CN109071918B - 固化树脂用组合物及其固化物 - Google Patents
固化树脂用组合物及其固化物 Download PDFInfo
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- CN109071918B CN109071918B CN201780026301.3A CN201780026301A CN109071918B CN 109071918 B CN109071918 B CN 109071918B CN 201780026301 A CN201780026301 A CN 201780026301A CN 109071918 B CN109071918 B CN 109071918B
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- benzoxazine
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- polyfunctional
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/02—Polyamines
- C08G73/0233—Polyamines derived from (poly)oxazolines, (poly)oxazines or having pendant acyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
- C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
- C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
- C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/506—Amines heterocyclic containing only nitrogen as a heteroatom having one nitrogen atom in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/64—Amino alcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C08L61/04, C08L61/18 and C08L61/20
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims (3)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-091115 | 2016-04-28 | ||
| JP2016091115 | 2016-04-28 | ||
| JP2016188911 | 2016-09-27 | ||
| JP2016-188911 | 2016-09-27 | ||
| PCT/JP2017/017066 WO2017188448A1 (ja) | 2016-04-28 | 2017-04-28 | 硬化樹脂用組成物及びその硬化物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109071918A CN109071918A (zh) | 2018-12-21 |
| CN109071918B true CN109071918B (zh) | 2022-04-15 |
Family
ID=60160774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780026301.3A Active CN109071918B (zh) | 2016-04-28 | 2017-04-28 | 固化树脂用组合物及其固化物 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20190119447A1 (zh) |
| EP (1) | EP3450499B1 (zh) |
| JP (1) | JP6952684B2 (zh) |
| KR (1) | KR102324393B1 (zh) |
| CN (1) | CN109071918B (zh) |
| PT (1) | PT3450499T (zh) |
| TW (1) | TWI762483B (zh) |
| WO (1) | WO2017188448A1 (zh) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6946088B2 (ja) * | 2017-07-14 | 2021-10-06 | Eneos株式会社 | 硬化樹脂用組成物、該組成物の硬化物、該組成物および該硬化物の製造方法、ならびに半導体装置 |
| US11584824B2 (en) | 2017-10-27 | 2023-02-21 | Eneos Corporation | Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device |
| KR102427035B1 (ko) * | 2017-10-27 | 2022-08-01 | 에네오스 가부시키가이샤 | 경화 수지용 조성물, 상기 조성물의 경화물, 상기 조성물 및 상기 경화물의 제조방법, 및 반도체 장치 |
| US11897998B2 (en) | 2017-10-27 | 2024-02-13 | Eneos Corporation | Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device |
| WO2019186269A1 (en) * | 2018-03-30 | 2019-10-03 | Toray Industries, Inc. | Benzoxazine resin composition, prepreg, and fiber-reinforced composite material |
| US10487077B1 (en) | 2018-06-14 | 2019-11-26 | Sabic Global Technologies B.V. | Bis(benzoxazinyl)phthalimidine and associated curable composition and composite |
| KR102725652B1 (ko) * | 2018-08-03 | 2024-11-05 | 가부시키가이샤 에네오스 마테리아루 | 경화 수지용 조성물, 상기 조성물의 경화물, 상기 조성물 및 상기 경화물의 제조방법, 및 반도체 장치 |
| CN113166346B (zh) | 2018-12-10 | 2024-03-15 | 引能仕株式会社 | 固化树脂用组合物、该组合物的固化物、该组合物和该固化物的制造方法以及半导体装置 |
| CN113474387A (zh) * | 2019-02-26 | 2021-10-01 | 长濑化成株式会社 | 固化性材料的固化物、固化物的制造方法及聚合物组合物 |
| CN113728032A (zh) * | 2019-04-26 | 2021-11-30 | 引能仕株式会社 | 固化树脂用组合物、该组合物的固化物、该组合物及该固化物的制造方法、以及半导体装置 |
| JP2022118627A (ja) * | 2021-02-02 | 2022-08-15 | Eneos株式会社 | 硬化樹脂用組成物、該組成物の硬化物、該組成物および該硬化物の製造方法、ならびに半導体装置 |
| CN114573842B (zh) * | 2022-03-14 | 2023-09-26 | 山东大学 | 耐高温、可再加工的苯并噁嗪热固性树脂及其合成方法与应用 |
| JP2025012975A (ja) * | 2023-07-14 | 2025-01-24 | 信越化学工業株式会社 | ダイボンディング用有機変性シリコーン樹脂組成物、その硬化物、及び光半導体素子 |
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| TW201224033A (en) * | 2010-07-28 | 2012-06-16 | Huntsman Adv Mat Americas Inc | Solvent-free benzoxazine based thermosetting resin composition |
| CN103265791A (zh) * | 2013-05-29 | 2013-08-28 | 苏州生益科技有限公司 | 一种用于集成电路的热固性树脂组合物及使用其制作的半固化片及层压板 |
| CN103540101A (zh) * | 2012-07-17 | 2014-01-29 | 台光电子材料(昆山)有限公司 | 无卤素树脂组合物及应用其的铜箔基板及印刷电路板 |
| CN103554834A (zh) * | 2013-09-04 | 2014-02-05 | 东莞联茂电子科技有限公司 | 一种无卤高频树脂组合物 |
| CN103937157A (zh) * | 2014-03-05 | 2014-07-23 | 浙江华正新材料股份有限公司 | 无卤树脂组合物及采用其制造半固化片及层压板的方法 |
| CN103965624A (zh) * | 2014-05-28 | 2014-08-06 | 苏州生益科技有限公司 | 一种无卤树脂组合物、由其制备的预浸料及层压板 |
| CN103980704A (zh) * | 2014-05-28 | 2014-08-13 | 苏州生益科技有限公司 | 用于高频高速基板的无卤树脂组合物、半固化片及层压板 |
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-
2017
- 2017-04-28 US US16/096,969 patent/US20190119447A1/en not_active Abandoned
- 2017-04-28 WO PCT/JP2017/017066 patent/WO2017188448A1/ja not_active Ceased
- 2017-04-28 TW TW106114324A patent/TWI762483B/zh active
- 2017-04-28 CN CN201780026301.3A patent/CN109071918B/zh active Active
- 2017-04-28 KR KR1020187033627A patent/KR102324393B1/ko active Active
- 2017-04-28 JP JP2018514742A patent/JP6952684B2/ja active Active
- 2017-04-28 EP EP17789729.5A patent/EP3450499B1/en active Active
- 2017-04-28 PT PT177897295T patent/PT3450499T/pt unknown
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102439088A (zh) * | 2009-02-12 | 2012-05-02 | 吉坤日矿日石能源株式会社 | 苯并*嗪树脂组合物 |
| TW201224033A (en) * | 2010-07-28 | 2012-06-16 | Huntsman Adv Mat Americas Inc | Solvent-free benzoxazine based thermosetting resin composition |
| CN103540101A (zh) * | 2012-07-17 | 2014-01-29 | 台光电子材料(昆山)有限公司 | 无卤素树脂组合物及应用其的铜箔基板及印刷电路板 |
| CN103265791A (zh) * | 2013-05-29 | 2013-08-28 | 苏州生益科技有限公司 | 一种用于集成电路的热固性树脂组合物及使用其制作的半固化片及层压板 |
| CN103554834A (zh) * | 2013-09-04 | 2014-02-05 | 东莞联茂电子科技有限公司 | 一种无卤高频树脂组合物 |
| CN103937157A (zh) * | 2014-03-05 | 2014-07-23 | 浙江华正新材料股份有限公司 | 无卤树脂组合物及采用其制造半固化片及层压板的方法 |
| CN103965624A (zh) * | 2014-05-28 | 2014-08-06 | 苏州生益科技有限公司 | 一种无卤树脂组合物、由其制备的预浸料及层压板 |
| CN103980704A (zh) * | 2014-05-28 | 2014-08-13 | 苏州生益科技有限公司 | 用于高频高速基板的无卤树脂组合物、半固化片及层压板 |
| CN105131597A (zh) * | 2014-06-05 | 2015-12-09 | 广东生益科技股份有限公司 | 一种无卤树脂组合物以及使用它的预浸料和印制电路用层压板 |
| CN104817823A (zh) * | 2015-05-19 | 2015-08-05 | 广州宏仁电子工业有限公司 | 有卤树脂组合物及其应用 |
| CN105482452A (zh) * | 2015-12-25 | 2016-04-13 | 广东生益科技股份有限公司 | 一种无卤树脂组合物以及含有它的预浸料、层压板和印制电路板 |
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| Publication number | Publication date |
|---|---|
| JPWO2017188448A1 (ja) | 2019-03-07 |
| WO2017188448A1 (ja) | 2017-11-02 |
| PT3450499T (pt) | 2024-01-12 |
| US20190119447A1 (en) | 2019-04-25 |
| EP3450499B1 (en) | 2023-11-01 |
| KR20190003590A (ko) | 2019-01-09 |
| KR102324393B1 (ko) | 2021-11-10 |
| TW201803859A (zh) | 2018-02-01 |
| EP3450499A4 (en) | 2019-10-09 |
| TWI762483B (zh) | 2022-05-01 |
| CN109071918A (zh) | 2018-12-21 |
| EP3450499A1 (en) | 2019-03-06 |
| JP6952684B2 (ja) | 2021-10-20 |
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