CN102876274A - 太阳能电池硅片切割工艺用胶 - Google Patents
太阳能电池硅片切割工艺用胶 Download PDFInfo
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- CN102876274A CN102876274A CN2012104026548A CN201210402654A CN102876274A CN 102876274 A CN102876274 A CN 102876274A CN 2012104026548 A CN2012104026548 A CN 2012104026548A CN 201210402654 A CN201210402654 A CN 201210402654A CN 102876274 A CN102876274 A CN 102876274A
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- Prior art keywords
- solar cell
- cutting process
- silicon wafer
- cell silicon
- wafer cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 27
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 27
- 239000010703 silicon Substances 0.000 title claims abstract description 27
- 238000005520 cutting process Methods 0.000 title claims abstract description 20
- 239000000853 adhesive Substances 0.000 title abstract description 13
- 230000001070 adhesive effect Effects 0.000 title abstract description 13
- 239000003292 glue Substances 0.000 claims abstract description 19
- 239000003822 epoxy resin Substances 0.000 claims abstract description 13
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 13
- 239000004952 Polyamide Substances 0.000 claims abstract description 11
- 229920002647 polyamide Polymers 0.000 claims abstract description 11
- 239000000945 filler Substances 0.000 claims abstract description 8
- 239000000654 additive Substances 0.000 claims abstract description 6
- -1 alicyclic amine Chemical class 0.000 claims abstract description 5
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000003085 diluting agent Substances 0.000 claims abstract description 5
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 5
- 239000012745 toughening agent Substances 0.000 claims abstract description 5
- 230000000996 additive effect Effects 0.000 claims abstract description 4
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 3
- 150000001412 amines Chemical class 0.000 claims abstract description 3
- 229920000570 polyether Polymers 0.000 claims abstract description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 18
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 12
- 239000002270 dispersing agent Substances 0.000 claims description 9
- 239000013530 defoamer Substances 0.000 claims description 8
- 229920000459 Nitrile rubber Polymers 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 5
- IGSBHTZEJMPDSZ-UHFFFAOYSA-N 4-[(4-amino-3-methylcyclohexyl)methyl]-2-methylcyclohexan-1-amine Chemical compound C1CC(N)C(C)CC1CC1CC(C)C(N)CC1 IGSBHTZEJMPDSZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910021485 fumed silica Inorganic materials 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 4
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 claims description 3
- WFCSWCVEJLETKA-UHFFFAOYSA-N 2-piperazin-1-ylethanol Chemical compound OCCN1CCNCC1 WFCSWCVEJLETKA-UHFFFAOYSA-N 0.000 claims description 3
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 claims description 3
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 claims description 3
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical group NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 3
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 claims description 3
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 3
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical group C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 claims description 2
- 230000002528 anti-freeze Effects 0.000 claims description 2
- 239000012752 auxiliary agent Substances 0.000 claims description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 2
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 claims description 2
- MIJDSYMOBYNHOT-UHFFFAOYSA-N 2-(ethylamino)ethanol Chemical compound CCNCCO MIJDSYMOBYNHOT-UHFFFAOYSA-N 0.000 claims 1
- UWIULCYKVGIOPW-UHFFFAOYSA-N Glycolone Natural products CCOC1=C(CC=CC)C(=O)N(C)c2c(O)cccc12 UWIULCYKVGIOPW-UHFFFAOYSA-N 0.000 claims 1
- 150000004985 diamines Chemical class 0.000 claims 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 239000000203 mixture Substances 0.000 description 12
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 6
- 239000002994 raw material Substances 0.000 description 4
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 3
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000000645 desinfectant Substances 0.000 description 2
- 239000004088 foaming agent Substances 0.000 description 2
- 230000004807 localization Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Sealing Material Composition (AREA)
- Epoxy Resins (AREA)
Abstract
Description
| 固化时间/h | 剪切强度/MPa | 邵氏硬度 | 脱胶时间/s | |
| 实施例一 | 2 | 16.8 | 87 | 320 |
| 实施例二 | 2 | 15.9 | 85 | 290 |
| 实施例三 | 2 | 17.3 | 89 | 350 |
| 实施例四 | 2 | 16.3 | 86 | 308 |
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210402654.8A CN102876274B (zh) | 2012-10-22 | 2012-10-22 | 太阳能电池硅片切割工艺用胶 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210402654.8A CN102876274B (zh) | 2012-10-22 | 2012-10-22 | 太阳能电池硅片切割工艺用胶 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102876274A true CN102876274A (zh) | 2013-01-16 |
| CN102876274B CN102876274B (zh) | 2014-03-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210402654.8A Active CN102876274B (zh) | 2012-10-22 | 2012-10-22 | 太阳能电池硅片切割工艺用胶 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102876274B (zh) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103552162A (zh) * | 2013-09-30 | 2014-02-05 | 洛阳鸿泰半导体有限公司 | 一种消除硅片粘接面线痕的方法 |
| CN103881638A (zh) * | 2014-03-12 | 2014-06-25 | 南京艾布纳密封技术有限公司 | 太阳能电池硅片切割工艺用胶 |
| CN105255424A (zh) * | 2015-11-17 | 2016-01-20 | 湖北回天新材料股份有限公司 | 一种拉伸强度和伸长率可调控的防水粘接胶及其制备方法 |
| CN106995663A (zh) * | 2017-03-22 | 2017-08-01 | 合肥仁德电子科技有限公司 | 一种用于集成主板的工艺用胶 |
| CN107109176A (zh) * | 2014-12-22 | 2017-08-29 | 汉高股份有限及两合公司 | 环氧树脂组合物 |
| CN110198966A (zh) * | 2016-12-21 | 2019-09-03 | 赢创德固赛有限公司 | N-羟乙基哌啶(nhep):用于环氧体系的新固化剂 |
| CN115746765A (zh) * | 2022-11-23 | 2023-03-07 | 常州时创能源股份有限公司 | 一种胶板一体化粘棒胶水及工艺 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007149377A2 (en) * | 2006-06-19 | 2007-12-27 | Ashland Licensing And Intellectual Property Llc | Epoxy adhesive composition and use thereof |
| CN101724368A (zh) * | 2009-11-24 | 2010-06-09 | 烟台德邦科技有限公司 | 一种抗冲击环氧结构胶及其制备方法 |
| CN101818037A (zh) * | 2009-02-27 | 2010-09-01 | 汉高(中国)投资有限公司 | 一种室温固化环氧结构胶粘剂组合物及其制备方法 |
| JP2010536953A (ja) * | 2007-08-17 | 2010-12-02 | ダウ グローバル テクノロジーズ インコーポレイティド | 二液型耐衝撃性エポキシ接着剤 |
| CN102093832A (zh) * | 2010-12-03 | 2011-06-15 | 烟台德邦科技有限公司 | 一种高抗冲击环氧树脂填充胶及其制备方法 |
| CN102304275A (zh) * | 2011-07-25 | 2012-01-04 | 株洲时代新材料科技股份有限公司 | 永磁电机用室温固化环氧树脂灌封胶及制备方法和工艺 |
-
2012
- 2012-10-22 CN CN201210402654.8A patent/CN102876274B/zh active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007149377A2 (en) * | 2006-06-19 | 2007-12-27 | Ashland Licensing And Intellectual Property Llc | Epoxy adhesive composition and use thereof |
| JP2010536953A (ja) * | 2007-08-17 | 2010-12-02 | ダウ グローバル テクノロジーズ インコーポレイティド | 二液型耐衝撃性エポキシ接着剤 |
| CN101818037A (zh) * | 2009-02-27 | 2010-09-01 | 汉高(中国)投资有限公司 | 一种室温固化环氧结构胶粘剂组合物及其制备方法 |
| CN101724368A (zh) * | 2009-11-24 | 2010-06-09 | 烟台德邦科技有限公司 | 一种抗冲击环氧结构胶及其制备方法 |
| CN102093832A (zh) * | 2010-12-03 | 2011-06-15 | 烟台德邦科技有限公司 | 一种高抗冲击环氧树脂填充胶及其制备方法 |
| CN102304275A (zh) * | 2011-07-25 | 2012-01-04 | 株洲时代新材料科技股份有限公司 | 永磁电机用室温固化环氧树脂灌封胶及制备方法和工艺 |
Non-Patent Citations (1)
| Title |
|---|
| 李子东等: "《胶粘剂助剂》", 30 June 2009, article "《固化剂》,《分散剂》,《消泡剂》" * |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103552162A (zh) * | 2013-09-30 | 2014-02-05 | 洛阳鸿泰半导体有限公司 | 一种消除硅片粘接面线痕的方法 |
| CN103881638A (zh) * | 2014-03-12 | 2014-06-25 | 南京艾布纳密封技术有限公司 | 太阳能电池硅片切割工艺用胶 |
| CN103881638B (zh) * | 2014-03-12 | 2015-08-26 | 南京艾布纳密封技术有限公司 | 太阳能电池硅片切割工艺用胶 |
| CN107109176A (zh) * | 2014-12-22 | 2017-08-29 | 汉高股份有限及两合公司 | 环氧树脂组合物 |
| CN107109176B (zh) * | 2014-12-22 | 2021-01-26 | 汉高股份有限及两合公司 | 环氧树脂组合物 |
| CN105255424A (zh) * | 2015-11-17 | 2016-01-20 | 湖北回天新材料股份有限公司 | 一种拉伸强度和伸长率可调控的防水粘接胶及其制备方法 |
| CN110198966A (zh) * | 2016-12-21 | 2019-09-03 | 赢创德固赛有限公司 | N-羟乙基哌啶(nhep):用于环氧体系的新固化剂 |
| CN106995663A (zh) * | 2017-03-22 | 2017-08-01 | 合肥仁德电子科技有限公司 | 一种用于集成主板的工艺用胶 |
| CN115746765A (zh) * | 2022-11-23 | 2023-03-07 | 常州时创能源股份有限公司 | 一种胶板一体化粘棒胶水及工艺 |
| CN115746765B (zh) * | 2022-11-23 | 2024-10-11 | 常州时创能源股份有限公司 | 一种胶板一体化粘棒胶水及工艺 |
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| Publication number | Publication date |
|---|---|
| CN102876274B (zh) | 2014-03-26 |
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Address after: 211200 No. 10 Qianjin Road, Lishui Economic Development Zone, Nanjing, Jiangsu Patentee after: NANJING ABNEN SEALING TECHNOLOGY STOCK CO.,LTD. Address before: 211200 No. 10 Qianjin Road, Lishui Economic Development Zone, Nanjing, Jiangsu Patentee before: NANJING ABNEN SEALING TECHNOLOGY Co.,Ltd. |
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Denomination of invention: Glue for cutting process of solar cell silicon wafers Effective date of registration: 20191015 Granted publication date: 20140326 Pledgee: Bank of China Limited by Share Ltd. Lishui branch Pledgor: NANJING ABNEN SEALING TECHNOLOGY STOCK CO.,LTD. Registration number: Y2019320000197 |
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