[go: up one dir, main page]

CN109801667A - A kind of parallel static memory address wire out of circuit test method - Google Patents

A kind of parallel static memory address wire out of circuit test method Download PDF

Info

Publication number
CN109801667A
CN109801667A CN201811602061.XA CN201811602061A CN109801667A CN 109801667 A CN109801667 A CN 109801667A CN 201811602061 A CN201811602061 A CN 201811602061A CN 109801667 A CN109801667 A CN 109801667A
Authority
CN
China
Prior art keywords
address
data
address wire
write
root
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201811602061.XA
Other languages
Chinese (zh)
Other versions
CN109801667B (en
Inventor
张锐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CETC 20 Research Institute
Original Assignee
CETC 20 Research Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CETC 20 Research Institute filed Critical CETC 20 Research Institute
Priority to CN201811602061.XA priority Critical patent/CN109801667B/en
Publication of CN109801667A publication Critical patent/CN109801667A/en
Application granted granted Critical
Publication of CN109801667B publication Critical patent/CN109801667B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Techniques For Improving Reliability Of Storages (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

The present invention provides a kind of parallel static memory address wire out of circuit test methods, if parallel static memory has m root address wire, n root data line, then address wire is expressed as A from a high position to low levelm‑1~A0, data line is expressed as D from a high position to low leveln‑1~D0;When testing m root address wire, decimal number is first written in order respectively to decimal address;Then corresponding data is read again;The write-in data of identical address are subtracted each other with data are read respectively, if result is all 0, then address wire is without breaking phenomena;Otherwise, all write-in data are found out and read the address that data subtraction value is not 0, if any k address, just there is the open circuit of k root address wire, subtraction value is not the former write-in data decimal value i of 0 address is how many, means that AiNumber address wire open circuit.The present invention saves the time of nearly one third than being currently known method, effectively shortens the testing time, improves work efficiency.

Description

A kind of parallel static memory address wire out of circuit test method
Technical field
The present invention relates to the test methods of SRAM a kind of.
Background technique
In recent years, with the rapid development of computer technology, integrated circuit technique, in board largely using based on BGA, The high-density memory device of QFP encapsulation.Parallel static memory (SRAM) is high with its integrated level, manufacturing cost is low, easy to use Many advantages, such as be widely used in electronics, these chips will do it stringent performance test when leaving the factory, but in electricity It is easy to be caused device pin rosin joint by reasons such as pin oxidation, electrical fitting technologies during dress, and work going out in bad environments The problems such as existing pin cracking.
Parallel static memory (SRAM) interface is mainly made of control line, data line and address wire, wherein data line and Number of address lines is more, and probability of malfunction is big.The measuring means such as the visual of routine, X-ray, intelligent image identification easily determine that memory draws Foot overlap joint, short circuit phenomenon, but the above-mentioned means of the breaking phenomenas such as rosin joint, cracking are difficult to judge, position, it generally must be by memory Test is written and read to judge.Data line open circuit is easy to position, and general use " full 0 ", " complete 1 " method, i.e., same address are first write " full 0 " after reading, then is written that " complete 1 " is read, and the binary number of judgement data twice, who is identical, then this bit of data line Open circuit.But the above method is not suitable for address wire judgement, and required time overhead is too big.
It is investigated that disclosed documents and materials are read, currently, Li Gang et al. is in " 51 series monolithic system design and application skill " In give the method for test macro RAM a kind of, this method is to check in two steps, and first backward entire data field send " complete respectively 0 ", " complete 1 ", then successively read and compare, if different, illustrate to malfunction.It adds up since this method is used to packet data block And verification, it is therefore desirable to a large amount of data transmitting is carried out between CPU and RAM, time overhead needed for RAM self-test is very big.It is old Soldier et al. proposes that a kind of " by-line scanning method " judges memory address line in " improved method of RAM Self-checking for Single Chip Processor " The breaking used time is shorter, and piece address wire of every detection only write for 2 times to RAM and 1 reading, that is, judges n bit address line, need to write 2n times, read n times.Although the method greatly reduces detection time, but still needs to be further increased detection efficiency.
Summary of the invention
For overcome the deficiencies in the prior art, the present invention provides a kind of parallel static memory (SRAM) address wire open circuit inspection Survey method can be improved efficiency, more quickly judge memory address line open circuit.
The technical solution adopted by the present invention to solve the technical problems is: setting parallel static memory has m root address wire, n Root data line, then address wire is expressed as A from a high position to low levelm-1~A0, data line is expressed as D from a high position to low leveln-1~D0;It surveys When trying m root address wire, first to decimal address 20、21、22、23……2m-2、2m-1, 0 respectively in order write-in decimal number 0,1, 2,3……,m-2,m-1,m;Then again from address 20、21、22、23……2m-2、2m-1, read corresponding data in 0;Respectively by phase Write-in data with address are subtracted each other with data are read, and if result is all 0, then address wire is without breaking phenomena;Otherwise, all write is found out Enter data and read the address that data subtraction value is not 0, if any k address, just has k root address wire breaking, these subtraction values are not Former write-in data decimal value i for 0 address is how many, means that AiNumber address wire open circuit.
The beneficial effects of the present invention are: judging the open circuit conditions of m root memory address line, it can only pass through m+1 write-in Operation and m+1 read operation, so that it may quickly and position which root or which root address wire open circuit, be saved than being currently known method The time of nearly one third, the testing time is effectively shortened, is improved work efficiency.Simultaneously this method can be generalized to it is a variety of simultaneously In the address wire open circuit detection of line storage.
Specific embodiment
Below with reference to embodiment, the present invention is further described, and the invention includes, but is not limited to, the following examples.
The present invention provides a kind of test method of parallel static memory (SRAM) address wire open circuit positioning, is particularly suitable for using In printed board Denso, equipment adverse circumstances using caused chip pin rosin joint, cracking, to cause SRAM in circuit-board card logical Believe the positioning of failure.
If parallel static memory has m root address wire, n root data line, then address wire is expressed as A from a high position to low levelm-1~ A0, data line is expressed as D from a high position to low leveln-1~D0, this method can test address line number amount be 1~2nRoot, i.e., up to 2 N times root, therefore 1≤m≤2n, behind m in document, n indicates this definition, no longer describes.
M root address wire is tested, first to decimal address 20、21、22、23……2m-2、2m-1, 0 respectively in order write-in ten into Number 0 processed, 1,2,3 ..., m-2, m-1, m;Then again from address 20,21、22、23……2m-2、2m-1, read corresponding data in 0. The write-in data of identical address are subtracted each other with data are read respectively, if result is all 0, then address wire is without breaking phenomena;Otherwise, ground Location line has breaking phenomena.Finding out all write-in data and reading the address that data subtraction value is not 0 just has k if any k address Root address wire open circuit, these subtraction values are not former write-in data decimal value i (0≤i≤m) of 0 address is how many, mean that AiNumber address wire open circuit.
In the embodiment of the present invention, by processor (model TMS320C28335) to SRAM (model CY7C1061AV33 address wire) is tested to illustrate specific implementation process of the invention.Data between the processor and SRAM Totally 16, line, it is expressed as D7~D0, n=8;Address wire totally 10, it is expressed as A9~A0, m=10.A is set9、A5、A1、A0For open circuit State.
First to decimal address 20、21、22、23……28、29, 0 respectively in order write-in decimal number 0,1,2,3 ..., 8,9,10, then from decimal address 20、21、22、23……28、29, 0 read data, then respectively by the write-in number of identical address Subtract each other according to reading data.Write-in data, reading data, write-in data in writing address and the difference such as following table for reading data It is shown:
Write-in data have 4 with the address that data subtraction value is not 0 is read as can be seen from the table, therefore judgement has 4 Address wire open circuit, these subtraction values are not that the former write-in data decimal value of 0 address is 0,1,5,9 respectively, therefore indicates A0、A1、 A5、A9Number address wire open circuit.
Judging result is consistent with actual result, it was demonstrated that this method can quickly and effectively orient the address wire open circuit shape of memory State.

Claims (1)

1.一种并行静态存储器地址线断路测试方法,其特征在于包括下述步骤:1. a parallel static memory address line disconnection test method is characterized in that comprising the following steps: 设并行静态存储器有m根地址线,n根数据线,则地址线从高位到低位表示为Am-1~A0,数据线从高位到低位表示为Dn-1~D0;测试m根地址线时,先向十进制地址20、21、22、23……2m-2、2m-1、0分别按顺序写入十进制数0、1、2、3……、m-2、m-1、m;然后再从地址20、21、22、23……2m -2、2m-1、0中读出相应数据;分别将相同地址的写入数据与读出数据相减,如结果全为0,则地址线无断路现象;否则,找出所有写入数据与读出数据相减值不为0的地址,如有k个地址,就有k根地址线断路,这些相减值不为0的地址的原写入数据十进制值i是多少,就表示Ai号地址线断路。Suppose the parallel static memory has m address lines and n data lines, then the address lines from high to low are expressed as A m-1 ~ A 0 , and the data lines are expressed as D n-1 ~ D 0 from high to low; test m When the root address line is used, first write the decimal numbers 0, 1 , 2 , 3 ..., m-2, m-1, m; then read the corresponding data from addresses 2 0 , 2 1 , 2 2 , 2 3 ...... 2 m -2 , 2 m-1 , 0; write the same address respectively Subtract the input data and the read data. If the result is all 0, the address line has no open circuit phenomenon; otherwise, find all the addresses whose subtraction value is not 0 between the write data and the read data. If there are k addresses, then There are k address lines disconnected, and the decimal value i of the original written data of these addresses whose subtraction value is not 0 indicates that the address line A i is disconnected.
CN201811602061.XA 2018-12-26 2018-12-26 Parallel static memory address line open circuit test method Active CN109801667B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811602061.XA CN109801667B (en) 2018-12-26 2018-12-26 Parallel static memory address line open circuit test method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811602061.XA CN109801667B (en) 2018-12-26 2018-12-26 Parallel static memory address line open circuit test method

Publications (2)

Publication Number Publication Date
CN109801667A true CN109801667A (en) 2019-05-24
CN109801667B CN109801667B (en) 2020-09-08

Family

ID=66557698

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811602061.XA Active CN109801667B (en) 2018-12-26 2018-12-26 Parallel static memory address line open circuit test method

Country Status (1)

Country Link
CN (1) CN109801667B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115691628A (en) * 2021-07-26 2023-02-03 珠海一微半导体股份有限公司 Method, device and storage medium for locating failed DRAM address lines

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1012000A (en) * 1996-06-20 1998-01-16 Toshiba Corp EEPROM test method
CN1681048A (en) * 2004-04-07 2005-10-12 华为技术有限公司 Testing method of memory address line
US20130275822A1 (en) * 2012-04-14 2013-10-17 Texas Instruments Incorporated At Speed Testing of High Performance Memories with a Multi-Port BIS Engine
US20170301402A1 (en) * 2015-01-08 2017-10-19 Toshiba Memory Corporation Memory system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1012000A (en) * 1996-06-20 1998-01-16 Toshiba Corp EEPROM test method
CN1681048A (en) * 2004-04-07 2005-10-12 华为技术有限公司 Testing method of memory address line
US20130275822A1 (en) * 2012-04-14 2013-10-17 Texas Instruments Incorporated At Speed Testing of High Performance Memories with a Multi-Port BIS Engine
US20170301402A1 (en) * 2015-01-08 2017-10-19 Toshiba Memory Corporation Memory system

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
陈卫兵,何娟: "单片机系统RAM自检的改进方法", 《工业控制计算机》 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115691628A (en) * 2021-07-26 2023-02-03 珠海一微半导体股份有限公司 Method, device and storage medium for locating failed DRAM address lines

Also Published As

Publication number Publication date
CN109801667B (en) 2020-09-08

Similar Documents

Publication Publication Date Title
CN103367189B (en) Test system and test method thereof
US10228998B2 (en) Systems and methods for correcting data errors in memory susceptible to data loss when subjected to elevated temperatures
JPS61278992A (en) IC card with failure inspection function
CN113887163A (en) Method for inserting redundant through hole
CN102929755A (en) Fault detection method of CPU (Central Processing Unit) module address and data bus
CN101727980A (en) Multi-chip module
CN103000226B (en) The method of testing of defect is detected by RAM chip address pin
CN109726057A (en) A kind of CPU security system parallel bus failure Real-time and Dynamic Detection method
CN109801667A (en) A kind of parallel static memory address wire out of circuit test method
CN205067680U (en) Bga chip testing system
US6035431A (en) Semiconductor integrated circuit with test device
US6136618A (en) Semiconductor device manufacturing process diagnosis system suitable for diagnoses of manufacturing process of logic LSI composed of a plurality of logic circuit blocks and diagnosis method thereof
CN117669480A (en) Test method, device and equipment of layout verification tool and storage medium
Smirnov et al. Methods to ensure reliable contact of super-large integrated circuit with test equipment
JP2837703B2 (en) Fault diagnosis device
JP3272238B2 (en) Failure analysis method for semiconductor device
CN115201720A (en) Wiring inspection method and device of wafer test equipment, wafer test equipment and system
CN115480153A (en) System and method for improving pin test coverage rate in circuit board to be tested
TWI865372B (en) Memory test verification system and memory test verification method
CN114689940B (en) Substrate impedance testing methods, apparatus, systems, computer equipment, and storage media
CN104101826A (en) Electronic device, and electrostatic discharge test system and method
JPS6131499B2 (en)
CN100516905C (en) Test system and method for printed circuit board
TWI245914B (en) System and method for testing a PCB
US10319453B2 (en) Board level leakage testing for memory interface

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant