[go: up one dir, main page]

CN1021140C - 制造一种平板光耦合器的方法 - Google Patents

制造一种平板光耦合器的方法 Download PDF

Info

Publication number
CN1021140C
CN1021140C CN90104311A CN90104311A CN1021140C CN 1021140 C CN1021140 C CN 1021140C CN 90104311 A CN90104311 A CN 90104311A CN 90104311 A CN90104311 A CN 90104311A CN 1021140 C CN1021140 C CN 1021140C
Authority
CN
China
Prior art keywords
passage
sheet material
millimeters
excimer laser
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN90104311A
Other languages
English (en)
Other versions
CN1048104A (zh
Inventor
约克恩·康坦迪恩
沃纳尔·格罗
皮特·赫布莱施迈尔
约根·泰斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoechst AG
Original Assignee
Hoechst AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoechst AG filed Critical Hoechst AG
Publication of CN1048104A publication Critical patent/CN1048104A/zh
Application granted granted Critical
Publication of CN1021140C publication Critical patent/CN1021140C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/69—General aspects of joining filaments 
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/70—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by moulding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
    • G02B6/2804—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals forming multipart couplers without wavelength selective elements, e.g. "T" couplers, star couplers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
    • B29C66/7316—Surface properties
    • B29C66/73161—Roughness or rugosity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • B29L2011/0075—Light guides, optical cables
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3688—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier using laser ablation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Microscoopes, Condenser (AREA)
  • Laser Beam Processing (AREA)

Abstract

可在其中敷设聚合物光波导的通道，可以用一台准分子激光器在塑料表面上刻蚀出来。光波导之间的自由空间用一种透明充填树脂填上。用激光制成的通道的特点是高尺寸精度和低表面粗糙度。

Description

此发明涉及一种用准分子激光器制造用于聚合物光波导系统的平板光耦合器的方法。
光耦合器是一种光学器件，可将N条输入光纤内的光强度分配给M条输出光纤。这类器件可在无源光波导网络中用作光强度分配器成光强度组合器。光强度的分配或多条光纤的光强度组合进入某一条光纤，是在该耦合器的混合区域内完成的。
光纤光耦合器与平板光耦合器之间是有区别的。迄今主要有两种方法已为人所知可用来制造用于聚合物光波导系统的平板光耦合器。
已知的一种制造用于聚合物光波导的平板光学器件的方法，是将一层250μm厚的光刻层沉积在一个衬底上的复合镀层上面，而光刻是用一层掩膜和紫外光形成的（参见：A.Boiarski，SPIF，840卷，29页（1987））。在显影之后，未曝光的区域就形成一个波导通道，其截面为正方形，而其中敷设有直径为250μm的聚合物光波导。然后在光纤之间的自由空间填上某种适当的光学充填树脂。
另外已知的一种光耦合器是用这样一种方法制造的：在一个透明衬底上加工出的沟槽内填上某种透光材料，以达到形成波导通道的目的，所述材料的折射率高于衬底的（参见：JP61-73，109）。波导通道在技术上的实现未予描述。最后，据信还有用一台准分子激光器来加工塑料的（参见：R.Srinivasan等，应用物理快报，41卷（b），576页（1982））。
现已发现，具有低表面粗糙度和高尺寸精度的波导通道可以用一台准分子激光器在某种塑料内刻蚀出来。
依此发明所述的方法，一块用某种透明塑料制成的片材固定在一个可沿X或Y方向移动的滑动台面上，用以制作出通道。用一束沿Z方向射出的聚焦的准分子激光束来照射该片材。滑动台面移动的方式使得所需的波导结构的通道能在透明片材上该蚀出来。另一种可能则是通过一块具有所需结构的金属掩膜来照射塑料片材。在这种情况下，有两种方法可以采用：首先用一束扩散得很大的激光束照射整个掩膜，或其次，用一束跨越掩膜宽度的条缝形激光束借助于一块活动反射镜沿掩膜长度移动。
塑料片材是由某种透明材料制成的，比如PMMA、PS、聚甲基戊烯、PET或PC之类的。该片材的厚度为1至20毫米，最好为1至10毫米。根据所要制成的耦合器的类型，该片材的长度和宽度在5至200毫米范围内，最好在80至120毫米之间。为了达到烧蚀的目的，对于PMMA和聚甲基戊烯最好用ArF（激光波长λ＝193毫微米）作为充入准分子激光器的气体，而对PC、PET和PS最好用KrF（波长λ＝248毫微米）。
在波导通道已用一台准分子激光器在透明塑料片材上刻蚀出之后，聚合物光波导可敷设在通道内，并且光纤端头之间的自由空间可用某种透明充填树脂填上。
更为经济的是：用电沉积方法将已刻蚀好的塑料片材镀上某种金属，并且用制成的金属结构作为注射成型机用的模坯，以达到大规模生产的目的。
与已知的方法相比，此发明所述方法的优点是：一方面，获得了较高的尺寸精度和较低的通道壁粗糙度;另一方面，有可能制成1毫米及以上的结构高度，而采用已知方法这还是不可能的。
下面的例子参照图1、2、3、4和5说明此发明。
Y形耦合器的制造
一块长度为30毫米而宽度为20毫米的4毫米厚的PMMA片材（4）固定在一个能在X和Y方向上移动的滑动面上。该台面由一台其中已存入了Y形波导通道坐标的计算机来控制。由一台装有ArF（λ＝193毫微米）的准分子激光器发出的垂直于台面平面并聚焦于该小片材的光束刻出通道（1）、（2）和（3），相应于塑料片上的特定坐标形成Y形。通道的宽度和深度精确地都是1毫米，而Y形的夹角α为20°。（图1）。
在清洗了这个已刻蚀出的部分之后，根据所需 的良好的光学质量其端头（8、9、10）已事先用精密切刀制备好了的直径为1毫米的聚合物光波导（5、6、7）敷设在通道（1）、（2）和（3）内，相对地接近耦合点（11）（图2）。
光纤端面（8、9、10）之间的自由空间用一种透光的环氧树脂（12）（型号EPO-TEK301、-2，n＝1.564）填上。选择树脂（12）的折射率使得以PMMA作为光学包覆的耦合区域（11）的数值孔径（NA）等同于敷设在沟槽（1、2、3）内的聚合物光波导（5、6、7）的NA。
最后，一小块PMMA片材粘在耦合器上作为封壳。
与作为输入装在通道（1）中的光纤（5）和作为输出装在通道（2）及（3）中光纤的插入损失分别为4.7分贝和4.9分贝。因而它们的差仅为0.2分贝。
图3表示一个由三根按以上所述方式在耦合点（11）处相连接的光波导（5、6和7）构成的X形耦合器。例如，还有可能在一台注射成型机上制造这种耦合器。
非对称耦合器的制造
非对称的Y形通道是借助于一台准分子激光器在一块长度为35毫米而宽度为30毫米的4毫米厚的PMMA片材上刻蚀出来的。制成的通道（1、2、3）宽度和深度为1毫米。非对称Y形的夹角β在0至60°范围内，典型情况下在5至25°之间。
在清洗了刻蚀部分之后，端头已用精密切刀切割好的直径为1毫米的聚合物光波导敷设在通道内，相对地接近耦合点（11）（图4）。与对称Y形耦合器类似，剩余的自由空间用一种透光的环氧树脂（型号EPO-TEK301-2，no＝1.564）填上。一小块粘在耦合器片材（4）上的PMMA薄片（13）也是用作封壳。该小薄片长度为35毫米、宽度为30毫米而厚度为2毫米。
用这种方法有可能通过改变夹角β选定某个确定的分配率。具有光纤截面的Y形耦合器。
具有半圆形截面的对称Y形结构是用一台准分子激光器（λ＝193毫微米）在两小块长度为30毫米、宽度为20毫米而厚度为4毫米的PMMA厚片材上刻蚀出来的。所制成的通道（1′、2′、3′）直径为1毫米。
在清洗了刻蚀部分之后，端头已用精密切刀切割好的直径为1毫米的聚合物光波导敷设在一块中相对地接近耦合点（1）的通道中（图5）。与前面的例子类似，空隙还是用一种环氧树脂填上。为了避免气泡形成，光纤之间的粘合剂在空气中预先干燥。在固化开始之后，第二小块也带入有Y形的PMMA片材（13）倒扣在第一小块已敷设了光纤（5、6、7）的片材（4）上，并粘结起来。
与作为输入装在通道（1）中光纤和作为输出装在通道（2）及（3）中的光纤的插入损耗分别为4.0分贝和4.2分贝。因而其差只有2分贝。采用半圆形通道截面的结果是有可能将前面各例中存在的1分贝的表面损耗降低到最小。采用半圆形的边缘形状在非对称Y形耦合器的情况下，插入损耗可降低多达1分贝。
也有可能用某种CNC（计算机数控）机床来刻蚀出半圆形截面。

Claims (2)

1、一种通过在一块透明塑料片材表面上加工出通道，在通道内敷设聚合物光波导并用某种透明充填树脂填充光波导之间的自由空间来制造平板光耦合器的方法，其特征在于用一台准分子激光器来刻蚀出所述通道。
2、权利要求1所述的方法，其中通道设置成一对称的Y形，并具有一半圆形截面。
CN90104311A 1989-06-13 1990-06-12 制造一种平板光耦合器的方法 Expired - Fee Related CN1021140C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3919262A DE3919262A1 (de) 1989-06-13 1989-06-13 Verfahren zur herstellung eines planaren optischen kopplers
DEP3919262.8 1989-06-13

Publications (2)

Publication Number Publication Date
CN1048104A CN1048104A (zh) 1990-12-26
CN1021140C true CN1021140C (zh) 1993-06-09

Family

ID=6382653

Family Applications (1)

Application Number Title Priority Date Filing Date
CN90104311A Expired - Fee Related CN1021140C (zh) 1989-06-13 1990-06-12 制造一种平板光耦合器的方法

Country Status (12)

Country Link
US (1) US5030321A (zh)
EP (1) EP0402797B1 (zh)
JP (1) JPH0327006A (zh)
KR (1) KR910001410A (zh)
CN (1) CN1021140C (zh)
AT (1) ATE117230T1 (zh)
AU (1) AU622329B2 (zh)
CA (1) CA2018766A1 (zh)
DE (2) DE3919262A1 (zh)
DK (1) DK0402797T3 (zh)
ES (1) ES2066908T3 (zh)
GR (1) GR3015101T3 (zh)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0451549A3 (en) * 1990-03-23 1992-07-08 Hoechst Aktiengesellschaft Method of manufacturing of optical couplers from polymers
EP0449446A1 (en) * 1990-03-29 1991-10-02 The Whitaker Corporation Fiber optic connector and method of forming an optical splice
DE4118457A1 (de) * 1991-06-05 1992-12-10 Max Planck Gesellschaft Verfahren zum speichern von information in einem optisch lesbaren datenspeicher
CA2075610A1 (en) * 1991-08-07 1993-02-08 Chin L. Chang Integrated optics chips and laser ablation methods for attachment of optical fibers thereto for linbo3 substrates
US5308555A (en) * 1992-07-31 1994-05-03 At&T Bell Laboratories Molding of optical components using optical fibers to form a mold
DE4300652C1 (de) * 1993-01-13 1994-03-31 Bosch Gmbh Robert Verfahren zur Herstellung einer hybrid integrierten optischen Schaltung und Vorrichtung zur Emission von Lichtwellen
US5745989A (en) * 1995-08-04 1998-05-05 Exotic Materials, Inc. Method of preparation of an optically transparent article with an embedded mesh
EP0786677B1 (de) * 1996-01-25 2001-06-27 Infineon Technologies AG Verfahren zum Betrieb eines Phased Array
KR100243315B1 (ko) * 1996-11-18 2000-02-01 윤종용 다중모드 광커플러
US6225031B1 (en) 1998-11-09 2001-05-01 International Business Machines Corporation Process for filling apertures in a circuit board or chip carrier
US6614972B1 (en) 1998-12-02 2003-09-02 3M Innovative Properties Company Coupler for transporting and distributing light to multiple locations with uniform color and intensity
US6618530B1 (en) 1998-12-02 2003-09-09 3M Innovative Properties Company Apparatus for transporting and distributing light using multiple light fibers
JP3645108B2 (ja) * 1998-12-03 2005-05-11 日本電信電話株式会社 合分波素子の製造方法
DE10013200A1 (de) * 2000-03-17 2001-09-20 Harting Elektrooptische Bauteile Gmbh & Co Kg Baugruppe zum optischen Koppeln mindestens eines ersten Lichtleiters mit einem zweiten Lichtleiter
JP3779539B2 (ja) * 2000-10-23 2006-05-31 日本電信電話株式会社 ファイバボードの製造方法
US6609836B1 (en) * 2002-09-17 2003-08-26 The United States Of America As Represented By The Secretary Of The Navy Method for coupling fiber optic elements
WO2004036280A1 (ja) 2002-10-17 2004-04-29 The Furukawa Electric Co., Ltd. 光部品及び光モジュール
DE10250540B3 (de) * 2002-10-29 2004-07-15 Infineon Technologies Ag Verfahren zur Herstellung eines optoelektronischen Bauteiles
JP4370158B2 (ja) * 2003-12-24 2009-11-25 シャープ株式会社 光結合器およびそれを用いた電子機器
JP4496319B2 (ja) * 2005-09-06 2010-07-07 国立大学法人静岡大学 光導波路及びその製造方法
JP4970364B2 (ja) * 2008-06-27 2012-07-04 豊田合成株式会社 光分岐結合器及びその製造方法
DE102009025072A1 (de) 2009-06-16 2010-12-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Erzeugen eines Bereiches mit erhöhtem Brechungsindex und ein Substrat mit örtlich variablem Brechungsindex
CN102814989A (zh) * 2012-08-23 2012-12-12 天津鹏翎胶管股份有限公司 胶管与胶管之间连接的注胶模具及连接方法
JP6435290B2 (ja) * 2016-06-06 2018-12-05 株式会社フジクラ 光学デバイス、レーザシステム及び光学デバイスの製造方法
DE102020106041A1 (de) 2020-03-05 2021-09-09 Sick Ag Optoelektronischer Sensor
EP3937491B1 (en) * 2020-07-07 2024-09-11 Vay Technology GmbH Optimizing video encoding for remote driving applications
CN114077016B (zh) 2020-08-11 2023-09-01 美国莫列斯有限公司 具有光子集成电路的封装结构
CN113523730A (zh) * 2021-08-09 2021-10-22 来安县山关轨道装备有限公司 一种车钩座及其车钩座的加工工艺

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4824522A (en) * 1988-04-01 1989-04-25 Bell Communications Research, Inc. Fabrication of polydiacetylene waveguides
US4880494A (en) * 1988-10-07 1989-11-14 Eastman Kodak Company Method of making a fiber optic array

Also Published As

Publication number Publication date
EP0402797B1 (de) 1995-01-18
DK0402797T3 (da) 1995-05-15
ES2066908T3 (es) 1995-03-16
AU622329B2 (en) 1992-04-02
DE59008280D1 (de) 1995-03-02
US5030321A (en) 1991-07-09
JPH0327006A (ja) 1991-02-05
DE3919262A1 (de) 1990-12-20
ATE117230T1 (de) 1995-02-15
KR910001410A (ko) 1991-01-30
AU5697490A (en) 1990-12-20
EP0402797A2 (de) 1990-12-19
EP0402797A3 (de) 1992-03-25
CN1048104A (zh) 1990-12-26
CA2018766A1 (en) 1990-12-13
GR3015101T3 (en) 1995-05-31

Similar Documents

Publication Publication Date Title
CN1021140C (zh) 制造一种平板光耦合器的方法
US5974214A (en) Raised rib waveguide ribbon for precision optical interconnects
EP0480618A2 (en) Passive optical waveguide
US6341190B1 (en) Organic optical components and preparation thereof
US5850498A (en) Low stress optical waveguide having conformal cladding and fixture for precision optical interconnects
US4765702A (en) Glass integrated optical component
EP0560043B1 (de) Verfahren zum Herstellen von Bauelementen für Lichtwellenleiternetze und nach diesem Verfahren hergestellte Bauelemente
US5473721A (en) Multi-mode optical circuit to couple light between various optical elements and method of fabricating same
EP0718646B1 (en) Method for producing a polymeric optical waveguide
EP1662284B1 (en) Optical device, optical device manufacturing method, and optical integrated device
EP1847861A2 (en) Optical waveguide having specular surface formed by laser beam machining
CA2482178C (en) Integrated optical circuit with tapered conversion waveguide portion
US6735354B2 (en) Optical device
KR20060060610A (ko) 필름상 광도파로의 제조 방법
CN100462754C (zh) 光分路装置及光耦合模块
JPS61228403A (ja) 高分子光導波路の製造方法
Klotzbuecher et al. Custom specific fabrication of integrated optical devices by excimer laser ablation of polymers
Keyworth et al. Computer-controlled pressure-dispensed multimode polymer waveguides
US6829402B2 (en) Optical switch and method of manufacturing the same
DE2942664A1 (de) Verfahren zur herstellung eines optischen strahlteilers
JP2002519711A (ja) 光結合素子
Miura et al. Low-loss single-mode plastic waveguide fabricated by photopolymerization
Ehsan et al. Plastic optical fiber coupler with high index contrast waveguide taper
Van Erps et al. MT-compatible interface between peripheral fiber ribbons and printed circuit board-integrated optical waveguides
Paillard Recent developments in integrated optics on moldable glass

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C15 Extension of patent right duration from 15 to 20 years for appl. with date before 31.12.1992 and still valid on 11.12.2001 (patent law change 1993)
OR01 Other related matters
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee