CN101111900A - Semiconductor device, address assignment method, and verification method - Google Patents
Semiconductor device, address assignment method, and verification method Download PDFInfo
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Abstract
一种半导体装置,包含:CAM单元阵列(4),用以储存半导体装置(1)的操作设定信息;控制器(8),用以控制CAM单元阵列的读取与写入;行译码器(5);以及列译码器(6),并且,具备有用以将不同的行地址分配到不同操作设定信息的各个功能区块的构成。由于将不同行地址分配到各个操作设定信息的功能,故于编程时,不会产生应力至未被选择的功能的CAM单元阵列(4)。
A semiconductor device includes: a CAM cell array (4) for storing operation setting information of the semiconductor device (1); a controller (8) for controlling the reading and writing of the CAM cell array; a row decoder (5); and a column decoder (6), and has a configuration for assigning different row addresses to various functional blocks of different operation setting information. Because of the function of assigning different row addresses to various operation setting information, during programming, no stress is generated on the CAM cell array (4) that is not selected.
Description
技术领域 technical field
本发明关于一种半导体装置,尤其有关于一种具备有非易失性存储体的半导体装置。更具而言,本发明有关于一种使用CAM(Contentaddressable Memory;内容可寻址存储体)数据来控制半导体装置的操作的技术。The present invention relates to a semiconductor device, and more particularly to a semiconductor device provided with a nonvolatile memory. More specifically, the present invention relates to a technique for controlling the operation of a semiconductor device using CAM (Content Addressable Memory) data.
背景技术 Background technique
过去,已知有一种半导体装置,具有:数据,于非易失性存储体的编程(program)或擦除(erase)时,被存储至非易失性存储体;半导体装置的构成,用以检侧是否与期望值数据一致,并自动进行数据检验(亦即所谓的CAM单元(cell),用以控制顾客所使用的一般非易失性存储体单元以及半导体装置的操作)。近年来,为了减少装置尺寸,已提出一种具有以一般非易失性存储体单元形成的CAM单元的结构。在将CAM单元作成与一般存储体单元相同的结构的情形下,连接至CAM单元的字线与位线亦构成与至一般存储体单元相同的构成较佳。In the past, there has been known a semiconductor device that has: data stored in a nonvolatile memory body during programming or erasing of the nonvolatile memory body; Check whether the data is consistent with the expected value, and automatically perform data verification (that is, the so-called CAM unit (cell), used to control the general non-volatile storage unit and the operation of the semiconductor device used by customers). In recent years, in order to reduce the device size, a structure having a CAM cell formed in a general nonvolatile memory cell has been proposed. When the CAM cell has the same structure as the general memory cell, it is preferable that the word line and the bit line connected to the CAM cell also have the same structure as the general memory cell.
在开机或硬件重新设定时,被写入于与一般存储体单元相同构成的CAM单元的CAM数据较佳为转送到SRAM(Static Random AccessMemory;静态随机存取存储体)等的易失性存储部(闩锁电路)。藉此,CAM数据读取不会降低一般非易失性存储体单元的读取存取(read-access)时的速度。When starting up or resetting the hardware, the CAM data written in the CAM unit with the same configuration as the general storage unit is preferably transferred to a volatile storage such as SRAM (Static Random Access Memory; Static Random Access Memory) part (latch circuit). In this way, the CAM data reading will not reduce the read-access speed of general non-volatile memory cells.
在将CAM单元作成与一般存储体单元相同构成的情形下,较佳为如同一般存储体单元的验证操作,于CAM数据的重写时在半导体装置内部完成验证(verify)操作。专利文献1揭示有一种用于编程一般存储体单元时的验证电路。In the case where the CAM cell has the same configuration as a general memory cell, it is preferable to perform a verify operation in the semiconductor device when rewriting CAM data as in the verification operation of the general memory cell.
当编程一般存储体单元时,由使用者通过I/O输入信息「1」与「0」。「0」表示设定为编程的存储体单元,「1」表示设定为擦除的存储体单元。此外,使用各I/O的信息作为验证操作时的期望值。When programming a common memory cell, the user inputs information "1" and "0" through I/O. "0" indicates a memory cell set to be programmed, and "1" indicates a memory cell set to be erased. In addition, the information of each I/O is used as an expected value at the time of verifying the operation.
在半导体装置中,于实际编程之前,将连接至成为编程对象的字线的多个存储体单元的数据予以一次读出。称此处理为预读(pre-reading)。将经过预读的数据与通过I/O输入的数据作比较,只对设定成处于擦除状态(存储有信息「1」)且通过I/O予以编程(输入有「0」)的存储体单元进行编程。In a semiconductor device, before actual programming, data of a plurality of memory bank cells connected to a word line to be programmed is read out at once. This processing is called pre-reading. Compare the pre-read data with the data input through I/O, only for the memory that is set to be in the erased state (stored with information "1") and programmed through I/O (input with "0") Units are programmed.
对于已编程的存储体单元(存储有信息「0」)则不进行编程,因为额外的编程会产生应力(stress)。当通过I/O输入到已编程的存储体单元(存储有信息「0」)的信息为「1」时,则送回错误信号到控制器。这是因为存储体单元为实际进行写入操作的非易失性存储体,且因为可逆性而分离擦除操作与编程操作,例如对每个扇区(sector)共同地进行擦除。当从I/O输入到已擦除的存储体单元(存储有信息「1」)的信息为「1」时,则不执行操作。For programmed memory cells (stored with information "0"), programming is not performed because additional programming will generate stress. When the information input to the programmed memory bank unit (stored with information "0") through the I/O is "1", an error signal is sent back to the controller. This is because the memory bank unit is a non-volatile memory bank that actually performs the write operation, and the erase operation and the program operation are separated because of reversibility, for example, each sector (sector) is commonly erased. When the information input from the I/O to the erased bank unit (stored information "1") is "1", no operation is performed.
CAM单元的编程与一般存储体单元的编程相同较佳。然而,为CAM单元的编程时,使用与一般存储体单元的编程接口不同的两个接口方法来进行。用以使进行编程的CAM单元以及不进行编程的CAM单元对应来自于I/O的信息「1」与「0」而进行输入设定的CAM单元的编程接口称作接口1(参照专利文献2)。为接口1的情形下,使用者通过各自的I/O输入信息「1」与信息「0」。信息「1」表示设定成编程的存储体单元,而信息「0」表示设定成不执行操作(不进行编程)的存储体单元。The programming of the CAM unit is the same as that of the general memory cell. However, when programming a CAM cell, two interface methods different from the programming interface of a general memory bank cell are used. The programming interface of the CAM unit for making the CAM unit that is programmed and the CAM unit that is not programmed correspond to the information "1" and "0" from the I/O to input and set is called interface 1 (refer to Patent Document 2 ). In the case of
此外,对CAM单元进行编程时,非使用接口1的方法,而是使用一种通过命令输入而仅指定待编程的CAM单元。此方法称作接口2。为使用接口2的情形时,由于指定CAM单元的地址,故经指定的CAM单元意味着设定为编程的存储体单元。In addition, when programming CAM cells, instead of using the method of
专利文献1:日本特开平6-76586号公报Patent Document 1: Japanese Patent Application Laid-Open No. 6-76586
专利文献2:日本特开平10-106275号公报Patent Document 2: Japanese Patent Application Laid-Open No. 10-106275
发明内容 Contents of the invention
(发明所欲解决的课题)(Problem to be solved by the invention)
较佳为于CAM单元设置让使用者进行信息重写的使用者区块(user block)以及让工厂制造者预先写入信息的出厂区块(factoryblock)。于这种构成终,当进行使用者区块的CAM数据的重写时,则必需确保出厂区块的存储体单元不被单元信息的干扰(disturb)影响。所谓干扰为在编程被指定的存储体单元时连接至相同字线及位线的存储体单元受到电性影响而在存储体单元产生电荷损失或电荷增加的现象。Preferably, a user block (user block) for users to rewrite information and a factory block (factory block) for factory manufacturers to pre-write information are provided in the CAM unit. In this configuration, when rewriting the CAM data of the user block, it must be ensured that the memory cells of the factory block are not affected by the disturbance of the cell information. The so-called disturbance is a phenomenon in which memory cells connected to the same word line and bit line are electrically affected during programming of a designated memory cell, resulting in charge loss or charge increase in the memory cell.
习知技术的第一问题点为在进行使用者区块的CAM数据的重写时,必需确保出厂区块的存储体单元不会受到单元信息的干扰。The first problem of the conventional technology is that when rewriting the CAM data of the user block, it is necessary to ensure that the memory cells of the factory block will not be disturbed by the cell information.
习知技术的第二个问题点为在编程CAM单元后无法进行正确的验证。以下详述此问题点。The second problem with the conventional technology is that it cannot be verified correctly after programming the CAM cells. This problem point is detailed below.
当为在相同字线上连接有多个CAM单元的阵列构成,且针对相同字线上的多个CAM单元同时进行验证操作时,会造成第二个问题。The second problem arises when it is configured as an array with multiple CAM cells connected on the same word line, and the verification operation is performed on the multiple CAM cells on the same word line at the same time.
第1图(A)是显示在相同字线上所配置的多个CAM单元处于编程状态。第1图(A)中显示为「1」的CAM单元为擦除单元,且尚未被编程。为「0」的CAM单元为编程单元,且为已被编程的单元。Figure 1 (A) shows that multiple CAM cells arranged on the same word line are in a programmed state. The CAM cells shown as "1" in Figure 1 (A) are erased cells and have not been programmed yet. The CAM cells that are "0" are programming cells, and are cells that have already been programmed.
在第1图(A)所示的字线上的CAM单元进行第1图(B)所示的所述接口1的I/O输入。此外,第1图(B)所示的「1」是设定成实行编程,「0」是设定成不实行编程而处于目前的状态。The CAM cell on the word line shown in FIG. 1 (A) performs I/O input of the
在半导体装置中,通过所述预读从字线上的各CAM单元读出数据,并将预读的数据与从I/O输入的数据作比较,并只对处于擦除状态(存储有信息「1」)且通过I/O设定成进行编程(输入有信息「1」)的存储体单元进行编程。在此,如第1图(C)所示,在字线上最右方的CAM单元进行编程。In the semiconductor device, data is read from each CAM cell on the word line through the pre-reading, and the pre-reading data is compared with the data input from the I/O, and only the data in the erased state (stored information "1") and the memory bank cells set to be programmed (input with information "1") through the I/O are programmed. Here, as shown in FIG. 1 (C), programming is performed on the rightmost CAM cell on the word line.
编程后进行验证。编程后由CAM单元读出的数据与作为期望值的I/O输入数据作比较(参照第1图(D))。此时,如第1图(D)所示,当对已编程的CAM单元,I/O输入的期望值为不进行编程时,比较结果为「失败」,且验证操作以失败结束。Verify after programming. The data read from the CAM cell after programming is compared with the I/O input data as an expected value (see FIG. 1 (D)). At this time, as shown in Figure 1 (D), when the expected value of the I/O input is not programmed for the programmed CAM cell, the comparison result is "failure", and the verification operation ends in failure.
此外,在使用所述接口2的指定方法的情形下,由于为通过命令输入来指定仅进行编程的CAM单元的方法,因此,无法产生在相同字线上未被编程的CAM单元相对应的期望值,且无法实现验证操作。In addition, in the case of using the designation method of the
本发明乃有鉴于所述问题而研创者,其目的在于提供一种在具备有CAM单元的半导体装置中,能正常进行数据的重写和验证的半导体装置及一种地址分配方法和一种验证方法。The present invention was developed in view of the above-mentioned problems, and its object is to provide a semiconductor device that can normally perform data rewriting and verification in a semiconductor device with a CAM unit, an address allocation method, and a Authentication method.
(解决课题的手段)(means to solve the problem)
为了达成目的,本发明的半导体装置具备有:单元阵列,用以存储半导体装置的操作设定信息;以及控制部,用以控制所述单元阵列的读取与写入,并且,所述控制部具备有用来分配不同的行地址至所述操作设定信息的各个功能的构成。由于将不同的行地址分配至操作设定信息的各个功能,因此于编程时,不会产生应力(栅极干扰)至未被选择的功能的单元阵列。In order to achieve the object, the semiconductor device of the present invention has: a cell array for storing operation setting information of the semiconductor device; and a control unit for controlling reading and writing of the cell array, and the control unit It has a structure for assigning various row addresses to the operation setting information. Since different row addresses are allocated to each function of the operation setting information, no stress (gate disturbance) will be generated to the cell array of the unselected function during programming.
在所述的半导体装置中,所述控制部也可分配不同的列地址至所述操作设定信息的各个功能。由于将不同的列地址分配至操作设定信息的各个功能,因此不会产生应力(漏极干扰)至未被选择的功能的单元阵列。In the semiconductor device described above, the control unit may assign different column addresses to the respective functions of the operation setting information. Since different column addresses are assigned to the respective functions of the operation setting information, no stress (drain disturb) is generated to the cell array of the unselected functions.
在所述的半导体装置中,所述控制部也可分配连续的列地址至所述操作设定信息的多个不同的功能。由于将连续的列地址分配给多个不同的功能,故可连续读出数据,从而可缩短读取时间。In the semiconductor device described above, the control unit may assign consecutive column addresses to a plurality of different functions of the operation setting information. Since consecutive column addresses are allocated to a plurality of different functions, data can be continuously read, thereby shortening the read time.
在所述的半导体装置中,所述控制部也可分配所述操作设定信息至以所述行地址所选择的复数个列(column)。此外,所述控制部也可分配所述操作设定信息至以所述行地址所选择的任意列的所有I/O。可最小化读取周期(cycle)的次数,从而减少读取时间。In the semiconductor device described above, the control unit may distribute the operation setting information to a plurality of columns selected by the row address. In addition, the control unit may distribute the operation setting information to all I/Os of an arbitrary column selected by the row address. The number of read cycles can be minimized, thereby reducing the read time.
在所述的半导体装置中,具备有在不同行地址的存储体单元间,切断局部位线(local bit line)的配线图形(pattern)的构成。由于在不同行地址的存储体单元间切断局部位线的配线图形,故能以在不同功能的存储体单元间同时选择字线的状态下,通过切换列地址而读出数据。In the semiconductor device described above, a wiring pattern of a local bit line (local bit line) is cut off between memory bank cells of different row addresses. Since the wiring patterns of the local bit lines are cut between bank cells with different row addresses, data can be read by switching column addresses while simultaneously selecting word lines between bank cells with different functions.
在所述的半导体装置中,所述不同行地址的存储体单元也可分别具有开关,用以切换与对应列所设置的位线的连接。可以在不同功能的存储体单元间同时选择字线的状态下,通过切换列地址而读出数据。In the above semiconductor device, the memory cells with addresses in different rows may respectively have switches for switching the connection with the bit lines provided in the corresponding columns. Data can be read out by switching column addresses while word lines are simultaneously selected between memory bank cells with different functions.
在所述半导体装置中,所述单元阵列于各列具有多个存储体单元,且未储存所述操作设定信息的所述多个存储体单元也可从配置于对应列的位线来切离。因此,编程时,不会产生应力至未被选择的功能的单元阵列。In the semiconductor device, the cell array has a plurality of memory cells in each column, and the plurality of memory cells in which the operation setting information is not stored can also be switched from a bit line arranged in a corresponding column. Leave. Therefore, when programming, there is no stress to the cell array of unselected functions.
在所述半导体装置中,所述控制部也可选择所述单元阵列上的所有字线,且连续切换所述列地址而读出数据。能不进行字线的切换而仅通过列地址的切换来读出数据,从而能缩短读取时间。In the above-mentioned semiconductor device, the control unit may select all the word lines on the cell array, and continuously switch the column address to read data. Data can be read only by switching the column address without switching the word line, and the reading time can be shortened.
在所述半导体装置中,所述控制部也可具有转换表,用以从被指定的存储体单元的号码,转换为对应的存储体单元的地址。由于能转换成指定的单元的地址,故能对期望的单元进行编程。In the above semiconductor device, the control unit may have a conversion table for converting the number of the designated memory unit into the address of the corresponding memory unit. Since the address of the specified cell can be converted, a desired cell can be programmed.
本发明为一种分配地址至存储有半导体装置的操作设定信息的单元阵列的地址分配方法,是分配不同的行地址至所述操作设定信息的各个功能。由于将不同的行地址分配到操作设定信息的各个功能,故编程时,不会产生应力至未被选择的功能的单元阵列。此外,可对每个功能进行擦除。The present invention is an address allocation method for allocating addresses to a cell array storing operation setting information of a semiconductor device, in which different row addresses are allocated to each function of the operation setting information. Since different row addresses are assigned to each function of the operation setting information, no stress is generated on the cell array of the function not selected during programming. In addition, each function can be erased.
在所述地址分配方法中,也可分配不同的列地址至所述操作设定信息的各个功能。能于操作设定信息的各个功能以不同列地址来读出数据。In the address allocation method, different column addresses may also be allocated to the respective functions of the operation setting information. Data can be read with different column addresses for each function of the operation setting information.
在所述地址分配方法中,也可分配连续的列地址至所述操作设定信息的多个不同的功能。变的容易读出多个不同功能的操作设定信息。In the address assignment method, consecutive column addresses may also be assigned to a plurality of different functions of the operation setting information. It becomes easy to read out the operation setting information of multiple different functions.
在所述地址分配方法中,也可选择所述单元阵列上的所有字线,且连续切换所述列地址而读取数据。因此,能不进行字线的切换而仅通过列地址的切换来读出操作设定信息。In the address allocation method, all the word lines on the cell array may also be selected, and the column addresses may be switched continuously to read data. Therefore, the operation setting information can be read only by switching the column address without switching the word line.
本发明的构成具备有:单元阵列,用以存储半导体装置的操作设定信息;写入电路,用以同时编程所述单元阵列的多个单元;以及验证电路,用以验证只实际被编程的单元的编程结果。以此方式,本发明能验证只有实际被编程的单元的编程结果。The composition of the present invention has: a cell array for storing operation setting information of a semiconductor device; a writing circuit for simultaneously programming a plurality of cells of the cell array; and a verifying circuit for verifying only actually programmed cells. The programming result of the unit. In this way, the present invention can verify the programming results of only the cells that were actually programmed.
在所述半导体装置中,所述验证电路也可包含:比较电路,用以比较以正常编程所获得的期望值数据与所述编程后由所述单元或感测放大器(Sense Amplifier)所读取的数据;以及控制部,用以进行控制,俾使针对未被编程的所述单元所分配的所述比较电路的结果作出虚拟通过(pseudo-pass)。由于进行控制俾使针对未被编程的单元所分配的比较电路的结果作出虚拟通过,故能使被编程的单元的编程结果反映至验证。In the semiconductor device, the verification circuit may also include: a comparison circuit for comparing the expected value data obtained by normal programming with the data read by the cell or sense amplifier (Sense Amplifier) after the programming. data; and a control unit for controlling to make a pseudo-pass for the result of the comparison circuit assigned to the unprogrammed cell. Since the control is performed so that the result of the comparison circuit assigned to the unprogrammed cell is given a dummy pass, the programming result of the programmed cell can be reflected in the verification.
在所述半导体装置中,所述控制部为通过外部输入而被指定成编程的单元,且亦可具备有:期望值保持电路,是在所述编程前判定擦除位的单元,并根据来自所述控制部的指令而产生在编程所述单元时所获得的期望值数据,且输出至所述单元所分配的所述比较电路。以此方式,由于判定实际被编程的单元且将期望值数据输出到分配到该单元的比较电路,因此可正确判定被编程的单元的编程结果。In the above-mentioned semiconductor device, the control unit is a unit designated to be programmed by an external input, and may include an expected value holding circuit, which is a unit for determining an erase bit before the programming, and according to the The expected value data obtained when programming the unit is generated according to the instruction of the control unit, and output to the comparison circuit assigned to the unit. In this way, since the actually programmed cell is determined and the expected value data is output to the comparison circuit assigned to the cell, the programming result of the programmed cell can be correctly determined.
在上述半导体装置中也可具备有:单元阵列,用以存储半导体装置的操作设定信息;写入电路,用以同时写入所述单元阵列的多个单元;易失性存储电路,用以存储所述编程前的所述多个单元的存储数据;以及验证电路,在所述多个单元中,对未进行所述编程的单元直接使用所述存储数据来进行验证,并对实际进行有所述编程的单元使用在进行正常编程后所获得的期望值数据来验证编程结果。以此方式,由于本发明对未进行编程的单元直接使用存储数据来进行验证,且对实际进行有编程的单元使用正常进行编程时所获得的期望值数据来验证编程结果,因此可正确验证被编程的单元的编程结果。The above-mentioned semiconductor device may also include: a cell array for storing operation setting information of the semiconductor device; a write circuit for simultaneously writing a plurality of cells of the cell array; a volatile memory circuit for storing the storage data of the plurality of cells before the programming; and a verification circuit, among the plurality of cells, directly using the storage data to verify the cells that have not been programmed, and verifying the actual The programmed cells verify programming results using expected value data obtained after performing normal programming. In this way, since the present invention directly uses the stored data to verify the unprogrammed cells, and uses the expected value data obtained during normal programming to verify the programming results for the actually programmed cells, it can correctly verify the programmed The programming result of the unit.
在所述半导体装置中,所述验证电路也可具备有:多个比较电路,用以比较以正常进行编程所获得的期望值数据与于所述编程后由所述单元或感测放大器所读取的数据;以及控制部,用以判定实际进行过编程的单元,且于该单元所分配的所述比较电路使用正常进行编程后所获得的期望值数据来验证编程结果。能判定实际被编程的单元,且正确地验证被编程的单元的编程结果。In the semiconductor device, the verification circuit may also include a plurality of comparison circuits for comparing expected value data obtained by normal programming with those read by the cells or sense amplifiers after the programming. the data; and the control unit is used to determine the cell that has actually been programmed, and the comparison circuit assigned to the cell uses the expected value data obtained after normal programming to verify the programming result. The actually programmed cells can be determined, and the programming results of the programmed cells can be verified correctly.
在所述半导体装置中,所述控制部为通过外部输入而被指定成编程的单元,且将相当于所述编程前为擦除位的单元的所述易失性存储体电路所存储的期望值数据变更为被编程后的期望值数据,并输出至所述比较电路。能判定实际被编程的单元,且正确地验证被编程的单元的编程结果。In the semiconductor device, the control unit is a cell designated to be programmed by an external input, and stores an expected value in the volatile memory circuit corresponding to a cell whose bit is erased before the programming. The data is changed into programmed expected value data and output to the comparison circuit. The actually programmed cells can be determined, and the programming results of the programmed cells can be verified correctly.
在所述半导体装置中,所述控制部也可将用以指示是否设定成编程对象的指示信号予以外部输入至所述多个单元,来判定设定成所述编程对象的单元是否为擦除位的单元,并判定实际进行编程的单元。能通过来自外部的指令信号来设定编程对象的单元,并对被指定的单元进行编程。In the semiconductor device, the control unit may externally input an indication signal indicating whether to set as a programming target to the plurality of cells to determine whether the cell set as the programming target is an eraser or not. Divide the bit cell and determine the cell that is actually programmed. The unit to be programmed can be set by an external command signal, and the designated unit can be programmed.
在所述半导体装置中,所述控制部也可将外部输入的地址信息予以译码,判定设定成编程对象的单元,并判定设定成所述编程对象的单元是否处为擦除位的单元,且判定实际进行编程的单元。能通过外部输入的地址信息来设定编程对象的单元,且对被指定的单元进行编程。In the semiconductor device, the control unit may decode address information input from the outside, determine the cell set as the programming target, and determine whether the cell set as the programming target is at the erase bit. cell, and determine the cell that is actually being programmed. A cell to be programmed can be set by address information input from the outside, and the designated cell can be programmed.
在所述半导体装置中,所述控制部也可通过外部输入的模式切换信号(mode switching signal)来切换用以指定所述编程对象的单元的接口。可对应多个接口来接受待编程的单元的指定。In the semiconductor device, the control unit may switch an interface for specifying the programming target unit by a mode switching signal input from the outside. Designation of cells to be programmed may be accepted corresponding to a plurality of interfaces.
在所述半导体装置中,对存储所述操作设定信息的单元阵列进行编程后的验证与对存储一般数据的一般单元阵列进行编程后的验证,也可共享所述验证电路。由于可共享验证电路,因此可谋求电路的小型化。In the semiconductor device, the verification circuit may be shared between the verification after programming of the cell array storing the operation setting information and the verification after programming of a general cell array storing general data. Since the verification circuit can be shared, the circuit can be miniaturized.
在所述半导体装置中,所述比较电路也可输入用以对存储有所述操作设定信息的单元阵列切换成编程的模式信号,并比较所述期望值数据与从所述单元或感测放大器读出的数据。能仅在验证时使比较电路操作。In the semiconductor device, the comparison circuit may also input a mode signal for switching the cell array storing the operation setting information to programming mode, and compare the expected value data with that from the cell or sense amplifier. read data. The comparison circuit can be operated only at the time of verification.
在所述半导体装置中,于对用以存储所述操作设定信息的单元阵列进行编程时,也可使用所述易失性存储电路的输出,并在所述比较电路进行比较操作,而于对用以存储一般数据的一般单元阵列进行编程时,也可使用保存有所述单元被编程时所获得的期望值数据的期望值保持电路的输出,并进行所述比较电路的比较操作。能在对用以存储操作设定信息的单元阵列进行编程时与对一般单元阵列进行编程时,进行不同的验证控制。In the semiconductor device, when programming the cell array for storing the operation setting information, the output of the volatile storage circuit may be used, and a comparison operation may be performed in the comparison circuit, and in When programming a general cell array for storing general data, it is also possible to use the output of the expected value holding circuit storing the expected value data obtained when the cells are programmed, and perform the comparison operation of the comparison circuit. Different verification control can be performed when programming a cell array for storing operation setting information and when programming a general cell array.
本发明也提供一种验证存储有半导体装置的操作设定信息的单元阵列的验证方法,在所述单元阵列的多个单元中,只验证实际进行编程的单元的编程结果。以此方法,本发明能仅验证实际进行编程的单元的编程结果。The present invention also provides a verification method for verifying a cell array storing operation setting information of a semiconductor device, wherein among a plurality of cells in the cell array, only a programming result of a cell actually programmed is verified. In this way, the present invention can only verify the programming results of the cells that were actually programmed.
本发明也提供一种验证存储有半导体装置的操作设定信息的单元阵列的验证方法,该验证方法是对未进行所述编程的单元直接使用该单元在所述编程前的所述数据来进行验证,而对实际进行所述编程的单元,使用正常进行编程时所获得的期望值数据来验证编程的结果。以此方法,由于本发明对未被编程的单元直接使用存储数据来进行验证,而对实际进行编程的单元使用正常进行编程时所获得的期望值数据来验证编程结果,因此,可正确地验证被编程的单元的编程结果。The present invention also provides a verification method for verifying a cell array storing operation setting information of a semiconductor device. The verification method is to directly use the data of the cell before the programming for the cell that has not been programmed. Verification, and for the cells that are actually programmed, use the expected value data obtained when programming is performed normally to verify the programming results. In this way, since the present invention directly uses the storage data to verify the unprogrammed cells, and uses the expected value data obtained during normal programming to verify the programming results for the actually programmed cells, it can be correctly verified. The programming result of the programmed cell.
(发明的效果)(effect of invention)
本发明于具备有用以存储操作设定信息的单元阵列的半导体装置中,能正常地进行数据重写及验证。The present invention can normally perform data rewriting and verification in a semiconductor device with a cell array for storing operation setting information.
附图说明 Description of drawings
第1图(A)至第1图(D)是用以说明先前技术的问题点。FIG. 1 (A) to FIG. 1 (D) are used to illustrate the problems of the prior art.
第2图是显示本发明的半导体装置的构成。Fig. 2 shows the structure of the semiconductor device of the present invention.
第3图是显示CAM单元阵列的位映像(bitmap)的一例。FIG. 3 shows an example of a bitmap of a CAM cell array.
第4图是显示CAM单元阵列的位映像的一例。FIG. 4 shows an example of a bitmap of a CAM cell array.
第5图是显示WP位号码及地址之间的对应关系。Figure 5 shows the correspondence between the WP bit number and the address.
第6图是显示朝WP位地址的CAM单元阵列的地址的转换。Figure 6 shows the conversion of the CAM cell array address towards the WP bit address.
第7图(A)与第7图(B)是显示CAM单元阵列与一般单元阵列的存储体单元的构成。FIG. 7 (A) and FIG. 7 (B) show the structure of memory cells of a CAM cell array and a general cell array.
第8图(A)与第8图(B)是显示CAM单元阵列与一般单元阵列的存储体单元的构成。FIG. 8 (A) and FIG. 8 (B) show the structure of the memory cell of the CAM cell array and the general cell array.
第9图是显示将WP地址转换为CAM列地址的逻辑电路的构成。Fig. 9 shows the configuration of the logic circuit for converting the WP address into the CAM column address.
第10图是显示将WP地址转换为DQ的逻辑电路的构成。Figure 10 shows the configuration of the logic circuit that converts the WP address into DQ.
第11图是显示单元阵列与验证电路的构成。Fig. 11 shows the structure of cell array and verification circuit.
第12图显示WP位选择电路的构成。Figure 12 shows the configuration of the WP bit selection circuit.
第13图是显示验证电路处于I/O模式时的操作顺序的流程图。Fig. 13 is a flowchart showing the sequence of operations when the verification circuit is in I/O mode.
第14图(A)至第14图(D)是用以说明验证电路处于I/O模式时的顺序。FIG. 14 (A) to FIG. 14 (D) are used to illustrate the sequence when the verification circuit is in the I/O mode.
第15图是显示验证电路处于地址模式(address mode)时的操作顺序的流程图。FIG. 15 is a flowchart showing the operation sequence when the verification circuit is in address mode.
第16图是用以说明验证电路处于地址模式的顺序。FIG. 16 is used to illustrate the sequence of verifying circuit in address mode.
第17图是显示验证电路的详细构成。Fig. 17 shows the detailed configuration of the verification circuit.
第18是显示单元阵列与验证电路的构成。The eighteenth is the configuration of the display cell array and verification circuit.
第19图是显示WP位选择电路的构成。Fig. 19 shows the configuration of the WP bit selection circuit.
第20图是显示验证电路处于I/O模式时的操作顺序的流程图。Fig. 20 is a flow chart showing the sequence of operations when the verification circuit is in I/O mode.
第21图是用以说明验证电路处于I/O模式时的顺序。FIG. 21 is used to illustrate the sequence when the verification circuit is in I/O mode.
第22图是显示验证电路处于地址模式时的操作顺序的流程图。Fig. 22 is a flow chart showing the operation sequence when the verification circuit is in the address mode.
第23图是用以说明验证电路处于地址模式时的顺序。Fig. 23 is used to illustrate the sequence when the verification circuit is in the address mode.
第24图是显示验证电路的详细构成。Fig. 24 shows the detailed configuration of the verification circuit.
具体实施方式 Detailed ways
以下参照附图说明本发明的较佳具体实施例。Preferred specific embodiments of the present invention are described below with reference to the accompanying drawings.
第一实施例first embodiment
参照照附图说明本发明的较佳实施例。Preferred embodiments of the present invention will be described with reference to the accompanying drawings.
首先参照第2图,说明本实施例的整体构成。本实施例的半导体装置1具备有:一般单元阵列3,用以存储一般的数据;以及CAM单元阵列4,用以存储CAM的数据。CAM单元阵列4与一般单元阵列3相同,具有存储体单元排列成多条行及列的构成。CAM单元阵列4是存储半导体装置1的操作设定信息(即所谓的CAM数据)。例如,存储有一般单元阵列3的写入保护信息、半导体装置1的内部电压调整信息、内部时序调整信息、操作模式切换信息、以及存储体单元备份位的信息等。并设置用以实现对这些单元阵列的数据写入、读取、及擦除的周边电路。如第1图所示,周边电路设置有行(row)译码器5、列译码器6、命令缓存器7、控制器8、编程电压产生电路9、感测放大器10、易失性存储体单元11、判定电路12、验证电路13、以及数据输入/输出电路14。First, referring to Fig. 2, the overall configuration of this embodiment will be described. The
行译码器5是用以于数据写入、擦除、及读取时,基于各自的地址,选择性驱动多个字线WL者,且从编程电压产生电路9施加所需的电压至该字线驱动器(未图标)。列译码器6基于外部输入的地址来选择单元阵列的列(亦即,选择全域位线或局部位线)。The
命令缓存器7是将来自外部的命令译码成内部控制信号。控制器(控制部)8是对应通过命令缓存器7所译码的内部控制信号而控制对应命令的内部操作。控制器8例如以微处理器所构成,且根据所述内部控制信号来控制编程电压产生电路9、判定电路12、以及验证电路13等。The
在半导体装置1电源投入或硬件重置时等,将存储于CAM单元阵列4的CAM数据转送到易失性存储体单元11并予以存储。由于在易失性存储体单元11预先读取CAM数据,故在一般单元阵列3预读时不会因为CAM数据的读出而产生读取(read)操作的延迟。由于读取操作时间会随着激活时间的增大而变长,故以短时间来转送CAM数据为佳。The CAM data stored in the
数据输入/输出电路14具备有I/O端子,用以从外部输入编程指令且输出读出数据。数据输入/输出电路14是执行对一般单元阵列3与CAM单元阵列4的数据的写入(编程)与读出(读取)。The data input/
接下来,针对CAM单元阵列4的构成加以说明。第3图是显示将CAM数据分配至CAM单元阵列4的位映像(bitmap)。CAM单元阵列4分成使用者区块与出厂区块的功能区块。数据的擦除在功能区块单位被执行。Next, the configuration of the
所谓使用者区块是指用以写入使用者可重写的写入保护(write-protect)位(以下也称作WP位)等的区域。写入保护位为用以控制对存储体单元的编程或擦除的位,是以任意数目的扇区(以下,将该单元称作扇区组群)为单位来设定。在第3图所示的例子中,较佳为将WP位分配到DQ0至DQ15所有的I/O,字线为分配一条(一个行地址),局部位线(LBL)为每个I/O分配四条(亦即,4个列地址份(LBL0至LBL3)),全域位线(GBL)为每个I/O分配一条份(GBL0)。在此,所谓将WP位分配到DQ0至DQ15所有的I/O是指分配数据至以行地址所选择的任意列的所有存储体单元。当WP位的数目不能被I/O个数整除时,可重点放在I/O分配来分配列(column),或重点放在列分配来分配I/O。例如,当WP位的数目为60且I/O个数为16时,用重点放在I/O分配来分配列的方法中,则不分配与最后的列地址(000011)的WP位60、61、62、63对应的I/O(DQ),或将与最前面的列地址(000000)的WP位1、2、3、4对应的I/O(DQ)移位(shift)并与以分配。在重点放在列分配来分配I/O的方法中,则略过与WP位15、31、47、63对应的I/O(DQ)来分配。The so-called user block refers to an area for writing a user-rewritable write-protect (write-protect) bit (hereinafter also referred to as a WP bit). The write protect bit is a bit for controlling programming or erasing of a memory bank unit, and is set in units of an arbitrary number of sectors (hereinafter, the unit is referred to as a sector group). In the example shown in Figure 3, it is preferable to assign the WP bit to all I/Os from DQ0 to DQ15, one word line (one row address), and one local bit line (LBL) for each I/O Four are allocated (ie, 4 column address shares (LBL0 to LBL3)), and the global bit line (GBL) is allocated one share (GBL0) for each I/O. Here, allocating the WP bit to all the I/Os of DQ0 to DQ15 refers to allocating data to all memory bank units in any column selected by the row address. When the number of WP bits is not divisible by the number of I/Os, you can focus on I/O allocation to allocate columns, or focus on column allocation to allocate I/O. For example, when the number of WP bits is 60 and the number of I/Os is 16, in the method of allocating columns with emphasis on I/O allocation,
使用者区块是以WP位0至63的64个位份所构成,且根据第5图所示的对应关系(转换表)与第6图所示的转换(转换表)来进行位分配。亦即,如第5图与第6图所示,各WP位0至63是对应作为I/O的DQ端子的地址A17至A20以及作为列地址的地址A21与A22。The user block is composed of 64 bits of
出厂区块(factory block)为厂商执行重写而使用者不能重写的功能区块。在此功能区块中,写入备份数据、内部电压修整数据、以及内部时序修整数据等。The factory block is a functional block that is rewritten by the manufacturer but cannot be rewritten by the user. In this functional block, backup data, internal voltage trimming data, internal timing trimming data, etc. are written.
在第3图所示的出厂区块中,是以修整(Triming)用TR0至TR15的16个位、用以使用8位来存储一个缺陷释放地址的扇区备份用的REDSECA至REDSECD的32个位份、以及用以使用8位来记亿一个缺陷释放地址的列备份用的REDCOL(0至0)至REDCOL(7至1)的128个位份所构成者。In the factory block shown in Figure 3, 16 bits from TR0 to TR15 are used for trimming, and 32 bits from REDSECA to REDSECD are used to store a sector backup of a defect release address using 8 bits. Bit share, and 128 bit shares of REDCOL (0 to 0) to REDCOL (7 to 1) used to record a defect release address using 8 bits.
如第3图所示,出厂区块也分配到DQ0至DQ15各者,字线为分配一条,局部位线(LBL)为每个I/O分配11条份(亦即,11个列地址(LBL4至LBL14)),出厂区块的全域位线(GBL)为每个I/O分配三条份(GBL1至GBL3)。如第4图所示,出厂区块也可与使用者区块相同,以64个位份所构成,且分配到DQ0至DQ15各者。As shown in Figure 3, the factory block is also allocated to each of DQ0 to DQ15, one word line is allocated, and 11 local bit lines (LBL) are allocated for each I/O (that is, 11 column addresses ( LBL4 to LBL14)), the global bit line (GBL) of the factory block allocates three copies (GBL1 to GBL3) for each I/O. As shown in FIG. 4 , the factory block can also be configured with 64 bits the same as the user block, and allocated to each of DQ0 to DQ15.
第7图(A)是显示CAM单元阵列4的详细构成,而第7图(B)是显示一般单元阵列3的详细构成。第7图(A)所示的CAM单元阵列4在出厂区块与使用者区块具有彼此独立的字线,藉此出厂区块不会因为使用者区块的重写而受到存储体信息的栅极干扰。亦即,将不同的行地址分配到出厂区块与使用者区块。第2图所示的行译码器5是根据从外部所输入的地址,将各个功能区块的CAM数据分配到不同的行地址。第7图(A)是显示分配到包含于使用者区块的WP位的字线WL0以及分配到包含于出厂区块的出厂位的字线WL1。并且,在相同功能区块(使用者区块或出厂区块)中,将进行分配的字线的数目设定成最小限度。这是因为该结构设计成能够将功能区块单位的数据整体地擦除。在此,所谓栅极干扰是指连接到与进行编程的存储体单元相同的位线,且该位线对未被选择的存储体单元的栅极施加编程时的高电压而造成电荷增加的现象。因为这种现象,未被选择的存储体单元的数据会由于电荷增加而从「1」(低临界值)变成「0」(高临界值)。FIG. 7(A) shows the detailed structure of the
同样地,列译码器6根据外部输入的地址,将各个功能区块的CAM数据分配到不同的列地址。此外,在出厂区块与使用者区块之间,以列地址连续的方式来分配地址。Similarly, the
为了使出厂区块不会因为使用者区块的重写等而受到存储体信息的漏极干扰,故如第7图(A)所示在出厂区块与使用者区块之间将位线予以分离。亦即,列译码器6在使用者区块与出厂区块将彼此独立的列地址分至到数据。此外,列译码器6在不同功能区块之间设定成连续列地址。在此,所谓位线的分离是指局部位线与全域位线的物理性分离及电气性分离。所谓漏极干扰是指连接至与进行编程的存储体单元相同的位线,且位线对非选择的存储体单元的漏极施加编程时的高电压而造成电荷漏失的现象。因为此现象,非选择的存储体单元的数据会因为电荷漏失而从「0」(高临界值)变成「1」(低临界值)。In order to prevent the factory block from being disturbed by the drain of the memory bank information due to the rewriting of the user block, etc., the bit line is connected between the factory block and the user block as shown in Figure 7 (A). be separated. That is to say, the
此外,由于在选择所有字线(例如,字线WL1与WL2)的状态下,仅切换列地址而使CAM数据全部读出,故在功能区块之间不会有相同的列地址,且使列地址在功能区块内为连续。因此,能节省字线切换的时间,并能在短时间内将CAM数据从CAM单元阵列4转送至易失性存储体单元11。在此情形中,当同时选择多个字线时,连接不必要的单元数据的位线被分开,使得必要的单元数据与不必要的单元数据不会通过相同的位线而重复被选择。In addition, since all the CAM data are read out only by switching the column address in the state where all the word lines (for example, word lines WL1 and WL2) are selected, there will not be the same column address between functional blocks, and the Column addresses are continuous within a functional block. Therefore, the time for word line switching can be saved, and the CAM data can be transferred from the
并且,利用使用者区块与出厂区块不共享相同列地址的这项事实,如第8图(A)所示将使用者区块与出厂区块之间的局部位线(LBL)的配线图形予以物理性断开,且断开的局部位线(LBL)不会连接至全域位线(例如,不设置接触贯穿孔)。或者,将使用者区块与出厂区块以扇区的概念彼此分离,且如第7图(A)所示于使用者区块与出厂区块各自具有与全域位线连接的列开关(column switch),从而将使用者区块与出厂区块予以电气性分离。And, taking advantage of the fact that the user block and the factory block do not share the same column address, the allocation of the local bit line (LBL) between the user block and the factory block is shown in Figure 8 (A). The line pattern is physically disconnected, and the disconnected local bit line (LBL) is not connected to the global bit line (eg, no contact vias are provided). Alternatively, the user block and the factory block are separated from each other with the concept of a sector, and each of the user block and the factory block has a column switch (column) connected to the global bit line as shown in FIG. switch) to electrically separate the user block from the factory block.
藉此,在电源供给时等中,当从CAM单元阵列4读出数据至易失性存储体单元11时,能在同时选择使用者区块的字线与出厂区块的字线的状态下,仅通过列地址的选择切换而读出CAM数据。由于不需进行字线的选择切换,故可缩短CAM数据所有位的总读出时间。Thereby, when data is read from the
第9图是显示将编程/擦除操作用的地址信号转换成各个存储库(bank)的列地址信号的转换电路的构成。该转换电路由于设置在列译码器6内,且将CAM编程模式信号(CAMPGM)切换成活性状态与非活性状态,故能切换成一般单元阵列3的列地址与CAM单元阵列4的列地址。FIG. 9 shows the configuration of a conversion circuit for converting address signals for program/erase operations into column address signals for individual banks. Since this conversion circuit is arranged in the
转换电路的构成具备有:OR(反或)栅121,用以输入编程/擦除操作用的地址信号WA(0)或WA(1)以及CAMPGM信号;OR栅123,用以分别输入CAMPGM信号的反相输出与地址信号WA(21)或WA(22);NAND(反及)栅124,用以输入OR栅121与123的输出;以及反相器125,用以使NAND栅124的输出反相。反相器125的输出成为列地址AA(0)与AA(1)。当CAMPGM信号为非活性的情形时,地址信号WA(1)与WA(0)会直接成为列地址AA(1)与AA(0)。The composition of the conversion circuit is provided with: OR
此外,并具备有:OR栅131,用以输入GAMPGM信号、各地址信号WA(2)、WA(3)、WA(4)、及WA(5);OR栅133,用以输入CAMPGM信号的反相输出以及电源电压VCC;NAND栅134,用以输入OR栅131与133的输出;以及反相器135,用以判定NAND栅134的输出。反相器135的输出会作为列地址AA(2)、AA(3)、AA(4)、及AA(5)来输出。In addition, and possess: OR
第10图是显示将编程/擦除操作用的地址信号转换成DQ的转换电路。该转换电路是作为开关而设置在数据输入/输出电路14中。用以产生DQ0的转换电路是由下述所构成者:NOR栅142,用以输入地址信号WA(20)、WA(19)、WA(18)、WA(17);NAND栅143,用以输入CAMPGM信号与NOR栅142的输出;以及反相器144,用以使NAND栅143的输出反相。通过相同的电路构成来构成用以产生DQ1至DQ15的转换电路。Fig. 10 is a diagram showing a conversion circuit for converting address signals for program/erase operations into DQ. This conversion circuit is provided in the data input/
当CAMPGM信号为活性化时,将地址信号WA(0)至WA(17)分配到CAM_DQ15至CAM_DQ0。当一般单元阵列3为选择状态(亦即,CAMPGM信号为非活性)时,CAM_DQ15至CAM_DQ0成为非活性状态。When the CAMPGM signal is active, address signals WA(0) to WA(17) are assigned to CAM_DQ15 to CAM_DQ0. When the
在写入保护位的编程时,通过第10图所示的转换电路仅将成为编程对象的DQ予以活性化操作,并控制施加应力、期望值、以及判定信号,藉此忽略非编程对象的DQ。When programming the write protection bit, only the DQ to be programmed is activated by the conversion circuit shown in FIG. 10 , and the applied stress, expected value, and judgment signal are controlled, thereby ignoring the DQ not to be programmed.
所述实施例虽为较佳的实施例,但本发明并未限定于此。例如,出厂区块也可包含有一次性可编程只读存储体(One TimeProgrammable Rom;OTP ROM)。OTP ROM为一种使用者只可编程一次的功能存储体。在允许使用者的功能观点来看,虽与出厂区块不同,但从一次编程后就不允许再度编程的功能观点来看,是从使用者可重复编程及擦除的使用者区块予以分离。亦即,被要求避免栅极干扰与漏极干扰。Although the above-described embodiments are preferred embodiments, the present invention is not limited thereto. For example, the factory block may also include a one-time programmable read-only memory (One Time Programmable Rom; OTP ROM). OTP ROM is a functional memory bank that can only be programmed once by the user. From the point of view of the function that allows users, although it is different from the factory block, but from the point of view of the function that does not allow reprogramming after one programming, it is separated from the user block that can be repeatedly programmed and erased by the user. . That is, it is required to avoid gate disturbance and drain disturbance.
此外,也可用读取位区块(read bit block)来形成使用者区块,而取代写入位区块(write bit block),并以任意的扇区单位来进行读取的控制。In addition, the read bit block can also be used to form the user block instead of the write bit block, and the read control can be performed in any sector unit.
在所述的实施例中,虽揭示在出厂区块与使用者区块之间的局部位线为物理性分离和全域位线为电气性分离,但本发明并未限定于此,也可将出厂区块与使用者区块之间的全域位线予以物理性或电性分离。In the described embodiment, although it is disclosed that the local bit lines between the factory block and the user block are physically separated and the global bit lines are electrically separated, the present invention is not limited thereto, and the The global bit lines between the factory block and the user block are physically or electrically separated.
也可连接一般单元阵列与CAM单元阵列以便共享数据总线,或连接成共享使用者区块与出厂区块的全域位线。Ordinary cell arrays and CAM cell arrays can also be connected to share the data bus, or connected to share the global bit lines of the user block and factory block.
此外,使用者区块与出厂区块之间的阱(well)可分开或共享。若共享,可减少晶粒的尺寸。在此情况下,在使用者区块中进行擦除操作时,对出厂区块的字线进行浮动控制(floating control)。In addition, the wells between the user block and the factory block can be separated or shared. If shared, the size of the die can be reduced. In this case, when the erase operation is performed in the user block, floating control is performed on the word line of the factory block.
第二实施例second embodiment
参照第11图,说明本实施例的构成。第11图是显示用以存储半导体装置1的数据的单元阵列部2(一般单元阵列3与CAM单元阵列4)、用以确认单元阵列部2的数据的写入状态或数据的擦除状态的验证电路13、以及数据输入/输出电路14内的期望值保持电路32的构成。在本实施例中,也具备16位同时写入模式,藉此能同时存取一般单元阵列3或CAM单元阵列4的16个存储体单元并进行编程。Referring to Fig. 11, the configuration of this embodiment will be described. Figure 11 shows the cell array part 2 (
如第11图所示,验证电路13具备有WP位选择电路33与数据比较电路34。数据输入/输出电路14内的期望值保持电路32与数据比较电路34对应16个I/O而分别设置有16个。As shown in FIG. 11 , the
如第11图所示,将接口模式设定信号、由各个I/O输入的信号、以及指定写入保护CAM(以下称为WP-CAM)的地址信号(WP-CAM地址指定信号)输入到WP位选择电路33。As shown in Figure 11, the interface mode setting signal, the signal input from each I/O, and the address signal (WP-CAM address designation signal) designating the write-protect CAM (hereinafter referred to as WP-CAM) are input to the The WP bit selects the
有两种进行编程CAM单元的指定方法。一种为将信息「1」输入到对应至待编程的CAM单元的I/O,并将信息「0」输入到对应至不予编程的CAM单元的I/O,藉此进行指定的方法(以下称为I/O模式)。另一种方法为将对应地址输入到待编程的CAM单元(以下称为地址模式)。接口模式设定信号为一种在所述两种方法之间用以切换待编程的CAM单元的指定方法的信号。There are two specified methods for programming CAM cells. A method of specifying by inputting information "1" to an I/O corresponding to a CAM cell to be programmed, and inputting information "0" to an I/O corresponding to a CAM cell not to be programmed ( Hereinafter referred to as I/O mode). Another method is to input the corresponding address to the CAM cell to be programmed (hereinafter referred to as address mode). The interface mode setting signal is a signal used to switch the designated method of the CAM cell to be programmed between the two methods.
第12图是显示WP位选择电路33的详细构成。如第12图所示,WP位选择电路33主要具备有译码器51、AND(及)栅53、以及开关54。AND栅53与开关54是对应16个I/O而分别设置16个。以此构成,选择用以进行虚拟验证的数据比较电路34。FIG. 12 shows the detailed configuration of the WP
当以接口模式设定信号来设定地址模式时,将开关54-(0)至54-(15)予以关断(OFF),以译码器51将输入的WP-CAM地址指定信号予以译码而产生验证控制信号。此外,当以接口模式设定信号设定I/O模式时,经由反相器52并通过输入到译码器51的接口模式设定信号而将译码器51予以关断(OFF),并将开关54-(0)至54-(15)予以导通(ON)。When the address mode is set with the interface mode setting signal, the switches 54-(0) to 54-(15) are turned off (OFF), and the input WP-CAM address designation signal is translated by the
将由各个I/O所输入的信号(I/O-(0)至I/O(15))与由CAM单元预先读出的预读数据(DAV)输入到AND栅53-(0)至53-(15),而获得这些信号的逻辑积。亦即,当CAM单元编程前的数据与由I/O输入的数据皆为「1」时,则输出高位准信号作为验证控制信号。其它的情形则输出低位准信号作为验证控制信号。Input the signal (I/O-(0) to I/O(15)) input by each I/O and the pre-read data (DAV) read in advance by the CAM unit to the AND gate 53-(0) to 53 -(15), and the logical product of these signals is obtained. That is, when the data before programming of the CAM unit and the data input by the I/O are both "1", a high level signal is output as a verification control signal. In other cases, a low-level signal is output as a verification control signal.
如第11图所示,期望值保持电路32-(0)至32-(15)是对应各个I/O来设置,并保持I/O输入的信息。在一般单元阵列3编程后,将所保持的信息作为期望值数据输出到数据比较电路34。期望值保持电路32-(0)至32-(15)在设定成I/O模式且进行CAM单元阵列4的编程时,保持I/O输入的信息。在CAM单元阵列4编程后,将所保持的信息作为期望值数据输出到数据比较电路34。此外,当设定成地址模式且进行CAM单元阵列4的编程时,当通过接口模式设定信号使开关35变成导通时,期望值保持电路32会输入由WP位选择电路33输出的验证控制信号并产生期望值。在CAM单元阵列4编程后,将此数据作为期望值数据输出到数据比较电路34。As shown in FIG. 11, the expected value holding circuits 32-(0) to 32-(15) are provided corresponding to the respective I/Os, and hold the information input by the I/Os. After the
数据比较电路34-(0)至34-(15)也对应I/O而分别设置,且将由一般单元阵列3或CAM单元阵列4读出的数据与保持于期望值保持电路32-(0)至32-(15)内的数据(期望值)进行比较。在CAM单元阵列4的编程时,数据比较电路34通过来自WP位选择电路33的验证控制信号对非编程对象的单元全部进行虚拟验证。The data comparison circuits 34-(0) to 34-(15) are also respectively provided corresponding to the I/Os, and hold the data read by the
接着,参照第13图的流程图以及第14图(A)至第14图(D),说明设定成本实施例的I/O模式且进行CAM单元阵列4的编程时的操作。在此实施例中,可对由多个扇区所构成的扇区组群进行用以保护写入的写入保护的设定,并将I/O分配到各扇区组群。当选择设定成用以保护写入的写入保护的扇区组群时,在该扇区组群的WP-CAM单元进行保护数据的编程。Next, referring to the flowchart of FIG. 13 and FIG. 14(A) to FIG. 14(D), the operation of setting the I/O mode of this embodiment and programming the
首先,由各个I/O输入已设定待编程的WP-CAM单元的CAM编程设定信号(I/O-0至15)(步骤S10)。将用以指示编程实行的信息「1」输入到对应至待编程的WP-CAM单元的I/O,且将用以指示不进行编程的信息「0」输入到其它的I/O(参照第14图(B))。First, the CAM programming setting signals (I/O-0 to 15) of the WP-CAM cells to be programmed are input from the respective I/Os (step S10). Input the information "1" to indicate that programming is performed to the I/O corresponding to the WP-CAM unit to be programmed, and input the information "0" to indicate that programming is not performed to other I/Os (see 14 (Figure (B)).
接着,读出(预读)已储存于WP-CAM单元的数据(步骤S11)。判定已预读的数据,并判定各WP-CAM单元的数据写入状态。当数据已写入且为已编程的状态时,存储信息「0」,当数据未写入且为擦除状态时,则存储信息「1」(参照第14图(A))。Next, the data stored in the WP-CAM unit is read (pre-read) (step S11). The pre-read data is judged, and the data writing status of each WP-CAM cell is judged. When data has been written and is in a programmed state, information "0" is stored, and when data is not written and is in an erased state, information "1" is stored (see FIG. 14(A)).
接着,通过I/O输入信号设定成写入,并检测现在的状态处于擦除状态的WP-CAM单元(步骤S12)。将预读的WP-CAM单元的数据为「1」的擦除状态且I/O输入为「1」的WP-CAM单元予以检测出。此判定也可使用第11图所示的期望值保持电路32与数据比较电路34。Next, write is set by an I/O input signal, and a WP-CAM cell whose current state is in an erased state is detected (step S12). A WP-CAM cell whose data of the pre-read WP-CAM cell is "1" in an erased state and whose I/O input is "1" is detected. For this judgment, the expected
然后对检测出的WP-CAM单元进行编程(步骤S13)(例如参照第14图(C))。在进行编程时,验证电路13判定数据是否已确实写入WP-CAM单元。此时,通过设定成I/O模式的接口模式设定信号将各个I/O所设置的开关35-(0)至35-(15)予以关断。此外,接口模式设定信号也输入到WP位选择电路33,并将开关54-(0)至54-(15)设定成导通。Then, the detected WP-CAM cells are programmed (step S13) (for example, refer to FIG. 14(C)). When programming is performed, the
WP位选择电路33通过AND栅53-(0)至53-(15)得出由各WP-CAM单元在预读时所读出的数据与I/O输入的信号(I/O-0至15)的逻辑积以产生验证控制信号。当I/O输入为以「1」来指定成编程,且预读数据也以「1」来指定擦除单元时,将高位准的验证控制信号输出到数据比较电路34。在其它的情形下,将低位准的验证控制信号输出到数据比较电路34。WP
期望值保持电路32-(0)至32-(15)将输入的I/O-(0)、(1)至(15)的信号直接予以闩锁,并以预定时序将闩锁的数据作为DIN0至DIN15输出至数据比较电路34-(0)至34-(15)。将这些数据称为期望值数据。来自WP位选择电路33的验证控制信号也输入到各数据比较电路34-(0)至34-(15)。Expected value holding circuits 32-(0) to 32-(15) directly latch the input I/O-(0), (1) to (15) signals, and use the latched data as DIN0 at a predetermined timing to DIN15 to output to data comparison circuits 34-(0) to 34-(15). These data are referred to as expected value data. The verification control signal from the WP
数据比较电路34-(0)至34-(15)是将从WP-CAM单元读出的数据(亦即,编程后的数据)与从期望值保持电路32-(0)至32-(15)读出的期望值进行比较。此时,在由WP位选择电路33输入低位准的验证控制信号的数据比较电路34中,不进行比较操作而输出高位准的匹配信号,藉此使验证虚拟通过(参照第14图(D))。在由WP位选择电路33输入高位准的验证控制信号的数据比较电路34中,将由对应的期望值保持电路32所输入的期望值数据与WP-CAM单元编程后的数据进行比较。当I/O输入以「1」设定成「待编程」,且编程后由WP-CAM单元读取的数据为以「1」设定的擦除状态时,将表示失败(Fail)的低位准信号输出到判定电路12。如第14图(D)所示,当I/O输入为「1」且编程后由WP-CAM单元读取的数据为以「0」设定的编程状态时,将表示验证通过的高位准信号输出到判定电路12。The data comparison circuit 34-(0) to 34-(15) is to compare the data (that is, the data after programming) read from the WP-CAM unit with the expected value holding circuit 32-(0) to 32-(15) The expected value of the readout is compared. At this time, in the
当由各数据比较电路34-(0)至34-(15)所输出的匹配信号都处于「H」位准时,判定电路12输出表示数据写入成功的验证信号到控制器。When the matching signals output by the data comparison circuits 34-(0) to 34-(15) are all at the "H" level, the
在此实施例中,由于对分配到未被编程的CAM单元的数据比较电路的比较结果进行虚拟通过,因此能将已编程的CAM单元的编程结果反映至验证中。In this embodiment, since the comparison result of the data comparison circuit assigned to the unprogrammed CAM cell is dummy passed, the programming result of the programmed CAM cell can be reflected in the verification.
接着参照第15图的流程图以及第16图,说明在从外面指定扇区组群地址(SGA)的情形下的操作。如第16图所示,用于执行WP-CAM的编程命令的顺序,以5个周期(cycle)进行命令辨识的程序,且在第6个周期重写信息。亦即,指定待编程的SGA,并以合计6个周期来进行一个SGA的编程。Next, referring to the flowchart of FIG. 15 and FIG. 16, the operation in the case of specifying the sector group address (SGA) from the outside will be described. As shown in FIG. 16 , the sequence for executing the programming command of WP-CAM is to carry out the program of command recognition in 5 cycles (cycle), and rewrite the information in the 6th cycle. That is, an SGA to be programmed is specified, and one SGA is programmed in a total of six cycles.
首先,输入已指定待编程的WP-CAM单元的WP-CAM地址指定信号。用译码器分析该WP-CAM地址指定信号(步骤S20),藉此产生对应至实际待编程的WP-CAM单元的地址。在验证电路13中,也用译码器51译码WP-CAM地址指定信号。然后,将高位准的验证控制信号输出到对应待编程的WP-CAM单元的期望值保持电路32以及数据比较电路34。将低位准的验证控制信号输出到其它的期望值保持电路32以及数据比较电路34。First, a WP-CAM address designation signal designating a WP-CAM cell to be programmed is input. Analyze the WP-CAM address specifying signal with a decoder (step S20 ), thereby generating an address corresponding to the actual WP-CAM unit to be programmed. In the
接着,预读已存储于译码结果所指定的WP-CAM单元内的数据(步骤S21)。判定已预读的数据以判定WP-CAM单元的数据写入状态。Next, read ahead the data stored in the WP-CAM unit specified by the decoding result (step S21). Determine the pre-read data to determine the data writing status of the WP-CAM unit.
当判定WP-CAM单元是处于擦除状态时(步骤S22为是(YES)),则写入数据于该单元且设为编程状态(步骤S23)。当判定WP-CAM单元是处于编程状态时(步骤S22为否(NO)),则视为编程完毕而结束处理。When it is determined that the WP-CAM cell is in the erasing state (YES in step S22), write data into the cell and set it in the programming state (step S23). When it is judged that the WP-CAM unit is in the programming state (step S22 is negative (NO)), it is considered that the programming is completed and the process ends.
当WP-CAM单元的编程完成时,用验证电路13进行判定数据是否已正确地写入于WP-CAM单元的验证。When the programming of the WP-CAM cell is completed, the
用导线分别连接WP位选择电路33与对应I/O而设定的数据比较电路34-(0)至34-(15),且由WP位选择电路33输出验证控制信号。当处于地址模式时,通过接口模式设定信号将开关35-(0)至35-(15)予以导通。因此,将验证控制信号仅输入到与输出有「H」位准的验证控制信号的导线相连接的期望值保持电路32。输入有「H」位准的验证控制信号的期望值保持电路32产生表示该WP-CAM单元已被编程时的期望值「0」,并输出至数据比较电路34(步骤S24)(参照第16图)。输入有「L」位准的验证控制信号的期望值保持电路32不产生期望值(步骤S24)。因此,不输出期望值到数据比较电路34。The WP
输入有来自期望值保持电路32的期望值「0」的数据比较电路34将存储于该WP-CAM单元的数据予以读出,且将该数据DAVi与期望值「0」(第16图中以/DINi表示)进行比较。其它的数据比较电路34,由于验证控制信号为低位准,故强制输出「H」位准的匹配信号。亦即,使验证虚拟通过(参照第16图)。The
当由各数据比较电路34所输出的匹配信号都处于「H」位准时,判定电路12输出数据写入成功的验证信号到控制器(步骤S25)。亦即,可输出实际被编程的WP-CAM单元的数据比较结果作为验证结果。When the matching signals output by each
第17图是显示第11图所示的期望值保持电路32以及数据比较电路34以及判定电路12的详细构成。如所述,通过来自WP位选择电路33的验证控制信号来控制数据比较电路34的输出,且输出到判定电路12。此外,通过用以重写CAM单元的模式信号的CAM模式信号来进行数据比较电路34的控制。此外,通过接口模式设定信号来进行期望值保持电路32的控制。FIG. 17 shows detailed configurations of the expected
第三实施例third embodiment
接着,参照第18图,说明本发明的第三实施例。写入至CAM单元阵列4的CAM数据是在电源投入时或硬件重置时通过开关61设为导通而被读取,并转送到第18图所示的SRAM等的易失性存储体11。由于在CAM数据的读取时是从该易失性存储体11读出,故不会延迟一般单元阵列3的读取存取的速度。在此实施例中,当朝CAM进行编程时,将存储于该易失性存储体11的数据作为期望值数据来使用,且通过数据比较电路34与从CAM单元所读出的数据进行比较。Next, a third embodiment of the present invention will be described with reference to FIG. 18 . The CAM data written into the
除了对CAM单元阵列4已编程的数据进行验证的时候以外,通过CAM模式信号来切换开关62藉此将期望值保持电路32与数据比较电路34予以连接。藉此,在验证一般单元阵列3时可进行使用有期望值保持电路32的验证。Except when verifying the programmed data of the
第19图是显示WP位选择电路33的构成。在此实施例中,当不设置第二实施例的AND栅53而通过接口模式设定信号设定成I/O模式时,将I/O输入的信号I/O(0)至(15)直接作为验证控制信号来输出。处于地址模式时,通过接口模式设定信号将开关54-(0)至54-(15)予以关断,并输出来自译码器51的译码信号。当设定为地址模式时,将WP-CAM地址指定信号输入到译码器51并分析该信号,而判定编程所指定的WP-CAM单元。然后,将用以表示该WP-CAM单元已被指定成编程的高位准的验证控制信号输出到易失性存储体11。与未指定成编程的其它的WP-CAM单元所对应的验证控制信号会以低位准来输出。FIG. 19 shows the configuration of the WP
在易失性存储体11中,有两个用以保持由CAM单元读出的数据的存储区域。第一存储区域为将通过验证证明其数据确实储存于CAM单元的数据予以存储的区域。亦即,保持有与CAM单元编程(包含验证)后的CAM单元阵列中的非易失性存储体信息相同性质的信息。因此,在一般单元阵列3的正常操作时,当操作上所需的电路要求CAM单元的数据时,输出该第一存储区域的数据。此外,第二存储区域是作为暂时存储区域来使用,且为预先存储于编程时等已预读的CAM单元的数据的区域。In the
当从WP位选择电路33输入验证控制信号时,易失性存储体11会如第18图所示输出「0」作为根据该验证控制信号所指定的WP-CAM单元的期望值,以取代预读时所读取的数据。此外,在预读时直接输出(初始通过)存储于第二存储区域的数据以作为对应其它低位准的验证控制信号的WP-CAM单元的数据。When the verification control signal is input from the WP
参照第20图的流程图以及第21图,说明设定成本实施例的I/O模式且为CAM单元阵列4的编程时的操作顺序。首先,由各个I/O输入已设定待编程的WP-CAM单元的CAM编程设定信号(I/O-0至I/O-15)(步骤S30)。将用以指示编程实行的信息「1」输入到对应待编程的WP-CAM单元的I/O,且将信息「0」输入到其它的I/O。Referring to the flowchart of FIG. 20 and FIG. 21, the operation sequence when setting the I/O mode of this embodiment and programming the
然后,由WP-CAM单元预读数据,且判定各WP-CAM单元的数据写入状态(步骤S31)。当为已写入数据且已被编程的状态时,则存储信息「0」,当为未写入数据的擦除状态时,则存储信息「1」。Then, the data is pre-read by the WP-CAM unit, and the data writing status of each WP-CAM unit is judged (step S31). When it is in a state where data has been written and programmed, information “0” is stored, and when it is an erased state where no data has been written, information “1” is stored.
接着,通过I/O输入信号设定成写入,并将现在的状态为处于擦除状态的WP-CAM单元予以检测出(步骤S32)。将已预读的WP-CAM单元的数据为「1」的擦除状态,且I/O输入为「1」的WP-CAM单元予以检测出。此外,当被指定成写入的WP-CAM单元已经结束编程时,结束该处理,且输出错误信号。此外,目前为止所描述的处理是以控制器8来进行。Next, write is set by the I/O input signal, and the current state of the WP-CAM cell in the erased state is detected (step S32). The WP-CAM cells whose data of the pre-read WP-CAM cells are "1" in the erased state and whose I/O input is "1" are detected. Also, when the WP-CAM cell designated to be written has finished programming, this process is ended, and an error signal is output. In addition, the processing described so far is performed by the
接着,对检测出的WP-CAM单元进行编程(步骤S33)。在进行编程时,在验证电路13进行判定是否已将数据确实写入于WP-CAM单元的验证。此时,通过接口模式设定信号将设置在各I/O的开关54-(0)至54-(15)设定成导通。此外,译码器51会根据经由反相器52所输入的接口模式设定信号而停止操作。Next, the detected WP-CAM cells are programmed (step S33). When programming is performed, verification is performed in the
WP位选择电路33直接将输入的I/O-(0)至I/O-(15)的信号作为验证控制信号输出到易失性存储体11。亦即,由于在指定成编程的WP-CAM单元予以I/O输入为「1」,故输出高位准的信号作为验证控制信号。对应至其它WP-CAM单元的验证控制信号则变为低位准。The WP
易失性存储体11输出期望值「0」以作为用高位准的验证信号指定的WP-CAM单元的数据到数据比较电路34(参照第21图)。输出存储于第二存储区域预读时的数据作为其它WP-CAM单元的期望值数据(参照第21图)。The
各数据比较电路34-(0)至34-(15)将编程后由各WP-CAM单元读取的数据与由易失性存储体11读取的期望值进行比较(步骤S34)。由于由未编程的WP-CAM单元读取的数据必定与期望值相同,故已进行编程的WP-CAM单元的数据与期望值一致的检测结果会直接成为验证的判定结果。当由WP-CAM单元读取的数据与期望值不一致时(步骤S35为否),操作返回到编程步骤(步骤S33)。当由WP-CAM单元读取的数据与期望值一致时(步骤S35为是),由数据比较电路34输出表示一致的匹配信号到判定电路12。当所有数据比较电路34的匹配信号都表示匹配,则输出表示验证通过的信号到控制器8(步骤S36)。当验证成功时,从WP-CAM单元或感测放大器读取数据,且将数据存储至易失性存储体11的第一存储区域以作为正式的WP-CAM单元的数据(步骤S37)。Each data comparison circuit 34-(0) to 34-(15) compares the data read from each WP-CAM cell after programming with the expected value read from the volatile memory bank 11 (step S34). Since the data read from the unprogrammed WP-CAM unit must be the same as the expected value, the detection result that the data of the programmed WP-CAM unit is consistent with the expected value will directly become the determination result of the verification. When the data read by the WP-CAM unit does not agree with the expected value (NO at step S35), the operation returns to the programming step (step S33). When the data read by the WP-CAM unit coincides with the expected value (YES in step S35 ), the
在此实施例中,由于将分配到未编程的CAM单元的数据比较电路的比较结果进行虚拟通过的控制,因此验证可反映被编程的CAM单元的编程结果。In this embodiment, since the comparison result of the data comparison circuit allocated to the unprogrammed CAM cell is controlled by dummy pass, the verification can reflect the programming result of the programmed CAM cell.
接着,参照第22图的流程图以及第23图,说明地址模式时的操作顺序。首先,输入已设定待编程的WP-CAM单元的WP-CAM地址指定信号。用译码器分析WP-CAM地址指定信号(步骤S40),藉此产生对应实际待编程的WP-CAM单元的地址。在验证电路13中,也用译码器51将WP-CAM地址指定信号予以译码。然后,将用以指定待编程的WP-CAM单元的验证控制信号输出到易失性存储体11。Next, referring to the flowchart of FIG. 22 and FIG. 23, the operation procedure in the address mode will be described. First, a WP-CAM address specifying signal of a WP-CAM cell to be programmed is input. Analyze the WP-CAM address specifying signal with a decoder (step S40), thereby generating an address corresponding to the actual WP-CAM unit to be programmed. In the
接着,通过预读读出已储存于译码结果所选择的WP-CAM单元的数据(步骤S41)。判定预读的数据,并判定该WP-CAM单元的数据写入状态。Next, the data stored in the WP-CAM cell selected by the decoding result is read out by pre-reading (step S41). The pre-read data is judged, and the data writing status of the WP-CAM unit is judged.
当判定WP-CAM单元是处于擦除状态时(步骤S42为是),写入数据至该单元,使其成为编程状态(步骤S43)。当判定WP-CAM单元是处于编程状态时(步骤S42为否),则视为编程完毕而结束处理。When it is determined that the WP-CAM cell is in the erased state (Yes in step S42), write data into the cell to make it into the programmed state (step S43). When it is determined that the WP-CAM unit is in the programming state (step S42: No), it is considered that the programming is completed and the process ends.
之后,和第20图所示的流程图相同,对检测出的WP-CAM单元进行编程与验证。在验证时,易失性存储体11将期望值「0」作为以高位准的验证控制信号所指定的WP-CAM单元的数据输出到数据比较电路34(参照第23图)。将存储于第二存储区域的预读时的数据直接输出作为其它WP-CAM单元的期望值数据(参照第23图)。各数据比较电路34-(0)至34-(15)将由各WP-CAM单元于编程后读取的数据与由易失性存储体11读取的期望值进行比较。当由WP-CAM单元于编程后读取的数据与期望值一致时,将表示验证通过的信号输出到控制器8。当验证成功时,从WP-CAM单元或感测放大器读取数据并存储至易失性存储体11的第一存储区域以作为正式的WP-CAM单元的数据。Thereafter, the detected WP-CAM cells are programmed and verified in the same manner as the flow chart shown in FIG. 20 . At the time of verification, the
第24图是显示详细的构成。第24图所示的半导体装置是通过CAM模式信号来切换数据比较电路34的输入。亦即,在CAM模式时,将易失性存储体11的输出输入到数据比较电路34,而在一般操作时,将期望值保持电路32的输出输入到数据比较电路34。Fig. 24 shows the detailed structure. In the semiconductor device shown in FIG. 24, the input of the
所述实施例均为本发明的较佳实施例。不过,本发明并未限定于该等实施例,在不脱离本发明精神的范畴内可进行各种变形。The described embodiments are preferred embodiments of the present invention. However, the present invention is not limited to these examples, and various modifications can be made without departing from the spirit of the present invention.
例如,易失性存储体11可仅以一个存储区域(第一存储区域)来形成。于CAM单元阵列4写入的CAM数据在供给电源或硬件重置时,通过将开关61予以导通而被读取,并转送至易失性存储体11(第一存储区域)。在预读时,通过读出易失性存储体11的信息,检测出WP-CAM单元的数据为「1」的擦除状态且I/O输入为「1」的WP-CAM单元。然后,对检测出的WP-CAM单元进行编程。在进行编程时,验证电路13会进行验证以判定是否已将数据确实写入至WP-CAM单元。WP位选择电路33会输出高位准的信号至易失性存储体11以作为对由编程所指定的WP-CAM单元的验证控制信号,且输出低位准信号以作为对应其它WP-CAM单元的验证控制信号。不管在第一存储区域的读出部份(未图标)中储存作为高位准验证控制信号所指定的]WP-CAM单元数据的信息为何,易失性存储体11输出期望值「0」到数据比较电路34。更简单言之,将使用验证控制信号的箝位电路(clamp circuit)连接至第一存储区域的读出部份,以便将该等输出箝制为「0」。输出储存于第一存储区域的信息作为其它WP-CAM单元的期望值数据而不使该箝位电路操作。各数据比较电路将由各WP-CAM单元于编程后读取的数据与由易失性存储体11读取的期望值进行比较。当验证结果一致时,将开关61予以导通而从WP-CAM单元或感测放大器读取数据,并存储至易失性存储体11的第一存储区域以作为正式的WP-CAM单元的数据。For example, the
并且,易失性存储体11的组件构成可为所谓的静态存储体单元,或可为适用于周边电路的逻辑组件所构成的闩锁电路。In addition, the component configuration of the
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| CN (1) | CN101111900B (en) |
| DE (1) | DE112005003436B4 (en) |
| GB (1) | GB2436272B (en) |
| TW (2) | TWI407440B (en) |
| WO (1) | WO2006080063A1 (en) |
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| CN101937712A (en) * | 2009-06-30 | 2011-01-05 | 海力士半导体有限公司 | Nonvolatile memory device and operation method thereof |
| CN108231121A (en) * | 2016-12-13 | 2018-06-29 | 华邦电子股份有限公司 | Semiconductor storage and its method for setting operations |
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| KR102496678B1 (en) * | 2016-02-19 | 2023-02-07 | 에스케이하이닉스 주식회사 | Semiconductor memory device and operating method thereof |
| TWI708253B (en) * | 2018-11-16 | 2020-10-21 | 力旺電子股份有限公司 | Nonvolatile memory yield improvement and testing method |
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| DE112022001987T5 (en) * | 2021-06-25 | 2024-01-18 | Rohm Co., Ltd. | STORAGE DEVICE |
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- 2005-01-27 DE DE112005003436.4T patent/DE112005003436B4/en not_active Expired - Lifetime
- 2005-01-27 JP JP2007500376A patent/JP4944763B2/en not_active Expired - Lifetime
- 2005-01-27 GB GB0714115A patent/GB2436272B/en not_active Expired - Fee Related
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2006
- 2006-01-27 TW TW095103428A patent/TWI407440B/en active
- 2006-01-27 TW TW102127390A patent/TWI529717B/en active
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2008
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101937712A (en) * | 2009-06-30 | 2011-01-05 | 海力士半导体有限公司 | Nonvolatile memory device and operation method thereof |
| US8599594B2 (en) | 2009-06-30 | 2013-12-03 | Hynix Semiconductor Inc. | Nonvolatile memory device and operation method thereof |
| CN101937712B (en) * | 2009-06-30 | 2014-09-17 | 海力士半导体有限公司 | Nonvolatile memory device and operation method thereof |
| CN108231121A (en) * | 2016-12-13 | 2018-06-29 | 华邦电子股份有限公司 | Semiconductor storage and its method for setting operations |
| CN108231121B (en) * | 2016-12-13 | 2021-04-27 | 华邦电子股份有限公司 | Semiconductor memory device and operation setting method thereof |
Also Published As
| Publication number | Publication date |
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| WO2006080063A1 (en) | 2006-08-03 |
| US8023341B2 (en) | 2011-09-20 |
| TW200632912A (en) | 2006-09-16 |
| JPWO2006080063A1 (en) | 2008-06-19 |
| US20110026287A1 (en) | 2011-02-03 |
| TW201346912A (en) | 2013-11-16 |
| US20060209583A1 (en) | 2006-09-21 |
| US20080316787A1 (en) | 2008-12-25 |
| JP4944763B2 (en) | 2012-06-06 |
| GB0714115D0 (en) | 2007-08-29 |
| GB2436272B (en) | 2011-01-19 |
| CN101111900B (en) | 2011-02-16 |
| US7813154B2 (en) | 2010-10-12 |
| TWI407440B (en) | 2013-09-01 |
| DE112005003436B4 (en) | 2017-05-18 |
| US7433219B2 (en) | 2008-10-07 |
| DE112005003436T5 (en) | 2007-12-13 |
| GB2436272A (en) | 2007-09-19 |
| TWI529717B (en) | 2016-04-11 |
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