TW201607392A - Surface treatment device of substrate material - Google Patents

Abstract

To provide a surface treatment device of a substrate material, capable of improving processing accuracy, such as improvement of uniformity and preventing the variation of circuit width from being generated and advantageously achieved in a cost. A surface treatment device 1 is formed by combining various kinds of arrangement position settings, etc., of the spray nozzles 5. The spray nozzles 5 uniformly treat a substrate material A by treatment liquids injected from the spray nozzles 5 on the basis of the combination of: setting of a positional relationship sequentially laterally shifted by a lateral shift interval K without forming a row before/after by an interval between the spray nozzles located before/after; setting of a vertical interval between the spray nozzle 5 and the substrate material A; and setting of a lateral pitch interval N between the spray nozzles 5 on the basis on the setting of the vertical interval. The lateral shift interval K is 5-25 mm, the vertical interval is 30-150 mm, and the lateral pitch interval N is 30-120 mm.

Description

Base plate surface treatment device

The present invention relates to a surface treatment apparatus for a base sheet. That is, the present invention relates to a surface treatment apparatus for a base material used in a manufacturing step of an electronic circuit board.

"technical background"

The development of the circuit board for electronic equipment is small, lightweight, extremely thin, and flexible, and the electronic circuit formed is also made finer and more dense.

Further, a surface treatment apparatus is used in the manufacturing steps of such an electronic circuit board. Further, in the surface treatment apparatus, the base material sheet for the electronic circuit board is surface-treated by the ejection of the processing liquid, thereby forming an electronic circuit to manufacture the circuit board.

Prior Technology

Representative manufacturing steps for such a printed wiring board and other electronic circuit boards are as follows.

First, a liquid or dry film-like photosensitive resist is applied or adhered to the outer surface of the base material composed of the copper foil laminate.

→ Next, after the film of the circuit is pasted and exposed, → the resist other than the circuit forming portion is dissolved and removed by development, and → outside the circuit shape portion to be exposed After the copper foil is dissolved and removed by etching, the resist of the circuit forming portion is dissolved and removed by peeling off. → By such a step, an electronic circuit is formed from a copper foil remaining on the outer surface of the base material, thereby manufacturing an electronic circuit board.

Further, the development step, the etching step (circuit forming step), the stripping step, the half etching step of the preparation step (copper foil surface shape processing step), or the soft etching step (surface roughening step) of the preparation step are performed by The following operations were performed to carry out the surface treatment.

In other words, in the surface treatment apparatus such as the developing device, the etching device, and the peeling device, a processing liquid such as a developing solution, an etching solution, or a peeling liquid is sprayed from the spray nozzle on the substrate which is conveyed horizontally by the conveyor. Thereby, surface treatment such as development, etching, and peeling is sequentially performed on the base material.

The spray nozzle for spraying the treatment liquid is located at a position directly opposite to or directly below the base material to be horizontally conveyed, and is disposed at a predetermined interval between the front, rear, and left and right.

[Previous Technical Literature] [Patent Literature]

Examples of such surface treatment apparatuses include those disclosed in Patent Document 1 and Patent Document 2 below.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2002-68435 (Japanese Patent Laid-Open Publication)

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2006-222117 (Japanese Patent Laid-Open Publication)

Further, regarding the surface treatment apparatus of such a prior substrate, the following problems are pointed out.

"First Question"

First, it is pointed out that there is a problem in the processing accuracy of the base sheet. That is, if the processing is performed by the previous surface processing apparatus, the circuit width is likely to vary with respect to the formed circuit. In particular, regarding etching, there is a problem in uniformity, that is, uniformity of etching depth (circuit depth), and uniformity is poor, and the circuit width is deviated.

For example, as shown in (2) and (3) of FIG. 6, regarding the circuit B formed on the base material A, it is pointed out that there is a delay and an insufficient etching process, and the circuit depth C is shallow, and the circuit width (bottom width) is generated. L is too large. On the other hand, it is also pointed out that the etching process is excessive, and the circuit depth C is deepened, and the circuit width L is narrowed and narrowed. In the conventional surface treatment apparatus, such deterioration in uniformity and variation in circuit width L are a problem for the substrate in which the circuit B is made finer and higher in density. The current capacity, resistance value, and the like of the circuit B vary with respect to the specification value, which is a cause of failure.

"The reason for the first question"

As the cause of such a first problem, the following (A) and (B) are considered.

In (A), in the substrate processing apparatus, the processing size of the base material A to be processed is typically 600 mm × 500 mm or 500 mm × 400 mm. That is, in view of the manufacturing cost, the base material A of several times the actual substrate is used, and a plurality of smaller substrates can be obtained from the larger base material A.

As a result, the processing size of the base material sheet A is large, for example, the uniformity between the central portion and the peripheral portion is deteriorated, and the circuit width L is deviated.

As (B), as a cause of greater deviation, the following aspects are considered. In other words, in the surface treatment apparatus, a plurality of spray nozzles are disposed in front, rear, and left and right. However, in the prior art, the spray nozzles located before and after the transport direction are arranged in a row in the front and rear transport directions. That is, the spray nozzles are spaced apart in the width direction of the left and right and are oriented in a plurality of rows toward the front and rear transport directions. Assume.

Therefore, the formed circuit B is located directly below or directly above the row of the spray nozzle (formed in a parallel line shape and a ridged track in the front and rear transport directions), and is always subjected to a strong spray pressure and jet impact. The etching process is excessive and the circuit width L is too small.

On the other hand, the spray pressure and the jet impact are weaker on the portion located at a position offset directly below or directly above the spray nozzle row (formed in a parallel linear or striate path in the transport direction before and after). The liquid storage or the like is generated, resulting in insufficient etching treatment and excessive circuit width L.

As described above, the arrangement of the spray nozzles causes deterioration of the uniformity of the base material A and a large variation in the circuit width L.

"Second Question"

Second, the following problems (A) and (B) are also pointed out in terms of cost.

As described above (A), the circuit B of the substrate is made finer and higher in density. However, in the prior art, it is difficult to manufacture a fine circuit (etching) in view of the above-described deviation problem. In particular, it is difficult to manufacture by a cap hole method which is relatively simple and excellent in manufacturing cost.

Further, the substrate of the fine circuit is previously manufactured by a semi-additive process (SAP, Semi-Additive-process) or a modified-semi-additive-process (MSAP). Also, it pointed out that there is a problem of rising manufacturing costs.

For example, for the base material A having a copper foil thickness of 18 μm, the limit system circuit width L or the inter-circuit space S of the cover hole method is 40 μm to 50 μm. Further, in (2) of FIG. 6 and (D), D represents the top surface width (top width) of the circuit B.

As (B), the deterioration of uniformity, the variation of the circuit width L, and etching are caused. In the case of the liquid storage or the retention of one of the causes of the insufficient treatment, various techniques have been developed in the past (for example, refer to Japanese Patent No. 4015667 or Japanese Patent No. 4117135).

However, it has been pointed out for the prior art that the original cost is correspondingly due to the use of a special mechanism such as a shaking head oscillating mechanism, a horizontal oscillating mechanism, an oblique arranging mechanism, or a liquid storage vacuum mechanism for the spray nozzle of the spray nozzle. rise. In addition, it is also noted that it is effective as a countermeasure against liquid storage or retention, but it is not sufficient for countermeasures such as the above-described variations, and it is attached to a vacuum mechanism or the like in the case of an extremely thin base material.

About the Invention

The surface treatment apparatus for a base material of the present invention is completed in order to solve the above problems of the prior art in view of such actual circumstances.

Further, an object of the present invention is to provide a surface treatment apparatus for a base material, which is capable of, for example, improving uniformity, improving processing accuracy, preventing variations in circuit width, and second, being excellent in cost.

"On the invention of this case"

The technical means of the present invention for solving such a problem is as follows. The first invention is as follows. A surface treatment apparatus for a base material according to a first aspect of the invention is characterized in that it is used in a manufacturing step of an electronic circuit board. Further, the base material to be conveyed by the conveyor is subjected to surface treatment by spraying the treatment liquid from the spray nozzle. The spray nozzles are disposed in a plurality of front and rear, left and right, and are located opposite to the base material to be conveyed.

Moreover, the spray nozzle is based on the fact that the spray nozzles arranged from front to back are not in front of each other. The row is set in accordance with the positional relationship of the left and right offsets, the setting of the upper and lower intervals between the spray nozzle and the base material, and the setting of the left-right spacing between the spray nozzles based on the setting of the vertical spacing. In combination, the substrate is uniformly treated with the treatment liquid sprayed from the spray nozzle.

The second invention is as follows. A surface treatment apparatus for a base material according to a second aspect of the present invention, wherein the surface treatment apparatus is a development step, an etching step, a half etching step, a soft etching step, a rapid etching step, and a step of manufacturing the electronic circuit substrate. Or used in the stripping step.

Further, the surface treatment apparatus is used as a developing device, an etching device, or a peeling device, and the spray nozzle is configured to spray a developing solution, an etching solution, or a peeling liquid as the processing liquid.

The third invention is as follows.

According to a second aspect of the invention, in the spray nozzle, the distance between the right and left spray nozzles is set to be 5 mm or more and 25 mm or less.

The fourth invention is as follows.

According to a third aspect of the invention, in the surface treatment apparatus of the base material, the vertical distance between the spray nozzle and the base material is set to be 30 mm or more and 150 mm or less.

The fifth invention is as follows.

According to a fourth aspect of the invention, in the surface treatment apparatus of the base material, the distance between the left and right pitches between the spray nozzles is set to be 30 mm or more and 120 mm or less.

The sixth invention is as follows.

A surface treatment apparatus for a base material according to a sixth aspect of the present invention, wherein the spray nozzle is formed of a flat type, and is oriented in a horizontal plane in the developing step or the etching step. Set in the width direction of the left and right.

The seventh invention is as follows.

A surface treatment apparatus for a base material according to a seventh aspect of the present invention, wherein the spray nozzle is formed of a flat type, and is in a horizontal etching manner in the half etching step, the soft etching step, the rapid etching step, or the peeling step. It is set so that the width direction of the left and right is inclined toward the front and rear conveyance directions by a nozzle angle of 4° or more to 10° or less.

The eighth invention is as follows.

The surface treatment apparatus of the base material according to the eighth aspect of the present invention, wherein the injection pipe for supplying the treatment liquid is arranged in a plurality of intervals at a predetermined left-right pitch along a front-to-back conveyance direction, or The width direction is arranged with a plurality of roots arranged at predetermined intervals.

Further, the spray nozzles are provided at a plurality of intervals at predetermined intervals in the spray pipe.

"About role, etc."

Since the present invention includes such means, it is as follows.

(1) The surface treatment apparatus is used in a manufacturing step of an electronic circuit board, for example, an etching step.

(2) Further, the surface treatment apparatus sprays the treatment liquid from the spray nozzle to surface-treat the base material.

(3) Further, the surface treatment apparatus is characterized in that the spray nozzles are disposed at various positions and are configured in various combinations.

(4) That is, first, the spray nozzle is set to a positional relationship in which the front and rear arrangements are not aligned with each other, but are sequentially shifted in the left and right directions. The left and right offset intervals are set to 5 mm to 25 mm.

(5) In addition to this, the height between the spray nozzle and the base material, that is, the upper and lower intervals is set to 30 mm to 150 mm, preferably 50 mm to 100 mm.

(6) Further, the distance between the right and left spray nozzles is set to be 30 mm to 120 mm.

(7) Further, the spray nozzle is typically formed of a flat type and is disposed in the width direction of the left and right (noise angle of 0° or about 0°) or by a nozzle angle of 4° to 10°. Settings.

(8) The surface treatment apparatus is used by combining such a setting position of the spray nozzle, and the like, thereby improving the processing precision of the base material and achieving uniform processing.

(9) That is, with respect to the base sheet, the surface portion of the spray impact of the treatment liquid is prevented from being generated, and the surface treatment is performed integrally, uniformly, and uniformly. Also, the magnitude deviation of the formed circuit width is eliminated. Especially in the etching step, the uniformity of the etching depth, that is, the uniformity is improved.

(10) Further, these are easily realized by a simple configuration by combining the setting positions of the spray nozzles and the like.

(11) Further, the microcircuit can be manufactured by the lid hole method as the deviation of the formed circuit width is eliminated and the uniformity is improved.

(12) Furthermore, the elimination of the deviation of the circuit width and the improvement of the uniformity are achieved, and of course, the occurrence of the liquid storage or the retention can be suppressed in the process. Moreover, there is no need to use a special mechanism for handling liquid storage.

(13) Therefore, the surface treatment apparatus for a base material of the present invention exerts the following effects.

"1st effect"

First, the uniformity is improved, the processing accuracy is improved, and variations in circuit width are prevented.

The surface treatment apparatus for the base material of the present invention uniformly treats the base material by a combination of the arrangement positions of the spray nozzles and the like.

With regard to the base material, it is necessary to suppress the occurrence of a portion where the circuit width is excessively large as in the above-described prior art, and to suppress the occurrence of a portion where the circuit width is narrowed and become too small, and to reduce variations in circuit width, particularly regarding etching, Improve uniformity and reduce variations in circuit width.

Further, the present invention exerts such an effect on a substrate in which the circuit is made finer and higher in density. For example, it is also possible to avoid the case where the current-carrying capacity, the resistance value, and the like of the circuit as described above are changed with respect to the standard value, and it is desired to reduce the substrate failure.

"2nd effect"

Second, the first effect is achieved on the basis of excellent cost. The surface treatment apparatus for a base material of the present invention achieves the first effect described above by a combination of setting positions of spray nozzles and the like. In other words, it is easy to achieve on the basis of cost advantage by a simple configuration. Moreover, according to the surface treatment apparatus, it is possible to manufacture a fine circuit (etching) by a lid hole method which is excellent in manufacturing cost as the uniformity is improved and the circuit width variation is prevented. The need for SAP or MSAP methods with high complexity and increased manufacturing costs is reduced. From this point of view, it is also excellent in terms of cost.

Further, with the improvement of the uniformity and the prevention of the variation in the circuit width, the surface treatment apparatus does not need to use the special mechanism for the liquid storage which is improved in the original cost as in the prior art described above, and does not need to be used for the retention. A dedicated institution. From this point of view, it is also excellent in terms of cost.

Thus, all the problems of the prior art are solved, and the present invention is exerted. The effect is significantly larger.

A‧‧‧ base plate

B‧‧‧Electronic circuit (circuit)

C‧‧‧D Circuit Depth (Circuit Height)

D‧‧‧Top width (top width)

E‧‧‧Electronic circuit board (substrate)

F‧‧‧Transfer direction

G‧‧‧ treatment solution

H‧‧‧Width direction

J‧‧‧Up and down direction

Offset interval around K‧‧

L‧‧‧Circuit width (bottom width)

M‧‧‧ upper and lower intervals

N‧‧‧ spacing interval

S‧‧‧Inter-circuit space

θ ‧‧‧ nozzle angle

1‧‧‧ surface treatment equipment

2‧‧‧Processing room

3‧‧‧Conveyor

4‧‧‧ round

5‧‧‧ spray nozzle

6‧‧‧ liquid tank

7‧‧‧ pump

8‧‧‧Pipe

9‧‧‧Steam tube

10‧‧‧Conveyor shaft

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing the principal part of a surface treatment apparatus for a substrate according to the present invention, which is provided for explaining the form of the invention.

Fig. 2 is a view showing an example of the surface treatment apparatus for explaining the form of the invention. Moreover, (1) is a side view, and (2) is a top view.

Fig. 3 is a view showing another example of the surface treatment apparatus for explaining the form of the invention. Moreover, (1) is a side view, and (2) is a top view.

Fig. 4 is a view for explaining the form of the invention, and (1) is a side view of a main portion of the example of Fig. 3, and (2) is a plan view of the main portion.

Figure 5 is for illustration of a form for carrying out the invention. Further, (1) is a plan view showing an enlarged main portion of the example of FIG. 3. (2) The figure shows the measurement points of the examples, and is a plan view.

Fig. 6 is for explanation of a base material (electronic circuit board). Moreover, (1) is a top view explanatory view of an example. (2) The figure shows an example of the circuit formed, which is a front cross-sectional explanatory view, and (3) shows another example of the circuit formed, and is a front cross-sectional explanatory view.

Hereinafter, the form for carrying out the invention will be described in detail.

"About Electronic Circuit Board E, etc."

The surface treatment apparatus of the base material sheet A of the present invention is used in the manufacturing steps of the electronic circuit board E. Therefore, first, the electronic circuit board E and the like which are the premise will be described with reference to FIG.

The electronic circuit board E is used in audio and video (AV, Audio Visual) devices, computers, mobile phone terminals, mobile phones, digital cameras, various other electronic devices, and IT related devices. When the electrical connection of the backbone is formed. Further, the electronic circuit board E is formed on the outer surface or inside of the insulating layer to form a circuit pattern for connecting between the semiconductor components.

Further, the electronic circuit board E is divided into a single-sided board and a double-sided board, and has a multilayer board (substrate including a build-up method) and various other substrates. Moreover, the electronic circuit board E is also divided into a hard hard substrate and a film-shaped flexible substrate.

Further, as part of such an electronic circuit board E, semiconductor components such as an integrated circuit (IC), a large-scale integrated circuit (LSI, Large Scale Integrated) element, a passive component, a drive component, and a capacitor are also present. A module substrate (semiconductor integrated package substrate) assembled integrally with the circuit B.

Further, there is also a glass substrate in which a circuit B and a semiconductor component are embedded in a glass substrate, that is, a glass substrate for a liquid crystal display (LCD), and a chip scale package (CSP), a plastic package. Ball grid array (PBGA, Plastic Ball Grid Array), touch panel, and the like. In the present specification, the electronic circuit board (hereinafter sometimes referred to simply as the board) E includes the above-mentioned board in addition to the printed wiring board.

In addition, the size, weight reduction, flexibility, and the like of the electronic circuit board E are prominent, and the electronic circuit (in the present specification, sometimes referred to simply as the circuit) B is also made finer and more dense.

The base material A used in the manufacturing steps of the electronic circuit board E is typically a dimension having an aspect ratio of 600 mm × 500 mm, or 500 mm × 400 mm, or 500 mm × 330 mm, and a thickness of about 0.06 mm to 1.6 mm.

As a method of manufacturing such an electronic circuit board E, a subtractive color method (wet processing method) is representative (refer to the prior art column of the above background art), but a semi-additive method (SAP method) and various other manufacturing methods are known. . Of course, the present invention is applicable to the steps of the various manufacturing methods described above. The electronic circuit board E and the like are as described above.

"About surface treatment device 1"

Next, the surface treatment apparatus 1 will be generally described with reference to Figs. 2 and 3 .

The surface treatment apparatus 1 is used in the manufacturing steps of such an electronic circuit board E. Then, in the processing chamber 2, the substrate A is horizontally conveyed by the conveyor 3 in the transport direction F before and after, and the processing liquid G is sprayed from the spray nozzle 5 to surface-treat the base material A.

The conveyor 3 of the illustrated example is composed of a plurality of wheels 4 arranged in pairs in the upper and lower sides. The wheel 4 of the illustrated example has a diameter of 30 mm, and the distance between the wheels 4 is 25 mm, and the wheel 4 is disposed so as to partially overlap in the conveying direction F.

A plurality of the spray nozzles 5 are disposed in the transport direction F and the left and right width directions H in the front and rear directions, and the treatment liquid G is sprayed in such a manner as to face up and down with respect to the base material A to be conveyed. In the example of the figure, the base sheets A to be conveyed are arranged above and below, and the front and back sides of the base sheet A are surface-treated.

Further, the surface treatment apparatus 1 is used in a developing step, an etching step, a half etching step, a soft etching step, a rapid etching step, a peeling step, and the like in the manufacturing steps of the electronic circuit substrate E.

The half etching step is performed as a preparation step of the base material A to process the surface shape of the copper foil to cut the thickness of the copper foil to be thin. The soft etching step is performed by roughening the surface of the copper foil in advance as a pre-processing step of the base material A. The rapid etching step is carried out as a post-additive method (SAP method). Further, the surface treatment apparatus 1 is used as a developing device, an etching device, a half etching device, a soft etching device, a rapid etching device, or a peeling device. Thereby, the spray nozzle 5 is used for spraying a developing solution, an etching solution, a semi-etching liquid, a soft etching liquid, A rapid etching liquid, a peeling liquid, or the like is used as the processing liquid G.

The treatment liquid G is sprayed from the spray nozzle 5, and after surface treatment of the base material A, it flows to the liquid tank 6 at the lower portion of the treatment chamber 2, and is recovered and stored. Then, afterwards, the pump 7, the filter (not shown), the pipe 8, the injection pipe 9, and the like are again flowed to the spray nozzle 5, and are circulated and reused. Further, Fig. 2 (1), Fig. 3 (1), and Fig. 4 indicate the vertical direction.

Further, the spray nozzles 5 are provided in the injection pipe 9 at a plurality of intervals at predetermined intervals. The injection pipe 9 for supplying the treatment liquid G to the spray nozzle 5 is disposed as in the example shown in FIG. 2 or as shown in FIG. 3, FIG. 4, FIG. 5 (1), and the like.

In the example shown in Fig. 2, a plurality of injection pipes 9 are arranged in parallel in the transport direction F before and after, and there is a predetermined left-right pitch interval therebetween. In the example shown in Fig. 3 and the like, a plurality of injection pipes 9 are arranged in parallel along the width direction H in the right and left directions at right angles to the conveyance direction F, and there are predetermined front and rear intervals between them.

Further, the processing in the processing chamber 2 of the surface treatment apparatus 1 is usually performed in a gas atmosphere as shown in the example, but is not limited thereto, and may be performed in a liquid.

Regarding the surface treatment apparatus 1, as described above.

Summary of the Invention

Hereinafter, the surface treatment apparatus 1 of the base material sheet A of the present invention will be described with reference to Figs. 1 to 6 .

First, regarding its outline, it is as follows. The surface treatment apparatus 1 of the present invention is characterized by a combination of arrangement position setting of the spray nozzles 5.

In other words, the spray nozzle 5 is based on the positional relationship in which the spray nozzles 5 arranged in the front and rear are not aligned with each other, but are shifted left and right by only the interval K, and the spray nozzle 5 is The base sheet A is uniformly treated by a combination of the setting of the upper and lower intervals M between the base sheets A and the setting of the left-right spacing N between the spray nozzles 5 based on the upper and lower intervals M. That is, the base material A is uniformly treated by the treatment liquid G sprayed from the spray nozzle 5. The outline of the present invention is as described above. Hereinafter, the surface treatment apparatus 1 of the base material sheet A of the present invention will be described in more detail.

"About the left and right offset interval K between the front and rear spray nozzles"

First, as shown in FIG. 1, a plurality of spray nozzles 5 are disposed in front, rear, and left and right. Further, in the case of observing the transport direction F in the front and rear, the spray nozzles 5 located in front and rear are arranged in the opposite direction to the transport direction F in the front and rear directions, and are not arranged in a row, and are slightly offset in the lateral width direction H of the left and right. Move and set. In other words, the front and rear spray nozzles 5 are positioned and positioned so as to overlap each of the transport directions F without overlapping. That is, the positioning setting is performed such that there is a left-right offset interval K. Further, the spray nozzles 5 arranged in the front-rear direction may be shifted left and right. In other words, the spray nozzles 5 located at the same left and right positions may be present in the transport direction F, for example, every 5 rows to 10 rows or more.

Further, the setting of the left-right offset interval K of the spray nozzle 5 is realized in accordance with the arrangement of the injection pipe 9.

First, the example shown in Fig. 2 is as follows. In the example of Fig. 2, the injection pipes 9 are arranged in the front and rear conveying directions F. Further, as shown in FIG. 2(2), the injection pipe 9 does not need to be accurately oriented in the conveyance direction F, and can be disposed slightly inclined in the width direction H of the left and right.

In the example of Fig. 2, the setting of the left and right offset intervals K between the front and rear spray nozzles 5 is achieved in this manner.

On the other hand, examples shown in FIG. 3, FIG. 4, FIG. 5 (1), and the like are as follows. In this example, the injection pipes 9 are arranged in the width direction H of the left and right. Further, as shown in Fig. 3 (2) and Fig. 4 (2), the injection pipe 9 is disposed such that the positions of the spray nozzles 5 provided at regular intervals are sequentially shifted to the right and left.

In other words, in the example of FIG. 3 and the like, each of the injection pipes 9 is disposed such that the position of the spray nozzle 5 provided in the injection pipe 9 is shifted to the left and right in the front-rear direction, and the left and right positions of the spray nozzle 5 are shifted.

In the example of Fig. 3 and the like, the setting of the left and right offset intervals K between the front and rear spray nozzles 5 is realized in this manner.

The function of setting the left and right offset interval K is as follows. The treatment liquid G sprayed from the spray nozzle 5 is subjected to surface treatment with a strong spray pressure and jet impact on a portion of the base material A located directly below or directly above it. For example, in the etching step, the portion of the base sheet A located directly above or below the spray nozzle 5 is subjected to a strong spray pressure and a jet impact by the etchant sprayed to promote etching.

On the other hand, the ejection impact is weaker at the portion of the base sheet A which is located directly above or below the spray nozzle 5. Therefore, for example, there is a possibility that the etching is insufficient and the other processing is insufficient.

Therefore, in the present invention, the spray nozzles 5 arranged in the front and rear are arranged in order with a left-right offset interval K therebetween.

Thereby, the portion of the base sheet A subjected to the strong spray pressure and the jet impact is dispersed without being overlapped on the trajectory. The surface treated portion, such as etching, which is subjected to a strong jet impact, is slightly staggered. Thereby, as a result, the base material A is subjected to surface treatment such as etching as a whole, evenly and uniformly. The setting of the left and right offset intervals K between the front and rear spray nozzles 5 exhibits such a function.

And said that the spray nozzles 5 arranged before and after are offset from each other by the interval K Set to 5mm or more to 25mm or less.

In the case where the left-right offset interval K is less than 5 mm, the offset is too small, and it is difficult to exhibit the above-described offset function. In other words, in the same manner as in the above-described prior art, the strong and weak impact portions are generated in the base material sheet A in accordance with the case where the spray nozzles 5 are formed in the front and rear conveyance directions F. Therefore, in the transport direction F before and after, the surface-treated portions such as the under-etched portions are formed in a parallel line shape or a striated shape.

In the case where the left-right offset interval K exceeds 25 mm, it is also difficult to exert the above-described offset function.

In other words, when the left and right offset intervals K are set for the base sheet A, a strong and weak impact portion that cannot be covered is generated in a gap. Thereby, a surface-treated portion such as an under-etched portion is formed in a parallel line shape or a striated shape.

Further, in FIGS. 1 and 2 (2), FIG. 3 (2), and FIG. 4 (2), the illustration of the left-right offset interval K is schematically shown. In other words, the manner in which the size line is taken and the like are described as being pattern, exaggeration, and explanatory.

The left-right offset interval K between the front and rear spray nozzles 5 is as described above.

"About the upper and lower intervals M between the spray nozzle 5 and the base plate A"

In the present invention, the spray nozzle 5 is set to have a left-right offset interval K between the front and rear, and the height interval between the spray nozzle 5 and the base material A, that is, the vertical interval M is set to be 30 mm or more to 150 mm or less.

That is, first, surface treatment such as uniform etching is realized by setting the left and right offset intervals K. It is avoided that the front and rear transfer directions F are formed in a parallel line shape or a striated shape to form a weakly-impacted impact portion and a surface-treated portion such as etching. This has also been confirmed experimentally.

However, as a result of the experiment, although it is a little, the surface-treated portion such as an under-etched portion is formed in a parallel line shape or a striated shape in the width direction H of the left and right. Although before and after Although the interval in the transport direction F is vacant, a small amount of surface-treated portions such as an under-etched portion are left to be formed.

Further, such a portion which is insufficiently etched in the width direction H is formed by the spray nozzle 5 and the base as shown in Fig. 2 (1), Fig. 3 (1), Fig. 4 (1), and the like. The upper and lower intervals M between the sheets A are set to be 30 mm or more to 150 mm or less and are eliminated. Thereby, regarding the base material sheet A, surface treatment such as etching treatment of integrity, averageness, and uniformity can be surely achieved.

In particular, if the upper and lower intervals M are set to 50 mm or more to 100 mm or less, an optimum result is obtained experimentally, and higher uniformity can be obtained. The upper and lower intervals M between the spray nozzle 5 and the base plate A are set to function as described above.

Due to the improvement of the etching factor at the time of pattern etching, etc., the demand for the enhanced impact of the spray treatment liquid G on the base material A by the spray nozzle 5 is strong. Therefore, the upper and lower intervals M between the spray nozzle 5 and the base material A are also set to be shorter and closer as described above.

In addition, when the upper and lower intervals M are less than 30 mm, the spray nozzle 5 and the base material A are too close to each other, so that it is difficult to exhibit the shift function of the left and right offset intervals K. That is, the spray pressure and the jet impact of the portion of the base sheet A located directly above or below the spray nozzle 5 become stronger. On the other hand, since the spray pressure and the jet impact at the portion located at a position shifted from the upper side or the lower side are weak, the etching is insufficient and the processing is insufficient.

On the other hand, in the case where the upper and lower intervals M exceed 150 mm, the spray nozzle 5 and the base material sheet A become too far apart, resulting in insufficient etching and insufficient processing as a whole. That is, the ejection impact on the entire substrate A is weak, and the processing rate such as the etching rate is lowered.

The upper and lower intervals M between the spray nozzle 5 and the base material A are as described above.

"About the distance between the spray nozzles 5"

In order to perform surface treatment such as etching, averaging, and uniformity of the base material A, in addition to the above, it is also considered that the distance N between the spray nozzles 5 is also a point.

In other words, in addition to the setting of the left-right offset interval K between the front and rear sides and the setting of the upper and lower intervals M between the spray nozzle 5 and the base material A, the spray nozzle 5 may be supported by The right and left spacing intervals N between the spray nozzles 5 are considered in combination.

Further, as shown in Fig. 1, Fig. 2 (2), Fig. 3 (2), Fig. 4 (2), Fig. 5 (1), etc., the distance between the spray nozzles 5 is N. In principle, it is set to be 30 mm or more and 120 mm or less. In particular, when the vertical spacing M is set to 50 mm or more to 100 mm or less, it is set to be 30 mm or more and 120 mm or less. Further, in particular, if it is set to 30 mm or more to 60 mm or less, an experimentally optimal result can be obtained.

That is, for example, due to an increase in the etching factor at the time of pattern etching or the like, the demand for the enhanced impact of the sprayed treatment liquid G by the spray nozzle 5 is strong. Therefore, as the spray nozzle 5, the tendency to select and use a narrow spray angle is remarkable. In other words, as the spray nozzle 5, it is preferable to use a spray angle of 40° or more to 90° or less in the width direction of the left and right.

Thereby, since the injection range of the spray processing liquid G to the base material sheet A is narrowed, the left-right pitch interval N between the spray nozzles 5 is set to be relatively narrow as described above. When the left-right pitch interval N is less than 30 mm, the spray nozzles 5 are too close to each other on the right and left, and it is difficult to exhibit the shift function of the left-right offset interval K.

On the other hand, when the left-right pitch interval N exceeds 120 mm, the spray nozzles 5 are too far apart from each other on the left and right sides, and in this case, it is also difficult to exhibit the function of shifting the left and right offset intervals K. Therefore, the base sheet A is caused to generate a spray squeezing portion and a strong portion of the jet impact.

Incidentally, in the design of the surface treatment apparatus 1 of the example shown in FIG. 3 and the like, if the value of the left and right offset interval K is first determined, then the value of the left and right pitch interval N is determined as an integral multiple of the value. As a result, the number of necessary injection tubes 9 is obtained as an integer value.

The left-right spacing interval N between the spray nozzles 5 is as described above.

"About the nozzle angle θ of the spray nozzle 5, etc."

In the surface treatment apparatus 1, as the spray nozzles 5 of the various settings described above, a flat type in which the spray pattern is elliptical as shown in Fig. 4 (2) and Fig. 5 (1) is typically used (fan type) )By.

Further, the spray nozzle 5 is attached to the horizontal plane in the width direction H on the horizontal plane. In other words, it is provided so as to include a nozzle angle of 0° which is accurately oriented in the width direction H of the right and left, or a nozzle angle θ of about 0°, and a nozzle angle θ which is inclined by 10° or less toward the front and rear transport directions F.

This will be described in detail. First, in the developing step or the etching step as the circuit forming step, the width of the (Y-direction) circuit width formed in parallel with the left-right width direction H in the case where the nozzle angle θ is 0° or 0° or less, and The thickness of the (X-direction) circuit width formed in parallel with the front and rear transfer directions F is poor, and thus is not preferable.

Therefore, in the developing step or the etching step, the nozzle angle θ is typically set to be 0°, and further to the range of ±1° or 2° before and after 0°.

That is, the nozzle angle θ is representatively 0°, but may be a nozzle angle θ inclined by 0° to 0°+1° or less or 0° to 0°-1° toward the front and rear conveying directions F. Further, the nozzle angle θ may be inclined from 0° to +2° or may be a nozzle angle θ inclined from 0° to -2°.

On the other hand, in the half etching step, the soft etching step, the rapid etching step, the peeling step, and the like which are not directly involved in the circuit formation, it is effective to clearly set the nozzle angle θ to make the processing speed faster. Therefore, in each of these steps, the nozzle angle θ is set to be 4° or more and 10° or less.

However, in the case where the nozzle angle θ at this time is less than 4°, the treatment liquids G to be sprayed between the spray nozzles 5 interfere with each other, which is not preferable. Also, at a nozzle angle θ exceeding 10° In this case, the wheel 4 of the conveyor 3 disposed before and after is also sprayed with the treatment liquid G, which is not preferable. Incidentally, in the example of the figure, in the region where the spray nozzle 5 is provided, the wheel 4 of the conveyor 3 is disposed in the transport direction F as small as, for example, only 20 mm.

Further, as the nozzle performance, the spray nozzle 5 has an injection angle of 40° or more and 90° or less, and a spray amount of about 2 L/min to 5 L/min at 0.3 MPa. Further, in Fig. 4 (2) and Fig. 5 (1), 10 is the conveyor shaft 10 of the wheel 4.

The nozzle angle θ and the like of the spray nozzle 5 are as described above.

"Action, etc."

The surface treatment apparatus 1 of the base material sheet A of the present invention is configured as described above. Therefore, it becomes as follows.

(1) The surface treatment apparatus 1 is used in the manufacturing steps of the electronic circuit board E. That is, it is used as various etching apparatuses, developing apparatuses, and peeling apparatuses in the developing step, the peeling step, the half-etching step, the soft etching step, the rapid etching step, and the like, which are the etching steps which are the core of the manufacturing steps.

(2) In the surface treatment apparatus 1, the base material A conveyed by the conveyor 3 is provided with a plurality of spray nozzles 5 sprayed with the treatment liquid G from the front, rear, left and right sides, thereby surface-treating the base material A ( Refer to Figure 2, Figure 3, etc.). In other words, the treatment liquid G such as the etching liquid, the developing solution, and the peeling liquid is sprayed from the spray nozzle 5, whereby the base material sheet A is subjected to surface treatment such as etching, development, and peeling.

(3) Further, the surface treatment apparatus 1 of the present invention is characterized in that the spray nozzle 5 is configured in various combinations as follows.

(4) In other words, the spray nozzles 5 are first disposed in front and rear, and are arranged in a positional relationship that is shifted in the right and left directions (see FIG. 1 and FIG. 2 (2). 3 (2), Figure 4 (2), etc.).

In other words, the left-right offset interval K of the spray nozzle 5 is set to be 5 mm or more and 25 mm or less. Thereby, the spray nozzle 5 is superimposed on the front and rear conveyance directions F without being opposed to each other, and is disposed to be slightly offset in the width direction H of the left and right.

(5) Further, the upper and lower intervals M between the spray nozzle 5 and the base material A are set to 30 mm or more to 150 mm or less, preferably 50 mm or more to 100 mm (refer to Fig. 2 (1) and Fig. 3 (1). Figure (1), etc.).

(6) Further, the distance N between the spray nozzles 5 and the right and left is set to 30 mm to 120 mm (see Fig. 1 and Fig. 2 (2), Fig. 3 (2), Fig. 4 (2). Figure, Figure 5 (1), etc.).

(7) In addition, the spray nozzle 5 is typically a flat type, and the nozzle angle θ inclined at 0° or 0° in the front and rear transport directions F is oriented in the width direction H of the left and right or inclined by 4° or more. The nozzle angle θ of ~10° or less is oriented in the width direction H of the left and right (see FIG. 4 (2) and FIG. 5 (1)).

(8) The surface treatment apparatus of the base material sheet A of the present invention is used in various combinations as described above in order to set the arrangement position of the spray nozzles 5, and the like. Thereby, the processing precision of the base material A is improved, and the base material A is uniformly processed.

(9) That is, the portion of the base material A to be treated which is treated by the treatment liquid G which is subjected to the strong spray pressure and the jet impact, and the spray pressure and the jet impact of the treatment liquid G are weak, and the treatment is insufficient.

Of course, in the process, the case where the sprayed treatment liquid G generates a liquid storage or a build-up on the base material A is alleviated.

Therefore, the base material sheet A is surface-treated in a uniform, uniform, and uniform manner. Avoid creating a circuit width (bottom width) L that is formed due to over-treatment, becoming narrower and smaller. The portion of the circuit is prevented from being excessively large due to insufficient processing. Thereby, the deviation of the circuit width L is eliminated (see also FIG. 6 (2) and (3)).

Especially in the etching step, the uniformity of the etching depth and the circuit depth C is improved. That is, uniformity (minimum etching amount / maximum etching amount × 100%) is improved, and uniform etching without unevenness is realized.

(10) Further, the above case can be easily realized by a simple configuration. That is, the surface treatment apparatus 1 of the base material sheet A achieves the above-described situation by setting the arrangement position of the spray nozzles 5 as described above.

In other words, the surface treatment apparatus 1 is easy to realize in terms of cost by setting a numerical value of a predetermined left-right offset interval K, a vertical interval M, and a left-right spacing interval N of the spray nozzle 5, and combining them. Moreover, the processing accuracy is improved and the circuit width deviation is prevented.

(11) Further, when the surface treatment apparatus 1 is used, the circuit width L of the circuit B formed by the cover hole method which is excellent in cost can be improved as the uniformity is improved and the variation of the circuit width L is eliminated. Narrow microcircuit (etching).

It is also possible to manufacture the base material A having a base material A having a copper foil thickness of 18 μm or less and a circuit width L or an inter-circuit space S of 40 μm or less by the cover hole method. Further, the base material A having a copper foil having a thickness of about 12 μm and a circuit width L or an inter-circuit space S of about 20 to 30 μm is also a target value which can be manufactured by the cover hole method (see also FIG. 6 (also 2) Figure, (3) Figure).

(12) Further, according to the surface treatment apparatus 1, the uniformity is improved and the variation of the circuit width L is prevented. Of course, during the process, the generation or retention of the liquid storage of the treatment liquid G is suppressed. Therefore, it is not necessary to adopt a dedicated mechanism for handling liquid storage or for stagnation. That is, the surface treatment apparatus 1 does not need to take the needle of the prior art as described above. The oscillating mechanism, the horizontal oscillating mechanism, the oblique arranging mechanism, or the liquid storage vacuum mechanism of the injection pipe 9. The action and the like of the present invention are as described above.

[Examples]

Hereinafter, experimental materials and the like of the examples of the present invention will be described. That is, the experimental data obtained in the examples of the present invention and the experimental data obtained in the conventional examples (comparative examples) will be described with respect to the experimental results of the uniformity.

"About Experimental Methods"

First, the experimental method mentioned before the experiment is described. As an etching apparatus which is a representative example of the surface treatment apparatus 1, as a method of uniformity evaluation of the etching depth (circuit depth C), that is, a method of uniformity evaluation, first, the following (I) and (II) are considered.

(I) A method in which the circuit B is actually formed by performing each step of development, etching, and stripping using a resist, and the circuit B obtained as a result verifies the deviation of the circuit width L.

(II) Only etching is performed. That is, the copper foil is etched, and the copper thickness (corresponding to the circuit depth C) of the residual copper obtained as a result is verified.

If the methods of (I) and (II) are compared, they are as follows. In the method (I), the uniformity evaluation is affected by the performance of the etching apparatus itself, the factors of the production technique, the type of the resist used, the type of the etching liquid, and the like.

On the other hand, in the method of (II), regarding the etching apparatus, it is possible to evaluate the uniformity of the etching performance of the copper foil alone. Therefore, the experiment was carried out by the method of (II).

"Test Conditions of Embodiments of the Invention"

The test conditions of the examples of the present invention are shown in Table 1 below. Further, in Table 1, the liquid temperature, specific gravity, based on the use as an etching solution of copper chloride CuCl _2. In Table 1, the effective length is the length dimension of the conveyance direction F of the processing chamber 2 of the surface treatment apparatus 1.

"Test Results of Embodiments of the Invention"

The test results of the examples of the present invention are shown in Tables 2 to 5 below.

In Tables 2 and 4, A to I and 1 to 7 are the vertical and horizontal axes of the measurement points of the base material A as shown in Fig. 5 (2), and the intersections of the two are used as measurement points.

Further, at each measurement point of the base material A, the copper foil having a copper thickness of 67.3 μm was measured for the copper thickness of the residual copper (corresponding to the circuit depth C) at the beginning of the experiment as in the test conditions of the above Table 1. As a result, the measurement results of Table 2 were obtained for the upper surface (surface) of the base material A, and the measurement results of Table 4 were obtained for the lower surface (back surface).

Thus, the uniformity (the minimum copper thickness/maximum copper thickness x 100% of the residual copper in Table 2 or Table 4) was calculated based on this. Thus, the upper surface (surface) was 94.12% as shown in Table 3. The lower surface (back surface) was 94.21% as shown in Table 5 (again, 100 was set as the highest evaluation).

Thus, according to an embodiment of the present invention, extremely high uniformity can be obtained.

"Test Conditions for Conventional Examples (Comparative Examples)"

The test conditions of the conventional example (comparative example) are shown in Table 6 below. Table 6 is about the base plate Test conditions for the surface (surface) and the lower surface (back) of A. Further, conditions which are similar to the test conditions of the above-described embodiment of the present invention are set.

In Table 6, the liquid temperature, specific gravity, based on the use of a copper chloride CuCl ₂ etch solution. In Table 6, the effective length is the length dimension of the conveying direction of the processing chamber of the surface treatment apparatus used.

Further, as a conventional example (comparative example), the surface treatment apparatus described in the above background art column in the present specification is used.

"Test Results of the Known Example (Comparative Example)"

The test results of the conventional examples (comparative examples) are shown in Tables 7 to 10 below. In Tables 7 and 9, S1 to S6 and 1 to 9 indicate the vertical and horizontal axes of the respective measurement points of the base material A, and the intersections of the two are used as measurement points.

Further, at each measurement point of the base material A, the copper thickness of the residual copper was measured for a copper foil having a copper thickness of 64.0 μm (corresponding to the circuit depth C) at the start of the experiment as in the test conditions of the above Table 6. As a result, the measurement results of Table 7 were obtained for the upper surface (surface) of the base material A, and the measurement results of Table 9 were obtained for the lower surface (back surface).

Thus, the uniformity (the minimum copper thickness/maximum copper thickness x 100% of the residual copper in Table 7 or Table 9) was calculated based on this. Thus, the upper surface (surface) was 76.99% as shown in Table 8, and the lower surface (back surface) was 77.63%.

Thus, according to the conventional example (comparative example), the uniformity is compared with the above-described embodiment of the present invention. difference. In the embodiment of the present invention, a higher uniformity of the upper surface (surface) 94.12% and the lower surface (back surface) 94.21% is obtained as described above, and the deviation of the circuit B is almost eliminated.

Thus, the superiority of the uniformity of the present invention was also confirmed from the experimental data.

Experimental materials and the like regarding the examples of the present invention are as described above.

1‧‧‧ surface treatment equipment

2‧‧‧Processing room

5‧‧‧ spray nozzle

A‧‧‧ base plate

F‧‧‧Transfer direction

H‧‧‧Width direction

Offset interval around K‧‧

N‧‧‧ spacing interval

Claims (8)

A surface treatment device for a base material is used in a manufacturing step of an electronic circuit board, and a surface treatment is performed by spraying a processing liquid from a spray nozzle on a substrate conveyed by a conveyor; and the spray nozzle is attached to the front, back, left and right a plurality of disposed, and disposed opposite to the base plate to be transported; and the spray nozzle is formed based on a positional relationship in which the spray nozzles disposed in front and rear are not aligned with each other in front and rear, but are sequentially shifted to the left and right. a setting of the upper and lower spacing between the spray nozzle and the base material, and a setting of the left-right spacing between the spray nozzles based on the setting of the vertical spacing, the treatment liquid sprayed from the spray nozzle The base plate is uniformly treated. The surface treatment apparatus for a base material according to the first aspect of the invention, wherein the surface treatment apparatus is used in a development step, an etching step, a half etching step, a soft etching step, a rapid etching step, and a step of manufacturing the electronic circuit substrate. Or a peeling step; and the surface treating apparatus is used as a developing device, an etching device, or a peeling device that sprays a developing solution, an etching liquid, or a peeling liquid as the processing liquid. In the surface treatment apparatus for a base material according to the second aspect of the invention, in the spray nozzle, the left and right offset intervals of the spray nozzles arranged in the front and rear are set to be 5 mm or more and 25 mm or less. The surface treatment apparatus for a base material according to the third aspect of the invention, wherein the vertical distance between the spray nozzle and the base material is set to be 30 mm or more to 150 mm or less. A surface treatment apparatus for a base material according to item 4 of the patent application, wherein The above-described left-right pitch interval between the spray nozzles is set to be 30 mm or more and 120 mm or less. The surface treatment apparatus for a base material according to the fifth aspect of the invention, wherein the spray nozzle is formed of a flat type, and is disposed in a horizontal direction toward a left-right direction in the developing step or the etching step. The surface treatment apparatus of the base material of claim 5, wherein the spray nozzle is formed of a flat type, and is in a horizontal etching step, a soft etching step, a rapid etching step, or a peeling step, to be horizontal The surface is provided with a nozzle angle inclined by 4° or more to 10° or less toward the front and rear conveying directions with respect to the width direction of the left and right. The surface treatment apparatus for a base material according to the sixth or seventh aspect of the invention, wherein the spray pipe for supplying the treatment liquid is arranged in a plurality of rows at a predetermined left-right pitch in a front-to-back conveyance direction, or The width direction is arranged at a predetermined interval between the front and rear intervals, and the plurality of nozzles are arranged at intervals of the predetermined interval.