CN109801819B - A composite nano-cold cathode structure with high stable electron emission and preparation method - Google Patents
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Abstract
本发明公开了一种高稳定电子发射的复合纳米冷阴极结构及制备方法。该复合纳米冷阴极结构包括衬底;直立制备在衬底上的低维纳米冷阴极;覆盖在低维纳米冷阴极尖端上的二维薄膜材料;用于调控二维薄膜材料尖端几何曲率的支撑结构。该结构的优点是利用了二维薄膜材料的表面无悬挂键结构,来获得干净的发射表面。另外,通过调控二维薄膜材料尖端的几何曲率,能够控制发射电子的输运过程,使其成为能量较高的热电子,从而有更低的开启电场。更干净的表面以及表面势垒的降低使得该复合低维纳米冷阴极能够实现高稳定的电子发射。
The invention discloses a composite nano-cold cathode structure with high stable electron emission and a preparation method. The composite nano-cold cathode structure includes a substrate; a low-dimensional nano-cold cathode prepared upright on the substrate; a two-dimensional thin film material covered on the tip of the low-dimensional nano cold cathode; a support for regulating the geometric curvature of the tip of the two-dimensional thin film material structure. The advantage of this structure is that the surface of the two-dimensional thin film material has no dangling bond structure to obtain a clean emission surface. In addition, by adjusting the geometric curvature of the tip of the two-dimensional thin film material, the transport process of the emitted electrons can be controlled, making them become hot electrons with higher energy, thus having a lower turn-on electric field. The cleaner surface and reduced surface potential barrier enable the composite low-dimensional nanocold cathode to achieve highly stable electron emission.
Description
技术领域technical field
本发明涉及真空微电子技术领域。尤其涉及一种高稳定电子发射的复合纳米冷阴极结构,更涉及一种高稳定电子发射的复合纳米冷阴极制备方法。The invention relates to the technical field of vacuum microelectronics. In particular, the invention relates to a composite nano-cold cathode structure with high stability of electron emission, and more particularly to a preparation method of a composite nano-cold cathode with high stability of electron emission.
背景技术Background technique
冷阴极电子源具有亮度高,相干性好,便于集成等优点,因此在高精度电子显微镜,平板X射线源,平板显示,平行电子束刻蚀等方面有重要应用。然而,冷阴极固有的发射电流不稳定性限制了其发展。Cold cathode electron sources have the advantages of high brightness, good coherence, and easy integration, so they have important applications in high-precision electron microscopes, flat-panel X-ray sources, flat-panel displays, and parallel electron beam etching. However, the inherent emission current instability of cold cathodes limits its development.
一般来说,冷阴极的不稳定性主要与两个方面有关。一个是表面吸附脱附过程,该过程主要与表面悬挂键及表面电荷有关。目前,主要通过高温加热冷阴极的方法来尽可能地去除吸附分子(如Field emission microscopy of carbon nanotube caps)。然而,高温加热的方法对电子源结构中所用材料的熔点有较大限制,而且当温度下降到正常工作温度时,残留气体依然会吸附到冷阴极上。Generally speaking, the instability of cold cathode is mainly related to two aspects. One is the surface adsorption and desorption process, which is mainly related to surface dangling bonds and surface charges. At present, the adsorption molecules are mainly removed as much as possible by heating the cold cathode at high temperature (such as Field emission microscopy of carbon nanotube caps). However, the high-temperature heating method has a great limitation on the melting point of the materials used in the electron source structure, and when the temperature drops to the normal operating temperature, the residual gas will still be adsorbed on the cold cathode.
另外一个因素是表面结构在强电场下会形成原子级突起,从而引起局部电场的变化。根据场发射理论,冷阴极的表面势垒越高,其发射电流对电场变化越敏感,因此,电场扰动会引起更大的电流波动性。Another factor is the formation of atomic-scale protrusions on the surface structure under strong electric fields, which induce changes in the local electric field. According to the field emission theory, the higher the surface barrier of a cold cathode, the more sensitive its emission current is to changes in the electric field, therefore, the electric field disturbance will cause greater current fluctuation.
发明内容SUMMARY OF THE INVENTION
本发明为克服上述现有技术所述的至少一种缺陷,提供一种高稳定电子发射的复合纳米冷阴极结构。The present invention provides a composite nano-cold cathode structure with highly stable electron emission in order to overcome at least one of the above-mentioned defects in the prior art.
为解决上述技术问题,本发明采用的技术方案是:In order to solve the above-mentioned technical problems, the technical scheme adopted in the present invention is:
本发明的复合纳米冷阴极结构包括衬底,制备在衬底上的低维纳米冷阴极,覆盖在低维纳米冷阴极尖端上的二维薄膜材料,以及用于调节二维薄膜材料尖端几何曲率的支撑结构,二维薄膜材料尖端的几何曲率要小于低维纳米结构尖端的几何曲率。The composite nano-cold cathode structure of the present invention includes a substrate, a low-dimensional nano-cold cathode prepared on the substrate, a two-dimensional thin film material covered on the tip of the low-dimensional nano cold cathode, and a tip for adjusting the geometric curvature of the two-dimensional thin film material The geometric curvature of the tip of the two-dimensional thin film material is smaller than that of the tip of the low-dimensional nanostructure.
衬底可以是硅片或玻璃等平面结构,也可以是钨针等尖锥型结构。支撑结构可以是低维纳米冷阴极阵列,也可以是集成的绝缘层或分离的陶瓷等孔状结构。The substrate can be a planar structure such as a silicon wafer or glass, or a tapered structure such as a tungsten needle. The support structure can be a low-dimensional nanocold cathode array, or a porous structure such as an integrated insulating layer or a separated ceramic.
根据几何学,当二维薄膜材料尖端的几何曲率小于低维纳米结构尖端的几何曲率时,其尖端能够紧密接触,否则在尖端会形成悬空结构,不利于热电子的产生和电子的稳定发射。According to geometry, when the geometric curvature of the tip of the two-dimensional thin film material is smaller than that of the low-dimensional nanostructure tip, the tip can be in close contact, otherwise a dangling structure will be formed at the tip, which is not conducive to the generation of hot electrons and the stable emission of electrons.
优选地,衬底为平面型衬底或尖锥型衬底。衬底可为玻璃、陶瓷、硅等平面型衬底,或钨针尖、镍针尖、金针尖等尖锥型衬底。其中,平面型衬底适用于冷阴极电子源阵列的制作,而尖锥型衬底适用于冷阴极点电子源器件的制作。Preferably, the substrate is a planar substrate or a tapered substrate. The substrate can be a flat substrate such as glass, ceramics, silicon, etc., or a tapered substrate such as a tungsten needle tip, a nickel needle tip, or a gold needle tip. Among them, the planar substrate is suitable for the manufacture of cold cathode electron source arrays, and the tapered substrate is suitable for the manufacture of cold cathode point electron source devices.
优选地,支撑结构可以是低维纳米冷阴极阵列本身,更进一步地,也可以是额外制备的集成或分离的孔状结构。其中,采用低维纳米冷阴极阵列本身和集成孔状结构来构成的支撑结构适用于电子源阵列的制作,而采用分离的孔状结构作为支撑结构则适用于点电子源器件的制作。采用低维纳米冷阴极阵列本身的支撑结构具有结构简单,容易制作等优点,但其对低维纳米冷阴极的长径比有一定要求,如果长径比太大,二维薄膜材料容易压倒低维纳米冷阴极,而集成孔状结构则可以减少低维纳米冷阴极所承受的来自二维薄膜材料自身的重力以及其转移过程中的压力。Preferably, the support structure can be the low-dimensional nano-cold cathode array itself, and further, it can also be an additionally prepared integrated or separated pore-like structure. Among them, the support structure composed of the low-dimensional nano-cold cathode array itself and the integrated hole-like structure is suitable for the fabrication of electron source arrays, while the use of the separated hole-like structure as the support structure is suitable for the fabrication of point electron source devices. The support structure of the low-dimensional nano-cold cathode array itself has the advantages of simple structure and easy fabrication, but it has certain requirements on the aspect ratio of the low-dimensional nano-cold cathode. If the aspect ratio is too large, the two-dimensional thin film material is easily overwhelmed. 3D nano-cold cathode, and the integrated pore-like structure can reduce the gravity of the low-dimensional nano-cold cathode from the 2D thin film material itself and the pressure during its transfer process.
优选地,集成孔状结构可由二氧化硅、氮化硅或氧化铝等绝缘薄膜,或铬、钨、铜等金属薄膜来构成。Preferably, the integrated hole-like structure can be composed of insulating films such as silicon dioxide, silicon nitride or aluminum oxide, or metal films such as chromium, tungsten, and copper.
优选地,分离孔状结构可由陶瓷或铜、铝,铁等金属来构成。由于电子主要是通过低维纳米冷阴极注入到二维薄膜材料的,所以支撑结构可以是导体也可以是绝缘体。Preferably, the separated porous structure can be composed of ceramics or metals such as copper, aluminum, iron and the like. Since electrons are mainly injected into 2D thin film materials through low-dimensional nanocold cathodes, the supporting structures can be either conductors or insulators.
本发明还提供一种高稳定电子发射的复合纳米结构的制备方法,包括清洗衬底,制作等高或接近等高的低维纳米冷阴极和支撑结构,再把二维薄膜材料转移到低维纳米冷阴极和支撑结构上。The invention also provides a method for preparing a composite nanostructure with highly stable electron emission, which includes cleaning the substrate, fabricating a low-dimensional nano-cold cathode and a supporting structure of equal or near equal height, and then transferring the two-dimensional thin film material to a low-dimensional low-dimensional cold cathode. Nano-cold cathodes and support structures.
优选地,低维纳米冷阴极可为纳米线、纳米棒、纳米锥等准一维纳米结构,直立石墨烯、纳米墙等二维纳米结构和spindt冷阴极等,而其材料可为氧化锌、氧化钨、氧化铜、硅、碳、钼、镍、钨等。Preferably, the low-dimensional nano-cold cathodes can be quasi-one-dimensional nanostructures such as nanowires, nanorods, nanocones, two-dimensional nanostructures such as vertical graphene and nanowalls, and spindt cold cathodes, and the materials thereof can be zinc oxide, Tungsten oxide, copper oxide, silicon, carbon, molybdenum, nickel, tungsten, etc.
优选地,二维薄膜材料可以由石墨烯,二硫化钼、二硒化钼、二硫化钨、二硒化钨及其它过渡金属硫化物,六方氮化硼等一种或多种材料组成。Preferably, the two-dimensional thin film material may be composed of one or more materials such as graphene, molybdenum disulfide, molybdenum diselenide, tungsten disulfide, tungsten diselenide and other transition metal sulfides, hexagonal boron nitride and the like.
本发明提高电子发射稳定性的原理是利用二维薄膜材料的干净表面,二维薄膜材料没有表面悬挂键,减少了表面的吸附脱附过程,并且其电子输运过程所产生的热电子能降低表面势垒,从而提高电子发射的稳定性。The principle of improving the electron emission stability of the present invention is to use the clean surface of the two-dimensional thin film material. The two-dimensional thin film material has no surface dangling bonds, which reduces the adsorption and desorption process of the surface, and the thermal electron energy generated by the electron transport process is reduced. surface barrier, thereby improving the stability of electron emission.
与现有技术相比,本发明的有益效果是:Compared with the prior art, the beneficial effects of the present invention are:
(1)本发明应用范围广,采用低维纳米冷阴极阵列本身和集成孔状结构来构成的支撑结构适用于电子源阵列的制作,而采用分离的孔状结构作为支撑结构则适用于点电子源器件的制作。该电子发射的复合纳米冷阴极结构适用于在真空点电子源和平板电子源阵列上的应用。(1) The present invention has a wide range of applications. The support structure formed by the low-dimensional nano-cold cathode array itself and the integrated hole-like structure is suitable for the production of electron source arrays, while the use of the separated hole-like structure as the support structure is suitable for point electrons. Fabrication of source devices. The electron-emitting composite nano-cold cathode structure is suitable for application in vacuum point electron sources and flat plate electron source arrays.
(2)本发明的复合纳米冷阴极结构具有结构简单,可操作性高的优点。(2) The composite nano-cold cathode structure of the present invention has the advantages of simple structure and high operability.
(3)本发明利用了二维薄膜材料的表面无悬挂键结构,来获得干净的发射表面。另外,通过调控二维薄膜材料尖端的几何曲率,能够控制发射电子的输运过程,使其成为能量较高的热电子,从而有更低的开启电场。更干净的表面以及表面势垒的降低使得该复合低维纳米冷阴极能够实现高稳定的电子发射。(3) The present invention utilizes the surface-free dangling bond structure of the two-dimensional thin film material to obtain a clean emission surface. In addition, by regulating the geometric curvature of the tip of the two-dimensional thin film material, the transport process of the emitted electrons can be controlled, making them become hot electrons with higher energy, thus having a lower turn-on electric field. The cleaner surface and reduced surface potential barrier enable the composite low-dimensional nanocold cathode to achieve highly stable electron emission.
附图说明Description of drawings
图1是在不同衬底的基础上复合低维纳米冷阴极的结构示意图;Figure 1 is a schematic structural diagram of a composite low-dimensional nano-cold cathode on the basis of different substrates;
图2是实施例1中图1中的(a)所示的复合纳米冷阴极结构的制作流程示意图;2 is a schematic diagram of the fabrication process of the composite nano-cold cathode structure shown in (a) in FIG. 1 in Example 1;
图3是实施例1中图1中的(b)所示的复合纳米冷阴极结构的制作流程示意图;3 is a schematic diagram of the fabrication process of the composite nano-cold cathode structure shown in (b) in FIG. 1 in Example 1;
图4是实施例1中图1中的(c)所示的复合纳米冷阴极结构的制作流程示意图;4 is a schematic diagram of the fabrication process of the composite nano-cold cathode structure shown in (c) in FIG. 1 in Example 1;
图5是二维薄膜材料尖端曲率大于/小于低维纳米结构尖端曲率的复合低维纳米冷阴极的结构示意图;Figure 5 is a schematic structural diagram of a composite low-dimensional nano-cold cathode with a tip curvature of two-dimensional thin film material greater than/less than that of a low-dimensional nanostructure tip;
图6是不同厚度的单层二硒化钨薄膜在2.5V/nm的外加电场下的表面能带弯曲的模拟结果;Fig. 6 is the simulation result of the surface energy band bending of single-layer tungsten diselenide thin films with different thicknesses under the applied electric field of 2.5V/nm;
图7是实际制作的复合纳米冷阴极结构的扫描电子显微镜照片和稳定性测试结果。FIG. 7 is a scanning electron microscope photograph and a stability test result of the actually fabricated composite nano-cold cathode structure.
附图标记说明Description of reference numerals
衬底1;低维纳米冷阴极2;二维薄膜材料3;支撑结构4。Substrate 1; low-dimensional nano-
具体实施方式Detailed ways
下面结合具体实施方式对本发明作进一步的说明。The present invention will be further described below in conjunction with specific embodiments.
本发明实施例的附图中相同或相似的标号对应相同或相似的部件;在本发明的描述中,需要理解的是,若有术语“上”、“下”、“左”、“右”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此附图中描述位置关系的用语仅用于示例性说明,不能理解为对本专利的限制。The same or similar numbers in the drawings of the embodiments of the present invention correspond to the same or similar components; in the description of the present invention, it should be understood that if there are terms “upper”, “lower”, “left” and “right” , "top", "bottom", "inside", "outside" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or It is implied that the referred device or element must have a specific orientation, be constructed and operate in a specific orientation, so the terms describing the positional relationship in the drawings are for illustrative purposes only and should not be construed as limitations on this patent.
此外,若有“第一”、“第二”等术语仅用于描述目的,主要是用于区分不同的装置、元件或组成部分(具体的种类和构造可能相同也可能不同),并非用于表明或暗示所指示装置、元件或组成部分的相对重要性和数量,而不能理解为指示或者暗示相对重要性。In addition, if there are terms such as "first" and "second", they are only used for descriptive purposes, and are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used for Indicate or imply the relative importance and quantity of the indicated means, elements or components, but should not be construed as indicating or implying relative importance.
实施例1Example 1
如图1所示,给出了在不同衬底的基础上,以纳米线作为低维冷阴极材料的三种复合低维纳米冷阴极的结构示意图。As shown in Figure 1, the structural schematic diagrams of three kinds of composite low-dimensional nano-cold cathodes based on different substrates and using nanowires as low-dimensional cold cathode materials are given.
该冷阴极的基本结构包括衬底1、低维纳米冷阴极2、二维薄膜材料3及支撑结构4。The basic structure of the cold cathode includes a substrate 1 , a low-dimensional nano-
图1中的(a)中衬底1为平面结构,支撑结构为低维纳米冷阴极阵列本身;图1中的(b)中衬底1为平面结构,支撑结构为集成的绝缘层小孔;图1中的(c)中衬底1为尖锥型结构,支撑结构为分离的陶瓷网/铜网。In (a) of FIG. 1, the substrate 1 is a planar structure, and the supporting structure is the low-dimensional nano-cold cathode array itself; in (b) of FIG. 1, the substrate 1 is a planar structure, and the supporting structure is an integrated insulating layer pinhole ; In (c) of FIG. 1 , the substrate 1 is a tapered structure, and the supporting structure is a separate ceramic mesh/copper mesh.
实施例2Example 2
基于图1的复合纳米冷阴极结构的制作流程示意图。Schematic diagram of the fabrication process of the composite nano-cold cathode structure based on FIG. 1 .
如图2所示,图2给出了图1中的(a)中的复合纳米冷阴极结构的制作流程图。首先准备一平面衬底1(图2中的(a));然后在其上制备直立等高的低维纳米冷阴极2,多个低维纳米冷阴极2构成低维纳米冷阴极阵列(图2中的(b));最后把二维薄膜材料3转移到低维纳米冷阴极2上(图2中的(c))。等高的低维纳米冷阴极保证了二维薄膜材料尖端的几何曲率小于纳米线尖端的几何曲率。As shown in FIG. 2 , FIG. 2 shows a flow chart of the fabrication of the composite nano-cold cathode structure in (a) of FIG. 1 . First prepare a planar substrate 1 ((a) in FIG. 2 ); then prepare low-dimensional nano-
如图3所示,图3给出了图1中的(b)中的复合纳米冷阴极结构的制作流程图。首先准备一平面衬底1(图3中的(a));然后在其上沉积一层绝缘层薄膜4(图3中的(b));接着在绝缘层薄膜4中刻蚀出一小孔(图3中的(c));再在小孔中制备与绝缘层薄膜等高的低维纳米冷阴极2(图3中的(d));最后把二维薄膜材料3转移到小孔中,并搭在纳米线上(图3中的(e))。纳米线与绝缘层薄膜之间保持相同高度保证了二维薄膜材料尖端的几何曲率小于纳米线尖端的几何曲率。As shown in FIG. 3 , FIG. 3 shows a flow chart of the fabrication of the composite nano-cold cathode structure in (b) of FIG. 1 . First prepare a flat substrate 1 ((a) in FIG. 3 ); then deposit an insulating layer film 4 thereon ((b) in FIG. 3 ); hole ((c) in Figure 3); then prepare a low-dimensional nano-
如图4所示,图4给出了图1中的(c)中的复合纳米冷阴极结构的制作流程图。首先准备一尖锥型衬底1(图4中的(a));然后在其上制备低维纳米冷阴极2(图4中的(b));接着准备一带有小孔的陶瓷网/铜网4(图4中的(c));再把二维薄膜材料3转移到小孔中(图4中的(d));最后把陶瓷网/铜网4置于低维纳米冷阴极2的上方,并移动至两者接触(图4中的(e))。移动中需确保二维薄膜材料尖端的几何曲率小于纳米线尖端的几何曲率。As shown in FIG. 4 , FIG. 4 shows a flow chart of the fabrication of the composite nano-cold cathode structure in (c) of FIG. 1 . First prepare a cone-shaped substrate 1 ((a) in FIG. 4 ); then prepare low-dimensional nano-
本发明中基于其它低维纳米冷阴极的复合纳米冷阴极结构的制作可按照以上例子的基本步骤进行。需要特别指出的是,图1中的(a)、图1中的(b)和图1中的(c)中的复合纳米冷阴极结构并不仅仅局限于图中所示的单个发射体,还可以应用到大面积的发射体阵列结构中。The fabrication of the composite nano-cold cathode structure based on other low-dimensional nano-cold cathodes in the present invention can be performed according to the basic steps of the above examples. It should be specially pointed out that the composite nano-cold cathode structures in Figure 1(a), Figure 1(b) and Figure 1(c) are not limited to the single emitter shown in the figure, It can also be applied to large area emitter array structures.
实施例3Example 3
图5是二维薄膜材料尖端曲率大于/小于低维纳米结构尖端曲率的复合低维纳米冷阴极表面能带弯曲的模拟结果。Figure 5 is the simulation result of the surface band bending of the composite low-dimensional nanocold cathode with the tip curvature of the two-dimensional thin film material greater than/less than the tip curvature of the low-dimensional nanostructure.
如图5所示,分别列举了二维薄膜材料尖端的几何曲率大于和小于纳米线尖端几何曲率的结构示意图。根据几何学,图5中的(b)中的二维薄膜材料在尖端处与纳米线尖端紧密接触,而图5中的(a)中的二维薄膜材料在尖端处则形成一悬空结构。As shown in Fig. 5, the schematic diagrams of the structures in which the geometrical curvature of the tip of the two-dimensional thin film material is larger than or smaller than the geometrical curvature of the tip of the nanowire are listed respectively. According to the geometry, the 2D thin film material in Fig. 5(b) is in close contact with the nanowire tip at the tip, while the 2D thin film material in Fig. 5(a) forms a dangling structure at the tip.
图6是不同厚度的单层二硒化钨薄膜在2.5V/nm的外加电场下的表面能带弯曲的模拟结果;以二硒化钨作为二维薄膜材料为例,数值计算了其在2.5V/nm电场下的能带弯曲情况。其中,图6中的(a)是厚度为0.7nm的单层二硒化钨薄膜的模拟结果。图6中的(b)是厚度为700nm的块体二硒化钨的模拟结果,从结果可见,对于单层薄膜而言,其表面电势能仅约为0.13eV,而对于块体形状来说,其表面电势能约为1.4eV。Figure 6 shows the simulation results of the surface energy band bending of single-layer tungsten diselenide films with different thicknesses under an applied electric field of 2.5 V/nm; Band bending under V/nm electric field. Among them, (a) in FIG. 6 is the simulation result of a single-layer tungsten diselenide thin film with a thickness of 0.7 nm. (b) in Figure 6 is the simulation result of bulk tungsten diselenide with a thickness of 700 nm. From the results, it can be seen that the surface potential energy is only about 0.13 eV for the monolayer film, while for the bulk shape , and its surface potential energy is about 1.4 eV.
结合图5和图6,在图5中的(a)的结构中,二维薄膜材料尖端是悬空的,因此,发射电子只在二维薄膜材料的c轴方向上受到渗透电场的加速作用。所以其渗透电场的能量为单层薄膜的表面电势能,如图6中的(a),即0.13eV。而在图5中的(b)的结构中,二维材料尖端与纳米线是紧密接触的,因此,发射电子能在渗透电场下通过纳米线加速注入到二维材料中。所以其渗透电场的能量可近似为块体形状的表面电势能,如图6中的(b),即1.4eV。由此可见,图5中的(b)中的结构能够获得更高能量的发射电子,从而有更低的表面势垒。5 and 6, in the structure of (a) in FIG. 5, the tip of the two-dimensional thin film material is suspended, so the emitted electrons are only accelerated by the osmotic electric field in the c-axis direction of the two-dimensional thin film material. Therefore, the energy of the penetration electric field is the surface potential energy of the monolayer film, as shown in (a) in Figure 6, that is, 0.13 eV. In the structure in (b) of Figure 5, the tip of the two-dimensional material is in close contact with the nanowire, so the emitted electrons can be injected into the two-dimensional material through the nanowire under the osmotic electric field. Therefore, the energy of its penetrating electric field can be approximated as the surface potential energy of the bulk shape, as shown in (b) in Figure 6, that is, 1.4 eV. It can be seen that the structure in (b) of Fig. 5 can obtain higher energy emitted electrons and thus have a lower surface barrier.
实施例4Example 4
本实施例给出了采用氧化锌纳米线作为准一维低维纳米冷阴极,单层二硒化钨薄膜作为二维薄膜材料的复合低维纳米冷阴极的制作过程以及电镜扫描和稳定性测试结果。This example presents the fabrication process, electron microscope scanning and stability test of a composite low-dimensional nano-cold cathode using zinc oxide nanowires as a quasi-one-dimensional low-dimensional nano-cold cathode and a single-layer tungsten diselenide film as a two-dimensional film material result.
具体的制作步骤参见附图2。首先将硅片衬底分别用丙酮、乙醇和去离子水超声清洗30分钟。用氮气吹干后,在硅片衬底上采用电子束蒸发技术制备厚度为1微米的锌薄膜。接着把硅片放入大气环境下的管式炉中进行热氧化。管式炉的温度先从室温上升至470℃,然后在470℃下保温3小时。待硅片自然冷却后,锌薄膜会生长出氧化锌低维纳米冷阴极阵列。紧接着采用有机溶胶辅助的方法把单层二硒化钨薄膜转移到低维纳米冷阴极阵列上。最后把硅片样品放到真空管式炉中快速升温至450℃,并保持2小时来去除有机溶胶。The specific production steps are shown in Figure 2. First, the silicon wafer substrate was ultrasonically cleaned with acetone, ethanol and deionized water for 30 minutes, respectively. After drying with nitrogen, a zinc film with a thickness of 1 micron was prepared on a silicon wafer substrate by electron beam evaporation technology. The silicon wafers are then thermally oxidized in a tube furnace in an atmospheric environment. The temperature of the tube furnace was first raised from room temperature to 470°C and then held at 470°C for 3 hours. After the silicon wafer is naturally cooled, the zinc film will grow into a low-dimensional nano-cold cathode array of zinc oxide. Then, the monolayer tungsten diselenide thin film was transferred to the low-dimensional nano-cold cathode array by organosol-assisted method. Finally, the silicon wafer samples were placed in a vacuum tube furnace to rapidly heat up to 450 °C and held for 2 hours to remove the organosol.
我们对制备的复合纳米冷阴极结构进行了扫描电子显微镜观察。图7是实际制作的复合纳米冷阴极结构的扫描电子显微镜照片和稳定性测试结果。We carried out scanning electron microscopy observations on the as-prepared composite nanocold cathode structures. FIG. 7 is a scanning electron microscope photograph and a stability test result of the actually fabricated composite nano-cold cathode structure.
如图7所示,图7中的(a)是扫描电子显微镜观察到的复合纳米冷阴极结构的图片。其中,白色箭头所指为二硒化钨与氧化锌纳米线接触的尖端位置。可以看出二硒化钨较为平坦地覆盖在纳米线上,且二硒化钨的几何曲率要小于纳米线尖端的几何曲率。图7中的(b)为该结构的场发射稳定性测试结果。可以看到在300秒的测试时间内,冷阴极的场发射稳定性非常好,波动性低至0.79%。As shown in FIG. 7, (a) in FIG. 7 is a picture of the composite nano-cold cathode structure observed by scanning electron microscope. Among them, the white arrow points to the tip position of the tungsten diselenide and the zinc oxide nanowire in contact. It can be seen that tungsten diselenide covers the nanowire relatively flatly, and the geometric curvature of tungsten diselenide is smaller than that of the tip of the nanowire. (b) in FIG. 7 is the field emission stability test result of the structure. It can be seen that the field emission stability of the cold cathode is very good with a volatility as low as 0.79% in the test time of 300 seconds.
显然,本发明的上述实施例仅仅是为清楚地说明本发明所作的举例,而并非是对本发明的实施方式的限定。对于所属领域的普通技术人员来说,在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明权利要求的保护范围之内。Obviously, the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, rather than limiting the embodiments of the present invention. For those of ordinary skill in the art, changes or modifications in other different forms can also be made on the basis of the above description. There is no need and cannot be exhaustive of all implementations here. Any modifications, equivalent replacements and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the claims of the present invention.
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