CN102086977A

CN102086977A - Manufacturing method of AC light-emitting diode packaging device

Info

Publication number: CN102086977A
Application number: CN2009102503979A
Authority: CN
Inventors: 王中林
Original assignee: MICROSOLAR CORP
Current assignee: MICROSOLAR CORP
Priority date: 2009-12-07
Filing date: 2009-12-07
Publication date: 2011-06-08

Abstract

The invention discloses a manufacturing method of an alternating current light emitting diode packaging device, which comprises the steps of firstly providing a plurality of groups of light emitting diode module wafers, wherein each light emitting diode module wafer is provided with a plurality of light emitting diodes in the same polarity direction; then at least two groups of LED module wafers are connected together on a packaging substrate according to a forward arrangement mode and a reverse arrangement mode respectively to form an AC LED packaging device; finally, the AC LED packaging device is connected to an AC power supply. The invention directly utilizes a plurality of LED module wafers with the same polarity direction to carry out the arrangement and packaging in the forward direction and the reverse direction, so that a complex photomask is not needed in the process, the process can be simplified, the yield can be improved, and the production and manufacturing cost can be effectively reduced.

Description

The preparation method of alternating-current light emitting diode packaging system

Technical field

The present invention is relevant a kind of alternating-current light emitting diode (AC LED) technology, particularly about the preparation method of the alternating-current light emitting diode packaging system of a kind of integration system single-chip (System on chip) and system's monobasal (System on board) technology.

Background technology

Light emitting diode be have efficient height, life-span long, not cracky, power saving or the like conventional light source can't with the advantage of comparison, therefore development is quite rapid.

At present light emitting diode must provide the suitable DC current could be normally luminous, the power supply of commercial power supply then is a High Level AC Voltage, therefore must collocation use transformer or AC/DC converter, elder generation could drive lumination of light emitting diode after alternating current is converted to direct current.

In order to save not gangster's AC/DC converter of cost, so develop the use alternating current directly to drive LED source luminous.This kind alternating-current light emitting diode mainly is to adopt the specific arrangement combination technique of LED crystal grain when encapsulation, utilizes simultaneously that the PN diode characteristic of LED is double does rectification, makes the alternating current can two-way admittance, and then makes lumination of light emitting diode.As shown in Figure 1, this alternating-current light emitting diode module wafer includes two groups of LED tandems, forward LED tandem 10 and reverse LED tandem 12, each

LED tandem

10,12 has a plurality of LED16 respectively, and two ends of

LED tandem

10,12 connect AC power 14 respectively, with the

LED tandem

10,12 of utilizing different directions, make the electric current of AC power 14 can two-way admittance, reach luminous purpose.

Except the alternating-current light emitting diode module wafer of the above-mentioned formula that is arranged in parallel, other has a kind of bridge-type alternating-current light emitting diode module wafer, as shown in Figure 2, include five groups of LED tandems, the one LED tandem 18, the 2nd LED tandem 20, the 3rd LED tandem 22, the 4th LED tandem 24 and shared LED tandem 26, each

LED tandem

18,20,22,24,26 have a plurality of LED respectively, wherein a LED tandem 18 forward is connected in series with the 2nd LED tandem 20, the 3rd LED tandem 22 forward is connected in series with the 4th LED tandem 24, and a LED tandem 18 and the 3rd LED tandem 22 reverse serial connections, the 2nd LED tandem 20 and the 4th LED tandem 24 reverse serial connections, and there is a shared LED tandem 26 forward to be connected in series a LED tandem 18 respectively, the 2nd LED tandem 20, the 3rd LED tandem 22, the 4th LED tandem 24, to form a bridge-type alternating-current light emitting diode module wafer, its two end then is connected to AC power 28 respectively.The positive half cycle of AC power 28 flows along the first path P1, makes a LED tandem 18, shared LED tandem 26 and the 4th LED tandem 24 luminous; The negative half period of AC power 28 flows along second path P 2, make the 3rd LED tandem 22, shared LED tandem 26 and the 2nd LED tandem 20 luminous, make four LED tandems on the brachium pontis luminous in turn, relatively the LED tandem is simultaneously luminous on the brachium pontis, and 26 of shared LED tandems are because of shared and lasting luminous.

Yet, no matter be arranged in parallel formula alternating-current light emitting diode module wafer or bridge-type alternating-current light emitting diode module wafer, all be that the light emitting diode of tandem and reverse tandem is a unit to have forward simultaneously, with the light emitting diode of tandem and reverse tandem forward, adopt semiconductor technology to be made into single wafer, this is to be a kind of integration system single-chip technology.But make simultaneously on single wafer forward and reverse light emitting diode, it must use comparatively complicated light shield just can be achieved, and causes yield not high, can't reduce cost, and light emitting diode arrangement design of every change just must redesign light shield, appropriate litigation fees costliness

In view of this, so the present invention proposes a kind of preparation method of alternating-current light emitting diode packaging system, to improve aforementioned various disappearance.

Summary of the invention

Main purpose of the present invention is in the preparation method that a kind of alternating-current light emitting diode packaging system is provided, and it is while integration system single-chip (System on chip) and system's monobasal (System on board) technology, and has the two-fold advantage of the two concurrently.

Another object of the present invention is in the preparation method that a kind of alternating-current light emitting diode packaging system is provided, and it need not use complicated light shield in technology, so can promote yield, effectively reduce cost.

For achieving the above object, the preparation method of the alternating-current light emitting diode packaging system that the present invention proposes is to include the following step: at first, a plurality of light-emitting diode (LED) module wafers are provided, it is to complete at least one wafer, and each light-emitting diode (LED) module wafer is to have the identical light emitting diode of a plurality of polar orientation; Again on a base plate for packaging with at least two light-emitting diode (LED) module wafers respectively according to forward arranging and reverse arrangement, connect described module wafer in the routing mode, to form an alternating-current light emitting diode packaging system; With this alternating-current light emitting diode packaging system, be connected to an AC power, to reach luminous purpose.

Preparation method of the present invention is used complicated light shield because of it reduces, or even need not be used complicated light shield in technology, so can effectively simplify technology lifting yield and reduce cost.

Beneath by the appended graphic explanation in detail of specific embodiment cooperation, when the effect that is easier to understand purpose of the present invention, technology contents, characteristics and is reached.

Description of drawings

Fig. 1 is the structural representation of the existing formula alternating-current light emitting diode module that is arranged in parallel;

Fig. 2 is the structural representation of existing bridge-type alternating-current light emitting diode module;

Fig. 3 makes the flow chart of alternating-current light emitting diode packaging system for the present invention;

Fig. 4 uses the structural representation of wafer manufacturing alternating-current light emitting diode module wafer for the present invention;

Fig. 4 A to Fig. 4 C is respectively the structural representation of each embodiment of the alternating-current light emitting diode module wafer that the present invention uses;

The structural representation of the formula that the is arranged in parallel alternating-current light emitting diode packaging system that Fig. 5 produces for the present invention;

The structural representation of the bridge-type alternating-current light emitting diode packaging system that Fig. 6 produces for the present invention.

Description of reference numerals: 10-is the LED tandem forward; The reverse LED tandem of 12-; The 14-AC power; 16-LED; 18-the one LED tandem; 20-the 2nd LED tandem; 22-the 3rd LED tandem; 24-the 4th LED tandem; The shared LED tandem of 26-; The 28-AC power; 30-light-emitting diode (LED) module wafer; The 32-light emitting diode; The 301-first light-emitting diode (LED) module wafer; The 302-second light-emitting diode (LED) module wafer; 303-the 3rd light-emitting diode (LED) module wafer; 304-the 4th light-emitting diode (LED) module wafer; 305-the 5th light-emitting diode (LED) module wafer; 306-the 6th light-emitting diode (LED) module wafer; 307-the 7th light-emitting diode (LED) module wafer; 308-the 8th light-emitting diode (LED) module wafer; 309-the 9th light-emitting diode (LED) module wafer; The 34-wafer; The 36-base plate for packaging; The 38-formula alternating-current light emitting diode packaging system that is arranged in parallel; The 40-AC power; 42-bridge-type alternating-current light emitting diode packaging system.

The specific embodiment

Below in conjunction with accompanying drawing, be described in more detail with other technical characterictic and advantage the present invention is above-mentioned.

For reducing the complexity of process complexity and light shield, the present invention adopts SoC (the System on chip) technology of leading portion, arrange in pairs or groups again system's monobasal (System on board) technology of back segment makes the two-fold advantage of preparation method part of the present invention with the two.

The preparation method of alternating-current light emitting diode packaging system of the present invention sees also shown in Figure 3.At first, as step S10, the light-emitting diode (LED) module wafer 30 of many group identical polar directions is provided, its structure is please consulted shown in Fig. 4 to Fig. 4 C simultaneously, and each light-emitting diode (LED) module wafer 30 is the light emitting diodes 32 with a plurality of identical polar directions, the quantity of light emitting diode 32 be at least more than two dozens of all can, be to be example at this with five light emitting diodes 32.Wherein, each light-emitting diode (LED) module wafer 30 is a plurality of light emitting diodes 32 that include the mutual series connection shown in Fig. 4 A, or includes a plurality of light emitting diodes 32 of the above series connection of two strings; In addition, shown in Fig. 4 B, described light-emitting diode (LED) module wafer 30 also can light emitting diode 32 first parallel connections with the identical polar direction after, be connected into a string at least light-emitting diode (LED) module wafer 30 again; Certainly also can be shown in Fig. 4 C, this light-emitting diode (LED) module wafer 30 includes at least two string light emitting diodes and links together with parallel way, and the light emitting diode of each string is to have a plurality of light emitting diodes 32 with the series connection of identical polar direction.And these light-emitting diode (LED) module wafers 30 are to complete at least one wafer 34, for example the used substrate of light emitting diode of visible light such as GaAs substrate, silicon nitride substrate, aluminum oxide substrate, germanium substrate, gallium phosphide substrate, silicon substrate, glass substrate or sapphire substrate or black light is directly made light-emitting diode (LED) module wafer 30 thereon.Owing on same wafer 34, make the light emitting diode 32 that described a plurality of light-emitting diode (LED) module wafers 30 all have the identical polar direction, therefore, can use more simple light shield, simplify process complexity.This part promptly belongs to the SoC technology of leading portion.

Utilizing after SoC technology produces a plurality of light-emitting diode (LED) module wafers 30 the system's monobasal technology that continues and carry out back segment.Shown in step S12, on a base plate for packaging with at least two group light-emitting diode (LED) module wafers respectively according to forward arranging and reverse arrangement, and the forward arrangement of light-emitting diode (LED) module wafer or reverse arrangement are to arrange with series, parallel or series-parallel system, link together in the routing mode, to form an alternating-current light emitting diode packaging system, wherein the light-emitting diode (LED) module wafer of at least two groups on base plate for packaging is the light emitting diodes that can have equal number simultaneously, also can have the light emitting diode of varying number respectively.Shown in step S14,, be connected to an AC power at last with this alternating-current light emitting diode packaging system.

In above-mentioned steps S12 and S14, when the arrangement of carrying out the light-emitting diode (LED) module wafer is connected with routing, its arrangement mode can have different choice, be with parallel arrangement mode or be called the matrix arrangement mode at this, and the bridge-type arrangement mode describes the arrangement architecture of this alternating-current light emitting diode packaging system in detail.

The structural representation of the formula that the is arranged in parallel alternating-current light emitting diode packaging system that Fig. 5 produces for the present invention, as shown in the figure, be that parallel is shown at least two group identical polar direction light-emitting diode (LED) module wafers on a base plate for packaging 36, at this is to be example with four groups, the first light-emitting diode (LED) module wafer 301 and the 3rd light-emitting diode (LED) module wafer 303 are to be installed on the base plate for packaging 36 with arrangement mode forward, and second 304 of light-emitting diode (LED) module wafer 302 and the 4th light-emitting diode (LED) module wafers be installed on the base plate for packaging 36 with reverse arrangement mode, with the composition formula alternating-current light emitting diode packaging system 38 that is arranged in parallel; And two ends of described a plurality of light-emitting diode (LED) module wafer 301,302,303,304 are to be connected to AC power 40, make the electric current of AC power 40 can two-way admittance, reach luminous purpose.

The structural representation of the bridge-type alternating-current light emitting diode packaging system that Fig. 6 produces for the present invention as shown in the figure, is to utilize at least five group identical polar direction light-emitting diode (LED) module wafers to be arranged in bridge architecture on a base plate for packaging 36; The 5th light-emitting diode (LED) module wafer 305 forward is connected in series with the 6th light-emitting diode (LED) module wafer 306, the 7th light-emitting diode (LED) module wafer 307 is forward to be connected in series with the 8th light-emitting diode (LED) module wafer 308, and the 5th light-emitting diode (LED) module wafer 305 and the 7th light-emitting diode (LED) module wafer 307 reverse serial connections, the 6th light-emitting diode (LED) module wafer 306 and the 8th light-emitting diode (LED) module wafer 308 reverse serial connections, and there is the 9th a shared light-emitting diode (LED) module wafer 309 forward to be connected in series the 5th light-emitting diode (LED) module wafer 305 respectively, the 6th light-emitting diode (LED) module wafer 306, the 7th light-emitting diode (LED) module wafer 307 and the 8th light-emitting diode (LED) module wafer 308 are to form a bridge-type alternating-current light emitting diode packaging system 42; Two ends of whole bridge-type alternating-current light emitting diode packaging system 42 then are connected to AC power 40 respectively.For example, light-emitting diode (LED) module wafer 305,309 and 308 is luminous when voltage forward, and light-emitting diode (LED) module wafer 307,309 and 306 is luminous when revers voltage, and the 9th middle light-emitting diode (LED) module wafer 309 is then because of shared and lasting luminous.

Therefore, preparation method of the present invention is used complicated light shield because of it reduces, or even need not be used complicated light shield in technology, so can effectively simplify technology lifting yield and reduce cost.

More than explanation is just illustrative for the purpose of the present invention, and nonrestrictive, those of ordinary skills understand; under the situation of the spirit and scope that do not break away from following claims and limited, can make many modifications, change; or equivalence, but all will fall within the scope of protection of the present invention.

Claims

1. A method for manufacturing an AC light-emitting diode packaging device, comprising the following steps:

Provide a plurality of light-emitting diode module chips, the light-emitting diode module chip has a plurality of light-emitting diodes connected in series in the same polarity direction;

Connecting at least two of the LED module chips on a packaging substrate according to the forward arrangement and the reverse arrangement, respectively, by wire bonding to form an AC LED packaging device; and

Connect the AC light emitting diode packaging device to an AC power source.

2. The manufacturing method of an AC light-emitting diode packaging device according to claim 1, wherein the light-emitting diode module chip is made of a gallium arsenide substrate, a silicon nitride substrate, an aluminum oxide substrate, a germanium substrate, or a gallium phosphide substrate. Substrates, silicon substrates, glass substrates or sapphire substrates are fabricated on substrates used for visible or invisible light-emitting diodes.

3 . The method for manufacturing an AC light emitting diode packaging device according to claim 1 , wherein the light emitting diode module includes the plurality of light emitting diodes connected in series in the same polarity direction. 4 .

4 . The method for manufacturing an AC LED packaging device according to claim 1 , wherein the LED module chip includes LEDs connected in series and in parallel with the same polarity.

5 . The method for manufacturing an AC LED packaging device according to claim 1 , wherein the plurality of LED module chips are arranged in parallel or in a matrix to form the AC LED packaging device. 6 .

6 . The method for manufacturing an AC LED packaging device according to claim 1 , wherein the plurality of LED module chips are arranged in a bridge manner to form the AC LED packaging device. 7 .

7 . The method for manufacturing an AC LED packaging device according to claim 6 , wherein the bridge arrangement has at least five groups of the LED module chips. 7 .

8 . The method for manufacturing an AC LED packaging device according to claim 1 , wherein the plurality of LED module chips are arranged in series, in parallel or in series-parallel.