CN108811309A - A kind of single-clad board and preparation method thereof suitable for handwriting pad - Google Patents
A kind of single-clad board and preparation method thereof suitable for handwriting pad Download PDFInfo
- Publication number
- CN108811309A CN108811309A CN201811010619.5A CN201811010619A CN108811309A CN 108811309 A CN108811309 A CN 108811309A CN 201811010619 A CN201811010619 A CN 201811010619A CN 108811309 A CN108811309 A CN 108811309A
- Authority
- CN
- China
- Prior art keywords
- clear switch
- pad
- clad board
- hole
- handwriting pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002360 preparation method Methods 0.000 title abstract description 4
- 238000004519 manufacturing process Methods 0.000 claims abstract description 22
- 238000009434 installation Methods 0.000 claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 22
- 239000010949 copper Substances 0.000 claims description 22
- 238000010586 diagram Methods 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacture Of Switches (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The single-clad board and preparation method thereof that the invention discloses a kind of suitable for handwriting pad, it include a plate body, the installation position middle that clear switch is corresponded on the plate body offers a through-hole, the clear switch is placed in the through-hole, the pin of the clear switch is welded on the pad of the plate body, and the push-botton operation of the clear switch is facing towards the direction opposite with the pad.Clear switch is placed in through-hole the single-clad board suitable for handwriting pad, clear switch pin is welded at the weld locations of plate body, the push-botton operation of clear switch is facing towards the direction opposite with pad, the direction in push-botton operation face of clear switch is identical as in the setting direction of other electronic components and existing double-sided printed-circuit board, so, the single-clad board can be directly mounted in existing handwriting pad and use, meet demand；The circuit board is designed using single-clad board simultaneously, production is relatively easy, and production cost is low.
Description
Technical field
The present invention relates to circuit board design techniques field more particularly to a kind of single-clad boards suitable for handwriting pad
And preparation method thereof.
Background technology
Handwriting pad is also hand-written instrument, is a kind of electronic product can be used for writing words or drawing.Existing handwriting pad packet
A handwriting screen and a removing button have been included, the clear switch on the lower end connection internal circuit plate of button has been removed, in general, by clear
Except switch is mounted on other electronic components in the different sides of circuit board, clear switch is influenced to avoid other electronic components
With remove button connection, thus, existing handwriting pad normally only use double-sided printed-circuit board realize.But printed on both sides
Need to be in two-sided arrangement circuit when board production, production process is relatively cumbersome, and board cost is also relatively high, in this way, handwriting pad
Whole production cost it is relatively high.In order to reduce cost, production firm wishes to be replaced with single-clad board two-sided
Printing plate makes handwriting pad, but in the case where Writing pad structure limits, if directly single-clad board is used to make hand
The circuit board of plate is write, clear switch can be mounted on the same face of circuit board with other electronic components, in this way, clear switch
Push-botton operation facing towards and other electronic components attachment direction and existing double-sided printed-circuit board be different, the list
Face printed circuit board will be unable to be assemblied in the handwriting pad of existing structure and directly use, and be printed on one side electricity as direct use
Road plate makes handwriting pad, needs the existing structure of corresponding transformation handwriting pad, improvement cost big and very troublesome.
In consideration of it, considering the restriction of existing Writing pad structure, need to be designed the circuit board in existing handwriting pad.
Invention content
Technical problem to be solved by the present invention lies in provide a kind of single-clad board suitable for handwriting pad and its
Production method, to meet the needs of assembling and reducing production cost.
In order to solve the above-mentioned technical problem, the invention discloses following technical solutions.A kind of single side suitable for handwriting pad
Printed circuit board includes a plate body, and the installation position middle that clear switch is corresponded on the plate body offers a through-hole, institute
It states clear switch to be placed in the through-hole, the pin of the clear switch is welded on the pad of the plate body, the removing
The push-botton operation of switch is facing towards the direction opposite with the pad.
Its further technical solution is：The pad of the clear switch is set to the edge of the through-hole.
Its further technical solution is：The clear switch in cube-shaped,
Its further technical solution is：The through-hole has a rectangular shape.
A kind of production method of single-clad board suitable for handwriting pad includes：
Design circuit diagram and being connected up obtains print circuit pattern, when wiring among the installation position of clear switch
Place, which is reserved with one, can house the accommodating position of the clear switch；
Print circuit pattern is printed on copper coin and obtains single-clad board；
The through-hole of the clear switch can be housed by punching to obtain one at the accommodating position of clear switch；
Clear switch is placed in through-hole, and the pin of clear switch is welded on pad, the push-botton operation of clear switch
Facing towards the direction opposite with pad.
Its further technical solution is：It is described that print circuit pattern is printed on copper coin to obtain single-clad board specific
Including：
It is generated according to wiring result and prints print circuit pattern；
By the print circuit pattern thermal transfer of printing on copper coin；
The copper coin transferred is put into and is corroded in corroding in case, is cleaned and is removed on copper coin with clear water after corroding successfully
Carbon dust obtain single-clad board.
Its further technical solution is：Print circuit pattern uses laser printer types.
Its further technical solution is：It is realized using ferric trichloride corrosive liquid when corroding copper coin.
The method have the benefit that：This is suitable for the peace of the clear switch on the single-clad board of handwriting pad
Dress mode is different from existing single-clad board, and through-hole is opened up by the installation position middle in clear switch, peace
When dress, clear switch is placed in through-hole, and clear switch pin is welded at the weld locations of plate body, the button of clear switch
The operating surface direction direction opposite with pad, the setting of the direction and other electronic components in the push-botton operation face of clear switch
It is identical on direction and existing double-sided printed-circuit board, in this way, the single-clad board can be directly mounted at existing hand
It writes in plate and uses, meet demand；Meanwhile the circuit board is designed using single-clad board, production is relatively easy, is produced into
This is low.
Description of the drawings
Fig. 1 is the schematic elevation view of one embodiment of the invention；
Fig. 2 is the schematic side view of one embodiment of the invention；
Fig. 3 is the schematic rear view of one embodiment of the invention；
Fig. 4 is the step flow chart of one embodiment of the invention；
Fig. 5 is the part steps flow chart of one embodiment of the invention.
Specific implementation mode
It is further to technical scheme of the present invention with reference to schematic diagram in order to more fully understand the technology contents of the present invention
It introduces and illustrates, but not limited to this.
As shown in Figure 1 to Figure 3, in this application, should include a plate body suitable for the single-clad board of handwriting pad
1, the installation position middle that clear switch 2 is corresponded on plate body 1 offers a through-hole 10, and clear switch 2 is placed in the through-hole 10
In, the pin of clear switch 2 is welded at 11 position of pad of plate body 1, the push-botton operation face 21 of clear switch 2 towards with weldering
The opposite direction of contact 11.
The integral manufacturing process of single-clad board is simple compared to double-sided printed-circuit board, and plank expends also relatively
Few, production cost is relatively low, but is limited by Writing pad structure, and most of hand-written panel products can only use printed on both sides electricity at present
Road plate is realized.To reduce production cost, production firm wishes directly be replaced in existing product with single-clad board
Double-sided printed-circuit board.Clear switch 2 is in not with other electronic components in double-sided printed-circuit board in existing handwriting pad
It is coplanar, so require position and direction and the double-sided printed-circuit board of the clear switch welded on single-clad board 2
Unanimously, but using common single-clad board it is obviously difficult to realize, mounts to remove on common single-clad board and open
When closing 2 with other electronic components, clear switch 2 can be in the same plane with other electronic components, can not directly fit
It is installed and used on handwriting pad.In the application, through-hole 10 is offered by the installation position middle in clear switch 2, clearly
Except switch 2 is placed in the through-hole 10, the pin of clear switch 2 is welded at 11 position of pad of plate body 1, clear switch 2
Push-botton operation face 21 towards the direction opposite with pad 11, although in this way, the pin welding position of clear switch 2 and other
Surface-pasted electronic component is on the same face, still, the direction and other surfaces in the push-botton operation face 21 of clear switch 2
Mounted electronic component is different, the setting direction of the direction and other electronic components in the push-botton operation face 21 of clear switch 2
Consistent in double-sided printed-circuit board, which can be directly mounted in existing handwriting pad and use, alternatively
Double-sided printed-circuit board in existing product, meet demand.
Since the pin of surface-pasted clear switch 2 is shorter, for convenience of installing, in the application, the welding of clear switch 2
Point 11 is set to the edge of through-hole 10.In this way, when clear switch 2 is contained in through-hole 10, the pin of clear switch 2 can conveniently connect
Pad 11 is touched to be welded.
In the present embodiment, as shown in Figures 2 and 3, clear switch 2 is in cube-shaped, and the structure of through-hole 10 need to be with removing
The structure matching of switch 2, correspondingly, the setting of through-hole 10 have a rectangular shape, wherein and the length of side of through-hole 10 need to be more than clear switch 2,
The clear switch 2 can so be housed.
Certainly, in some other embodiment, if clear switch 2 is realized using the switch of other structures shape, correspondingly,
Through-hole 10 need to be corresponded to and is designed, such as be designed to round, rectangle structure.
In addition, as shown in figure 4, present invention also provides the making sides of the single-clad board for being suitable for handwriting pad
Method, making step include：
S1, design circuit diagram are simultaneously connected up, and are reserved with one in the installation position middle of clear switch 2 when wiring
The accommodating position of the clear switch 2 can be housed；
In the step, when wiring, usually can first use self routing, and then again using manually adjusting wiring, when wiring notes
The installation position middle for being intended to clear switch 2 is reserved with one and can house the accommodating position of the electronic component, so as to follow-up
It is punched to obtain the through-hole 10 housed for clear switch 2.
Print circuit pattern is printed on copper coin and obtains single-clad board by S2；
S3, the through-hole of the clear switch 2 can be housed by punching to obtain one at the accommodating position of clear switch 2；
S4, clear switch 2 are placed in through-hole 10, and the pin of clear switch 2 is welded on pad 11, clear switch 2
Push-botton operation face 21 towards the direction opposite with pad 11.
After being welded, push-botton operation face 21 and other electronic components of clear switch 2 are in different sides, in this way, clearly
Except the direction in the push-botton operation face 21 of switch 2 is identical as on double-sided printed-circuit board as the setting direction of other electronic components,
The single-clad board can be directly applied for installing and using in existing handwriting pad, without changing the structure of handwriting pad, produce
And welding process is simple and convenient, reduces production cost, meets production requirement.
When the actual fabrication single-clad board, as shown in figure 5, step S2, print circuit pattern is printed on copper coin
Single-clad board is obtained to specifically include：
S21 is generated according to wiring result and is printed print circuit pattern.
Wherein, usual laser printer types when print circuit pattern only print when printing and apply copper region and pay attention to wanting mirror image
Printing.
S22, by the print circuit pattern thermal transfer of printing on copper coin.
When transfer, usually first heat transfer type platemaking machine is preheated, the print circuit pattern of printing is pasted on copper coin,
Copper coin is pushed into thermal transfer in platemaking machine when platemaking machine reaches 150 DEG C, takes out after the completion of transfer and is thrown off after copper coin cooling
The transfer paper in face, detection repair break lines, thread cast-off position are simultaneously repaired.
The copper coin transferred is put into and corrodes in corroding in case, cleaned with clear water after corroding successfully and remove copper removal by S23
Carbon dust on plate obtains single-clad board.
Normally, corroded using ferric trichloride corrosive liquid when corroding copper coin.
It, should be suitable for the mounting means of the clear switch 2 on the single-clad board of handwriting pad in the solution of the present invention
It is different from existing single-clad board, by opening up through-hole 10 in the installation position middle of clear switch 2, install
When, clear switch 2 is placed in through-hole 10, and 2 pin of clear switch is welded at 11 position of pad of plate body 1, clear switch 2
Push-botton operation face 21 towards the direction opposite with pad 11, the direction in the push-botton operation face 21 of clear switch 2 and other electricity
It is identical in the setting direction of sub- component and existing double-sided printed-circuit board, in this way, the single-clad board can be direct
It is installed in existing handwriting pad and uses, meet demand；Meanwhile the circuit board is designed using single-clad board, it produces
Relatively easy, production cost is low.
It is that above-mentioned preferred embodiment should be regarded as application scheme embodiment for example, all with application scheme thunder
Technology deduction, replacement, improvement etc. same, approximate or make based on this, are regarded as the protection domain of this patent.
Claims (8)
1. a kind of single-clad board suitable for handwriting pad, which is characterized in that include a plate body, corresponded on the plate body
The installation position middle of clear switch offers a through-hole, and the clear switch is placed in the through-hole, the clear switch
Pin be welded on the pad of the plate body, the push-botton operation of the clear switch is facing towards opposite with the pad
Direction.
2. the single-clad board according to claim 1 suitable for handwriting pad, which is characterized in that the pad is set
In the edge of the through-hole.
3. the single-clad board according to claim 1 suitable for handwriting pad, which is characterized in that the clear switch
In cube-shaped.
4. the single-clad board according to claim 3 suitable for handwriting pad, which is characterized in that the through-hole is in just
Square shape.
5. a kind of production method of single-clad board suitable for handwriting pad, which is characterized in that include：
Design circuit diagram and being connected up obtains print circuit pattern, and when wiring is pre- in the installation position middle of clear switch
There are the accommodating positions that one can house the clear switch；
Print circuit pattern is printed on copper coin and obtains single-clad board；
The through-hole of the clear switch can be housed by punching to obtain one at the accommodating position of clear switch；
Clear switch is placed in through-hole, and the pin of clear switch is welded on pad, and the push-botton operation of clear switch faces
To the direction opposite with pad.
6. the production method of the single-clad board according to claim 5 suitable for handwriting pad, which is characterized in that institute
It states print circuit pattern being printed on copper coin and obtains single-clad board and specifically include：
It is generated according to wiring result and prints print circuit pattern；
By the print circuit pattern thermal transfer of printing on copper coin；
The copper coin transferred is put into and is corroded in corroding in case, is cleaned with clear water after corroding successfully and removes the carbon on copper coin
Powder obtains single-clad board.
7. the production method of the single-clad board according to claim 6 suitable for handwriting pad, which is characterized in that print
Circuit diagram processed uses laser printer types.
8. the production method of the single-clad board according to claim 6 suitable for handwriting pad, which is characterized in that rotten
It is realized using ferric trichloride corrosive liquid when losing copper coin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811010619.5A CN108811309B (en) | 2018-08-31 | 2018-08-31 | Single-sided printed circuit board suitable for handwriting board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811010619.5A CN108811309B (en) | 2018-08-31 | 2018-08-31 | Single-sided printed circuit board suitable for handwriting board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108811309A true CN108811309A (en) | 2018-11-13 |
| CN108811309B CN108811309B (en) | 2024-06-18 |
Family
ID=64081484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811010619.5A Active CN108811309B (en) | 2018-08-31 | 2018-08-31 | Single-sided printed circuit board suitable for handwriting board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108811309B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110861423A (en) * | 2019-11-19 | 2020-03-06 | 江苏上达电子有限公司 | Transfer printing ink processing technology for printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0654150U (en) * | 1992-12-26 | 1994-07-22 | 豊田合成株式会社 | Switch module |
| JPH0758445A (en) * | 1993-08-10 | 1995-03-03 | Fujitsu Ltd | Printed wiring board and manufacturing method thereof |
| JP2001054286A (en) * | 1999-08-06 | 2001-02-23 | Mitsubishi Electric Corp | Electronic control board |
| CN1502876A (en) * | 2002-11-26 | 2004-06-09 | 乐金电子(天津)电器有限公司 | Controller assembly of microwave oven and intelligent switch assembly structure thereof |
| JP2004172533A (en) * | 2002-11-22 | 2004-06-17 | Denso Corp | Printed-board manufacturing method, and printed board formed by same method |
| JP2004327693A (en) * | 2003-04-24 | 2004-11-18 | Matsushita Electric Ind Co Ltd | Motor drive |
| US20090277684A1 (en) * | 2005-12-23 | 2009-11-12 | Teikoku Tsushin Kogyo Co., Ltd. | Mounting structure and method for mounting electronic component onto circuit board |
| US20100110647A1 (en) * | 2007-05-03 | 2010-05-06 | Super Talent Electronics, Inc. | Molded Memory Card With Write Protection Switch Assembly |
| CN105555035A (en) * | 2016-02-02 | 2016-05-04 | 东莞翔国光电科技有限公司 | Printing process for printed circuit board |
| CN105679563A (en) * | 2016-03-30 | 2016-06-15 | 苏州达方电子有限公司 | Key structure |
| CN105960101A (en) * | 2016-07-25 | 2016-09-21 | 苏州福莱盈电子有限公司 | Printed circuit board manufacturing method simple to operate |
| CN209299579U (en) * | 2018-08-31 | 2019-08-23 | 深圳市恒开源电子有限公司 | A kind of single-clad board suitable for handwriting pad |
-
2018
- 2018-08-31 CN CN201811010619.5A patent/CN108811309B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0654150U (en) * | 1992-12-26 | 1994-07-22 | 豊田合成株式会社 | Switch module |
| JPH0758445A (en) * | 1993-08-10 | 1995-03-03 | Fujitsu Ltd | Printed wiring board and manufacturing method thereof |
| JP2001054286A (en) * | 1999-08-06 | 2001-02-23 | Mitsubishi Electric Corp | Electronic control board |
| JP2004172533A (en) * | 2002-11-22 | 2004-06-17 | Denso Corp | Printed-board manufacturing method, and printed board formed by same method |
| CN1502876A (en) * | 2002-11-26 | 2004-06-09 | 乐金电子(天津)电器有限公司 | Controller assembly of microwave oven and intelligent switch assembly structure thereof |
| JP2004327693A (en) * | 2003-04-24 | 2004-11-18 | Matsushita Electric Ind Co Ltd | Motor drive |
| US20090277684A1 (en) * | 2005-12-23 | 2009-11-12 | Teikoku Tsushin Kogyo Co., Ltd. | Mounting structure and method for mounting electronic component onto circuit board |
| US20100110647A1 (en) * | 2007-05-03 | 2010-05-06 | Super Talent Electronics, Inc. | Molded Memory Card With Write Protection Switch Assembly |
| CN105555035A (en) * | 2016-02-02 | 2016-05-04 | 东莞翔国光电科技有限公司 | Printing process for printed circuit board |
| CN105679563A (en) * | 2016-03-30 | 2016-06-15 | 苏州达方电子有限公司 | Key structure |
| CN105960101A (en) * | 2016-07-25 | 2016-09-21 | 苏州福莱盈电子有限公司 | Printed circuit board manufacturing method simple to operate |
| CN209299579U (en) * | 2018-08-31 | 2019-08-23 | 深圳市恒开源电子有限公司 | A kind of single-clad board suitable for handwriting pad |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110861423A (en) * | 2019-11-19 | 2020-03-06 | 江苏上达电子有限公司 | Transfer printing ink processing technology for printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108811309B (en) | 2024-06-18 |
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Address after: 518000 Room 401, building a, Zhihai Industrial Park, B16, first industrial zone, Baihua community, Guangming office, Guangming New District, Shenzhen City, Guangdong Province Applicant after: Shenzhen do true scientific research Co.,Ltd. Address before: 518000 Room 401, building a, Zhihai Industrial Park, B16, first industrial zone, Baihua community, Guangming office, Guangming New District, Shenzhen City, Guangdong Province Applicant before: SHENZHEN HENGKAIYUAN ELECTRONICS Co.,Ltd. |
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