrier and each metal sheet are die-cast integrally. 6. A packaging method for packaging an image sensing chip, characterized in that it comprises the following steps: step one sheet metal; Arranging a plurality of metal sheets with first and second surfaces at intervals and sticking them on the adhesive tape forming the chip accommodation area, forming isolated gaps between the metal sheets; setting the hollow mold on the adhesive tape, and making the multiple The metal sheet is located in the hollow mold; step two Connect chips and metal sheets; placing the chip with multiple welding pads in the accommodating area of the adhesive tape, and electrically connecting the first surface of the metal sheet with the welding pads; step three Covered with transparent colloid; Pouring transparent plastic material into the mold to form a transparent colloid that covers multiple metal sheets, chips and fills the gaps between the metal sheets; step four Take out the packaged image sensing chip of the present invention; The adhesive tape is torn off, and the packaged image sensing chip of the present invention is taken out from the mold. 7. The method for packaging an image sensor chip according to claim 6, wherein in said step 2, the wires formed by wire bonding are connected to the pads of the chip and the first surface of the metal sheet. 8. The packaging method for packaging image sensor chips according to claim 6, wherein an accommodating area for placing the carrier is provided on the adhesive tape. 9. The method for packaging an image sensor chip according to claim 8, wherein the carrier is integrally formed with a plurality of metal sheets.

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