CN103260816A - Laser irradiation device and laser irradiation method - Google Patents
Laser irradiation device and laser irradiation method Download PDFInfo
- Publication number
- CN103260816A CN103260816A CN2011800616215A CN201180061621A CN103260816A CN 103260816 A CN103260816 A CN 103260816A CN 2011800616215 A CN2011800616215 A CN 2011800616215A CN 201180061621 A CN201180061621 A CN 201180061621A CN 103260816 A CN103260816 A CN 103260816A
- Authority
- CN
- China
- Prior art keywords
- laser
- output value
- laser irradiation
- output
- irradiation device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
- B29D11/00788—Producing optical films
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ophthalmology & Optometry (AREA)
- Laser Beam Processing (AREA)
- Polarising Elements (AREA)
Abstract
Description
技术领域technical field
本发明涉及抑制输出变动且照射的激光的输出得以稳定化的,能合适地切断薄膜的激光照射装置及激光照射方法。The present invention relates to a laser irradiation device and a laser irradiation method capable of appropriately cutting a thin film in which output variation is suppressed and output of irradiated laser light is stabilized.
背景技术Background technique
偏振膜被广泛应用于液晶面板等各种产品中。从来,偏振膜的切断加工中虽使用刀具,但由于从被切断物中易产生薄膜屑等异物,该异物附着于偏振膜上,会使作为被切断物体的产品的成品率下降。Polarizing films are widely used in various products such as liquid crystal panels. Conventionally, although a cutting tool is used in the cutting process of the polarizing film, foreign matter such as film scraps is easily generated from the cut object, and the foreign matter adheres to the polarizing film, which reduces the yield of the product as the cut object.
因此,近年来在偏振膜的切断加工中,使用激光取代刀具。通过用激光进行切断加工,与用刀具进行的切断加工相比,不容易从被切断物体中产生薄膜屑等异物,所以能抑制作为被切断物体的产品的成品率的下降。因此,利用激光的切断方法是有用的,有像例如专利文献1~5所述的那样的各种方法被提出。Therefore, in the cutting process of a polarizing film in recent years, a laser is used instead of a cutter. Cutting with a laser is less likely to generate foreign matter such as film scraps from the object to be cut than cutting with a cutter, so it is possible to suppress a decrease in the yield of the product as the object to be cut. Therefore, cutting methods using laser light are useful, and various methods such as those described in Patent Documents 1 to 5 have been proposed.
专利文献patent documents
专利文献1:日本国公开特许公报“特开2008-284572号公报(2008年11月27日公开)”Patent Document 1: Japanese Laid-Open Patent Publication "JP-A-2008-284572 (published on November 27, 2008)"
专利文献2:日本国公开特许公报特开2008-302376号公报“2008年12月18日公开)”Patent Document 2: Japanese Patent Laid-Open Publication No. 2008-302376 "published on December 18, 2008)"
专利文献3:日本国公开特许公报“特开2009-22978号公报(2009年2月5日公开)”Patent Document 3: Japanese patent publication "JP-A-2009-22978 (published on February 5, 2009)"
专利文献4:日本国公开特许公报“特开2009-167321号公报(2009年7月30日公开)”Patent Document 4: Japanese Laid-Open Patent Publication "JP-A-2009-167321 (published on July 30, 2009)"
专利文献5:日本国公开特许公报“特开2010-53310号公报(2010年3月11日公开)”Patent Document 5: Japanese Laid-Open Patent Publication "JP-A-2010-53310 Publication (Published on March 11, 2010)"
发明内容Contents of the invention
发明要解决的课题The problem to be solved by the invention
一般地说,激光振荡器具有激光输出不稳定,输出值以极短的周期(例如1毫秒)围绕着设定值以一定的振幅变动的特性。因此,由于激光振荡器的输出变动,即使将激光输出值设定为切断偏振膜的加工所需要的值,实际上也存在有时候不能适当地切断偏振膜的问题。以下对该问题进行具体说明。Generally speaking, the laser oscillator has the characteristics that the laser output is unstable, and the output value fluctuates around the set value with a certain amplitude in a very short period (for example, 1 millisecond). Therefore, even if the laser output value is set to a value required for processing to cut the polarizing film due to fluctuations in the output of the laser oscillator, there is a problem that the polarizing film may not be properly cut in practice. This problem will be specifically described below.
通常,偏振膜的切断加工,是一面以一定的速度输送长偏振膜一面照射激光连续地进行的。在这里,当激光的输出值设定为偏振膜的切断加工所需要的(而且是较低的)值时,在因输出的变动该输出值低于(小于)设定值达一定程度以上时,偏振膜就切不断了。因此,在卷起切断加工后的偏振膜时,就会发生该偏振膜的端部(切断部)或为被撕破的状态,或是从端部向偏振膜内侧破碎的那样的不理想的情况。另一方面,为解决上述的不理想的情况,即设定激光的输出值为高于偏振膜的切断加工所需要的值,以便在输出值低于设定值一定程度以上时也能进行切断加工,这样设定时,在因输出变动该输出值为高于(大于)设定值达一定程度以上时,输出值变得过高,偏振膜的端部(切断部)或是因激光的照射引起过热而熔化,或是因热膨胀而致隆起或翘曲。因此,切断加工后的偏振膜就发生品质劣化那样的另一类不理想的情况。Usually, the cutting process of the polarizing film is carried out continuously by irradiating the laser beam while conveying the long polarizing film at a constant speed. Here, when the output value of the laser is set to a (lower) value required for the cutting process of the polarizing film, when the output value is lower (less than) the set value by a certain degree or more due to the fluctuation of the output , the polarizing film is cut off. Therefore, when the polarizing film after cutting processing is rolled up, the end (cut portion) of the polarizing film is either in a torn state or is broken from the end to the inside of the polarizing film. Condition. On the other hand, in order to solve the above-mentioned unfavorable situation, the output value of the laser is set to be higher than the value required for the cutting process of the polarizing film, so that cutting can be performed even when the output value is lower than the set value to a certain extent. Processing, when set in this way, when the output value is higher (greater than) the set value to a certain extent due to output fluctuations, the output value becomes too high, and the end of the polarizing film (cut part) or the laser beam Melting due to overheating due to irradiation, or swelling or warping due to thermal expansion. Therefore, another unfavorable situation occurs in that the quality of the polarizing film after the cutting process is deteriorated.
可是,在上述专利文献1~5中所述的切断方法中,对激光振荡器的上述特性,即激光输出以极短的周期变动那种特性,并没有特别的考虑或对策。也就是说,上述专利文献1~5所述的切断方法中,存在有时不能合适地切断偏振膜的问题。因此,要求能经常合适地切断偏振膜的激光照射装置及激光照射方法。However, in the cutting methods described in Patent Documents 1 to 5, there is no special consideration or countermeasure for the above-mentioned characteristic of the laser oscillator, that is, the characteristic that the laser output fluctuates in an extremely short period. That is, in the cutting methods described in the above-mentioned Patent Documents 1 to 5, there is a problem that the polarizing film may not be properly cut. Therefore, a laser irradiation device and a laser irradiation method capable of cutting a polarizing film properly are demanded.
解决课题的手段means of solving problems
本发明鉴于上述课题而作,其主要目的在于提供输出变动得到抑制,照射的激光的输出得以稳定化的激光照射装置及激光照射方法。The present invention was made in view of the above-mentioned problems, and its main object is to provide a laser irradiation device and a laser irradiation method in which output fluctuations are suppressed and the output of irradiated laser light is stabilized.
本发明的激光照射装置,为解决上述课题,是为切断薄膜而对该薄膜照射激光的激光照射装置,具备振荡发生激光的激光振荡器、将由激光振荡器振荡发生的激光分为两束,并将被分离的激光中的一束激光照射于薄膜的光束分离器、测定被分离的激光中的另一束激光的强度的测定装置、以及根据测定到的强度算出所述激光振荡器的输出值,判断相对于设定值的所述输出值的大小,并进行校正以使所述激光振荡器的输出值接近于设定值的校正装置。The laser irradiation device of the present invention, in order to solve the above-mentioned problems, is a laser irradiation device for cutting a thin film and irradiating laser light to the thin film. A beam splitter for irradiating one of the split laser beams to the film, a measuring device for measuring the intensity of the other of the split laser beams, and calculating an output value of the laser oscillator from the measured intensity , a correction device for judging the magnitude of the output value relative to the set value, and performing correction so that the output value of the laser oscillator is close to the set value.
如果采用上述构成,则测定装置被配置为测定由光束分离器分离的激光中的另一束激光的强度,用校正装置根据所述强度算出激光振荡器的输出值,判断相对于设定值的所述输出值的大小,并进行校正以使所述激光振荡器的输出值接近于设定值。从而,即使将由上述激光照射装置振荡发生的激光的输出值设定为切断薄膜所需要的(且是更低的)值,也因输出变动得到抑制,该输出值不会低于(小于)设定值达一定程度以上,而能合适地切断薄膜。因此,能提供输出变动(相对于设定值的变动)得到抑制,照射的激光的输出得以稳定化,能合适地切断薄膜的激光照射装置。If the above configuration is adopted, the measuring device is configured to measure the intensity of another laser beam among the laser beams separated by the beam splitter, calculate the output value of the laser oscillator based on the intensity by the calibration device, and judge the output value relative to the set value. The magnitude of the output value, and correct it so that the output value of the laser oscillator is close to the set value. Therefore, even if the output value of the laser light oscillated by the above-mentioned laser irradiation device is set to a value (and lower) required for cutting the film, the output fluctuation is suppressed, and the output value will not fall below (less than) the set value. When the fixed value exceeds a certain level, the film can be properly cut. Therefore, it is possible to provide a laser irradiation device capable of suppressing output variation (variation with respect to a set value), stabilizing the output of irradiated laser light, and capable of appropriately cutting a thin film.
上述测定装置能够测定被分离的激光中的透射光的强度则更理想。又,上述测定装置是功率传感器则更理想。而且,上述激光振荡器是CO2激光振荡器则更理想。It is more preferable that the above-mentioned measuring device is capable of measuring the intensity of transmitted light in the separated laser light. Furthermore, it is more preferable that the measuring device is a power sensor. Furthermore, it is more preferable that the above-mentioned laser oscillator is a CO 2 laser oscillator.
为解决上述课题,本发明的激光照射方法,是为切断薄膜而对该薄膜照射激光的激光照射方法,包含:将由激光振荡器振荡产生的激光分为两束,并将被分离的激光中的一束激光照射于薄膜,同时测定另一束激光的强度,根据测定的强度算出所述激光振荡器的输出值,判断相对于设定值的所述输出值的大小,并进行全时校正以使所述激光振荡器的输出值接近于设定值的步骤。In order to solve the above-mentioned problems, the laser irradiation method of the present invention is a laser irradiation method for irradiating laser light to the thin film in order to cut the thin film, including: dividing the laser light oscillated by the laser oscillator into two beams, and dividing the separated laser beam into two beams. A beam of laser light is irradiated on the film, and the intensity of another laser beam is measured at the same time, the output value of the laser oscillator is calculated according to the measured intensity, the size of the output value relative to the set value is judged, and full-time correction is performed to The step of bringing the output value of the laser oscillator close to a set value.
如果采用上述构成,测定被分离的激光中的另一束激光的强度,根据所述强度算出所述激光振荡器的输出值,判断相对于设定值的所述输出值的大小,并在全部时间进行校正以使所述激光振荡器的输出值接近于设定值。从而,即使将由上述激光照射装置振荡发生的激光的输出值设定为切断薄膜所需要的(且是较低的)值,也因输出变动得到抑制,该输出值不会低于(小于)设定值达一定程度以上,而能合适地切断薄膜。因此,能提供输出变动(相对于设定值的变动)得到抑制,照射的激光的输出得以稳定化,能合适地切断薄膜的激光照射方法。If the above configuration is adopted, the intensity of the other laser beam among the separated laser beams is measured, the output value of the laser oscillator is calculated based on the intensity, the magnitude of the output value relative to the set value is judged, and all Time is corrected so that the output value of the laser oscillator is close to the set value. Therefore, even if the output value of the laser light oscillated by the above-mentioned laser irradiation device is set to a value (and low) required for cutting the film, the output fluctuation is suppressed, and the output value will not fall below (less than) the set value. When the fixed value exceeds a certain level, the film can be properly cut. Therefore, it is possible to provide a laser irradiation method that suppresses output fluctuation (variation from a set value), stabilizes the output of the irradiated laser light, and can cut the thin film appropriately.
发明效果Invention effect
如果采用本发明的激光照射装置及激光照射方法,即使将激光的输出值设定为切断薄膜所需要的(且是较低的)值,也因输出变动得到抑制,该输出值不会低于(小于)设定值达一定程度以上,能合适地切断薄膜。因此,达到能提供输出变动(相对于设定值的变动)得到抑制,照射的激光的输出得以稳定化,能合适地切断薄膜的激光照射装置及激光照射方法的效果。If the laser irradiation device and laser irradiation method of the present invention are used, even if the output value of the laser is set to a value (and lower) required for cutting the film, the output fluctuation is suppressed, and the output value will not be lower than (Less than) The set value is above a certain level, and the film can be cut off properly. Therefore, it is possible to provide a laser irradiation device and a laser irradiation method that suppress output fluctuations (variations from a set value), stabilize the output of irradiated laser light, and cut thin films appropriately.
用本发明的激光照射装置及激光照射方法切断的薄膜,不会发生其端部(切断部)或形成撕破的状态,或从端部向偏振膜内侧破裂的情况,而且,因没有将激光的输出值设定得超过需要,所以也不会发生熔化或因热膨胀而致隆起或翘曲的情况。因此,不担心切断加工后的薄膜品质劣化。The film that cuts off with laser irradiation device and laser irradiation method of the present invention, can not take place its end (cutting part) or the state that forms torn, or the situation that breaks from end to polarizing film inboard, and, because do not have laser beam The output value is set more than necessary, so there is no melting or swelling or warping due to thermal expansion. Therefore, there is no fear of deterioration in film quality after cutting.
附图说明Description of drawings
图1表示本发明的激光照射装置之一例,是表示其大概构成的框图。FIG. 1 shows an example of a laser irradiation device of the present invention, and is a block diagram showing its schematic configuration.
图2的(a)、(b)、(c)一起表示利用上述激光照射装置使激光的输出值稳定化之一例,是表示激光照射装置照射的激光的输出变动的曲线图。(a), (b), and (c) of FIG. 2 collectively show an example of stabilizing the output value of the laser light by the above-mentioned laser irradiation device, and are graphs showing fluctuations in the output of the laser light irradiated by the laser irradiation device.
图3表示已有的激光照射装置之一例,是表示其大概构成的框图。FIG. 3 shows an example of a conventional laser irradiation device, and is a block diagram showing its schematic configuration.
图4的(a)、(b)、(c)都是表示已有的激光照射装置照射的激光的输出变动的曲线图。(a), (b), and (c) of FIG. 4 are all graphs showing output variations of laser light irradiated by a conventional laser irradiation device.
图5的(a)、(b)、(c)都是将本发明的激光照射装置照射的激光的输出变动与已有的激光照射装置照射的激光的输出变动加以比较的曲线图。(a), (b), and (c) of FIG. 5 are graphs comparing the output variation of laser light irradiated by the laser irradiation device of the present invention with the output variation of laser light irradiated by a conventional laser irradiation device.
具体实施方式Detailed ways
下面根据图1~图5对本发明一实施形态进行说明。An embodiment of the present invention will be described below with reference to FIGS. 1 to 5 .
在以下的说明中,以被切断的薄膜是偏振膜的情况为例。又,本发明中所谓“切断”薄膜,除了至少将薄膜分割为两部分之外,也包含在薄膜上打出通孔或在薄膜上形成规定深度的沟(切槽)等“至少切断一部分”的情况。更具体地说,“切断”也包含例如薄膜的端部的切断(切落)、半切割、标志加工等。In the following description, the case where the cut film is a polarizing film is taken as an example. In addition, the term "cutting" the film in the present invention includes not only dividing the film into two parts, but also including "cutting at least a part" such as punching a through hole on the film or forming a groove (groove) of a predetermined depth on the film. Condition. More specifically, "cutting" includes, for example, cutting (cutting off) of the end of the film, half-cutting, marking processing, and the like.
[激光照射装置][Laser irradiation device]
图1表示本发明的激光照射装置之一例。如图1所示,本实施形态的激光照射装置10是为切断偏振膜(薄膜)而对该偏振膜照射激光的装置,具备:激光振荡器1、弯曲反射镜2、光束分离器3、功率传感器(测定装置)4、处理台(校正装置)5、及聚光透镜(未图示),同时根据需要还具备光束扩展器(未图示)等的光学构件。FIG. 1 shows an example of a laser irradiation device of the present invention. As shown in FIG. 1, the laser irradiation device 10 of this embodiment is a device for cutting a polarizing film (film) and irradiating laser light to the polarizing film, and includes: a laser oscillator 1, a bending mirror 2, a beam splitter 3, a power A sensor (measurement device) 4 , a processing table (calibration device) 5 , a condenser lens (not shown), and optical components such as a beam expander (not shown) are also provided as necessary.
激光振荡器1是振荡发生激光L的构件,例如可用CO2激光振荡器(二氧化碳激光振荡器),UV激光振荡器,半导体激光振荡器,YAG激光振荡器,受激准分子激光振荡器等振荡器,但具体结构没有特别限制。上述例示的振荡器中,CO2激光振荡器能够振荡发生适合偏振膜的切断加工的高输出的激光,所以较理想。The laser oscillator 1 is a member that oscillates the laser light L. For example, CO2 laser oscillator (carbon dioxide laser oscillator), UV laser oscillator, semiconductor laser oscillator, YAG laser oscillator, excimer laser oscillator, etc. can be used to oscillate device, but the specific structure is not particularly limited. Among the oscillators exemplified above, a CO 2 laser oscillator is preferable because it can oscillate and generate high-output laser light suitable for cutting processing of polarizing films.
一般地说,激光振荡器具有激光的输出不稳定,输出值以极短的周期(例如1毫秒)围绕着设定值以一定的振幅变动的特性,同时也有在输出低时激光的输出值容易变得不稳定(输出越高输出值的变动幅度越小)的特性。因此,为使激光振荡器1的输出值更稳定,最好是使激光振荡器1的输出为较高的输出。但是,输出值过高时,偏振膜在激光照射下或过热而熔化,或因热膨胀而致隆起或翘曲,切断加工后的偏振膜有可能品质劣化。因此,激光振荡器1的输出值预先设定为与偏振膜的材质和厚度等条件相应的合适的设定值即可。也就是,希望将激光振荡器1的具体输出值按照偏振膜的材质和厚度、偏振膜的输送速度、以及光束分离器3产生的透射光和反射光的比率,设定为合适的设定值。Generally speaking, the laser oscillator has the characteristics that the output of the laser is unstable, and the output value fluctuates around the set value with a certain amplitude in a very short period (for example, 1 millisecond). Becoming unstable (the higher the output, the smaller the fluctuation range of the output value). Therefore, in order to stabilize the output value of the laser oscillator 1, it is preferable to make the output of the laser oscillator 1 high. However, if the output value is too high, the polarizing film may be melted by laser irradiation or overheated, or swell or warp due to thermal expansion, and the quality of the polarizing film after cutting may deteriorate. Therefore, the output value of the laser oscillator 1 may be set in advance to an appropriate setting value according to conditions such as the material and thickness of the polarizing film. That is, it is desirable to set the specific output value of the laser oscillator 1 to an appropriate setting value according to the material and thickness of the polarizing film, the conveying speed of the polarizing film, and the ratio of the transmitted light and reflected light generated by the beam splitter 3 .
照射的激光L的频率根据激光振荡器1的输出、偏振膜的材质和厚度、偏振膜的输送速度等条件适当设定即可,但一般可设定为5kHz以上、100kHz以下。The frequency of the laser light L to be irradiated may be appropriately set according to conditions such as the output of the laser oscillator 1, the material and thickness of the polarizing film, and the conveying speed of the polarizing film, but generally it can be set at 5 kHz or more and 100 kHz or less.
然后,激光振荡器1按照预先设定的设定值输出激光,且通过校正装置即处理台5进行全时校正,以使其输出值接近于设定值。Then, the laser oscillator 1 outputs laser light according to the preset setting value, and the calibration device, ie, the processing table 5, performs full-time calibration so that the output value is close to the setting value.
激光照射装置10在从光束分离器3向偏振膜的光路上具有光束扩展器,是更理想的形态。光束扩展器是将激光L1扩展为平行光束的构件,可使用公知的光束扩展器。具体地说,利用光束扩展器将激光L1的直径扩展到例如2倍~10倍的程度更好。通过扩展激光的直径可更缩小照射于偏振膜的激光的光点直径。It is more preferable that the laser irradiation device 10 has a beam expander on the optical path from the beam splitter 3 to the polarizing film. The beam expander expands the laser light L1 into a parallel beam, and a known beam expander can be used. Specifically, it is more preferable to expand the diameter of the laser light L1 by, for example, 2 to 10 times with a beam expander. By expanding the diameter of the laser beam, the spot diameter of the laser beam irradiated on the polarizing film can be further reduced.
弯曲反射镜(bent mirror)2是将激光振荡器1振荡发生的激光L向着光束分离器反射的构件。上述弯曲反射镜2采用例如平面反射镜是合适的,只要形成能将激光L向光束分离器3反射的结构即可。另外,其个数也无特别限定。The bent mirror (bent mirror) 2 is a member that reflects the laser light L oscillated by the laser oscillator 1 toward the beam splitter. It is suitable to use, for example, a flat mirror as the above-mentioned curved mirror 2 , as long as it has a structure capable of reflecting the laser light L to the beam splitter 3 . In addition, the number is not particularly limited, either.
光束分离器(beam splitter)3是将激光振荡器1振荡发生并由弯曲反射镜2反射的激光L以一定的比率(比例)分为两束的构件。即光束分离器3是以一定的比率将激光L分为反射光L1和透射光L2的构件。而且,光束分离器3将被分离的激光中的反射光L1(一束激光)经聚光透镜等光学构件照射到偏振膜上,用于偏振膜的切断加工,同时将透射光L2(另一束激光)照射于功率传感器4,用于激光振荡器1的输出调节。该光束分离器3可使用公知的光束分离器。The beam splitter (beam splitter) 3 is a component that divides the laser light L oscillated by the laser oscillator 1 and reflected by the curved mirror 2 into two beams at a certain ratio (proportion). That is, the beam splitter 3 is a member that splits the laser light L into reflected light L1 and transmitted light L2 at a constant ratio. Moreover, the beam splitter 3 irradiates the reflected light L1 (one beam of laser light) in the separated laser light onto the polarizing film through optical components such as a condenser lens, and is used for cutting processing of the polarizing film. Beam laser light) is irradiated on the power sensor 4 for output adjustment of the laser oscillator 1 . As the beam splitter 3, a known beam splitter can be used.
上述聚光透镜采用例如球面透镜或非球面透镜等公知的透镜即可,没有特别限定。另外,因反射光L1即激光的聚光直径决定偏振膜的切断宽度,故在偏振膜上的该激光的聚光直径以5μm以上、500μm以下为宜,10μm以上、400μm以下更好。As the above-mentioned condensing lens, for example, a known lens such as a spherical lens or an aspheric lens may be used, and it is not particularly limited. In addition, since the focal diameter of the reflected light L1, that is, the laser light, determines the cutting width of the polarizing film, the focal diameter of the laser light on the polarizing film is preferably 5 μm or more and 500 μm or less, more preferably 10 μm or more and 400 μm or less.
还有,本实施形态的激光照射装置10采用在偏振膜切断加工中使用反射光L1,在激光振荡器1的输出调节中使用透射光L2的构成,但也可以通过使用例如弯曲反射镜(未图示),采用在偏振膜切断加工中使用透射光L2,在激光振荡器1的输出调节中使用反射光L1的构成。In addition, the laser irradiation device 10 of the present embodiment is configured to use the reflected light L1 in the cutting process of the polarizing film and the transmitted light L2 in the output adjustment of the laser oscillator 1. (shown in the figure) adopts a configuration in which transmitted light L2 is used for cutting the polarizing film and reflected light L1 is used for output adjustment of the laser oscillator 1 .
作为测定装置的功率传感器(power sensor)4是将透射光L2变换为热电动势并测定透射光L2的激光强度的元件。即功率传感器4测定因照射激光而发生的电力,借此来测定该激光的强度。利用功率传感器4进行测定的间隔短些更好,例如10毫秒就行,但不作特别限定。又,功率传感器4可用公知的功率传感器。另外,测定装置只要是能测定激光的强度的结构就行。A power sensor (power sensor) 4 as a measurement device is an element that converts the transmitted light L2 into a thermoelectromotive force and measures the laser intensity of the transmitted light L2. That is, the power sensor 4 measures the electric power generated by irradiation of laser light, thereby measuring the intensity of the laser light. The measurement interval by the power sensor 4 is preferably shorter, for example, 10 milliseconds, but it is not particularly limited. Also, as the power sensor 4, a known power sensor can be used. In addition, as long as the measuring device has a structure capable of measuring the intensity of laser light, it is sufficient.
然后,功率传感器4将测定的激光强度(测定值)的数据经A/D变换器(未图示)发送至处理台5。上述A/D变换器将测定值的模拟数据变换为数字数据,并将测定值的数字数据发送到处理台5。Then, the power sensor 4 transmits data of the measured laser intensity (measured value) to the processing station 5 via an A/D converter (not shown). The above-mentioned A/D converter converts the analog data of the measured value into digital data, and sends the digital data of the measured value to the processing station 5 .
校正装置即处理台5内藏CPU等运算处理装置。该处理台5根据从功率传感器4经A/D变换器接受的测定值的数字数据与由光束分离器3分离的透射光L2的比率(比例),算出上述激光振荡器1的输出值,判断相对于预先设定的设定值的上述输出值的大小(超过与不足),进行全时校正以使上述激光振荡器1的输出值接近于设定值。即处理台5在全部时间里,具体地说,例如每10毫秒将运算结果反馈到激光振荡器1,调节(校正)使激光振荡器1的实际输出值接近于设定值。更具体地说,在作为透射光L2的激光的强度小,激光振荡器1的输出值小于设定值时,调节激光振荡器1的输出使激光L的实际的输出值增大,另一方面,在作为透射光L2的激光的强度大,激光振荡器1的输出值大于设定值时,调节激光振荡器1的输出使激光L的实际输出值减少。又,处理台5只要是能进行上述的计算和判断的结构就行,其具体构成没有限定。The processing table 5, which is the calibration device, has a built-in arithmetic processing device such as a CPU. The processing station 5 calculates the output value of the above-mentioned laser oscillator 1 based on the ratio (ratio) of the digital data of the measured value received from the power sensor 4 via the A/D converter to the transmitted light L2 separated by the beam splitter 3, and judges Full-time correction is performed to make the output value of the laser oscillator 1 close to the set value for the size (exceed or fall) of the output value relative to the set value set in advance. That is, the processing station 5 feeds back the calculation results to the laser oscillator 1 at all times, specifically, for example, every 10 milliseconds, and adjusts (corrects) the actual output value of the laser oscillator 1 close to the set value. More specifically, when the intensity of the laser light as the transmitted light L2 is small and the output value of the laser oscillator 1 is smaller than the set value, the output of the laser oscillator 1 is adjusted to increase the actual output value of the laser light L. On the other hand, When the intensity of the laser light as the transmitted light L2 is high and the output value of the laser oscillator 1 is greater than the set value, the output of the laser oscillator 1 is adjusted so that the actual output value of the laser light L decreases. The specific configuration of the processing table 5 is not limited as long as it can perform the above-mentioned calculations and judgments.
本实施形态中的激光照射装置10中,采用借助于上述构成的功率传感器4和处理台5,以例如10毫秒的测定间隔测定透射光L2的强度,调节激光L的输出值的所谓的FTS(全时间稳定器;full time stabilizer)系统,能够调节(校正)激光振荡器1的实际输出值以使其接近于设定值,因此能合适地切断偏振膜。In the laser irradiation device 10 in the present embodiment, a so-called FTS ( Full time stabilizer (full time stabilizer) system, capable of adjusting (correcting) the actual output value of the laser oscillator 1 so as to be close to the set value, thus cutting the polarizing film appropriately.
本实施形态中的激光照射装置10被用作构成例如连续进行偏振膜的切断加工的切带机(未图示)的一个装置。切带机除了激光照射装置10外,还具备放出长尺寸的偏振膜(后面说明)的放出部、输送该偏振膜的多个输送滚筒、卷取切断加工后的偏振膜的卷取部等构件。下面对切带机加以说明。但切带机中的激光照射装置10以外的结构,可采用公知的结构,故其说明从略。The laser irradiation device 10 in this embodiment is used as one device constituting, for example, a tape cutting machine (not shown) that continuously cuts a polarizing film. In addition to the laser irradiation device 10, the tape cutting machine is equipped with components such as a discharge unit that discharges a long polarizing film (described later), a plurality of transport rollers that transport the polarizing film, and a winding unit that winds up and cuts the polarizing film. . The tape cutting machine will be described below. However, the structure other than the laser irradiation device 10 in the tape cutting machine can be a known structure, so the description thereof will be omitted.
放出部是保持长尺寸的偏振膜,同时利用旋转装置的旋转将卷绕的偏振膜向输送滚筒放出的构件,具体地说,可举出公知的放出部。又,对偏振膜施加的张力和偏振膜的输送速度利用旋转装置调节。另外,放出部设置一个即可,但通过设置两个,能在一放出部的偏振膜全部被放出之前,将该偏振膜与另一放出部的偏振膜连结,因此能减少替换偏振膜的卷筒的时间。The unwinding section holds the elongated polarizing film and unwinds the wound polarizing film to the conveyance roller by the rotation of the rotating device. Specifically, a known unwinding section can be used. In addition, the tension applied to the polarizing film and the transport speed of the polarizing film were adjusted with a rotating device. In addition, it is sufficient to provide only one discharge part, but by providing two, the polarizing film of one discharge part can be connected to the polarizing film of the other discharge part before all the polarizing films are released, so the number of rolls of replacement polarizing films can be reduced. drum time.
作为输送偏振膜的输送滚筒,有例如公知的输送滚筒。通常,输送滚筒的宽度是1.5m~2.5m左右。偏振膜的输送速度采取例如1m/秒以上、100m/秒以下即可,没有特别限定。另外,切带机中也可以具备将偏振膜按压在输送滚筒上的接触滚筒。As a conveyance roller which conveys a polarizing film, there exists a well-known conveyance roller, for example. Usually, the width of the conveying roller is about 1.5m to 2.5m. The conveying speed of the polarizing film may be, for example, not less than 1 m/sec and not more than 100 m/sec, and is not particularly limited. Moreover, the contact roll which presses a polarizing film to a conveyance roll may be provided in a tape cutting machine.
卷取部设置两个,是利用旋转装置的转动卷取切断加工后的偏振膜的卷取构件。具体可举出公知的卷取部。又,对切断加工后的偏振膜施加的张力和偏振膜的输送速度由旋转装置调节。Two take-up units are provided, and are take-up means for taking up the cut-processed polarizing film by the rotation of the rotating device. Specifically, a known take-up unit can be mentioned. Moreover, the tension|tensile_strength applied to the polarizing film after cutting processing, and the conveyance speed of a polarizing film are adjusted with a rotating device.
激光照射装置10被配置于由多个输送滚筒形成的偏振膜输送路径的途中,连续地对由输送滚筒输送的偏振膜进行切断加工。又,也可以取代偏振膜的移动,一边使激光照射装置10移动,一边进行偏振膜的切断加工。The laser irradiation apparatus 10 is arrange|positioned in the middle of the polarizing film conveyance path formed by several conveyance rollers, and cuts the polarizing film conveyed by a conveyance roller continuously. Moreover, instead of moving the polarizing film, the cutting process of the polarizing film may be performed while moving the laser irradiation device 10 .
因而,通过使用上述构成的切带机,能连续地进行偏振膜的切断加工。Therefore, cutting processing of a polarizing film can be performed continuously by using the tape cutting machine of the said structure.
[薄膜][film]
激光照射装置10切断的薄膜(切断对象)没有特别限定,但可举出公知的偏振膜。作为该偏振膜,通常可举出长尺寸(例如在切断方向上的偏振膜的长度为10m以上)的偏振膜,但也可以是短尺寸(例如在切断方向上的偏振膜的长度为2m以上、不满10m)或板状(例如在切断方向上的偏振膜的长度为10cm以上、不满2m)的偏振膜。The film (cutting target) to be cut by the laser irradiation device 10 is not particularly limited, but known polarizing films can be used. As the polarizing film, generally, a polarizing film of a long size (for example, the length of the polarizing film in the cutting direction is 10 m or more), but a short size (for example, the length of the polarizing film in the cutting direction is 2 m or more) may be used. , less than 10m) or plate-shaped (for example, the length of the polarizing film in the cutting direction is 10 cm or more and less than 2 m).
作为偏振膜的构成,具体地说,可举出例如在起偏振薄膜的两面上贴合TAC(三乙酰纤维素)薄膜、COP(环烯烃聚合物)薄膜等薄膜作为保护膜,在对着激光照射装置10的面的反面(里面)的TAC薄膜上,通过粘接剂层叠保护膜的构成。作为位于偏振膜的中心的起偏振薄膜,可举出对聚乙烯醇薄膜用碘等染色剂染色并延伸的薄膜,贴合TAC等保护膜构件的薄膜。又可以取代上述聚乙烯醇薄膜,而使用部分甲缩醛化聚乙烯醇系薄膜、乙烯·醋酸乙烯共聚物系部分皂化薄膜、纤维素系薄膜等亲水性高分子薄膜、聚乙烯醇的脱水处理物或聚氯乙烯的脱盐酸处理物等聚烯取向薄膜。As the composition of the polarizing film, specifically, for example, a TAC (triacetyl cellulose) film, a COP (cycloolefin polymer) film, etc. are bonded on both sides of the polarizing film as a protective film, The structure in which a protective film is laminated with an adhesive on the TAC film on the opposite (rear) surface of the irradiation device 10 . Examples of the polarizing film positioned at the center of the polarizing film include stretched polyvinyl alcohol films dyed with dyes such as iodine, and films bonded with protective film members such as TAC. Instead of the above-mentioned polyvinyl alcohol film, hydrophilic polymer films such as partially methylated polyvinyl alcohol-based films, ethylene-vinyl acetate copolymer-based partially saponified films, cellulose-based films, and dehydrating polyvinyl alcohol films can be used. Polyene oriented films such as treated products or dehydrochlorination-treated products of polyvinyl chloride.
作为上述保护膜,也可用聚酯薄膜、聚对苯二甲酸乙二酯薄膜等薄膜。上述保护膜的厚度和宽度没有特别限定,但从用作偏振膜的保护膜的考虑出发,以例如5μm以上、60μm以下的厚度,200mm以上、1500mm以下的宽度为宜。As the above-mentioned protective film, films such as polyester film and polyethylene terephthalate film can also be used. The thickness and width of the above-mentioned protective film are not particularly limited, but for example, a thickness of 5 μm to 60 μm and a width of 200 mm to 1500 mm are suitable for use as a protective film for a polarizing film.
含有保护膜的偏振膜的厚度没有特别限定,但可采用100μm以上、500μm以下。又,起偏振薄膜的厚度一般为10μm以上、50μm以下。又,偏振膜在实用上没有问题的范围内,在上述三层(起偏振薄膜、TAC薄膜和COP薄膜、保护膜)外还可以再含有其他层。The thickness of the polarizing film including the protective film is not particularly limited, but can be 100 μm or more and 500 μm or less. In addition, the thickness of the polarizing film is generally not less than 10 μm and not more than 50 μm. In addition, the polarizing film may further contain other layers in addition to the above-mentioned three layers (polarizing film, TAC film, COP film, and protective film) within the range where there is no practical problem.
[激光照射方法][Laser irradiation method]
本实施形态的激光照射方法,是为切断偏振膜(薄膜)而对该偏振膜照射激光的方法,该方法是将激光振荡器1振荡发生的激光L分为两束,将分离的激光中的例如反射光L1(其中一束激光)经聚光透镜等光学构件照射到偏振膜上,用于该偏振膜的切断加工,同时,测定作为透射光L2(另一束激光)的激光的强度,根据测定的强度(例如测定值的数字数据)和在光束分离器3进行的分离中透射光L2的比率(比例),算出上述激光振荡器1的输出值,判断相对于预先设定的设定值的上述输出值的大小(超过与不足),在全部时间进行校正以使上述激光振荡器1的输出值接近于设定值的方法。The laser irradiation method of this embodiment is a method of irradiating laser light to the polarizing film in order to cut the polarizing film (film). For example, the reflected light L1 (one of the laser beams) is irradiated on the polarizing film through optical components such as a condenser lens, and is used for cutting processing of the polarizing film. At the same time, the intensity of the laser beam as the transmitted light L2 (another laser beam) is measured. Based on the measured intensity (for example, digital data of the measured value) and the ratio (proportion) of the transmitted light L2 in the splitting by the beam splitter 3, the output value of the above-mentioned laser oscillator 1 is calculated, and the output value of the laser oscillator 1 is judged relative to the preset setting. The magnitude (over and under) of the above-mentioned output value of the value is corrected at all times so that the output value of the above-mentioned laser oscillator 1 is close to the set value.
作为上述激光L,因CO2激光能得到对偏振膜切断加工合适的高输出功率,所以较为理想。又,照射的激光L的频率,根据激光振荡器1的输出功率、偏振膜的材质与厚度、偏振膜的输送速度等条件适当设定即可,一般可采用5kHz以上、100kHz以下。As the above-mentioned laser light L, a CO 2 laser is preferable because a high output power suitable for cutting and processing of a polarizing film can be obtained. Also, the frequency of the laser light L to be irradiated may be appropriately set according to conditions such as the output power of the laser oscillator 1, the material and thickness of the polarizing film, and the conveying speed of the polarizing film. Generally, it can be 5 kHz or more and 100 kHz or less.
为将激光L分为两束,如上所述采用光束分离器3即可。但分离的方法不限于采用光束分离器的方法,只要是能将激光L分为两束的方法即可。但反射光L1与透射光L2的比率采用与激光振荡器1的输出功率、偏振膜的材质与厚度、偏振膜的输送速度等条件相应的合适的设定值即行,并无特定限定。To split the laser light L into two beams, the beam splitter 3 may be used as described above. However, the splitting method is not limited to the method using a beam splitter, and any method can be used as long as the laser light L can be split into two beams. However, the ratio of the reflected light L1 to the transmitted light L2 may be set appropriately according to the output power of the laser oscillator 1, the material and thickness of the polarizing film, and the conveying speed of the polarizing film, and is not particularly limited.
又,本实施形态的激光照射方法中,对薄膜的切断加工使用反射光L1,对激光振荡器1的输出调节使用透射光L2,但也可以采用对薄膜的切断加工使用透射光L2,对激光振荡器1的输出调节使用反射光L1的结构。Also, in the laser irradiation method of the present embodiment, the reflected light L1 is used for the cutting process of the film, and the transmitted light L2 is used for output adjustment of the laser oscillator 1, but it is also possible to use the transmitted light L2 for cutting the film, and the laser The output of oscillator 1 adjusts the structure using reflected light L1.
为测定作为透射光L2的激光的强度,只要按上面所述使用功率传感器4即可。但测定方法不限于使用功率传感器的方法,只要是能测定激光的强度的方法就行。测定间隔以短为宜,如10毫秒就行,但无特别限定。In order to measure the intensity of the laser light as the transmitted light L2, it is only necessary to use the power sensor 4 as described above. However, the measurement method is not limited to the method using a power sensor, and any method can be used as long as the intensity of laser light can be measured. The measurement interval is preferably as short as 10 milliseconds, but it is not particularly limited.
为了进行全时校正以使激光振荡器1的输出值接近于设定值,只要如上所述使用处理台5即可。但校正方法不限于使用处理台的方法,只要是能例如每10毫秒将用测定的激光的强度(例如测定值的数字数据)、透射光L2的比率(比例)、以及预先设定的设定值进行运算的运算结果反馈到激光振荡器1,进行调节(校正)以使激光振荡器1的实际输出值接近于设定值的方法就行。更具体地说,只要是能在作为透射光L2的激光的强度小,激光振荡器1的输出值小于设定值时,调节激光振荡器1的输出使激光L的实际输出值变大,另一方面,在作为透射光L2的激光的强度大,激光振荡器1的输出值大于设定值时,调节激光振荡器1的输出使激光L的实际输出值减小的方法就行。In order to perform full-time calibration so that the output value of the laser oscillator 1 approaches the set value, it is only necessary to use the processing table 5 as described above. However, the calibration method is not limited to the method using a processing table, as long as it can be used, for example, every 10 milliseconds, the measured laser intensity (for example, digital data of the measured value), the ratio (ratio) of the transmitted light L2, and the preset setting The calculation result of the value calculation is fed back to the laser oscillator 1, and adjustment (correction) is performed so that the actual output value of the laser oscillator 1 is close to the set value. More specifically, as long as the intensity of the laser light as the transmitted light L2 is small and the output value of the laser oscillator 1 is less than the set value, the output of the laser oscillator 1 can be adjusted so that the actual output value of the laser light L becomes larger. On the one hand, when the intensity of the laser light as the transmitted light L2 is high and the output value of the laser oscillator 1 is greater than the set value, it is sufficient to adjust the output of the laser oscillator 1 so that the actual output value of the laser light L is reduced.
本实施形态的激光照射方法中,能够采用以例如10毫秒的测定间隔测定透射光L2的强度,调节激光L的输出值的所谓FTS(full time stabilizer)系统,进行调节(校正)以使激光振荡器1的实际输出值接近于设定值,因此能合适地切断偏振膜。In the laser irradiation method of this embodiment, the so-called FTS (full time stabilizer) system that measures the intensity of the transmitted light L2 at a measurement interval of, for example, 10 milliseconds and adjusts the output value of the laser light L can be used to perform adjustment (correction) so that the laser oscillates. The actual output value of the device 1 is close to the set value, so the polarizing film can be cut off properly.
本实施形态的激光照射方法,能合适地用于例如连续进行偏振膜的切断加工的切带机。The laser irradiation method of the present embodiment can be suitably used for, for example, a tape cutting machine that continuously cuts a polarizing film.
又,本发明的激光照射装置及激光照射方法,是能合适地切断薄膜的装置和方法,因此也可以理解为是激光切断装置及激光切断方法。In addition, the laser irradiation device and the laser irradiation method of the present invention are devices and methods capable of appropriately cutting a thin film, and thus can also be understood as a laser cutting device and a laser cutting method.
实施例Example
上面讨论了本实施形态的激光照射装置10的性能。另外,为了与本实施形态的激光照射装置10的性能作对比,讨论了已有的激光照射装置的性能。具体地说,测定了本实施形态的激光照射装置10和已有的激光照射装置的激光振荡器1振荡发生的激光L的输出变动。The performance of the laser irradiation device 10 of this embodiment has been discussed above. In addition, in order to compare with the performance of the laser irradiation device 10 of this embodiment, the performance of a conventional laser irradiation device was discussed. Specifically, the output variation of the laser light L oscillated by the laser oscillator 1 of the laser irradiation device 10 of the present embodiment and the conventional laser irradiation device was measured.
讨论性能的激光照射装置的构成示于图3。如图3所示,已有的激光照射装置20具备激光振荡器1、弯曲反射镜2、弯曲反射镜8及聚光透镜(未图示)。也就是说,已有的激光照射装置20不具备光束分离器、功率传感器、A/D变换器及处理台,是由弯曲反射镜2和弯曲反射镜8反射激光振荡器1振荡发生的激光L的全部,用于薄膜的切断加工的构成。又,用来进行校正以使上述激光振荡器1的输出值接近于设定值的构成以外的构成(例如光束扩展器等光学构件),激光照射装置20与激光照射装置10同样具备。另外,激光振荡器1,在激光照射装置10与激光照射装置20中采用相同的振荡器。The configuration of the laser irradiation device for discussing performance is shown in FIG. 3 . As shown in FIG. 3 , a conventional
而且用本实施形态的激光照射装置10与已有的激光照射装置20测定激光振荡器1振荡发生的激光L的输出变动。Furthermore, the output variation of the laser light L oscillated by the laser oscillator 1 was measured using the laser irradiation device 10 of the present embodiment and the existing
即设定激光振荡器1振荡发生的激光L的输出值为14.0W,以6m/分的速度对薄膜进行切断加工。在本实施形态的激光照射装置10中,如图2的(a)所示,实际输出的激光L的输出值一般在13.4~14.1W的范围内(平均13.8W,振幅0.7W)。与之相对,在已有的激光照射装置20中,如图4的(a)所示,实际输出的激光L的输出值一般在12.3~15.0W的范围内波动(平均13.8W,振幅2.7W)。从而,由图5的(a)所示的结果可知,在将激光L的输出值设定为14.0W的情况下,激光照射装置10的激光振荡器1振荡发生的激光L的输出变动小,与已有的激光照射装置20的性能相比,判定本实施形态的激光照射装置10的性能格外优异。That is, the output value of the laser light L oscillated by the laser oscillator 1 was set at 14.0 W, and the thin film was cut at a speed of 6 m/min. In the laser irradiation device 10 of this embodiment, as shown in FIG. 2( a ), the output value of the actually output laser light L is generally in the range of 13.4 to 14.1W (average 13.8W, amplitude 0.7W). In contrast, in the conventional
又将激光振荡器1振荡发生的激光L的输出值设定为49.5W,以30m/分的速度对薄膜进行切断加工。本实施形态的激光照射装置10,如图2的(b)所示,实际输出的激光L的输出值一般在48.9~50.4W的范围内(平均49.5W,振幅1.6W)。与之相对,已有的激光照射装置20,如图4的(b)所示,实际输出的激光L的输出值一般在46.4~51.1W的范围内波动(平均49.2W,振幅4.7W)。从而,由图5(b)所示的结果可知,在将激光L的输出值设定为49.5W的情况下,激光照射装置10的激光振荡器1振荡发生的激光L的输出变动小,与已有的激光照射装置20的性能相比较,判定本实施形态的激光照射装置10的性能格外优异。The output value of the laser light L oscillated by the laser oscillator 1 was set to 49.5 W, and the thin film was cut at a speed of 30 m/min. The laser irradiation device 10 of the present embodiment generally has an output value of the laser light L actually output in the range of 48.9 to 50.4W (49.5W on average, 1.6W in amplitude) as shown in FIG. 2( b ). In contrast, in the conventional
又将激光振荡器1振荡发生的激光L的输出值设定为100.0W,以60m/分的速度进行薄膜的切断加工。本实施形态的激光照射装置10,如图2的(c)所示,实际输出的激光L的输出值一般在99.3~100.6W的范围内(平均99.9W,振幅1.3W)。与之相对,已有的激光照射装置20,如图4的(c)所示,实际输出的激光L的输出值一般在95.2~102.8W的范围内波动(平均99.1W,振幅7.6W)。从而,由图5的(c)所示的结果可知,在激光L的输出值设定为100.0W的情况下,激光照射装置10的激光振荡器1振荡发生的激光L的输出变动小,与已有的激光照射装置20的性能相比,判定本实施形态的激光照射装置10的性能格外优异。The output value of the laser light L oscillated by the laser oscillator 1 was set to 100.0 W, and the thin film was cut at a speed of 60 m/min. The laser irradiation device 10 of the present embodiment generally has an output value of the laser light L actually output in the range of 99.3 to 100.6 W (average 99.9 W, amplitude 1.3 W), as shown in FIG. 2( c ). In contrast, in the conventional
即根据图5的(a)~(c)所示的结果明显地看出,本实施形态的激光照射装置10的性能与已有的激光照射装置20的性能相比,激光振荡器1振荡发生的激光L的输出变动小,故其性能格外优异。That is, it is clear from the results shown in (a) to (c) of FIG. The output fluctuation of the laser light L is small, so its performance is particularly excellent.
又,本发明不限于上述实施形态,可在所述范围内以加上各种变形的形态来实施,从而,在权利要求项所示的范围内实施各种变更是可能的。In addition, the present invention is not limited to the above-described embodiments, and can be implemented in various modifications within the range described above, and therefore, various changes are possible within the scope of the claims.
工业上的可利用性Industrial availability
如果采用本发明的激光照射装置及激光照射方法,即使将激光的输出值设定为切断薄膜所需要的(且较低的)值,也因输出变动受到抑制,该输出值不会低于(小于)设定值达一定程度以上,能合适地切断薄膜。因此,有能提供输出变动(相对于设定值的变动)受到抑制,照射的激光的输出得以稳定化且能合适地切断薄膜的激光照射装置及激光照射方法的效果。If the laser irradiation device and laser irradiation method of the present invention are used, even if the output value of the laser is set to a value (and lower) required for cutting the film, the output fluctuation is suppressed, and the output value will not be lower than ( If the set value is above a certain level, the film can be properly cut off. Therefore, there is an effect of providing a laser irradiation device and a laser irradiation method capable of suppressing output fluctuations (variations with respect to a set value), stabilizing the output of irradiated laser light, and capable of appropriately cutting a thin film.
因此,本发明的激光照射装置及激光照射方法,能利于例如偏振膜的切断加工,故在用偏振膜的例如液晶面板等各种产品的制造过程中,即在用偏振膜的各种产业中能得到广泛应用。Therefore, the laser irradiation device and the laser irradiation method of the present invention can be beneficial to the cutting processing of such as polarizing film, so in the manufacturing process of various products such as liquid crystal panel with polarizing film, promptly in the various industries of using polarizing film Can be widely used.
符号说明Symbol Description
1 激光振荡器1 laser oscillator
2 弯曲反射镜2 curved mirrors
3 光束分离器3 beam splitter
4 功率传感器(测定装置)4 power sensor (measuring device)
5 处理台(校正装置)5 processing table (calibration device)
10 激光照射装置10 Laser irradiation device
L 激光L Laser
L1 反射光(激光)L1 reflected light (laser)
L2 透射光(激光)。L2 Transmitted light (laser).
Claims (5)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-288671 | 2010-12-24 | ||
| JP2010288671A JP2012135782A (en) | 2010-12-24 | 2010-12-24 | Apparatus and method for laser light irradiation |
| PCT/JP2011/079832 WO2012086764A1 (en) | 2010-12-24 | 2011-12-22 | Laser beam irradiation apparatus and laser beam irradiation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103260816A true CN103260816A (en) | 2013-08-21 |
Family
ID=46314031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011800616215A Pending CN103260816A (en) | 2010-12-24 | 2011-12-22 | Laser irradiation device and laser irradiation method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2012135782A (en) |
| KR (1) | KR20140019313A (en) |
| CN (1) | CN103260816A (en) |
| TW (1) | TW201233482A (en) |
| WO (1) | WO2012086764A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107378260A (en) * | 2016-05-17 | 2017-11-24 | 发那科株式会社 | Laser processing device and laser processing |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013128966A (en) * | 2011-12-22 | 2013-07-04 | Sumitomo Chemical Co Ltd | Laser beam irradiation apparatus, film cutting apparatus, laser beam irradiation method, and film cutting method |
| JP7475220B2 (en) * | 2020-07-03 | 2024-04-26 | 住友重機械工業株式会社 | Laser Power Measurement Device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6478694A (en) * | 1987-09-19 | 1989-03-24 | Hitachi Maxell | Method and device for cutting raw film consisting of plastic film as base material |
| JPH09122946A (en) * | 1995-10-31 | 1997-05-13 | Hitachi Cable Ltd | Substrate processing method using carbon dioxide laser light and its processing apparatus |
| JP2000357835A (en) * | 1999-06-15 | 2000-12-26 | Amada Eng Center Co Ltd | Laser oscillator |
| CN101266926A (en) * | 2007-01-24 | 2008-09-17 | 索尼株式会社 | Laser drawing method and apparatus |
-
2010
- 2010-12-24 JP JP2010288671A patent/JP2012135782A/en not_active Withdrawn
-
2011
- 2011-12-20 TW TW100147292A patent/TW201233482A/en unknown
- 2011-12-22 CN CN2011800616215A patent/CN103260816A/en active Pending
- 2011-12-22 KR KR1020137018981A patent/KR20140019313A/en not_active Withdrawn
- 2011-12-22 WO PCT/JP2011/079832 patent/WO2012086764A1/en not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6478694A (en) * | 1987-09-19 | 1989-03-24 | Hitachi Maxell | Method and device for cutting raw film consisting of plastic film as base material |
| JPH09122946A (en) * | 1995-10-31 | 1997-05-13 | Hitachi Cable Ltd | Substrate processing method using carbon dioxide laser light and its processing apparatus |
| JP2000357835A (en) * | 1999-06-15 | 2000-12-26 | Amada Eng Center Co Ltd | Laser oscillator |
| CN101266926A (en) * | 2007-01-24 | 2008-09-17 | 索尼株式会社 | Laser drawing method and apparatus |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107378260A (en) * | 2016-05-17 | 2017-11-24 | 发那科株式会社 | Laser processing device and laser processing |
| CN107378260B (en) * | 2016-05-17 | 2019-07-05 | 发那科株式会社 | Laser processing device and laser processing |
| US10537964B2 (en) | 2016-05-17 | 2020-01-21 | Fanuc Corporation | Laser machining apparatus and laser machining method for performing laser machining while controlling reflected light |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012135782A (en) | 2012-07-19 |
| KR20140019313A (en) | 2014-02-14 |
| TW201233482A (en) | 2012-08-16 |
| WO2012086764A1 (en) | 2012-06-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101706416B1 (en) | Method for cutting polarizing plate and polarizing plate cut by said method | |
| KR102109091B1 (en) | Methods and apparatus for fabricating glass ribbon of varying widths | |
| JP5293498B2 (en) | Web conveying apparatus and method and battery manufacturing method | |
| TW201628751A (en) | Feedback-controlled laser cutting of flexible glass substrates | |
| US10710351B2 (en) | System and method for continuously manufacturing optical display device | |
| WO2014097885A1 (en) | Manufacturing method for optical display device and manufacturing system for optical display device | |
| CN103260816A (en) | Laser irradiation device and laser irradiation method | |
| TWI501829B (en) | Laser cutter, slitter provided with the laser cutter, and laser cutting method | |
| KR101535050B1 (en) | System for continuous manufacture of optical display panels, and method for continuous manufacture of optical display panels | |
| JP2007014993A (en) | Laser workpiece cutting method and laser processing apparatus | |
| JP2014121736A (en) | Laser light irradiation apparatus and laser light irradiation method | |
| WO2013094758A1 (en) | Laser light irradiation system, laser light irradiation method, and recording medium | |
| JPWO2011158584A1 (en) | Thin film glass conveying apparatus and thin film glass conveying method | |
| EP3464201B1 (en) | Apparatus and method of managing mechanically induced stress on a crack tip when separating a flexible glass ribbon | |
| US11305958B2 (en) | Roll manufacturing method and manufacturing device | |
| JP6020884B2 (en) | Laser processing method | |
| JP7404815B2 (en) | Glass roll manufacturing method | |
| KR20250162232A (en) | Slitter apparatus with touch roll module | |
| JP2003114108A (en) | Thickness measuring method for thickening treatment part and thickening treatment method for web | |
| JPH04193500A (en) | Cutting device for film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130821 |