CN1148109C - a circuit board - Google Patents

Abstract

The present invention provides a circuit board which comprises a base layer with a first surface and a second surface, wherein the first surface and the second surface are respectively distributed with a signal circuit and a grounding circuit. The base layer comprises a lateral margin, and the first surface and the second surface are assembled together with a connector at the lateral margin position. The position on the base layer with appropriate distance adjacent to the lateral margin is provided with a plurality of through holes and slits mutually and correspondingly communicated and extended to the lateral margin for guiding and accommodating grounding terminals of the connector. A conductive layer connected with a grounding path of the circuit board is arranged on the inner surfaces of the through holes and the slits, and the conductive layer can be electrically connected with the corresponding grounding terminals.

Description

a circuit board

The invention relates to a circuit board, in particular to a grounding structure for a circuit board of a clip-in connector.

Electrical connectors that are connected to printed circuit boards in a clamping manner have existed for a long time. Card edge connectors are a type of clamping connector, such as the MICTOR connection that can be purchased from AMP Technology Co., Ltd. of Delaware, USA. An example is a matching impedance connector such as a MICTOR (MICTOR is one of the trademarks of AMP Technology Co., Ltd. of Delaware). Figures 1 and 2 are schematic diagrams of the matching impedance connector disclosed in US Patent No. 5,199,885. The connector includes two rows of conductive terminals 10, and a space for receiving a circuit board 12 is formed between the two rows of terminals. These conductive terminals 10 are in contact with the conductive strips 14 provided on the surface of the circuit board 12 to form an electrical connection between the connector 10 and the circuit board 12 . A plurality of through holes 16 are arranged on the circuit board 12 at a position close to the side edge 18 accommodated in the space of the aforementioned conductive terminal 10 and at an appropriate distance, and each through hole 16 is provided with an electrical connection to the circuit board. 12 internal plating for the ground path. The connector is further provided with a plurality of grounding terminals 20, which are arranged in the space between the aforementioned conductive terminals 10, so as to pass through the side edge 18 of the circuit board 12 and enter the corresponding through hole 16, and connect with the circuit board. 12 ground paths to achieve the connection.

In the above-mentioned '885 patent, several methods were mentioned to ensure the correct mating connection between the ground terminal 20 and the inner plating layer of the through hole 16. However, the described methods are not suitable for the actual situation, and additional structures are required. will complicate the structure.

A feasible way to construct an electrical connection path between the ground terminal 20 and the inner plating layer of the through hole 16 is to set a number of slits extending from the side edge 18 of the circuit board 12 to the corresponding through hole 16, so that the ground terminal 20 can pass through These slits extend into said through holes 16 . These slits are processed and formed by special tools when the connector is assembled to the circuit board 12, that is, these slits are processed and formed after the inner plating of the through hole 16 is completed, and thus the result of this processing and forming process, It will inevitably cause irreparable damage to the inner plating layer of the through hole 16 , and the correct and good electrical connection between the ground terminal 20 and the plating layer cannot be guaranteed.

Moreover, each ground terminal 20 is in contact with the inner plating layer of the corresponding through hole 16 through its tip, and only a point contact relationship is formed between the two, so it is difficult to maintain the distance between the ground terminal and the plating layer during the operation of the connector. Continuity and continuity of electrical contact.

Therefore, it is necessary to provide a circuit board structure used in the clip-on connector, which has a stable and reliable grounding performance to overcome the above-mentioned shortcomings of the existing structure.

The object of the present invention is to provide a circuit board combined with a card edge connector, which can ensure a continuous, coherent and good grounding conductive path between the card edge connector and the card edge connector.

To achieve the above purpose, the circuit board includes a base layer with a first surface and a second surface, and signal lines and grounding lines are arranged on the first and second surfaces respectively. The base layer includes a side edge at which the first and second surfaces are combined with a connector at the same time. It is characterized in that a number of through holes and slits are provided on the base layer near the side edge at an appropriate distance, and these slits communicate with the corresponding through holes and extend to the side edge to guide and accommodate the connector. Ground terminal. The first and second conductive layers connected to the ground path of the circuit board are arranged on the inner surface of the through hole and the slit, and can be electrically connected with the corresponding ground terminal. The slit has a width corresponding to the size of the ground terminal, so that the ground terminal can keep in contact with both sides of the slit at the same time, thereby ensuring a stable and reliable electrical connection between the ground terminal and the conductive layer.

In addition, the conductive layer is arranged along the circumference of each through hole and the inner surface of the corresponding slit, and the third and fourth conductive layers are further arranged on the side edge of the circuit board. Since the conductive layer is formed after the slits on the circuit board are formed, the forming process will not cause damage to the conductive layer.

Compared with the prior art, the invention can ensure continuous and coherent grounding performance, relatively simplify the manufacturing process and reduce the manufacturing cost.

The present invention will be further described below in conjunction with the accompanying drawings and preferred embodiments.

Fig. 1 is a partial perspective view of a conventional matching impedance connector.

Fig. 2 is an exploded plan view of a conventional matching impedance connector.

Fig. 3 is a partial perspective view of the circuit board for the clip-on connector of the present invention.

FIG. 4 is a plan view of the circuit board shown in FIG. 3 .

Referring to FIG. 3, the circuit board 100 of the present invention includes a base layer 102 with first and second surfaces 134, 136, and the two surfaces 134, 136 are respectively provided with conductive lines including signal lines 104 and grounding lines 106, The base layer 102 has a side edge 108 connected between the first and second surfaces 134, 136, so that a connector, especially a card edge connector, can be directly assembled at this position, as described in the previous "Description of the Prior Art" described above, and make the conductive terminal of the connector conduct with the signal line 104 .

A plurality of through holes 110 are provided on the base layer 102 at a proper distance from the side edge 108 for insertion of the ground terminals of the card edge connector. A plurality of slits 112 extend from each through hole 110 toward the side edge 108 on the base layer 102 . The slits 112 have openings 114 near the side edge 108 for accommodating corresponding ground terminals of the card edge connector.

A metal layer 116 or a conductive layer formed of other conductive materials (hereinafter referred to as the first conductive layer) is provided on the inner surface of each through hole 110, and the first conductive layer 116 is connected to the ground circuit 106 of the circuit board 110. . Moreover, a metal layer 118 (hereinafter referred to as the second conductive layer) is also provided on the two side walls of each slit 112, and these first and second conductive layers 116, 118 are connected to each other as a whole to form the through hole 110 and the slit. 112, so that when the ground terminal of the card edge connector is inserted into the through hole 110 through the slit 112, the ground terminal of the connector and the circuit board 100 can be connected by means of the first and second conductive layers. The ground lines 106 form an electrical connection. Moreover, the slit 112 has a width corresponding to the cross-sectional dimension of the ground terminal (shown in dotted line in FIG. 4 ), so that the ground terminal can be kept in close contact with the surfaces on both sides in the slit at the same time. A surface contact relationship is formed between the second conductive layer 118 of 112 and the ground terminal. Thereby, a stable mechanical fit between the circuit board 100 and the ground terminal of the connector can be ensured, and a stable and reliable electrical connection between the ground terminal and the conductive layer 106 can be ensured.

In addition, each surface 134, 136 of the base layer 102 is provided with a third conductive layer 120 along the circumference of the through hole 110 and the edge of the slit 112, which is electrically connected to the first and second conductive layers 116, 118. Together. And the fourth conductive layer 122 is also disposed on the side edge 108 . These conductive layers 116 , 118 , 120 , and 122 are connected together to form a continuous ground conductive layer, so as to ensure a continuous and good electrical connection between the ground line 106 and the ground terminal of the connector.

Since the slit 112 is formed before the formation of the conductive layers 116 , 118 , 120 and 122 , the conductive layer will not be irreparably damaged as in the conventional structure due to the slit. Moreover, the two side walls of the corresponding slit 112 are tightly held against the ground terminal, which can provide a stable and reliable electrical connection between the two.

Furthermore, since these slits are formed simultaneously during the manufacturing process of the circuit board 100 , there is no need to resort to special additional tools required in the prior art, and its cost can also be reduced. The process of assembling the connector to the circuit board 100 is relatively simplified by pre-processing the structure of the slit.

If necessary, solder paste can be coated on the first to fourth conductive layers 116 , 118 , 120 and 122 to facilitate soldering the ground terminals to the corresponding through holes 110 . With the structure disclosed in the present invention, the solder paste can be pre-coated before the connector is assembled on the circuit board, so that no additional template circuit design is needed, thereby effectively reducing its total cost.

Claims (9)

1. circuit board, be applicable in the clamp connected connector, it is provided with basic unit, this basic unit includes the surface that is oppositely arranged and between this two surface and can be for the electric connector of the tool earth terminal lateral margin with the winding of clamping connection mode, position at a distance of the suitable distance of this lateral margin on this circuit board is provided with some through holes, it is characterized in that: offer slit some and the corresponding perforation of each through hole on this lateral margin, on the two side walls of described through-hole inner surface and slit, be respectively arranged with first and second conductive layer that interconnects one.

2. circuit board according to claim 1 is characterized in that: each slit all has and the corresponding width of earth terminal width dimensions.

3. circuit board according to claim 1 is characterized in that: described conductive layer is provided with soldering paste.

4. circuit board according to claim 1 is characterized in that: the circumference of the described through hole in the surperficial upper edge of each of this circuit board and the edge of slit are provided with the 3rd conductive layer, and it is the one that is connected with first and second conductive layer.

5. circuit board according to claim 4 is characterized in that: described first and second and three conductive layers are to be wholely set.

6. circuit board according to claim 4 is characterized in that: the lateral margin in circuit board is provided with the 4th conductive layer that is connected with described second and third conductive layer.

7. circuit board according to claim 6 is characterized in that: described first, second and third and four conductive layers are to be wholely set.

8. circuit board according to claim 1 is characterized in that: further be provided with the 4th conductive layer that is connected with second conductive layer on the lateral margin of described basic unit.

9. connector according to claim 8 is characterized in that: these conductive layers are to be wholely set.

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