CN108809056A - A kind of three-dimensionally integrated intelligent power module and its manufacturing method - Google Patents

Abstract

The invention discloses a kind of three-dimensionally integrated intelligent power module and its manufacturing methods; including power switch circuit and driving circuit; and main control circuit, condition monitoring and the protection circuit being connected with power switch circuit and its driving circuit; main control circuit is assembled into top substrate layer; condition monitoring and protection Circuit assembly are to underlying substrate; top substrate layer is interconnected and form the intelligent control unit of three-dimensional structure with underlying substrate by leading directly to guide hole; power switch circuit and its driving circuit are welded to high thermal conductive substrate, are welded by lead and are connect with intelligent control unit.Intelligent power module disclosed by the invention; it is integrated with power switch circuit and its driving circuit, main control circuit, condition monitoring and protection circuit; using three-dimensionally integrated form; module power density can be improved, reduce device volume; shorten the conductor length between power semiconductor pin; parasitic parameter and noise spike voltage are reduced, the application reliability of power device is improved.

Description

A three-dimensional integrated intelligent power module and its manufacturing method

technical field

The invention belongs to the field of electronic technology, and more specifically relates to an intelligent power module and a manufacturing method thereof.

Background technique

The intelligent power control module integrates the power switching device, switch drive circuit, main control circuit and protection circuit into one package through system-level packaging technology, and the main control circuit is responsible for processing the collected or control input data and realizing various control Algorithms, send control signals to the power circuit through the output interface, and output the calculation results to the peripheral equipment, receive instructions from the peripheral equipment and perform corresponding operations. This integrated module simplifies device setup when dealing with different functional environments, and has significant advantages such as compact structure, powerful functions, flexible configuration and easy installation. The current intelligent power module generally only integrates a driving circuit and a simple protection circuit inside, and the protection circuit is not perfect, and an additional processor is required to realize the intelligent control algorithm, which increases the complexity of module manufacturing, resulting in long design cycles for users and low production efficiency. higher cost. Existing intelligent power modules are mainly assembled in a planar manner, and the module volume is large, the power density is low, the interconnection distance is long, and the parasitic parameters are large, which increases the electromagnetic interference of the module.

Contents of the invention

In view of the above reasons, the present invention provides a three-dimensional integrated intelligent power module and its manufacturing method, which integrates power switches, intelligent control circuits, acquisition circuits and protection circuits inside, and can realize sensorless control, power factor correction and other motor intelligent control algorithms; Moreover, the three-dimensional integration technology of high-power circuits and digital control circuits based on substrate stacking is used to reduce EMI interference, reduce module volume, and optimize signal transmission quality.

To achieve the above object, the present invention adopts the following technical means:

A three-dimensional integrated intelligent power module, including a power switch circuit and an intelligent control circuit, and the power switch circuit is connected to the intelligent control circuit;

The intelligent control circuit includes a main control circuit, a driving circuit, an external interface, a state monitoring circuit and a protection circuit, the external interface is connected to the main control circuit, the main control circuit is respectively connected to the driving circuit, the protection circuit, and the state monitoring circuit, and the protection circuit is connected to the driving circuit;

The main control circuit is used to receive the rotor position information of the external motor, provide working control signals for the power switch drive circuit, monitor the working information of the power switch circuit, and communicate with the user's main control system;

The driving circuit is connected to the power switch circuit, and is used for charging and discharging the gate of the power switch circuit, so that the power switch is turned on or off;

The protection circuit is connected to the power switch circuit and is used to provide overvoltage, overcurrent and overtemperature protection for the power switch circuit;

The state monitoring circuit is used to monitor the junction temperature, bus voltage and working current information of the power switch circuit, and feed back to the main control circuit.

The external interface includes the main control circuit program download interface, the intelligent power module power supply interface, the main control circuit communication interface and the phase interface of the motor, the main control circuit program download interface, the intelligent power module power supply interface, the main control circuit communication interface and the phase interface of the motor. The phase interfaces are all connected with the main control circuit.

The protection circuit is a power switch circuit, and is also used to feed back abnormal information to the main control circuit. The main control circuit records the abnormal information of the power switch circuit and provides the abnormal information of the power switch circuit to the user's main control system.

The power switch circuit includes a power switch device, and the power switch device is composed of six power MOS tubes.

It also includes multiple functional substrates for assembling chips, and the functional substrates and components form a hermetic package:

The power switch and its drive circuit are assembled to a high thermal conductivity substrate by bonding to form a power unit;

The state monitoring and protection circuit is assembled to the lower substrate by bonding to form a monitoring and protection unit;

The main control circuit and the external interface are assembled to the upper substrate by bonding to form a control communication unit;

The monitoring protection unit and the control communication unit are vertically interconnected through through holes to form an intelligent control unit with a three-dimensional structure;

The intelligent control unit and the power unit are connected by wire welding.

A method for manufacturing a three-dimensionally integrated intelligent power module, comprising the following steps:

Manufacture the upper substrate, lower substrate and high thermal conductivity substrate for assembling chips; among them, the upper substrate is a low-temperature co-fired ceramic substrate with a cavity inside, and the interconnection ports are drawn out through internal wiring and through holes, and palladium silver is made on the bottom Pad; the lower substrate is an LTCC substrate, and a palladium-silver pad is made at the connection position between the lower substrate and the upper substrate; the high thermal conductivity substrate is a ceramic DBC substrate;

Weld the state monitoring and protection circuit chip to the lower substrate, weld the filter capacitor to the upper substrate, and weld the lower substrate and high thermal conductivity substrate to the shell;

Bond the status monitoring and protection circuit chip to the underlying substrate;

Print solder paste on the palladium-silver pads on the upper substrate and the lower substrate, and perform reflow soldering after alignment; solder the power switch circuit and its drive circuit chip to the high thermal conductivity substrate; clean the module after soldering;

Bond the main control circuit chip to the upper substrate with an adhesive, and then complete the wire bonding through the bonding wire;

The power switch circuit and its driving circuit chip are bonded to the high thermal conductivity substrate.

The cavity depth of the upper substrate is 2-8mm, and the side width is 3-8mm.

Compared with the prior art, the present invention has the following advantages:

According to the intelligent power module and the main controller provided by the present invention, after collecting the information provided by the driving circuit, the protection circuit and the temperature sensor, they feed back to the user's main control system through the external interface. It integrates power switch, intelligent control circuit, acquisition circuit and protection circuit inside, which can realize motor intelligent control algorithms such as sensorless control and power factor correction; and adopts the three-dimensional integration technology of high-power circuit and digital control circuit based on substrate stacking, reducing the Reduce EMI interference, reduce module size, and optimize signal transmission quality. The user's control system only needs to communicate with the main controller inside the module to obtain the working information and fault information of the power switch circuit, which can provide convenience for the user's overall system design.

The manufacturing method of the present invention is simple and convenient, and the manufactured intelligent power module integrates a power switch circuit and its drive circuit, a main control circuit, a state monitoring and protection circuit, and adopts a three-dimensional integration form, which can increase the power density of the module and reduce the volume of the device , shorten the wire length between the pins of power semiconductor devices, reduce parasitic parameters and noise peak voltage, and improve the application reliability of power devices.

Description of drawings

In order to illustrate the embodiments of the present invention more clearly, the accompanying drawings required for the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those of ordinary skill in the art, In other words, other drawings can also be obtained from these drawings on the premise of not paying creative work.

Fig. 1 is a circuit functional block diagram of an intelligent power module provided by the present invention;

Fig. 2 is a schematic diagram of the circuit principle of the intelligent power module provided by the present invention;

Fig. 3 is a schematic diagram of a three-dimensional packaging structure of an intelligent power module provided by the present invention.

In the figure, 301 is the main control circuit chip; 302 is the bonding wire; 303 is the adhesive; 304 is the high temperature solder paste; 305 is the state monitoring and protection circuit chip; 306 is the solder paste; 307 is the bonding wire; 308 is the 309 is the lower substrate; 310 is the control signal pin; 311 is the metal shell; 312 is the interconnection hole; 313 is the power pin; 314 is the lead frame; 315 is the high thermal conductivity substrate; 316 is the power switch circuit and Its driving circuit chip; 317 is a bonding wire; 318 is a capacitor.

Detailed ways

Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. What has been described is by way of explanation, not limitation, of the invention.

Fig. 1 is a circuit functional block diagram of an intelligent power module provided by an embodiment of the present invention. As shown in FIG. 1 , the intelligent power module provided by the present invention includes a power switching device and an intelligent control circuit, and the power switching device is connected to the intelligent control circuit. The intelligent control circuit includes a main control circuit, a drive circuit, an external interface, a state monitoring circuit and a protection circuit.

Fig. 2 is a schematic diagram of a circuit principle of an intelligent power module provided by an embodiment of the present invention. As shown in Fig. 2, the intelligent power module provided by the embodiment of the present invention includes an intelligent control circuit and a power switching device, and the intelligent control circuit includes a main control circuit, a drive circuit, an external interface, a state monitoring circuit and a protection circuit.

The main control circuit receives the rotor position information and speed information of the external motor, collects current information, generates electronic commutation signals, provides working signals for the drive circuit, and receives the abnormal signal of the power switch circuit fed back by the protection circuit. Communication with the user's main control system;

The external interface includes a communication interface, a program download interface, a motor Hall signal interface, an analog input interface, and a power conversion interface;

The driving circuit is connected to the power switch circuit, and is used for charging and discharging the gate of the power switch circuit, so that the power switch is turned on or off;

The state monitoring circuit is composed of voltage sampling monitoring, current sampling monitoring, and temperature sampling monitoring circuits, which are used to monitor the junction temperature, bus voltage, and operating current information of the power switch circuit, and feed back to the main control circuit;

The protection circuit controls the drive circuit to be enabled or disabled according to the junction temperature, bus voltage, operating current information and protection logic of the power switch circuit, and is used to provide the power switch circuit with overvoltage, overcurrent, overtemperature Protect;

Fig. 3 is a schematic diagram of a three-dimensional packaging structure of an intelligent power module provided by the present invention. The intelligent power module disclosed in this embodiment discloses the optimal installation position of each power device, improves the overall heat dissipation of the module, and improves the thermal stability of the module. The power switch and its driving circuit are assembled to the high thermal conductivity substrate by bonding to form a power unit; the state monitoring and protection circuit is assembled to the lower substrate by bonding to form a monitoring and protection unit; the main control circuit and the external interface are assembled to the upper substrate by bonding , forming a control communication unit; the monitoring protection unit and the control communication unit are vertically interconnected through through holes to form an intelligent control unit with a three-dimensional structure; the intelligent control unit and the power unit are connected by wire welding.

The process steps of the manufacturing method of the intelligent power module according to the embodiment of the present invention will be described below:

As shown in FIG. 3 , an upper substrate 308 , a lower substrate 309 , and a high thermal conductivity substrate 315 for assembling chips are manufactured. The upper substrate 308 is a low temperature cofired ceramic substrate (Low Temperature Cofired Ceramic, LTCC) with a cavity inside, the depth of the cavity is 2-8 mm, and the side width is 3-8 mm. The interconnection port is drawn out through the internal wiring and the through hole 312 , making palladium-silver pads at the bottom; the lower substrate 309 is an LTCC substrate, and a palladium-silver pad is made at the connection position between the lower substrate 309 and the upper substrate 308; the high thermal conductivity substrate 315 is a ceramic DBC substrate.

Use high-temperature solder paste 304 to weld the state monitoring and protection circuit chip 305 to the lower substrate 309, weld the filter capacitor 318 to the upper substrate 308, and simultaneously weld the lower substrate 309 and the high thermal conductivity substrate 315 to the 10# steel shell 311, The welding temperature is 210°C~215°C;

Bonding the state monitoring and protection circuit chip 305 to the lower substrate 309;

Low-temperature solder paste 306 is printed on the palladium-silver pads on the upper substrate 308 and the lower substrate 309, and reflow soldering is performed after alignment; the power switch circuit and its driving circuit chip 316 are welded to the high thermal conductivity substrate 315 with the low-temperature solder paste 306; Clean the module after soldering.

The chip 301 is bonded to the upper substrate 308 with an epoxy resin adhesive 303, the baking temperature is 150°C-160°C, the baking time is 2h-4h, and then the wire bonding is completed through the bonding wire 302;

The power switch circuit and its driving circuit chip 316 are bonded to the high thermal conductivity substrate 315 .

It will be apparent to those skilled in the art that various modifications and changes can be made in the disclosed embodiments of the invention. Therefore, the disclosed embodiments of the present invention are intended to cover such obvious modifications and changes as come within the scope of the appended claims and their equivalents.

Claims (7)

1. a kind of three-dimensionally integrated intelligent power module, which is characterized in that including power switch circuit and intelligent control circuit, power Switching circuit connects intelligent control circuit；

Intelligent control circuit includes main control circuit, driving circuit, external interface, status monitor circuit and protects circuit, externally Interface connects main control circuit, and main control circuit is separately connected driving circuit, protection circuit, status monitor circuit, protects circuit Connect driving circuit；

The main control circuit, the rotor position information for receiving external motor provide work for power switch driver circuit Signal is controlled, the job information of power switch circuit is monitored, is additionally operable to communicate with the master control system of user；

The driving circuit, is connected with power switch circuit, for the grid charge and discharge for the power switch circuit so that work( Rate switch conduction or closing；

The protection circuit, is connected with power switch circuit, for providing overvoltage, overcurrent, excess temperature for the power switch circuit Protection；

The status monitor circuit, junction temperature, busbar voltage, operating current information for monitoring power switch circuit, and feed back To the main control circuit.

2. three-dimensionally integrated intelligent power module according to claim 1, which is characterized in that the external interface includes master control The phase interface of circuit program download interface processed, intelligent power module power interface, main control circuit communication interface and motor, it is main The phase interface of control circuit program download interface, intelligent power module power interface, main control circuit communication interface and motor It is connect with main control circuit.

3. three-dimensionally integrated intelligent power module according to claim 1, which is characterized in that the protection circuit is opened for power Powered-down road is additionally operable to main control circuit feedback exception information, the exception information of main control circuit recording power switching circuit, and The exception information of power switch circuit is supplied to the master control system of user.

4. three-dimensionally integrated intelligent power module according to claim 1, which is characterized in that the power switch circuit packet Device for power switching is included, device for power switching is made of six power MOS pipes.

5. three-dimensionally integrated intelligent power module according to claim 1, which is characterized in that further include it is multiple for group a cored The function substrate of piece, function substrate form level Hermetic Package with element：

Power switch and its driving circuit are assembled into high thermal conductive substrate by bonding, form power cell；

Condition monitoring and protection circuit are assembled into underlying substrate by bonding, form monitoring protection location；

Main control circuit is assembled into top substrate layer with external interface by being bonded, and forms control communication unit；

It monitors protection location and controls intelligent control unit of the communication unit by straight-through guide hole perpendicular interconnection formation three-dimensional structure；

Intelligent control unit is weldingly connected with power cell by lead；

Specifically, main control circuit is assembled into top substrate layer 308, the condition monitoring and protection Circuit assembly to underlying substrate 309, top substrate layer 308 is interconnected and form the intelligent control unit of three-dimensional structure, the work(with underlying substrate 309 by leading directly to guide hole Rate switching circuit and its driving circuit are welded to high thermal conductive substrate 315, are connected with intelligent control unit by the welding of bonding line 317 It connects.

6. the manufacturing method of three-dimensionally integrated intelligent power module as claimed in claim 5, which is characterized in that including following step Suddenly：

Top substrate layer (308), underlying substrate (309) and high thermal conductive substrate (315) of the manufacture for assembling chip；Wherein, upper layer Substrate (308) is that inside is provided with the low-temperature co-fired ceramic substrate of cavity, by internal wiring and clear opening (312) by interconnection port It draws, palladium-silver pad is made in bottom；Underlying substrate (309) is ltcc substrate, in underlying substrate (309) and top substrate layer (308) be connected position making palladium-silver pad；High thermal conductive substrate (315) is ceramics DBC substrates；

Condition monitoring and protection circuit chip (305) are welded on underlying substrate (309), filter capacitor (318) is welded to In top substrate layer (308), while underlying substrate (309) and high thermal conductive substrate (315) being welded on shell (311)；

Condition monitoring and protection circuit chip (305) are bonded on underlying substrate (309)；

Printing Paste on palladium-silver pad in top substrate layer (308) and underlying substrate (309) carries out Reflow Soldering after alignment；By work( Rate switching circuit and its drive circuit chip (316) are welded on high thermal conductive substrate (315)；Cleaning module after welding；

Main control circuit chip (301) is adhered in top substrate layer (308) with bonding agent (303), then passes through bonding wire (302) wire bonding is completed；

Power switch circuit and its drive circuit chip (316) are bonded on high thermal conductive substrate (315).

7. the manufacturing method of three-dimensionally integrated intelligent power module according to claim 6, which is characterized in that top substrate layer (308) 2~8mm of cavity depth, side 3~8mm of width.