CN104135818A - Heat dissipating PCB - Google Patents
Heat dissipating PCB Download PDFInfo
- Publication number
- CN104135818A CN104135818A CN201410357393.1A CN201410357393A CN104135818A CN 104135818 A CN104135818 A CN 104135818A CN 201410357393 A CN201410357393 A CN 201410357393A CN 104135818 A CN104135818 A CN 104135818A
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- heat
- layer
- heat dissipating
- pcb
- board
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- 239000000758 substrate Substances 0.000 claims abstract description 14
- 230000005855 radiation Effects 0.000 claims description 21
- 230000004888 barrier function Effects 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 241000276425 Xiphophorus maculatus Species 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 15
- 238000009413 insulation Methods 0.000 abstract description 3
- 238000010276 construction Methods 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000000739 chaotic effect Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a heat dissipating PCB, which consists of a circuit conductive layer (1), an insulation layer (2), a substrate (3) and a heat dissipating layer (5). The PCB is characterized in that the heat dissipating layer (5) is of a fold structure, and the circuit conductive layer (1), the insulation layer (2), the heat dissipating layer (5) and the substrate (3) are fixed in the top-down order. Based on the multi-layer structure of existing PCB, the designed heat dissipating PCB is provided with the heat dissipating layer (5) with an improved structure. Thus, the heat dissipating effect of the PCB is enhanced by increasing the contact area, and then the working performance of the PCB is ensured.
Description
Technical field
The present invention relates to a kind of heat radiation type PCB heat board.
Background technology
Pcb board is printed circuit board, claim again printed circuit board (PCB), printed substrate, be called for short wiring board, taking insulation board as base material, be cut into certain size, on it, at least have a conductive pattern cloth porose (as component hole, fastener hole, plated-through hole etc.), be used for replacing and installed the chassis of electronic devices and components in the past, and realize interconnecting between electronic devices and components.Because this plate is to adopt electron printing to make, therefore be called as " printing " circuit board; Can be divided into single sided board, double sided board, four laminates, six laminates and other multilayer circuit board according to the wiring board number of plies.Because printed circuit board (PCB) is not general end product, therefore slightly chaotic in the definition of title, for example: the motherboard that PC is used, be called mainboard, and can not directly be called circuit board, although there is the existence of circuit board in motherboard, not identical, while therefore assessing industry, both are relevant but not talkative identical.Again for example: because there is integrated circuit part to be loaded on circuit board, thereby news media claim that it is IC plate, but it is not equal to printed circuit board (PCB) yet in fact; The printed circuit board (PCB) that we conventionally say refers to bare board-the do not go up circuit board of components and parts.Existing pcb board all adopts sandwich construction design, the compacting that is layering forms, because the effect of pcb board is the use for circuit structure is provided, a large amount of electronic components will be arranged on pcb board, when electronic component and pcb board work, can produce a large amount of heat, because adopting sandwich construction compacting, pcb board forms, will have influence on like this heat dissipation problem of pcb board, prior art is to this, mostly be to improve for the material of pcb board, such mode can improve the radiating effect of pcb board, but effect is not still better, along with the development of integrated circuit on pcb board, there is the pcb board of more superior radiating effect, the eager product needing in market will be become.
Summary of the invention
For above-mentioned technical problem, technical problem to be solved by this invention is to provide a kind of sandwich construction based on existing pcb board, by the improvement to layer, can more effectively carry the heat radiation type PCB heat board of heat radiating type performance.
The present invention is in order to solve the problems of the technologies described above by the following technical solutions: the present invention has designed a kind of heat radiation type PCB heat board, comprises circuit conductive layer, insulating barrier, substrate and heat dissipating layer; Described heat dissipating layer is pleated structure; Described circuit conductive layer, insulating barrier, heat dissipating layer and substrate are fixed by order from top to bottom.
As a preferred technical solution of the present invention: described heat dissipating layer is that metal material is made.
As a preferred technical solution of the present invention: described heat dissipating layer is that aluminium alloy is made.
As a preferred technical solution of the present invention: also comprise heat-conducting layer, described circuit conductive layer, insulating barrier, heat-conducting layer, heat dissipating layer and substrate are fixed by order from top to bottom.
As a preferred technical solution of the present invention: described heat-conducting layer is carbon-coating, and carbon-coating is the platy structure compressing by material with carbon element.
As a preferred technical solution of the present invention: described heat-conducting layer is provided with engraved structure.
A kind of heat radiation type PCB heat board of the present invention adopts above technical scheme compared with prior art, has following technique effect:
(1) heat radiation type PCB heat board of the present invention's design, based on the sandwich construction of existing pcb board, carries out architecture advances for heat dissipating layer wherein, by the mode of enlarge active surface, has improved the radiating effect of pcb board, has ensured the service behaviour of pcb board;
(2) in the heat radiation type PCB heat board of the present invention's design, adopting on the basis of pleated structure for heating panel, heat dissipating layer adopts metal material to make, and when making to increase heat dissipating layer contact area, has improved the thermal conductivity of heat dissipating layer;
(3) in the heat radiation type PCB heat board of the present invention's design, also designed heat-conducting layer, the heat producing while work for pcb board carries out heat conduction, passes to heat dissipating layer, has further improved the radiating effect of this pcb board, has ensured the service behaviour of this pcb board;
(4) in the heat radiation type PCB heat board of the present invention's design, adopt material with carbon element compacting to form for heat-conducting layer, further improve the heat-conducting effect of heat-conducting layer, and for this heat-conducting layer, design engraved structure, the heat dispersion of this pcb board is further promoted, further ensured the service behaviour of this pcb board.
Brief description of the drawings
Fig. 1 is the structural representation of the heat radiation type PCB heat board that designs of the present invention.
Wherein, 1. circuit conductive layer, 2. insulating barrier, 3. substrate, 4. heat-conducting layer, 5. heat dissipating layer, 6. engraved structure.
Embodiment
Below in conjunction with Figure of description, the specific embodiment of the present invention is described in further detail.
As shown in Figure 1, the present invention has designed a kind of heat radiation type PCB heat board, comprises circuit conductive layer 1, insulating barrier 2, substrate 3 and heat dissipating layer 5; Described heat dissipating layer 5 is pleated structure; Described circuit conductive layer 1, insulating barrier 2, heat dissipating layer 5 and substrate 3 are fixed by order from top to bottom; The present invention is by the heat radiation type PCB heat board of above design design, based on the sandwich construction of existing pcb board, carry out architecture advances for heat dissipating layer 5 wherein, by the mode of enlarge active surface, improve the radiating effect of pcb board, ensured the service behaviour of pcb board.
The heat radiation type PCB heat board of the present invention's design, on technical scheme basis based on above design, also done following design: described heat dissipating layer 5 is made for metal material, and described heat dissipating layer 5 is made for aluminium alloy, when making to increase heat dissipating layer 5 contact area, improve the thermal conductivity of heat dissipating layer 5; Moreover, also comprise heat-conducting layer 4, described circuit conductive layer 1, insulating barrier 2, heat-conducting layer 4, heat dissipating layer 5 and substrate 3 are fixed by order from top to bottom, the heat producing when heat-conducting layer 4 is worked for pcb board carries out heat conduction, pass to heat dissipating layer 5, further improve the radiating effect of this pcb board, ensured the service behaviour of this pcb board; And described heat-conducting layer 4 is carbon-coating, carbon-coating is the platy structure compressing by material with carbon element, further improve the heat-conducting effect of heat-conducting layer 4, and described heat-conducting layer 4 is provided with engraved structure 6, the heat dispersion of this pcb board is further promoted, further ensured the service behaviour of this pcb board.
The heat radiation type PCB heat board of the present invention design in the middle of actual application process,
Comprise by sequentially fixing from top to bottom circuit conductive layer 1, insulating barrier 2, heat-conducting layer 4, heat dissipating layer 5 and substrate 3, described heat dissipating layer 5 is pleated structure, and heat dissipating layer 5 is made for metal material, be specially aluminium alloy and make, described heat-conducting layer 4 is carbon-coating, and carbon-coating is the platy structure compressing by material with carbon element, and heat-conducting layer 4 is provided with engraved structure 6, in actual application, electronic component is arranged on and on pcb board, forms operating circuit structure, 1 time insulating barrier 2 is set at circuit conductive layer, ensure the independence of circuit conductive layer 1, avoid other factors to have influence on its operating state and service behaviour, when work, electronic component produces a large amount of heat, heat passes to the heat-conducting layer 4 under insulating barrier 2, because heat-conducting layer 4 is carbon-coating, carbon-coating is the platy structure compressing by material with carbon element, and heat-conducting layer 4 is provided with engraved structure 6, therefore, the heat-conducting layer 4 of this design has good heat-conducting effect, the heat producing when circuit structure work is through insulating barrier 2, transmit by heat-conducting layer 4, being arranged on heat dissipating layer 5 under heat-conducting layer 4 receives the heat being transmitted by heat-conducting layer 4 and dispels the heat, because heat dissipating layer 5 is pleated structure, and heat dissipating layer 5 is made for aluminium alloy, utilize the high-termal conductivity of aluminium alloy, and expand contact area by pleated structure, effectively improve the radiating effect of this pcb board, more effectively ensure the service behaviour of this pcb board.
In sum, the heat radiation type PCB heat board of the present invention's design, simple in structure, for the sandwich construction of existing pcb board, by the improvement to heat dissipating layer 5 and set up and improve heat-conducting layer 4, effectively improve the radiating effect of this pcb board, greatly improve the service behaviour of this pcb board, and cheap for manufacturing cost, there is huge market popularization value.
By reference to the accompanying drawings embodiments of the present invention are explained in detail above, but the present invention is not limited to above-mentioned execution mode, in the ken possessing those of ordinary skill in the art, can also under the prerequisite that does not depart from aim of the present invention, makes a variety of changes.
Claims (6)
1. a heat radiation type PCB heat board, comprises circuit conductive layer (1), insulating barrier (2), substrate (3) and heat dissipating layer (5); It is characterized in that: described heat dissipating layer (5) is pleated structure; Described circuit conductive layer (1), insulating barrier (2), heat dissipating layer (5) and substrate (3) are fixed by order from top to bottom.
2. a kind of heat radiation type PCB heat board according to claim 1, is characterized in that: described heat dissipating layer (5) is made for metal material.
3. a kind of heat radiation type PCB heat board according to claim 2, is characterized in that: described heat dissipating layer (5) is made for aluminium alloy.
4. a kind of heat radiation type PCB heat board according to claim 1, is characterized in that: also comprise heat-conducting layer (4), described circuit conductive layer (1), insulating barrier (2), heat-conducting layer (4), heat dissipating layer (5) and substrate (3) are fixed by order from top to bottom.
5. a kind of heat radiation type PCB heat board according to claim 4, is characterized in that: described heat-conducting layer (4) is carbon-coating, and carbon-coating is the platy structure compressing by material with carbon element.
6. according to a kind of heat radiation type PCB heat board described in any one in claim 4 or 5, it is characterized in that: described heat-conducting layer (4) is provided with engraved structure (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410357393.1A CN104135818A (en) | 2014-07-25 | 2014-07-25 | Heat dissipating PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410357393.1A CN104135818A (en) | 2014-07-25 | 2014-07-25 | Heat dissipating PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104135818A true CN104135818A (en) | 2014-11-05 |
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ID=51808315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410357393.1A Pending CN104135818A (en) | 2014-07-25 | 2014-07-25 | Heat dissipating PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104135818A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106714442A (en) * | 2015-11-13 | 2017-05-24 | 建业科技电子（惠州）有限公司 | Multilayer circuit board heat radiating structure |
| CN120343807A (en) * | 2025-04-28 | 2025-07-18 | 东莞市龙谊电子科技有限公司 | A flexible circuit board preparation process capable of dynamic thermal management |
-
2014
- 2014-07-25 CN CN201410357393.1A patent/CN104135818A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106714442A (en) * | 2015-11-13 | 2017-05-24 | 建业科技电子（惠州）有限公司 | Multilayer circuit board heat radiating structure |
| CN120343807A (en) * | 2025-04-28 | 2025-07-18 | 东莞市龙谊电子科技有限公司 | A flexible circuit board preparation process capable of dynamic thermal management |
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| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141105 |
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| WD01 | Invention patent application deemed withdrawn after publication |