CN103484860A - Wet etching equipment and supply device thereof - Google Patents

Abstract

The supply device comprises a supply part and an adjusting part, wherein the supply part is provided with a supply channel penetrating through the supply part to convey fluid, the adjusting part is provided with an adjacent channel and a recovery channel, the supply part is arranged in the channel in a penetrating mode so that the fluid flowing through the supply part can be output from the channel, and the recovery channel can suck part of etching solution output from the channel so as to control the output quantity of the fluid.

Description

Wet etching equipment and its supply device

technical field

The invention relates to an etching device, in particular to a wet etching device and a supply device thereof.

Background technique

In the current semiconductor process, such as wafers, packaging substrates, packaging structures, or circuit boards, etc., etchant is used to clean the surface residues on the panels, such as copper slag, glue slag, and barrier layers. Generally, in the cleaning process, the etching solution is used to remove the residue on the surface of the layout, and then the etching solution on the layout is cleaned with a cleaning solution (such as water), and finally the surface of the layout is dried.

1A and 1B are schematic top and side views of the conventional circuit board layout 5 undergoing an etching and cleaning process. As shown in the figure, the wet etching equipment (not shown) sends the etching solution 3 through the delivery pipe 10 to a plurality of nozzles 11 arranged in groups, so that the etching solution 3 is sprayed on the circuit board layout 5 by these nozzles 11 .

However, the existing nozzle 11 is fixed, that is, it is impossible to adjust the position of the nozzle 11 and operate the nozzle 11 individually, so the design of the nozzle 11 needs to be able to spray the etching solution 3 over a wide range to avoid incomplete cleaning. However, due to the inability to control the output of the sprayed etchant 3, it is impossible to micro-etch or selectively etch a specific area, resulting in the inability to clean the surface of a small area, and it is also impossible to perform selective processing with high-precision control for product characteristic variation , so that it cannot meet the demand for improving the fineness of etching control.

In addition, in the existing wet etching equipment, the delivery pipes 10 and nozzles 11 are evenly distributed, and the positions of the delivery pipes 10 and nozzles 11 cannot be adjusted, and the nozzles 11 cannot be operated individually, so it is impossible to target the circuit board layout 5 Precision area etching operations in specific areas. For example, the inability to microetch specific areas results in inability to clean tiny areas of surface debris. Therefore, at present, the general wet etching equipment performs the etching operation in a whole batch and comprehensively in a continuous manner, and cannot perform selective processing with high precision control for product characteristic variation, so that it is difficult to improve the fineness of etching control, thus affecting the characteristic capability of the product. Effectiveness and product yield.

Therefore, how to overcome the various problems of the above-mentioned prior art has become an urgent problem to be solved at present.

Contents of the invention

In view of the shortcomings of the above-mentioned prior art, the main purpose of the present invention is to provide a wet etching device and its supply device to control the output of the fluid.

In the supply device of the present invention, an adjustment member is covered on the periphery of a supply member such as a nozzle, the adjustment member has adjacent channels and recovery channels, and the supply member is penetrated in the channel, so that the etching solution can flow through the channel. channel output, and make the recovery channel absorb part of the etching solution output by the channel, so as to reduce the output volume of the etching solution.

In the aforementioned supply device, it can be arranged on the machine platform of the wet etching equipment, and the machine platform has a positioning member for the supply member to be arranged on the positioning member, so that the supply member and the adjustment member can be driven by the positioning member to the desired location.

In addition, the machine has a programmable logic control system to control the operation of the positioning member, the movement of the etching solution or the operation of the recycling channel.

As can be seen from the above, the wet etching equipment and its supply device of the present invention, by virtue of the design of the recovery channel, the adjustment member can control the output of the sprayed etching solution, that is, the range of the sprayed etching solution can be controlled to target specific areas. Micro-etching or selective etching can clean the surface of small areas, and can carry out selective processing of high-precision control of product characteristic variation, so the ability of precision etching of the wet etching equipment can be improved to achieve high yield and The need for high performance capabilities.

In addition, the machine drives the supply part and the adjustment part to the desired position through the positioning part, and operates the supply part individually through the programmable logic control system, so it can precisely control the specific area of each layout Etching operations. Therefore, when the entire batch of layouts is fully and continuously operated, selective processing with high precision control can be carried out for product characteristic variations according to requirements, so as to improve the fineness of etching control.

Description of drawings

FIG. 1A is a schematic top view of an etching and cleaning process for an existing circuit board layout;

FIG. 1B is a schematic side view of an etching and cleaning process for an existing circuit board layout;

2A is a schematic side sectional view of the supply device of the present invention;

Fig. 2B is a schematic top view of the adjustment member of the supply device of the present invention; and

3A to 3C are schematic top views of different embodiments of the wet etching equipment of the present invention.

Explanation of main component symbols

10 delivery pipe

11 Nozzles

2,2’,2”wet etching equipment

2a Supply device

20 Positioning parts

21 supply parts

21a, 21b supply unit

22 Adjusting parts

220 channels

221 Recycling Road

3 Etching solution

5 circuit board layout

h height difference

x lateral movement

y Move vertically.

Detailed ways

The implementation of the present invention will be described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "upper", "lower" and "a" quoted in this specification are only for the convenience of description, and are not used to limit the applicable scope of the present invention, and the changes or adjustments of their relative relations , without substantially changing the technical content, it should also be regarded as the scope of the present invention that can be implemented.

2A and 2B are schematic diagrams of a supply device 2a for wet etching equipment of the present invention. As shown in FIG. 2A , the supply device 2 a includes a supply part 21 and an adjustment part 22 .

The supply part 21 has a through supply channel (not shown) to transport fluid. In this embodiment, the supply element 21 is a nozzle.

The adjustment part 22 has an adjacent channel 220 and a recovery channel 221, the supply part 21 is passed through the channel 220, so that the etching solution 3 flowing through the supply part 21 is output from the channel 220, and the recovery The channel 221 is used to absorb part of the etching solution 3 output from the channel 220 to reduce the output of the etching solution 3 .

In this embodiment, the recovery channel 221 uses siphon suction to recover the etching solution 3 , as shown in the direction of the arrow in FIG. 2A .

In addition, the port of the recovery path 221 has a height difference h from the port of the channel 220. As shown in FIG. It is located below the port of the channel 220 so that the recovery channel 221 absorbs part of the etching solution 3 output from the channel 220 .

Furthermore, the recovery channel 221 surrounds the outside of the channel 220 , as shown in FIG. 2B , so as to increase the recovery rate of the recovery channel 221 , that is, to improve the accuracy of the micro-supply of the etching solution 3 .

In the supply device 2a of the present invention, the etching area is controlled by the channel 220, and the etching solution 3 is recovered by the recovery channel 221, so that the adjustment member 22 can control the output of the spraying etching solution 3, that is, it can control The range of spraying etchant 3 is used to micro-etch or selectively etch a specific area, so that the surface of a small area (such as a dot area) can be cleaned, and selective processing of high-precision control of product characteristic variations can be performed, so it can To achieve the effect of high precision control.

Please also refer to Fig. 3A to Fig. 3C, which are wet etching equipment 2, 2', 2" having the supply device 2a, and the supply device 2a is set on a machine (not shown).

The machine table has an accommodating space (not shown) for storing fluid (such as etching solution 3), and the supply member 21 is arranged on the machine table, and the supply channel communicates with the accommodating space of the machine table, So that the etching solution 3 in the accommodating space flows through the supply channel to move out of the machine. In addition, the recovery path 221 of the adjustment member 22 is connected to the accommodation space of the machine, so that part of the etching solution 3 output by the channel 220 is sucked back to the accommodation space of the machine through the recovery path 221, as shown in FIG. 2A direction of the arrow indicated.

In this embodiment, the machine has a programmable logic control system (ProgrammableLogic Controller, PLC) and a positioning member 20, and the PLC is used to control the etching cleaning operation, for example, the movement of the etching solution 3 or the operation of the recycling channel 221 , and the positioning part 20 is used to set the supply part 21 thereon, so that the positioning part 20 is controlled by the PLC to drive the supply part 21 and the adjusting part 22 to the required positions.

In addition, when there are multiple supply elements 21, at least two supply elements 21 constitute a set of supply units 21a, 21b, as shown in FIG. 3A and FIG. 3B. Alternatively, as shown in FIG. 3C , the supply elements 21 are arranged in groups to form a group of etching showerheads arranged in a high-density matrix.

The supply unit 21a may be composed of a plurality of supply parts 21 arranged in a rectangle, as shown in FIG. 3A; or, the supply unit 21b may be composed of a plurality of supply parts 21 arranged in a line, as shown in FIG. 3B.

Furthermore, the supply member 21 or the supply units 21a, 21b can be moved longitudinally y by the positioning member 20, as shown in FIG. 3A and FIG. 3B.

In addition, the positioning member 20 can be used as a track, so that the supply member 21 or the supply unit 21a can move x laterally on the positioning member 20, as shown in FIG. 3A.

In the wet etching equipment 2, 2', 2" of the present invention, through the design of the PLC, the supply part 21 or the supply unit 21a, 21b can be individually operated to have selective etching control capability, so the circuit board can be Specific areas of the layout 5 are subjected to precise regional etching operations.

In addition, due to the design of the positioning member 20, the supply member 21 or the supply unit 21a, 21b and the adjustment member 22 are driven to the desired position, and have selective etching control capability, so the circuit board layout 5 can also be controlled. Precision area etching operations in specific areas.

Therefore, when the entire batch of layouts is fully and continuously operated, mobile (as shown in Figure 3A and Figure 3B) or multi-group (as shown in Figure 3C) wet etching equipment 2, 2', 2" etching can be used Clean the circuit board layout 5, so as to improve the fineness of etching control by performing selective processing of high-precision control for product characteristic variations according to requirements. For example, after the initial etching operation, optical inspection is carried out, and then for residues (such as Residual copper block) area (that is, point area) for secondary etching processing, without the need for full-page etching processing.

In addition, there are various types of layouts, such as wafers, package substrates or package structures, and are not limited to circuit boards.

In addition, there are various kinds of fluids in the accommodation space of the relevant machine, and they are not limited to etching liquid, and can also be other liquids (such as water), which is hereby stated.

To sum up, the wet etching equipment and its supply device of the present invention, mainly by the design of the recovery channel, enable the adjustment member to control the output of the sprayed etching solution to perform micro-etching or selective etching, thereby improving the Precision etching capability of wet etching equipment.

In addition, through the design of positioning parts and programmable logic control system, the etching operation can be carried out on the specific area of each layout, so when the whole batch of layouts is fully and continuously operated, selective processing with high precision control can be carried out according to the demand, so as to Improve the fineness of etching control, and improve the effectiveness of the product's characteristic capabilities and the output yield of the product.

The above-mentioned embodiments are only used to illustrate the principles and effects of the present invention, but not to limit the present invention. Any person skilled in the art can modify the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be listed in the claims.

Claims (11)

1. a Wet-type etching equipment comprises:

Board, it has the accommodation space in order to store fluid;

At least one delivery member, it is located on this board, and this delivery member has the supply road run through, and this supply road is communicated with the accommodation space of this board, to make the fluid in this accommodation space, through this supply road, moves to outside this board; And

Adjustment part, it has adjacent channel and reclaims road, and this channel is in order to accommodating this delivery member, so that the fluid of this delivery member of flowing through is by this channel output, and this recovery road is communicated with the accommodation space of this board.

2. Wet-type etching equipment according to claim 1, is characterized in that, this board has positioning element, for this delivery member, is arranged on this positioning element, to drive this delivery member and adjustment part by means of this positioning element to desired position.

3. Wet-type etching equipment according to claim 2, is characterized in that, but this board has program logic control system, with the running of controlling this positioning element and the motion of this fluid, and controls the running in this recovery road.

4. Wet-type etching equipment according to claim 1, is characterized in that, this delivery member is nozzle.

5. Wet-type etching equipment according to claim 1, is characterized in that, when this delivery member is a plurality of, by least two these delivery member, forms one group of feeding unit.

6. Wet-type etching equipment according to claim 1, is characterized in that, when this delivery member is a plurality of, those delivery member are array row and establish.

7. Wet-type etching equipment according to claim 1, is characterized in that, the port in this recovery road and the port of this channel have difference of altitude.

8. Wet-type etching equipment according to claim 1, is characterized in that, this reclaims the outside of road around this channel.

9. the feeding mechanism that Wet-type etching equipment is used, it comprises:

Delivery member, it has the supply road run through, with conveyance fluid; And

Adjustment part, it has adjacent channel and reclaims road, and this delivery member is arranged in this channel, so that the fluid of this delivery member of flowing through is by this channel output.

10. feeding mechanism according to claim 9, is characterized in that, the port in this recovery road and the port of this channel have difference of altitude.

11. feeding mechanism according to claim 9, is characterized in that, this reclaims the outside of road around this channel.

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