CN109407432A - A kind of production method of display base plate, display base plate and display device - Google Patents
A kind of production method of display base plate, display base plate and display device Download PDFInfo
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- CN109407432A CN109407432A CN201811260598.2A CN201811260598A CN109407432A CN 109407432 A CN109407432 A CN 109407432A CN 201811260598 A CN201811260598 A CN 201811260598A CN 109407432 A CN109407432 A CN 109407432A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136227—Through-hole connection of the pixel electrode to the active element through an insulation layer
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/13338—Input devices, e.g. touch panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/134309—Electrodes characterised by their geometrical arrangement
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
- G02F1/136295—Materials; Compositions; Manufacture processes
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Abstract
本发明实施例提供了一种显示基板的制作方法、显示基板及显示装置，显示基板的制作方法包括：在形成所述第一导电图形后，在所述第一导电图形上形成导电柱，所述导电柱在所述显示基板的衬底基板上的正投影与所述第二导电图形在所述衬底基板上的正投影至少部分重叠。这样无需在显示基板上进行孔洞设计，通过导电柱可以将位于异层的第一导电图形和第二导电图形建立连接，避免了由于隔垫物掉入孔洞或者PI液的填充不充分而造成显示基板的颜色云纹、黑点或亮点的显示问题，可提升显示电子产品的画质质感。
Embodiments of the present invention provide a method for manufacturing a display substrate, a display substrate, and a display device. The method for manufacturing a display substrate includes: after forming the first conductive pattern, forming conductive pillars on the first conductive pattern, so that the The orthographic projection of the conductive column on the base substrate of the display substrate at least partially overlaps the orthographic projection of the second conductive pattern on the base substrate. In this way, there is no need to design holes on the display substrate, and the first conductive pattern and the second conductive pattern on different layers can be connected through the conductive pillars, which avoids the display caused by the spacer falling into the hole or insufficient filling of the PI liquid. The display problems of color moiré, black dots or bright spots on the substrate can improve the image quality and texture of display electronic products.
Description
Technical field
The present invention relates to field of display technology, in particular to a kind of production method of display base plate, display base plate and display
Device.
Background technique
With the continuous improvement of living standards and the continuous development of display technology, image quality of the user to display electronic product
Texture, which has, higher to be required, so as to become display field continuous for the experience of image quality is fine and smooth, color is more beautiful display effect
The target of pursuit.However, existing display base plate can have the display problems such as color moire (Mura), colour contamination, stain or bright spot,
The above display problem is exactly the stumbling-block for influencing display experience and being promoted.
Summary of the invention
In order to solve the above-mentioned technical problem, the embodiment of the invention provides a kind of production methods of display base plate, display base
Plate and display device, to solve existing display base plate, there are the display problems of color moire (Mura) and stain or bright spot.
One aspect according to an embodiment of the present invention provides a kind of production method of display base plate, the display base plate
The first conductive pattern and the second conductive pattern including the connection of different layer, the production method include: to form first conductive pattern
After shape, form conductive column on first conductive pattern, the conductive column on the underlay substrate of the display base plate just
It projects least partially overlapped with orthographic projection of second conductive pattern on the underlay substrate.
Optionally, after the step of forming conductive column on first conductive pattern, the method also includes:
Form the insulating layer for wrapping up the side surface of the conductive column.
Optionally, after the step of forming the insulating layer of side surface of the first conductive column of package, or described first
After the step of forming the second conductive column on conductive pattern, the production method further include:
Flatness layer is formed on underlay substrate.
Optionally, first conductive pattern includes drain electrode, and second conductive pattern includes pixel electrode, described to lead
Electric column includes the first conductive column；
After the step of forming flatness layer on underlay substrate, the production method further include:
It is rectangular at common electrode layer on the flat laye；
Passivation layer is formed above the common electrode layer；
Pixel electrode is formed above the passivation layer, the pixel electrode is connect with first conductive column.
Optionally, first conductive pattern includes touch control electrode, and second conductive pattern includes common electrode layer, institute
Stating conductive column includes the second conductive column；
After the step of forming flatness layer on underlay substrate, the production method further include:
Rectangular at common electrode layer on the flat laye, the common electrode layer is connect with second conductive column.
Optionally, first conductive pattern includes drain electrode and touch control electrode, and second conductive pattern includes public
Electrode layer and pixel electrode, the conductive column include the first conductive column and the second conductive column；
It is described to form conductive column on first conductive pattern, comprising:
The second conductive column is formed in touch control electrode by a patterning processes, and the first conductive column is formed on drain electrode；
The second conductive column is being formed in touch control electrode by a patterning processes, and the first conductive column is formed on drain electrode
The step of after, the production method further include:
Form the insulating layer for wrapping up the side surface of first conductive column；
Flatness layer is formed on underlay substrate；
Rectangular at common electrode layer on the flat laye, the common electrode layer is connect with second conductive column；
Passivation layer is formed above the common electrode layer；
Pixel electrode is formed above the passivation layer, the pixel electrode is connect with first conductive column.
Optionally, the upper surface of the insulating layer is concordant with the upper surface of the passivation layer, the upper surface of the flatness layer
It is concordant with the upper surface of second conductive column.
It is optionally, described to form the insulating layer for wrapping up the side surface of the conductive column, comprising:
Form the insulating layer for wrapping up the preset thickness of side surface of the conductive column.
Other side according to an embodiment of the present invention additionally provides a kind of display base plate, using display as described above
The production method of substrate makes to obtain.
Another aspect according to an embodiment of the present invention additionally provides a kind of display device, including shows as described above
Substrate.
The embodiment of the present invention has the following beneficial effects:
In the embodiment of the present invention, by forming conductive column on the first conductive pattern, and make conductive column in the display
Orthographic projection and orthographic projection of second conductive pattern on the underlay substrate on the underlay substrate of substrate is at least partly heavy
It is folded, in this way without carrying out hole design on display base plate, by conductive column can will be located at the first conductive pattern of different layer with
Second conductive pattern establishes connection, falls into hole or PI (Polyimide, polyimides) liquid so as to avoid due to spacer material
The Mura insufficient and that cause display base plate of filling, stain or bright spot display problem, the picture of display electronic product can be promoted
Matter texture.
Detailed description of the invention
Fig. 1 is a kind of one of the structural schematic diagram of display base plate of the embodiment of the present invention；
Fig. 2 is the flow chart of the production method of display base plate shown in Fig. 1；
Fig. 3 is a kind of second structural representation of display base plate of the embodiment of the present invention；
Fig. 4 is a kind of third structural representation of display base plate of the embodiment of the present invention；
Fig. 5 is the four of the structural schematic diagram of a kind of display base plate of the embodiment of the present invention；
Fig. 6 is the five of the structural schematic diagram of a kind of display base plate of the embodiment of the present invention；
Fig. 7 is the six of the structural schematic diagram of a kind of display base plate of the embodiment of the present invention；
Fig. 8 is the seven of the structural schematic diagram of a kind of display base plate of the embodiment of the present invention.
Specific embodiment
To keep the technical problem to be solved in the present invention, technical solution and advantage clearer, below in conjunction with attached drawing and tool
Body embodiment is described in detail.
Term " first ", " second " in description and claims of this specification etc. are for distinguishing similar right
As without being used to describe a particular order or precedence order.It should be understood that the data used in this way in the appropriate case can be with
It exchanges, so that the embodiment of the present invention described herein for example can be with suitable other than those of illustrating or describing herein
Sequence is implemented.
Currently, routine TFT-LCD (Thin Film Transistor-Liquid Crystal Display, film crystal
Pipe liquid crystal display) display base plate is made of first substrate and the second substrate, the filling liquid between first substrate and the second substrate
Crystalline substance, and the stabilization supported to keep liquid crystal cell thickness for passing through spacer material.Since spacer material is usually designed at TPM (Touch
Pattern metal, touch pattern metal or be touch control electrode) hole nearby or top, this results in spacer material to be easy to
It falls into the hole TPM and makes the slight change of box thickness generation around, to will appear horizontal or perpendicular color in corresponding display area
The display problem of moire.Furthermore the increase of array substrate surface hole defect depth will lead to the insufficient of PI liquid filling, thus shadow
The arrangement and driving of its hole periphery liquid crystal are rung, and generates large batch of " pore " in display area.
Referring to Fig. 1, based on the above analysis, the embodiment of the invention provides a kind of display base plate, display base plate includes first
Conductive pattern 1 and the second conductive pattern 2 will be located at the first conductive pattern 1 and the second conductive pattern 2 of different layer by conductive column 3
Connection is established, without carrying out hole design in display base plate, can fundamentally solve Mura, the stain of existing display base plate
Or the display problem of bright spot.
Fig. 2 is the flow chart of the production method of display base plate shown in Fig. 1, referring to fig. 2, the production method of the display base plate
Include:
Step 201: after forming first conductive pattern 1, conductive column 3, institute are formed on first conductive pattern 1
Orthographic projection of the conductive column 3 on the underlay substrate 4 of the display base plate and second conductive pattern 2 are stated in the underlay substrate
Orthographic projection on 4 is least partially overlapped.
Wherein, the material of the conductive column 3 can for nano indium tin metal oxide (Indium Tin Oxides,
ITO), it is of course not solely limited to this.
In the embodiment of the present invention, referring to Fig. 3, by forming conductive column on the first conductive pattern 1, and make conductive column 3
In the orthographic projection and positive throwing of second conductive pattern 2 on the underlay substrate 4 on the underlay substrate 4 of the display base plate
Shadow is least partially overlapped, in this way without carrying out hole design on display base plate, can will be located at the of different layer by conductive column 3
One conductive pattern 1 and the second conductive pattern 2 establish connection, so as to avoid the filling for falling into hole or PI liquid due to spacer material
It is insufficient and cause display base plate there are the display problem of Mura, stain or bright spot, the image quality matter of display electronic product can be promoted
Sense.
In one embodiment, first conductive pattern 1 includes drain electrode 11, and second conductive pattern 2 includes pixel
Electrode 21, the conductive column 3 include the first conductive column 31, and referring to Fig. 1 and Fig. 4 to Fig. 8, the production method of the display base plate has
Body the following steps are included:
Step 301: after forming first conductive pattern 1, being formed on the drain electrode 11 of first conductive pattern 1
First conductive column 31；
In embodiments of the present invention, it is formed after drain electrode 11, can be existed on underlay substrate 4 by a patterning processes
The first conductive column 31 is formed on the drain electrode 11, it should be noted that the embodiment of the present invention does not limit described first specifically
The manufacturing process of conductive column 31.
With continued reference to Fig. 4, the position of the sets of holes 41 of the position and drain electrode 11 of first conductive column 31 is staggered.
Step 302: forming the insulating layer 5 for wrapping up the side surface of first conductive column 31；
Wherein, the height of the insulating layer 5 can be consistent with the height of first conductive column 31, it is to be understood that
It is well contacted to guarantee that the pixel electrode 21 can have with first conductive column 31, the height of the insulating layer 5 can be omited
Lower than the height of first conductive column 31.
In embodiments of the present invention, default thickness can be formed around the side surface of the conductive column by a patterning processes
The insulating layer of degree, the preset thickness can be 100nm~200nm.It should be noted that the above related thickness of insulating layer
And the description of manufacturing process is example and non-limiting.
It should be noted that the lower end of the insulating layer 5 is contacted with the drain electrode 11.
Step 303: flatness layer 6 is formed on underlay substrate 4；
Step 304: common electrode layer 22 is formed above the flatness layer 6；
It in embodiments of the present invention, can be by exposure and etching technics come really after the completion of common electrode layer 22 deposits
Short circuit phenomenon will not be occurred by protecting the common electrode layer 22 and pixel electrode 21, the problems such as to prevent causing subsequent drive to fail.
Step 305: passivation layer 7 is formed above the common electrode layer 22；
In embodiments of the present invention, the upper surface of the insulating layer 5 is concordant with the upper surface of the passivation layer 7.
In embodiments of the present invention, the passivation layer 7 and the insulating layer 5 can use same material, certainly and not only
It is limited to this.
Step 306: pixel electrode 21, the pixel electrode 21 and first conduction are formed above the passivation layer 7
Column 31 connects.
In embodiments of the present invention, pixel electrode 21 can be formed above the passivation layer 7 by a patterning processes.
In embodiments of the present invention, in the case where display base plate is designed without hole, pass through first conductive column 31
The connection between the drain electrode 11 and pixel electrode 21 of different layer can be achieved, avoid since spacer material falls into hole or PI
The display problem for filling Mura that is insufficient and causing display base plate, stain or bright spot of liquid can promote display electronic product
Image quality texture.
In another embodiment, first conductive pattern 1 includes touch control electrode 12, and second conductive pattern 2 wraps
Common electrode layer 22 is included, the conductive column 3 includes the second conductive column 32, referring to fig. 4 to Fig. 8, the production method of the display base plate
Specifically includes the following steps:
Step 401: after forming first conductive pattern 1, the shape in the touch control electrode 12 of first conductive pattern 1
At the second conductive column 32；
In embodiments of the present invention, it is formed after touch control electrode 12 on underlay substrate 4, a patterning processes can be passed through
The second conductive column 32 is formed in touch control electrode 12, it should be noted that the embodiment of the present invention does not limit described second specifically
The manufacturing process of conductive column 32.
Step 402: flatness layer 6 is formed on underlay substrate 4；
In embodiments of the present invention, the upper surface of the flatness layer 6 is concordant with the upper surface of second conductive column 32, can
With understanding, preferably contacted to guarantee that common electrode layer 22 has with second conductive column 32, the upper table of the flatness layer
Face can be slightly below the upper surface of second conductive column.
Step 403: common electrode layer 22, the common electrode layer 22 and described second are formed above the flatness layer 6
Conductive column 32 connects.
In embodiments of the present invention, in the case where display base plate is designed without hole, pass through second conductive column 32
Can be achieved positioned at different layer touch control electrode 12 and common electrode layer 22 between connection, avoid due to spacer material fall into hole or
The display problem for filling Mura that is insufficient and causing display base plate, stain or bright spot of person's PI liquid can promote display electronics and produce
The image quality texture of product.
In another embodiment, first conductive pattern 1 includes drain electrode 11 and touch control electrode 12, and described second is conductive
Figure 2 includes common electrode layer 22 and pixel electrode 21, and the conductive column 3 includes the first conductive column 31 and the second conductive column 32,
Referring to Fig. 1 and Fig. 4 to Fig. 8, the production method of the display base plate specifically includes the following steps:
Step 501: the second conductive column 32, the shape on drain electrode 11 are formed in touch control electrode 12 by a patterning processes
At the first conductive column 31；
Wherein, the implementation principle of step 501 is identical as the implementation principle of step 301 and step 401, and similarity is no longer superfluous
It states.
Step 502: forming the insulating layer 5 for wrapping up the side surface of first conductive column 31；
Wherein, the implementation principle of step 502 and the implementation principle of step 302 are identical, and similarity repeats no more.
Step 503: flatness layer 6 is formed on underlay substrate 4；
Wherein, the implementation principle of step 503 is identical as the implementation principle of step 402 and step 303, and similarity is no longer superfluous
It states.
Step 504: common electrode layer 22, the common electrode layer 22 and described second are formed above the flatness layer 6
Conductive column 32 connects；
Wherein, the implementation principle of step 504 is identical as the implementation principle of step 403 and step 304, and similarity is no longer superfluous
It states.
Step 505: passivation layer 7 is formed above the common electrode layer 22；
Wherein, the implementation principle of step 505 and the implementation principle of step 305 are identical, and similarity repeats no more.
Step 506: pixel electrode 21, the pixel electrode 21 and first conduction are formed above the passivation layer 7
Column 31 connects.
Wherein, the implementation principle of step 506 and the implementation principle of step 306 are identical, and similarity repeats no more.
In embodiments of the present invention, in the case where being not necessarily to hole design on display base plate, pass through first conductive column
31 can realize drain electrode 11 and pixel electrode 21 connection positioned at different layer, and the touching positioned at different layer may be implemented by the second conductive column
The connection between electrode 12 and common electrode layer 22 is controlled, it is insufficient to avoid the filling that hole or PI liquid are fallen into due to spacer material
And the display problem of the Mura of display base plate, stain or bright spot is caused, the image quality texture of display electronic product can be promoted.
Meanwhile the embodiment of the invention also provides a kind of display base plates, the display base plate is using display base as described above
The production method of plate makes to obtain.Further, the embodiment of the invention also provides a kind of display device, including it is as described above
Display base plate.
Wherein, display base plate through the embodiment of the present invention and display device can be avoided since spacer material falls into hole
The display problem of the filling in hole or PI liquid Mura that is insufficient and causing display base plate, stain or bright spot can promote display electricity
The image quality texture of sub- product.
Further, the conductive column can be cylinder, and the side cutaway view of the conductive column is rectangle at this time, and conventional orifices
The side cutaway view in hole is mostly trapezoidal, designs with traditional hole, and the display base plate and display device of the embodiment of the present invention have resistance
The advantages of uniformity is without mutation.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art
For, without departing from the principles of the present invention, it can also make several improvements and retouch, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (10)
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