[go: up one dir, main page]

CN109586703A - The D-latch of low redundancy nuclear hardening - Google Patents

The D-latch of low redundancy nuclear hardening Download PDF

Info

Publication number
CN109586703A
CN109586703A CN201811416960.0A CN201811416960A CN109586703A CN 109586703 A CN109586703 A CN 109586703A CN 201811416960 A CN201811416960 A CN 201811416960A CN 109586703 A CN109586703 A CN 109586703A
Authority
CN
China
Prior art keywords
transistor
latch
grid
drain electrode
node
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811416960.0A
Other languages
Chinese (zh)
Inventor
郭靖
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
North University of China
Original Assignee
North University of China
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by North University of China filed Critical North University of China
Priority to CN201811416960.0A priority Critical patent/CN109586703A/en
Publication of CN109586703A publication Critical patent/CN109586703A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K19/00Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/003Modifications for increasing the reliability for protection
    • H03K19/00323Delay compensation
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K19/00Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/003Modifications for increasing the reliability for protection
    • H03K19/0033Radiation hardening

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Logic Circuits (AREA)

Abstract

The D-latch of low redundancy nuclear hardening belongs to the nuclear hardening field in IC reliability.Hardware needed for solving traditional D-latch is more, power consumption is high, transmission time is long, although and can realize anti-binode upset, there are anti-binode upset ability is poor, or even cannot achieve the fault-tolerant problem to binode upset.The present invention includes NMOS transistor N1 to N20 and PMOS transistor P1 to P12, and device used is few, and small in size, structure is simple, since device used is few, to reduce the power consumption of entire latch and possess lower hardware spending.The signal of latch inputs only passes through a transmission gate can be for transmission to output port, and data transmission period is short, additionally it is possible to realize to the fault-tolerant of any single node and binode upset, to realize the fault-tolerant protection of anti-single node and binode upset.The present invention can provide protection for the application of IC chip in high radiation environment (such as space flight and aviation and ground nuclear power station).

Description

The D-latch of low redundancy nuclear hardening
Technical field
The invention belongs to the field of radioresistance reinforcement in IC reliability.
Background technique
D-latch is chiefly used in integrated circuit, as the memory element of sequence circuit in digital circuit, in certain operations Sometimes using D-latch as Data buffer in device circuit.But stored function is protected since latch has, Extraneous radiating particle will change the information of its preservation, so as to cause the mistake of electronic system.
Triplication redundancy is usually used to be reinforced in traditional D-latch, the disadvantage is that required hardware is more, power consumption is high, passes The defeated time is long, although and can realize anti-binode upset, there are the ability of anti-binode upset is poor, or even cannot achieve pair Binode upset it is fault-tolerant.Therefore, the problem urgent need to resolve present on.
Summary of the invention
The present invention is in order to which hardware needed for solving traditional D-latch is more, power consumption is high, transmission time is long, although and can It realizes anti-binode upset, but there are the ability of anti-binode upset is poor, or even cannot achieve to the fault-tolerant of binode upset Problem, the present invention provides a kind of D-latch of low redundancy nuclear hardening.
The D-latch of low redundancy nuclear hardening, including NMOS transistor N1 to N20 and PMOS transistor P1 to P12;
After the drain electrode of the source electrode, transistor N20 of transistor P12 is connected with the drain electrode of transistor N16 to N17, as latch One data input pin D of device;
Another data input pin after the drain electrode of transistor N18 is connected with the drain electrode of transistor N19, as latch DN;Two data input pin received signals of latch are opposite;
A clock signal clk N after the grid of transistor P12 is connected with the grid of transistor N15, as latch Input terminal;
After the grid of transistor N16 to N20 is connected with the grid of transistor P11, another clock as latch is believed The input terminal of number CLK;Two clock signal input terminal received signals of latch are opposite;
The drain electrode of transistor P12, the drain electrode of the source electrode of transistor N20, transistor P11 are connected with the drain electrode of transistor N15 Afterwards, as the output end Q of latch;
The source electrode of transistor N16, the grid of transistor N2, the source electrode of transistor N10, the drain electrode of transistor N12 and crystal After the grid connection of pipe N11, as node A;
The source electrode of transistor N18, the grid of transistor N1, the source electrode of transistor N9, the drain electrode of transistor N11, transistor After the grid of N12, the grid of transistor P10 are connected with the grid of transistor N14, as node B;
The grid of transistor P5, the grid of transistor N9, the grid of transistor P8, the drain electrode of transistor P6 and transistor N8 Drain electrode connection after, as node C;
The drain electrode of transistor P5, the drain electrode of transistor N7, the grid of transistor P7, transistor N10 grid and transistor After the grid connection of P6, as node DD;
The drain electrode of transistor P1, the drain electrode of transistor N1, the grid of transistor P3, transistor N4 grid and transistor P2 Grid connection after, as node E;
The source electrode of transistor N19, the source electrode of transistor N3, the drain electrode of transistor N5, the grid of transistor N6, transistor N7 Grid, transistor P9 grid connected with the grid of transistor N13 after, as node F;
The source electrode of transistor N17, the source electrode of transistor N4, the drain electrode of transistor N6, transistor N5 grid and transistor After the grid connection of N8, as node G;
The grid of transistor P1, the grid of transistor N3, the grid of transistor P4, the drain electrode of transistor P2 and transistor N2 Drain electrode connection after, as node H;
The source electrode of transistor P1 to P9 is connect with power supply, and the source electrode of transistor N1 to N2, transistor N5 are to N6's The source electrode of source electrode, the source electrode of transistor N7 to N8 and transistor N11 to N13 is connect with power ground;
The drain electrode of transistor P3 is connect with the drain electrode of transistor N3, and the drain electrode of transistor P4 and the drain electrode of transistor N4 connect It connects, the drain electrode of transistor P7 is connect with the drain electrode of transistor N9, and the drain electrode of transistor P8 is connect with the drain electrode of transistor N10;
The drain electrode of transistor P9 is connect with the source electrode of transistor P10, the drain electrode of transistor P10 and the source electrode of transistor P11 Connection, the source electrode of transistor N15 are connect with the drain electrode of transistor N14, and the drain electrode of the source electrode and transistor N13 of transistor N14 connects It connects.
Preferably, when clock signal clk is high level " 1 ", latch conducting;Clock signal clk is low level " 0 " When, latches.
Preferably, when latches low level " 0 ", latch sensitive nodes are B, C, DD, E, F and H;
When latches high level " 1 ", latch sensitive nodes are A, C, DD, E, G and H.
Preferably, the D-latch of the low redundancy nuclear hardening, including normal operating conditions and fault-tolerant operation shape State.
Normal operating conditions includes following situation:
Situation one: assuming that the data input pin D=1 of latch, then DN=0;
(1) as CLK=1, CLKN=0, at this point, NMOS transistor N2, N4, N5, N8, N10, N11, N16 are beaten to 20 Open, NMOS transistor N1, N3, N6, N7, N9, N12, N13, N14, N15 are turned off, PMOS transistor P1, P4, P5, P8, P9, P10, P12 are opened, and PMOS transistor P2, P3, P6, P7, P11 are turned off, at this point, A=DD=E=G=Q=1, B=C=F =H=0;
(2) as CLK=0, CLKN=1, NMOS transistor N16 to N20 and PMOS transistor P12 are closed, PMOS crystal Pipe P11 is opened, and therefore, the output end Q of latch will connect power supply voltage by the PMOS transistor P9 to P11 of conducting, Due to latch inner interlocked, output end Q will save always 1 state, and latch enters latch mode;
Situation two: assuming that the data input pin D=0 of latch, then DN=1;
(1) as CLK=1, CLKN=0, at this point, NMOS transistor N1, N3, N6, N7, N9, N12 to N14, N16 extremely N20 is opened, and NMOS transistor N2, N4, N5, N8, N10, N11, N15 are turned off;PMOS transistor P2, P3, P6, P7, P12 It opens, PMOS transistor P1, P4, P5, P8, P9 to P11 are turned off, at this point, A=DD=E=G=Q=0, B=C=F=H =1;
(2) as CLK=0, CLKN=1, NMOS transistor N16 to N20 and PMOS transistor P12 are closed, NMOS crystal Pipe N15 is opened, and therefore, the output end Q of latch will power on ground by the NMOS transistor N13 to N15 be connected, due to The reason of latch inner interlocked, output end Q will save always 0 state, and latch enters latch mode.
Fault-tolerant operation state occurs during latches, and fault-tolerant operation state includes following situation:
Situation one:
When latches low level " 0 ", sensitive nodes B, C, DD, E, F and H;It is any in above-mentioned sensitive nodes When one or two sensitive nodes is flipped, due to being constantly present two in the sensitive nodes and node A, G that are not flipped A or more than two node states remain unchanged, and therefore, can restore above-mentioned one or two node being flipped to respective State originally;
Situation two:
When latches high level " 1 ", sensitive nodes A, C, DD, E, G and H are any in above-mentioned sensitive nodes When one or two sensitive nodes is flipped, due to being constantly present two in the sensitive nodes and node B, F that are not flipped A or more than two node states remain unchanged, and therefore, can restore above-mentioned one or two node being flipped to respective State originally.
Principle analysis:
Fault-tolerant operation state is unrelated with the received data-signal of data input pin D of latch, and fault-tolerant operation state occurs In latches state, related with the data that node each inside latch latches, the D-latch of low redundancy nuclear hardening is fault-tolerant Working state analysis is as follows: clock signal clk=0, CLKN=1,8 internal nodes A=DD=E=G=1, B=C=F=H =0, output end Q=1, the inside sensitive nodes of the latch have 6, respectively A, C, DD, E, G and H at this time: described above-mentioned 6 Specific situation when one or two of a sensitive nodes are flipped is as follows:
1, when node A is turned to 0, NMOS transistor N11, N2 will be closed.Remaining node will keep respective State it is constant, therefore, PMOS transistor P8 and NMOS transistor N10 will be opened always, and A node will be pulled back to original 1, then, NMOS transistor N11, N2 will be opened.
2, when node C is turned to 1, PMOS transistor P5 and P8 will be closed, and NMOS transistor N9 will be beaten It opens.Remaining node will keep respective state constant, and therefore, NMOS transistor N8 will always be in open state, this will drop-down Recovery nodes C is to original correct 0 state.
3, when node DD is turned to 0, PMOS transistor P7 and P6 will be turned on.Due to node G state not It changes, or 1 original state, this will be so that NMOS transistor N8 be constantly in open state, therefore node C will be 0 state, PMOS transistor P5 will be constantly on, and node DD will be restored to 1 original state.
4, when node E is turned to 0, PMOS transistor P3 and P2 will be turned on.Since the state of node A is not sent out Changing, or 1 original state, this will be so that NMOS transistor N2 be constantly in open state, therefore node H will be 0 State, PMOS transistor P1 will be constantly on, and node E will be restored to 1 original state.
5, when node G is turned to 0, NMOS transistor N5, N8 will be closed.Remaining node will keep respective State is constant, and therefore, PMOS transistor P4 and NMOS transistor N4 will be opened always, and G node will be pulled back to original 1, Then, NMOS transistor N5, N8 will be opened.
6, when node H is turned to 1, PMOS transistor P1 and P4 will be closed, and NMOS transistor N3 will be beaten It opens.Remaining node will keep respective state constant, and therefore, NMOS transistor N2 will always be in open state, this will drop-down Recovery nodes H is to original correct 0 state.
7, when node A and C are flipped, NMOS transistor N11, N2 and PMOS transistor P5 and P8 will be closed It closes, NMOS transistor N9 will be opened.But since the state of node G does not change, NMOS transistor N8 is by one Straight in the open state, node C will retract 0 original state, then, PMOS transistor P5 under NMOS transistor N8 switched on It will be opened with P8, NMOS transistor N9 will be closed, and node A will be extensive by the PMOS transistor P8 and NMOS tube N10 of conducting It is multiple to arrive 1 original state.
8, when node A and DD are flipped, PMOS transistor P7 and P6 will be turned on, NMOS transistor N10, N11, N2 will be closed.But since the state of node G does not change, NMOS transistor N8 will always be in opening State, node C will always be in 0 state, and as a result PMOS transistor P5 will be constantly on, and node DD will be restored to original 1 state, PMOS transistor P7 and P6 will be closed, and NMOS transistor N10 will be turned on, and therefore, node A will pass through conducting PMOS transistor P8 and NMOS tube N10 is restored to 1 original state.
9, when node C and DD are flipped, PMOS transistor P5 and P8 will be closed, and NMOS transistor N9 will be temporary When be opened, PMOS transistor P7 and P6 will be opened temporarily, and NMOS transistor N10 will be temporarily closed.But due to node G State do not change, therefore, NMOS transistor N8 will always be in open state, and node C will be restored to 0 state, because This, PMOS transistor P5 and P8 will be turned on, and node DD will also be restored to original correct status.
10, when node A and node G is flipped simultaneously, NMOS transistor N11, N2, N5, N8 will be closed.This It will not influence the state of other nodes, therefore, node A will be extensive by the PMOS transistor P8 and NMOS transistor N10 of conducting Multiple, node G will be restored by the PMOS transistor P4 and NMOS transistor N4 of conducting.
11, when node A and node E is flipped simultaneously, NMOS transistor N11, N2, N4 will be temporarily closed, PMOS transistor P2, P3 will be opened briefly near bottom dead center on.Since no change has taken place for the state of G node, NMOS transistor N8 will Always on, node C will keep 0 original state, and PMOS transistor P8 will be always on.A node will be by leading always Logical PMOS transistor P8 and NMOS tube N10 is restored to original state.Then, NMOS transistor N11, N2 also will be extensive Open state is arrived again, and therefore, node H will be always maintained at 0 state, and PMOS transistor P1 is always on opening, so node E 1 original state will be pulled up back.
12, when node A and node H is flipped simultaneously, NMOS transistor N11, N2 and PMOS transistor P1, P4 It will be temporarily closed, NMOS transistor N3 will be opened briefly near bottom dead center on.Since no change has taken place for the state of G node, NMOS is brilliant Body pipe N8 will be always on, and node C will keep 0 original state, and PMOS transistor P8 will be always on.A node will lead to Constantly on PMOS transistor P8 and NMOS tube N10 are crossed to be restored to original state.Then, NMOS transistor N11, N2 Also it will be restored to open state, therefore, node H will be restored to 0 original state.
13, when node C and node E is flipped simultaneously, PMOS transistor P5, P8 and NMOS transistor N4 will be by Temporary close, NMOS transistor N9 and PMOS transistor P2, P3 will be by temporary unlatchings.Since node A and node G do not become Change, therefore, NMOS transistor N8 and N2 will be always on, and node C will be restored to original state.Node H will be kept 0 state originally, so that PMOS transistor P1 will be in the open state, node E will be pulled up go back to original 1.
14, when node C and node G is flipped simultaneously, PMOS transistor P5, P8 and NMOS transistor N5, N8 It will be temporarily closed, NMOS transistor N9 will be by temporary unlatching.Since the state of node A is unchanged, NMOS transistor N2 will In the open state, also no change has taken place for the state of node E, H.Therefore, node G passes through the PMOS transistor by conducting P4 and NMOS transistor N4 restores to 1 original state.Then, NMOS transistor N5, N8 will be switched on again, and node C will lead to The NMOS transistor N8 for crossing conducting restores to original state 0.
15, when node C and node H is flipped simultaneously, PMOS transistor P5, P8, P1, P4 will be closed temporarily It closes, NMOS transistor N9, N3 will be by temporary unlatchings.But since all no change has taken place for the state of A and G node, NMOS transistor N8 and N2 will be constantly on, this restores node C and node H all to original state 0.
16, when node DD and node E is flipped simultaneously, PMOS transistor P7, P6, P3, P3 will be opened temporarily It opens, NMOS transistor N10 and N4 will be temporarily closed.Since all no change has taken place for the state of node A and node G, NMOS transistor N8 and N2 will be constantly on, this will make node C and node H is 0 original state, PMOS transistor P5 It will be constantly on state with P1, therefore node DD and node E can be resumed.
17, when node DD and node H is flipped simultaneously, PMOS transistor P7, P6, P1, P4 and NMOS crystal Pipe N3 will be opened temporarily, and NMOS transistor N10 will be temporarily closed.Due to the state of node A and node G all there is no Change, therefore, NMOS transistor N8 and N2 will be constantly on, this will make node C be 0 original state, and node H can be extensive It is multiple to arrive 0 original state.By constantly on PMOS transistor P5, node DD will also be restored to 1 state.
18, when node DD and node G is flipped simultaneously, PMOS transistor P7, P6 will be opened temporarily, NMOS transistor N5 and N2 will be temporarily closed.Since the state of node A is constantly in 1 original state, NMOS crystal Pipe N2 will always be in open state, and also all no change has taken place for the state of node E and node H, then PMOS transistor P4 and NMOS transistor N4 is in open state, therefore node G can be restored to 1.Then, NMOS transistor N8 will be beaten again It opens, node C will be in 0 original state, therefore PMOS transistor P5 will be in the open state, and node DD will can be restored To 1 state.
19, when node E and node G is flipped simultaneously, PMOS transistor P3 and P2 will be turned on, and NMOS is brilliant Body pipe N4, N5, N8 will be closed.But since the state of node A does not change, NMOS transistor N2 will locate always In open state, node H will always be in 0 state, and as a result PMOS transistor P1 will be constantly on, and node E will be restored to 1 state originally, PMOS transistor P3 and P2 will be closed, and NMOS transistor N4 will be turned on, and therefore, node G will be by leading Logical PMOS transistor P4 and NMOS tube N4 is restored to 1 original state.
20, when node E and H are flipped, PMOS transistor P1 and P4 will be closed, and NMOS transistor N3 will be temporary When be opened, PMOS transistor P3 and P2 will be opened temporarily, and NMOS transistor N4 will be temporarily closed.But due to node A State do not change, therefore, NMOS transistor N2 will always be in open state, and node H will be restored to 0 state, because This, PMOS transistor P1 and P4 will be turned on, and node E will also be restored to original correct status.
21, when node G and H are flipped, NMOS transistor N8, N5 and PMOS transistor P1 and P4 will be closed It closes, NMOS transistor N3 will be opened.But since the state of node A does not change, NMOS transistor N2 is by one Straight in the open state, node H will retract 0 original state, then, PMOS transistor P1 under NMOS transistor N2 switched on It will be opened with P4, NMOS transistor N3 will be closed, and node G will be extensive by the PMOS transistor P4 and NMOS tube N4 of conducting It is multiple to arrive 1 original state.
To sum up, when one or two of 6 sensitive nodes are flipped, pass through above-mentioned analysis, it is found that total There are two or more than two nodes no change has taken place, by its save value, these overturning states can restore.
Inventive concept of the invention is to be reinforced according to the physical characteristic that radiating particle bombarding semiconductor device generates Sensitive nodes inside latch are reduced to 6 by design, therefore, the present invention, and sensitive area reduces, and cause to be bombarded by radiating particle Probability also reduce, compared to existing Flouride-resistani acid phesphatase D-latch, area, power consumption, delay will be can be greatly reduced.
The invention has the beneficial effects that
(1) present invention shares 32 transistors and constitutes, and device used is few, and small in size, structure is simple, due to device used It is few, to reduce the power consumption of entire latch and possess lower hardware spending.
(2) in the present invention, data input pin D only passes through a transmission gate and (that is: can latch for transmission to output port Device on state, data input pin D only can be transmitted directly by the transmission gate being made of transistor P12 and transistor N20 To latch outputs Q), therefore, data transmission period is short, and delay will also be reduced.
(3) traditional D-latch is typically necessary the ability for the anti-overturning that can be only achieved in conjunction with laying out pattern, and this hair It is bright not need cooperation diagram optimizing, because can restore after its internal any single node or binode are flipped, because This, the ability of anti-single node and binode upset is improved, and the D of low redundancy nuclear hardening of the present invention is latched Device can be realized to the fault-tolerant of any single node and binode upset, to realize the fault-tolerant of anti-single node and binode upset Protection.
The D-latch for the low redundancy nuclear hardening that the present invention constructs, high reliablity can be high radiation environment (such as space flight Aviation and ground nuclear power station etc.) in IC chip application provide protection.
Detailed description of the invention
Fig. 1 is the schematic illustration of the D-latch of low redundancy nuclear hardening of the present invention;
Fig. 2 is the analogous diagram of the D-latch of low redundancy nuclear hardening of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, those of ordinary skill in the art without making creative work it is obtained it is all its Its embodiment, shall fall within the protection scope of the present invention.
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase Mutually combination.
The present invention will be further explained below with reference to the attached drawings and specific examples, but not as the limitation of the invention.
Illustrate present embodiment referring to Fig. 1, the D-latch of low redundancy nuclear hardening described in present embodiment, including NMOS transistor N1 to N20 and PMOS transistor P1 to P12;
After the drain electrode of the source electrode, transistor N20 of transistor P12 is connected with the drain electrode of transistor N16 to N17, as latch One data input pin D of device;
Another data input pin after the drain electrode of transistor N18 is connected with the drain electrode of transistor N19, as latch DN;Two data input pin received signals of latch are opposite;
A clock signal clk N after the grid of transistor P12 is connected with the grid of transistor N15, as latch Input terminal;
After the grid of transistor N16 to N20 is connected with the grid of transistor P11, another clock as latch is believed The input terminal of number CLK;Two clock signal input terminal received signals of latch are opposite;
The drain electrode of transistor P12, the drain electrode of the source electrode of transistor N20, transistor P11 are connected with the drain electrode of transistor N15 Afterwards, as the output end Q of latch;
The source electrode of transistor N16, the grid of transistor N2, the source electrode of transistor N10, the drain electrode of transistor N12 and crystal After the grid connection of pipe N11, as node A;
The source electrode of transistor N18, the grid of transistor N1, the source electrode of transistor N9, the drain electrode of transistor N11, transistor After the grid of N12, the grid of transistor P10 are connected with the grid of transistor N14, as node B;
The grid of transistor P5, the grid of transistor N9, the grid of transistor P8, the drain electrode of transistor P6 and transistor N8 Drain electrode connection after, as node C;
The drain electrode of transistor P5, the drain electrode of transistor N7, the grid of transistor P7, transistor N10 grid and transistor After the grid connection of P6, as node DD;
The drain electrode of transistor P1, the drain electrode of transistor N1, the grid of transistor P3, transistor N4 grid and transistor P2 Grid connection after, as node E;
The source electrode of transistor N19, the source electrode of transistor N3, the drain electrode of transistor N5, the grid of transistor N6, transistor N7 Grid, transistor P9 grid connected with the grid of transistor N13 after, as node F;
The source electrode of transistor N17, the source electrode of transistor N4, the drain electrode of transistor N6, transistor N5 grid and transistor After the grid connection of N8, as node G;
The grid of transistor P1, the grid of transistor N3, the grid of transistor P4, the drain electrode of transistor P2 and transistor N2 Drain electrode connection after, as node H;
The source electrode of transistor P1 to P9 is connect with power supply, and the source electrode of transistor N1 to N2, transistor N5 are to N6's The source electrode of source electrode, the source electrode of transistor N7 to N8 and transistor N11 to N13 is connect with power ground;
The drain electrode of transistor P3 is connect with the drain electrode of transistor N3, and the drain electrode of transistor P4 and the drain electrode of transistor N4 connect It connects, the drain electrode of transistor P7 is connect with the drain electrode of transistor N9, and the drain electrode of transistor P8 is connect with the drain electrode of transistor N10;
The drain electrode of transistor P9 is connect with the source electrode of transistor P10, the drain electrode of transistor P10 and the source electrode of transistor P11 Connection, the source electrode of transistor N15 are connect with the drain electrode of transistor N14, and the drain electrode of the source electrode and transistor N13 of transistor N14 connects It connects.
The D-latch of low redundancy nuclear hardening described in present embodiment includes two data input pins, two clocks Signal input part and an output end.
Illustrate that this preferred embodiment, preferred embodiment are referring to Fig. 1, when clock signal clk is high level " 1 ", lock Storage conducting, it may be assumed that data input pin D only can be transmitted directly by the transmission gate being made of transistor P12 and transistor N20 To latch outputs Q, data transmission period is short;When clock signal clk is low level " 0 ", latches.
Although latch node of the present invention shares 8, respectively A, B, C, DD, E, F, G and H, according to latch Value, sensitive nodes are reduced to 6:
When latches low level " 0 ", latch sensitive nodes are B, C, DD, E, F and H;
When latches high level " 1 ", latch sensitive nodes are A, C, DD, E, G and H.
Illustrate that this preferred embodiment, preferred embodiment are referring to Fig. 1, the D-latch of low redundancy nuclear hardening includes Normal operating conditions and fault-tolerant operation state.
(1) normal operating conditions includes following situation:
Situation one: assuming that the data input pin D=1 of latch, then DN=0;
(1) as CLK=1, CLKN=0, at this point, NMOS transistor N2, N4, N5, N8, N10, N11, N16 are beaten to 20 Open, NMOS transistor N1, N3, N6, N7, N9, N12, N13, N14, N15 are turned off, PMOS transistor P1, P4, P5, P8, P9, P10, P12 are opened, and PMOS transistor P2, P3, P6, P7, P11 are turned off, at this point, A=DD=E=G=Q=1, B=C=F =H=0;
(2) as CLK=0, CLKN=1, NMOS transistor N16 to N20 and PMOS transistor P12 are closed, PMOS crystal Pipe P11 is opened, and therefore, the output end Q of latch will connect power supply voltage by the PMOS transistor P9 to P11 of conducting, Due to latch inner interlocked, output end Q will save always 1 state, and latch enters latch mode;
At this point, any variation of data input pin D will not affect that output end Q;
Situation two: assuming that the data input pin D=0 of latch, then DN=1;
(1) as CLK=1, CLKN=0, at this point, NMOS transistor N1, N3, N6, N7, N9, N12 to N14, N16 extremely N20 is opened, and NMOS transistor N2, N4, N5, N8, N10, N11, N15 are turned off;PMOS transistor P2, P3, P6, P7, P12 are equal It opens, PMOS transistor P1, P4, P5, P8, P9 to P11 are turned off, at this point, A=DD=E=G=Q=0, B=C=F=H= 1;
(2) as CLK=0, CLKN=1, NMOS transistor N16 to N20 and PMOS transistor P12 are closed, NMOS crystal Pipe N15 is opened, and therefore, the output end Q of latch will power on ground by the NMOS transistor N13 to N15 be connected, due to The reason of latch inner interlocked, output end Q will save always 0 state, and latch enters latch mode, at this point, data input Any variation of end D will not affect that output end Q.
(2) fault-tolerant operation state occurs during latches, and fault-tolerant operation state includes following situation:
Situation one:
When latches low level " 0 ", sensitive nodes B, C, DD, E, F and H;It is any in above-mentioned sensitive nodes When one or two sensitive nodes is flipped, due to being constantly present two in the sensitive nodes and node A, G that are not flipped A or more than two node states remain unchanged, and therefore, can restore above-mentioned one or two node being flipped to respective State originally;
Situation two:
When latches high level " 1 ", sensitive nodes A, C, DD, E, G and H are any in above-mentioned sensitive nodes When one or two sensitive nodes is flipped, due to being constantly present two in the sensitive nodes and node B, F that are not flipped A or more than two node states remain unchanged, and therefore, can restore above-mentioned one or two node being flipped to respective State originally.
Verification test: referring specifically to Fig. 2, the imitative of the D-latch of low redundancy nuclear hardening of the present invention is shown in Fig. 2 True figure, passes through the analogous diagram, it can be seen that the timing function of the D-latch for the novel low redundancy nuclear hardening that the present invention constructs and Fault tolerance is correct.For example, node A, C, DD, E, G and H have occurred respectively in the CLK time between 30ns~55ns Primary change has occurred in once inside out, the i.e. state of these nodes, but can finally return to respective correct state;? The CLK time, a binode upset had occurred in node A-C, A-DD, A-E, A-G, A-H respectively between 150ns~170ns, But it can finally return to respective correct state.
Although describing the present invention herein with reference to specific embodiment, it should be understood that, these realities Apply the example that example is only principles and applications.It should therefore be understood that can be carried out to exemplary embodiment Many modifications, and can be designed that other arrangements, without departing from spirit of the invention as defined in the appended claims And range.It should be understood that different appurtenances can be combined by being different from mode described in original claim Benefit requires and feature described herein.It will also be appreciated that the feature in conjunction with described in separate embodiments can be used Other embodiments.

Claims (6)

1. the D-latch of low redundancy nuclear hardening, which is characterized in that including NMOS transistor N1 to N20 and PMOS transistor P1 To P12;
After the drain electrode of the source electrode, transistor N20 of transistor P12 is connected with the drain electrode of transistor N16 to N17, as latch One data input pin D;
Another data input pin DN after the drain electrode of transistor N18 is connected with the drain electrode of transistor N19, as latch;Lock Two data input pin received signals of storage are opposite;
After the grid of transistor P12 is connected with the grid of transistor N15, the input of a clock signal clk N as latch End;
Another clock signal clk after the grid of transistor N16 to N20 is connected with the grid of transistor P11, as latch Input terminal;Two clock signal input terminal received signals of latch are opposite;
After the drain electrode of transistor P12, the drain electrode of the source electrode of transistor N20, transistor P11 are connected with the drain electrode of transistor N15, make For the output end Q of latch;
The source electrode of transistor N16, the grid of transistor N2, the source electrode of transistor N10, the drain electrode of transistor N12 and transistor N11 Grid connection after, as node A;
The source electrode of transistor N18, the grid of transistor N1, the source electrode of transistor N9, the drain electrode of transistor N11, transistor N12 Grid, transistor P10 grid connected with the grid of transistor N14 after, as node B;
The grid of transistor P5, the grid of transistor N9, the grid of transistor P8, the drain electrode of transistor P6 and transistor N8 leakage After the connection of pole, as node C;
The drain electrode of transistor P5, the drain electrode of transistor N7, the grid of transistor P7, the grid of transistor N10 and transistor P6 After grid connection, as node DD;
The drain electrode of transistor P1, the drain electrode of transistor N1, the grid of transistor P3, the grid of transistor N4 and transistor P2 grid After the connection of pole, as node E;
The source electrode of transistor N19, the source electrode of transistor N3, the drain electrode of transistor N5, the grid of transistor N6, transistor N7 grid Pole, transistor P9 grid connected with the grid of transistor N13 after, as node F;
The source electrode of transistor N17, the source electrode of transistor N4, the drain electrode of transistor N6, the grid of transistor N5 and transistor N8 After grid connection, as node G;
The grid of transistor P1, the grid of transistor N3, the grid of transistor P4, the drain electrode of transistor P2 and transistor N2 leakage After the connection of pole, as node H;
The source electrode of transistor P1 to P9 is connect with power supply, the source electrode of transistor N1 to N2, transistor N5 to N6 source electrode, The source electrode of transistor N7 to N8 and the source electrode of transistor N11 to N13 are connect with power ground;
The drain electrode of transistor P3 is connect with the drain electrode of transistor N3, and the drain electrode of transistor P4 is connect with the drain electrode of transistor N4, brilliant The drain electrode of body pipe P7 is connect with the drain electrode of transistor N9, and the drain electrode of transistor P8 is connect with the drain electrode of transistor N10;
The drain electrode of transistor P9 is connect with the source electrode of transistor P10, and the drain electrode of transistor P10 is connect with the source electrode of transistor P11, The source electrode of transistor N15 is connect with the drain electrode of transistor N14, and the source electrode of transistor N14 is connect with the drain electrode of transistor N13.
2. the D-latch of low redundancy nuclear hardening according to claim 1, which is characterized in that clock signal clk is high electricity When flat " 1 ", latch conducting;When clock signal clk is low level " 0 ", latches.
3. the D-latch of low redundancy nuclear hardening according to claim 1 or 2, which is characterized in that
When latches low level " 0 ", latch sensitive nodes are B, C, DD, E, F and H;
When latches high level " 1 ", latch sensitive nodes are A, C, DD, E, G and H.
4. the D-latch of low redundancy nuclear hardening according to claim 1, which is characterized in that including normal operating conditions With fault-tolerant operation state.
5. the D-latch of low redundancy nuclear hardening according to claim 4, which is characterized in that normal operating conditions includes Following situation:
Situation one: assuming that the data input pin D=1 of latch, then DN=0;
(1) as CLK=1, CLKN=0, at this point, NMOS transistor N2, N4, N5, N8, N10, N11, N16 are opened to 20, NMOS transistor N1, N3, N6, N7, N9, N12, N13, N14, N15 are turned off, PMOS transistor P1, P4, P5, P8, P9, P10, P12 is opened, and PMOS transistor P2, P3, P6, P7, P11 are turned off, at this point, A=DD=E=G=Q=1, B=C=F=H= 0;
(2) as CLK=0, CLKN=1, NMOS transistor N16 to N20 and PMOS transistor P12 are closed, PMOS transistor P11 It opens, therefore, the output end Q of latch will connect power supply voltage by the PMOS transistor P9 to P11 of conducting, due to lock The reason of storage inner interlocked, output end Q will save always 1 state, and latch enters latch mode;
Situation two: assuming that the data input pin D=0 of latch, then DN=1;
(1) as CLK=1, CLKN=0, at this point, NMOS transistor N1, N3, N6, N7, N9, N12 are beaten to N14, N16 to N20 It opens, NMOS transistor N2, N4, N5, N8, N10, N11, N15 are turned off;PMOS transistor P2, P3, P6, P7, P12 are opened, PMOS transistor P1, P4, P5, P8, P9 are turned off to P11, at this point, A=DD=E=G=Q=0, B=C=F=H=1;
(2) as CLK=0, CLKN=1, NMOS transistor N16 to N20 and PMOS transistor P12 are closed, NMOS transistor N15 It opens, therefore, the output end Q of latch will power on ground by the NMOS transistor N13 to N15 be connected, due to latch The reason of inner interlocked, output end Q will save always 0 state, and latch enters latch mode.
6. the D-latch of low redundancy nuclear hardening according to claim 4, which is characterized in that fault-tolerant operation state occurs During latches, fault-tolerant operation state includes following situation:
Situation one:
When latches low level " 0 ", sensitive nodes B, C, DD, E, F and H;Any one in above-mentioned sensitive nodes Or two sensitive nodes are when being flipped, due to be constantly present in the sensitive nodes and node A, G that are not flipped two or More than two node states remain unchanged, and therefore, can restore above-mentioned one or two node being flipped to respectively original State;
Situation two:
When latches high level " 1 ", sensitive nodes A, C, DD, E, G and H, any one in above-mentioned sensitive nodes Or two sensitive nodes are when being flipped, due to be constantly present in the sensitive nodes and node B, F that are not flipped two or More than two node states remain unchanged, and therefore, can restore above-mentioned one or two node being flipped to respectively original State.
CN201811416960.0A 2018-11-26 2018-11-26 The D-latch of low redundancy nuclear hardening Pending CN109586703A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811416960.0A CN109586703A (en) 2018-11-26 2018-11-26 The D-latch of low redundancy nuclear hardening

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811416960.0A CN109586703A (en) 2018-11-26 2018-11-26 The D-latch of low redundancy nuclear hardening

Publications (1)

Publication Number Publication Date
CN109586703A true CN109586703A (en) 2019-04-05

Family

ID=65924476

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811416960.0A Pending CN109586703A (en) 2018-11-26 2018-11-26 The D-latch of low redundancy nuclear hardening

Country Status (1)

Country Link
CN (1) CN109586703A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111223503B (en) * 2020-03-11 2021-10-01 河海大学常州校区 A dual-node single-event flip-immune memory cell and latch

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020017924A1 (en) * 2000-05-12 2002-02-14 Knowles Kenneth R. Logic architecture for single event upset immunity
CN103778954A (en) * 2014-02-24 2014-05-07 哈尔滨工业大学 Multi-node upset resistant memorizer
CN105577161A (en) * 2015-12-21 2016-05-11 合肥工业大学 A single-event multi-node flip-resistant hardened latch based on dual-mode redundancy
CN106847325A (en) * 2016-12-26 2017-06-13 中北大学 Primary particle inversion resistant memory cell
CN108233894A (en) * 2018-01-24 2018-06-29 合肥工业大学 A kind of low-power consumption dual-edge trigger based on duplication redundancy
CN108449071A (en) * 2018-03-28 2018-08-24 上海华虹宏力半导体制造有限公司 Resist the latch of two nodes overturning
CN108631764A (en) * 2018-04-23 2018-10-09 上海华虹宏力半导体制造有限公司 Latch
CN108766492A (en) * 2017-12-28 2018-11-06 北京时代民芯科技有限公司 A kind of anti-SEU storage unit circuits of low single-particle sensibility

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020017924A1 (en) * 2000-05-12 2002-02-14 Knowles Kenneth R. Logic architecture for single event upset immunity
CN103778954A (en) * 2014-02-24 2014-05-07 哈尔滨工业大学 Multi-node upset resistant memorizer
CN105577161A (en) * 2015-12-21 2016-05-11 合肥工业大学 A single-event multi-node flip-resistant hardened latch based on dual-mode redundancy
CN106847325A (en) * 2016-12-26 2017-06-13 中北大学 Primary particle inversion resistant memory cell
CN108766492A (en) * 2017-12-28 2018-11-06 北京时代民芯科技有限公司 A kind of anti-SEU storage unit circuits of low single-particle sensibility
CN108233894A (en) * 2018-01-24 2018-06-29 合肥工业大学 A kind of low-power consumption dual-edge trigger based on duplication redundancy
CN108449071A (en) * 2018-03-28 2018-08-24 上海华虹宏力半导体制造有限公司 Resist the latch of two nodes overturning
CN108631764A (en) * 2018-04-23 2018-10-09 上海华虹宏力半导体制造有限公司 Latch

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
DIANPENG LIN 等: "A Novel Highly Reliable and Low-power Radiation Hardened SRAM bitcell design", 《2018 INTERNATIONAL CONFERENCE ON RADIATION EFFECTS OF ELECTRONIC DEVICES》 *
孙永节 等: "基于DICE单元的抗SEU加固SRAM设计", 《国防科技大学学报》 *
王世超: "CMOS数字电路的电路级抗辐射加固方法研究", 《中国优秀硕士学位论文全文数据库 工程科技Ⅱ辑》 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111223503B (en) * 2020-03-11 2021-10-01 河海大学常州校区 A dual-node single-event flip-immune memory cell and latch

Similar Documents

Publication Publication Date Title
US6326809B1 (en) Apparatus for and method of eliminating single event upsets in combinational logic
US9768757B1 (en) Register circuitry with asynchronous system reset
CN109302174A (en) Low Redundancy Radiation Hardened D Latch
CN108134597A (en) A kind of completely immune latch of three internal nodes overturning
CN109546994A (en) The D-latch of the low anti-binode upset of redundancy
CN109525236A (en) The D-latch of anti-binode upset
US7741877B2 (en) Circuit for distributing an initial signal with a tree structure, protected against logic random events
CN106788379A (en) A kind of radiation hardening latch based on isomery duplication redundancy
CN109547006A (en) Flouride-resistani acid phesphatase D-latch
JP2008136192A (en) SET tolerance register
CN109547007A (en) Nuclear hardening D-latch
WO2018218898A1 (en) Anti-single event transient clock tree structure
CN107025925A (en) Apparatus and method with the capacitive character storage for latch redundancy
US20140328115A1 (en) Positive edge preset reset flip-flop with dual-port slave latch
CN109309495A (en) Nuclear hardened D latch
CN118399927A (en) Latch circuit with low delay and single event transient and single event upset resistance
CN109586706A (en) Using the Flouride-resistani acid phesphatase D-latch of stack architecture
CN109586705A (en) Flouride-resistani acid phesphatase D-latch based on double interlocking unit
CN109586703A (en) The D-latch of low redundancy nuclear hardening
CN103475359A (en) Anti-single event transient pulse CMOS circuit
US6078196A (en) Data enabled logic circuits
CN109586704A (en) Flouride-resistani acid phesphatase D-latch based on double interlocking structure
CN116318056A (en) A radiation-resistant Latch circuit and module utilizing source isolation reinforcement and polarity reinforcement
US9997210B2 (en) Data register for radiation hard applications
CN111162771A (en) Small D-Latch Resistant to Two-Node Toggling

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20190405