CN102200815A - Radiator structure - Google Patents
Radiator structure Download PDFInfo
- Publication number
- CN102200815A CN102200815A CN 201010131983 CN201010131983A CN102200815A CN 102200815 A CN102200815 A CN 102200815A CN 201010131983 CN201010131983 CN 201010131983 CN 201010131983 A CN201010131983 A CN 201010131983A CN 102200815 A CN102200815 A CN 102200815A
- Authority
- CN
- China
- Prior art keywords
- radiating part
- heat
- radiating
- heat spreader
- spreader structures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- 239000004411 aluminium Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a radiator structure. The radiator structure comprises heat-radiating fins, a first radiating part and a second radiating part, wherein an opening is arranged among the heat-radiating fins, the first heat-radiating part is arranged in the opening and is in matching contact with the opening, the first heat-radiating part is provided with a groove and is made of a copper material, the second heat-radiating part is completely arranged in the groove and is in mutual contact with the groove and is made of an aluminum material. The radiator structure has flexible structure design and low cost, can give attention to the heat-radiating performance and product weight, and is easy to assemble without special processing equipment.
Description
[technical field]
The present invention relates to a kind of heat spreader structures, particularly a kind of quick, light weight and low heat spreader structures of cost assembled.
[background technology]
The CPU on general or traditional desktop PC and the server or the main material of North Bridge radiating module are at present: aluminium or copper material, and material is more single, can not require to accomplish optimized design in response to weight, cost and the heat radiation of product.Existing heat spreader structures is as follows:
With reference to Fig. 1, shown in Figure 2, it is the overall schematic and the decomposing schematic representation of existing heat spreader structures.Existing heat spreader structures comprises:
Radiating fin 11, position is provided with an opening 111 in the middle of it, and in some embodiment, this radiating fin 11 is selected the fine aluminium material for use;
Heat-conducting part 12, it places above-mentioned opening 111 fully and cooperates contact, and this heat-conducting part 12 is selected the fine copper material for use.
In other embodiment, some existing heating radiators adopt the mode of aluminium material extrusion molding to obtain, and some heat spreader structures needs to be made up of radiating fin and cooling base two parts.
There is following defective in existing heat spreader structures:
1, heat dispersion is low;
2, design is dumb, needs to be made up of radiating fin and two ones of cooling bases;
3, material is selected for use dumbly, and weight is big, the cost height.
[summary of the invention]
In view of this, the object of the present invention is to provide a kind of heat spreader structures, with realize that processing is simple, combined and instant, in light weight, advantage that cost is low.
For achieving the above object, the invention provides a kind of heat spreader structures, this heat spreader structures comprises:
Radiating fin, position is provided with an opening in the middle of it;
First radiating part, it is located in the above-mentioned opening and cooperates contact, and this first radiating part is provided with a groove, and this first radiating part is selected copper material for use;
Second radiating part, it places in the above-mentioned groove fully and is in contact with one another this second radiating part aluminium material.
Compared to prior art, heat spreader structures of the present invention has following advantage:
1, flexible design, cost are low;
2, can take into account heat dispersion and product weight;
3, combined and instant, need not special process equipment.
For purpose of the present invention, structural attitude and function thereof are had further understanding, conjunction with figs. is described in detail as follows now:
[description of drawings]
Fig. 1 illustrates the overall schematic of existing heat spreader structures.
Fig. 2 illustrates the decomposing schematic representation of existing heat spreader structures.
Fig. 3 illustrates the overall schematic of heat spreader structures of the present invention.
Fig. 4 illustrates the decomposing schematic representation of heat spreader structures first state of the present invention.
Fig. 5 illustrates the decomposing schematic representation of heat spreader structures second state of the present invention.
Fig. 6 illustrates the heat radiation synoptic diagram of heat spreader structures of the present invention in preferred embodiment.
[embodiment]
With reference to Fig. 3, Fig. 4 and shown in Figure 5, it is respectively the overall schematic and the decomposing schematic representation of heat spreader structures of the present invention.
Heat spreader structures of the present invention, it comprises:
Radiating fin 21, position is provided with an opening 211 in the middle of it, in present embodiment, these radiating fin 21 rounded distributions, these radiating fin 21 flexible designs can be designed to difformity according to the actual needs in other embodiment, as: rectangular distribution;
First radiating part 22, it is located in the above-mentioned opening 211 and is in contact with one another fully, and this first radiating part 22 is provided with a groove 221, and the bottom of this groove 221 contacts with a pyrotoxin 20, thereby carries out heat conduction, and this first radiating part 22 is selected copper material for use;
Second radiating part 23, it places in the above-mentioned groove 221 fully and is in contact with one another these second radiating part, 23 aluminium materials.
By the mode combination of riveting, in other embodiment, the three also can adopt other combinations between wherein above-mentioned radiating fin 21, first radiating part 22 and second radiating part 23, and this case is not limited to the riveting mode.
In the lump with reference to shown in Figure 6, heat spreader structures of the present invention is in a preferable enforcement, itself and fan 30 fit applications are in a pyrotoxin 20 places, pyrotoxin 20 is by contacting with first radiating part 22, thereby with heat transferred first radiating part 22, (direction of arrow is the heat flow direction among the figure) and through first radiating part 22 by shedding.Heat spreader structures of the present invention is by adopting second radiating part 23 and aluminium material, makes the weight saving of entire radiator structure, and then cost descends, and combined and instant, need not special process equipment and only can finish by the mode of riveting.
Claims (2)
1. a heat spreader structures is characterized in that, this heat spreader structures comprises:
Radiating fin, position is provided with an opening in the middle of it;
First radiating part, it is located in the above-mentioned opening and cooperates contact, and this first radiating part is provided with a groove, and this first radiating part is selected copper material for use;
Second radiating part, it places in the above-mentioned groove fully and is in contact with one another this second radiating part aluminium material.
2. heat spreader structures as claimed in claim 1 is characterized in that, passes through the mode combination of riveting between above-mentioned radiating fin, first radiating part and second radiating part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010131983 CN102200815A (en) | 2010-03-25 | 2010-03-25 | Radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010131983 CN102200815A (en) | 2010-03-25 | 2010-03-25 | Radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102200815A true CN102200815A (en) | 2011-09-28 |
Family
ID=44661545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010131983 Pending CN102200815A (en) | 2010-03-25 | 2010-03-25 | Radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102200815A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030131971A1 (en) * | 2002-01-14 | 2003-07-17 | Kuo Yung-Pin | Heat dispensing device for electronic parts |
| CN2746727Y (en) * | 2004-04-02 | 2005-12-14 | 佳承精工股份有限公司 | Bendable combined planing radiator |
| CN1868661A (en) * | 2005-05-23 | 2006-11-29 | 艾比富热传有限公司 | Shaping method of radiator fin and its structure |
| CN200959704Y (en) * | 2006-08-31 | 2007-10-10 | 东莞市通旺达五金制品有限公司 | Radiator Structure Improvement |
| CN201654660U (en) * | 2010-03-25 | 2010-11-24 | 神基科技(南昌)有限公司 | Radiator structure |
-
2010
- 2010-03-25 CN CN 201010131983 patent/CN102200815A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030131971A1 (en) * | 2002-01-14 | 2003-07-17 | Kuo Yung-Pin | Heat dispensing device for electronic parts |
| CN2746727Y (en) * | 2004-04-02 | 2005-12-14 | 佳承精工股份有限公司 | Bendable combined planing radiator |
| CN1868661A (en) * | 2005-05-23 | 2006-11-29 | 艾比富热传有限公司 | Shaping method of radiator fin and its structure |
| CN200959704Y (en) * | 2006-08-31 | 2007-10-10 | 东莞市通旺达五金制品有限公司 | Radiator Structure Improvement |
| CN201654660U (en) * | 2010-03-25 | 2010-11-24 | 神基科技(南昌)有限公司 | Radiator structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110928 |