CN108336053A - The manufacturing method of packaging and packaging - Google Patents

Abstract

The present invention provides the manufacturing method of a kind of packaging and packaging, packaging includes：Substrate, chip, conductive film and packaging body；The side of substrate is provided with the first pad；Chip includes the second pad；The side of conductive film fits with the first pad, and the other side of conductive film fits with the second pad, and the first pad is oppositely arranged with the second pad；Packaging body is at least coated on the outside of chip and conductive film.In the packaging body of packaging, the second pad of chip is bonded with the first pad of substrate by conductive film, and chip, conductive film is made to be combined with substrates into intimate by way of pressing, is set and is fixed to each other in packaging body encapsulation standing back.Due to not using lead and solder, first pad and the second pad need not be welded using solder, so the problems such as being not in that silk is rushed in bonding at the bonding of the first pad and the second pad, bonding fracture, deformation will not be generated, there is no foreign matter participation in process, and then ensures bonding face cleaning.

Description

Packaged device and method of manufacturing the packaged device

technical field

The present invention relates to the technical field of packaged devices, in particular to a packaged device and a method for manufacturing the packaged device.

Background technique

At present, in traditional packaging technologies, bonding methods are mainly divided into wire bonding and flip-chip bonding technologies. Although the traditional wire bonding and flip-chip bonding technologies are quite mature, there are still many problems. First of all, in terms of cost, the wire bonding process requires a bonding machine, extremely thin gold wires, and flip-chip bonding requires pre-soldered solder joints on the chip. These inevitably complicate the process and increase the cost of equipment, processes, and materials. . Secondly, in terms of process, the bonding gap of wire bonding is limited by the size of the knife, which cannot meet the increasingly shrinking packaging device size requirements, especially cannot be applied to new packaging technologies, such as fan-out wafer packaging, system-in-package, and A series of problems such as wire punching and fracture deformation will occur when bonding wire is packaged. Flip-chip soldering technology is prone to vertical drop and horizontal swing, especially for power devices. Finally, in terms of reliability, wire bonding and flip-chip soldering will have corresponding damage to the bonding wire and preset solder joints under the long-term cyclic load working environment, which will affect the reliability of the packaged device. Therefore, the traditional bonding form cannot meet the increasing requirements of packaged devices. In order to solve the bottleneck of the traditional process technology and the deficiency of the existing technical solutions, it is necessary to develop a process method with simple processing flow, high yield and low cost.

Contents of the invention

The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

To this end, a first aspect of the present invention proposes a packaged device.

A second aspect of the present invention proposes a method of manufacturing a packaged device.

In view of this, the first aspect of the present invention provides a packaged device, including: a substrate, a chip, a conductive film and a package body; a first pad is provided on one side of the substrate; the chip includes a second pad; the conductive film One side is attached to the first pad, the other side of the conductive film is attached to the second pad, and the first pad is opposite to the second pad; the package is at least coated on the outside of the chip and the conductive film .

In the packaging device provided by the present invention, the second pad of the chip is bonded to the first pad of the substrate through a conductive film, and the conductive film is bonded to the side of the substrate where the chip needs to be installed during manufacture, and then the chip and the conductive film are pasted together. Combine, apply a certain pressure to the chip, and package the chip, conductive film and substrate tightly by pressing. After the package is packaged and cured, the positions of the chip, conductive film and substrate are fixed to each other. The method has a simple production process, does not require expensive bonding equipment, reduces production procedures, and can be applied to the production of micro-miniature packaging devices. Since lead wires and solder are not used in the manufacturing process, there is no need to use solder welding for the first pad and the second pad, so there will be no bonding punch at the bonding place between the first pad and the second pad, and there will be no bonding wire. There will be problems such as bond fracture and deformation, and there will be no foreign matter involved in the processing process, thereby ensuring that the bonding surface is clean. At the same time, the combination by pressing can also avoid the high-temperature processing steps during the flip-chip welding process, and the chip and the substrate will not be heated, avoiding the situation where the chip position swings and shifts when a large amount of thermal stress is generated during thermal loading, and When the packaged device is a power device, it is avoided that due to the high heat generation of the power device, the heat accumulated in the package will cause the bonding wire and solder joints to be damaged and desoldering due to long-term use. Therefore, the yield rate of packaged devices is higher, and the reliability in use is also better. At the same time, the production process is simple, which is conducive to mass production.

In addition, the packaged device in the above technical solution provided by the present invention may also have the following additional technical features:

In the above technical solution, preferably, the conductive film includes: an insulating carrier and a conductor; the conductor extends along the thickness direction of the insulating carrier.

In this technical solution, conductors are arranged at intervals along the thickness of the insulating carrier in the insulating carrier to form a conductive film, so that the conductive film passes through the conductors in the thickness direction to conduct current, and the second pad of the chip and the first pad of the substrate When a welding pad is attached to both sides of the conductive film, the electrical connection between the chip and the corresponding welding pad of the substrate is realized.

In any of the above technical solutions, preferably, a plurality of conductors are distributed in an array on the insulating carrier.

In this technical solution, a plurality of electrical conductors are distributed on an insulating carrier in the form of an array, and a single electrical conductor can be in the shape of a cylinder or a cube to ensure that the conductive film is electrically conductive in the thickness direction and each pad has at least In contact with one conductor, in the case that multiple conductors are in contact with the same pad at the same time, the total contact area can be increased and the conductivity can be improved.

In any of the above technical solutions, preferably, there are multiple first pads, and the number of the second pads is equal to the number of the first pads; any width of the cross-section of the conductor is smaller than that of the adjacent first pads. The distance between the pads; and/or any width of the cross-section of the conductor is smaller than the distance between adjacent second pads.

In this technical scheme, the number of first pads of the prefabricated substrate is set to be multiple, and the number is equal to the number of the second pads of the chip, so as to ensure that the number of pins/contacts of the chip after packaging remains unchanged; the cross-section of the conductor Any width is smaller than the distance between adjacent first pads, that is, a single conductor will not contact any two adjacent first pads in any direction at the same time, ensuring that any two adjacent first pads The pads will not be short-circuited; and/or any width of the cross-section of the conductor is smaller than the distance between the adjacent second pads, that is, a single conductor will also not contact any two phases in any direction at the same time. Adjacent second pads to ensure that any two adjacent second pads will not be short-circuited.

In any of the above technical solutions, preferably, one or more conductors are directly provided on the first pad and the second pad.

In this technical solution, the electrical connection between the corresponding first pad and the second pad is realized through one or more conductors, and on the basis of ensuring the reliability of the electrical connection, more conductors can increase the number of connections between the first pad and the second pad. The total area of the conductor between the two pads reduces the impedance.

In any of the above technical solutions, preferably, the packaged device further includes: a third pad; the third pad is disposed on the other side of the substrate and connected to the first pad.

In this technical solution, on the other side of the substrate, a third pad that is electrically connected to the first pad through a built-in circuit is provided, that is, the corresponding electrical connection relationship between the second pad and the third pad of the chip is realized. , to ensure that the function of the chip after being packaged as a packaged device is complete.

In any of the above technical solutions, preferably, the packaging device further includes: solder; the solder is disposed on the third pad.

In this technical solution, solder is provided on the third pad, so that the installation of the packaged device is more convenient and quick.

In any of the above technical solutions, preferably, the solder is tin solder or brazing material.

In this technical solution, the solder is tin solder or brazing material, which is low in cost, simple in application, and convenient for mass production.

In any of the above technical solutions, preferably, the first pad is embedded in the substrate, so that the surface of the first pad is flush with the surface of the substrate.

In this technical solution, the first pad is embedded in the substrate and is not easy to fall off; at the same time, the surface of the first pad is flush with the surface of the substrate, so that the conductive film and the substrate are more closely bonded and not easy to loosen, thereby increasing reliability. sex.

In any of the above technical solutions, preferably, the substrate is a ceramic substrate or a PCB board.

In this technical solution, the substrate is a ceramic substrate or a PCB (printed circuit board) board, which is mature in technology and low in production difficulty, which is beneficial to cost control.

The second aspect of the present invention provides a method for manufacturing a packaged device, including: setting a first pad on a substrate; setting a conductive film on the substrate, and the conductive film is attached to the first pad; The disk is pasted on the conductive film; the chip and the conductive film are packaged to form a packaged device.

In this technical solution, a first pad is provided on the substrate to connect to the second pad of the chip; a conductive film is provided on the substrate to be bonded to the first pad, and the second pad of the chip is bonded On the conductive film, realize the electrical connection between the second pad of the chip and the corresponding first pad on the substrate; package the chip and the conductive film, and the packaged chip and the conductive film are firmly fixed on the substrate to form a packaged device . This packaging method does not use wires and solder, and does not need to use solder welding for the first pad and the second pad, so there will be no damage to the bonding wire at the bonding of the first pad and the second pad, and there will be no damage to the bonding wire. Bonding deformation occurs, and there is no foreign matter involved in the processing process, thereby ensuring that the bonding surface is clean. At the same time, it avoids the high-temperature processing steps during flip-chip welding technology, and neither the chip nor the substrate is heated, which avoids the situation where the chip position swings and shifts when a large amount of thermal stress is generated during thermal loading, and when the packaged device is a power device, It avoids the situation that due to the large heat generation of the power device, the heat accumulated in the package will cause desoldering due to long-term use. At the same time, the packaging process can package multiple chips, conductive films and corresponding multiple substrates at the same time to improve production efficiency. After the packaging is completed, multiple packaged packaged devices are separated into independent packaged devices through the cutting process, which can be further processed. Increase production capacity.

In the above technical solution, preferably, between attaching the second pad of the chip to the conductive film, and packaging the chip and the conductive film to form a packaged device, the manufacturing method of the packaged device further includes: applying the second bonding pad to the chip A preset pressure, the direction of the first preset pressure is perpendicular to the substrate.

In this technical solution, a first preset pressure perpendicular to the substrate is applied to the chip, and the first preset pressure is less than the minimum pressure that will cause damage to the chip, so as to ensure that the chip will not be damaged during the packaging process, and at the same time, the first preset pressure of the chip will not be damaged. The bonding between the second pad, the conductive film and the first pad of the substrate is tighter, ensuring the reliability of the electrical connection between the second pad of the chip, the conductive film and the first pad of the substrate.

In the above technical solution, preferably, after the chip and the conductive film are packaged to form the packaged device, the manufacturing method of the packaged device further includes: disposing a third pad on the substrate; and disposing solder on the third pad.

In this technical solution, a third pad correspondingly connected to the first pad is provided on the substrate to realize the electrical connection between the second pad of the chip and the third pad of the packaging device substrate, and the third pad Solder is set on the package to make the installation of the packaged device more convenient and quick.

In any of the above technical solutions, preferably, after the chip and the conductive film are packaged to form the packaged device, the manufacturing method of the packaged device further includes: trimming burrs of the packaged device; cleaning the packaged device.

In this technical solution, after packaging the chip and the conductive film, the package body is cured and separated into independent packaged devices, the burrs of the packaged devices are trimmed and the packaged devices are cleaned, so as to improve the workmanship quality of the packaged devices and further improve the user's satisfaction with the product .

Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present invention will become apparent and comprehensible from the description of the embodiments in conjunction with the following drawings, wherein:

FIG. 1 shows a schematic structural view of a packaged device according to an embodiment of the present invention;

Fig. 2 shows a schematic structural view of a conductive film according to an embodiment of the present invention;

Figure 3 shows a schematic structural view of a conductive film according to another embodiment of the present invention;

FIG. 4 shows a schematic structural diagram of a packaged device according to another embodiment of the present invention;

FIG. 5 shows a schematic structural diagram of a packaged device according to yet another embodiment of the present invention;

FIG. 6 shows a schematic structural diagram of a packaged device according to yet another embodiment of the present invention;

FIG. 7 shows a schematic structural diagram of a packaged device according to yet another embodiment of the present invention;

FIG. 8 shows a flowchart of a method for manufacturing a packaged device according to an embodiment of the present invention;

FIG. 9 shows a flowchart of a method for manufacturing a packaged device according to another embodiment of the present invention;

FIG. 10 shows a flowchart of a method for manufacturing a packaged device according to yet another embodiment of the present invention;

FIG. 11 shows a flow chart of a method for manufacturing a packaged device according to yet another embodiment of the present invention;

Wherein, the corresponding relationship between the reference numerals and the part names in Fig. 1 to Fig. 7 is:

1 substrate; 2 first pad; 3 chip; 4 second pad; 5 conductive film; 51 insulating carrier; 52 conductor; 6 package; 7 third pad; 8 solder.

Detailed ways

In order to understand the above-mentioned purpose, features and advantages of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described here. Therefore, the protection scope of the present invention is not limited by the specific details disclosed below. EXAMPLE LIMITATIONS.

The packaged device and the manufacturing method of the packaged device according to some embodiments of the present invention will be described below with reference to FIGS. 1 to 11 .

As shown in Figure 1, in the embodiment of the first aspect of the present invention, the present invention provides a packaged device, comprising: a substrate 1, a chip 3, a conductive film 5 and a package body 6; one side of the substrate 1 is provided with a first A pad 2; the chip 3 includes a second pad 4; one side of the conductive film 5 is attached to the first pad 2, the other side of the conductive film 5 is attached to the second pad 4, and the first solder The pad 2 is opposite to the second pad 4 ; the package body 6 covers at least the outside of the chip 3 and the conductive film 5 .

In this embodiment, in the package body 6 of the packaged device, the second pad 4 of the chip 3 and the first pad 2 of the substrate 1 are bonded through the conductive film 5, and the conductive film 5 and the substrate 1 need to be installed with the chip during manufacture. 3, then attach the chip 3 and the conductive film 5, apply a certain pressure on the chip 3, and then package the chip 3, the conductive film 5 and the substrate 1 tightly by pressing, and then package the chip 3 and the conductive film 5. After the package is cured, the positions of the chip 3 , the conductive film 5 and the substrate 1 are fixed to each other. The method has a simple production process, does not require expensive bonding equipment, reduces production procedures, and can be applied to the production of micro-miniature packaging devices. Since lead wire and solder are not used in the manufacturing process, there is no need to use solder welding to the first pad 2 and the second pad 4, so no bonding impact will occur at the bonding place of the first pad 2 and the second pad 4. There will be no problems such as bond breakage and deformation, and there will be no foreign matter involved in the processing process, thereby ensuring that the bonding surface is clean. At the same time, the combination by pressing can also avoid the high-temperature processing steps during the flip-chip welding process, and neither the chip 3 nor the substrate 1 will be heated, which avoids the position of the chip 3 swinging and shifting when a large amount of thermal stress is generated during thermal loading. situation, and when the packaged device is a power device, it is avoided that due to the high heat generation of the power device, the heat accumulated in the package body 6 after long-term use will cause the bonding wire and solder joints to be damaged and desoldering. Therefore, the yield rate of packaged devices is higher, and the reliability in use is also better. At the same time, the production process is simple, which is conducive to mass production.

In one embodiment of the present invention, preferably, as shown in FIG. 2 , the conductive film 5 includes: an insulating carrier 51 and a conductor 52 ; the conductor 52 extends along the thickness direction of the insulating carrier 51 .

In this embodiment, in the insulating carrier 51, conductors 52 are arranged at intervals along the thickness of the insulating carrier 51 to form the conductive film 5, so that the conductive film 5 conducts electric current through the conductors 52 in the thickness direction, and the first part of the chip 3 When the second pad 4 and the first pad 2 of the substrate 1 are attached to both sides of the conductive film 5 respectively, the electrical connection between the chip 3 and the corresponding pad of the substrate 1 is realized.

In one embodiment of the present invention, preferably, as shown in FIG. 2 , a plurality of conductors 52 are distributed in an array on the insulating carrier 51 .

In this embodiment, a plurality of conductors 52 are distributed on the insulating carrier 51 in the form of an array, and a single conductor 52 can be in the shape of a cylinder or a cube to ensure that the conductive film 5 is electrically connected in the thickness direction and each All pads are in contact with at least one conductor 52 , and in the case that multiple conductors 52 are in contact with the same pad at the same time, the total contact area can be increased and the electrical conductivity can be improved.

In one embodiment of the present invention, preferably, as shown in FIGS. Any width of the cross section of the conductor 52 is smaller than the distance between adjacent first pads 2 ; and/or any width of the cross section of the conductor 52 is smaller than the distance between adjacent second pads 4 .

In this embodiment, the first pads 2 of the prefabricated substrate 1 are set in multiples, and the number is equal to the number of the second pads 4 of the chip 3, so as to ensure that the number of pins/contacts of the chip 3 after packaging remains unchanged; Any width of the cross-section of the body 52 is less than the distance between the adjacent first pads 2, that is, a single conductor 52 will not contact any two adjacent first pads 2 in any direction at the same time, ensuring Any two adjacent first pads 2 will not be short-circuited; and/or any width of the cross-section of the conductor 52 is smaller than the distance between the adjacent second pads 4, that is, a single conductor 52 Likewise, any two adjacent second pads 4 in any direction will not be contacted at the same time, ensuring that any two adjacent second pads 4 will not be short-circuited.

In one embodiment of the present invention, preferably, as shown in FIG. 5 and FIG. 6 , the first pad 2 and the second pad 4 are directly provided with one or more conductors 52 .

In this embodiment, the corresponding first pad 2 and the second pad 4 are electrically connected through one or more conductors 52. On the basis of ensuring the reliability of the electrical connection, more conductors 52 can increase the The total area of the conductor 52 between the first pad 2 and the second pad 4 reduces the impedance.

In one embodiment of the present invention, preferably, as shown in FIG. 1 to FIG. 7 , the packaged device further includes: a third pad 7; Disk 2 is connected.

In this embodiment, on the other side of the substrate 1, a third pad 7 that is connected to the first pad 2 through a built-in circuit is provided, that is, the connection between the second pad 4 and the third pad 7 of the chip 3 is realized. The corresponding electrical connection relationship between them ensures that the function of the chip 3 after being packaged as a packaged device is complete.

In one embodiment of the present invention, preferably, as shown in FIG. 1 , the packaged device further includes: solder 8 ; the solder 8 is disposed on the third pad 7 .

In this embodiment, the solder 8 is provided on the third pad 7, and the solder 8 is spherical or hemispherical, which makes the installation of the packaged device more convenient and quick.

In one embodiment of the present invention, preferably, the solder 8 is tin solder 8 or solder 8 .

In this technical solution, the solder 8 is tin solder or brazing material, which is low in cost, simple in application, and convenient for mass production.

In one embodiment of the present invention, preferably, as shown in FIG. 1, FIG. 3 to FIG. together.

In this embodiment, the first pad 2 is embedded in the substrate 1 and is not easy to fall off; at the same time, the surface of the first pad 2 is flush with the surface of the substrate 1, so that the conductive film 5 and the substrate 1 are more closely bonded, Not easy to loosen, thus increasing reliability.

In one embodiment of the present invention, preferably, the substrate 1 is a ceramic substrate or a PCB board.

In this embodiment, the substrate 1 is made of a ceramic substrate or a PCB board, which has mature technology and low production difficulty, which is beneficial to cost control.

As shown in FIG. 8, the embodiment of the second aspect of the present invention provides a method for manufacturing a packaged device, including: as shown in FIG. 3 and FIG. 4, S101, setting the first pad 2 on the substrate 1; 5, S102, a conductive film 5 is provided on the substrate 1, and the conductive film 5 is attached to the first pad 2; as shown in FIG. 6, S103, the second pad 4 of the chip 3 is attached to the conductive film 5; as shown in FIG. 7, S104, package the chip 3 and the conductive film 5 to form a packaged device.

In this embodiment, a first pad 2 is provided on the substrate 1 to connect to the second pad 4 of the chip 3; a conductive film 5 is provided on the substrate 1 to be bonded to the first pad 2, and the conductive film 5 is provided. The method of 5 can be methods such as placement, sticking or spraying, and the second pad 4 of the chip 3 is pasted on the conductive film 5 that has been set, so that the second pad 4 of the chip 3 and the corresponding first pad 4 on the substrate 1 can be realized. An electrical connection between the pads 2; packaging the chip 3 and the conductive film 5, and the packaged chip 3 and the conductive film 5 are firmly fixed on the substrate 1 to form a packaged device. This packaging method does not use wires and solder, and does not need to use solder to weld the first pad 2 and the second pad 4, so the bond between the first pad 2 and the second pad 4 will not be damaged by the bonding wire , There will be no bonding deformation, and there is no foreign matter involved in the processing process, thereby ensuring that the bonding surface is clean. At the same time avoid the high-temperature processing steps during the flip-chip welding process, the chip 3 and the substrate 1 will not be heated, avoiding the situation where the position of the chip 3 swings and shifts when a large amount of thermal stress is generated during thermal loading, and the packaged device is power When using the device, it is avoided that the power device generates a large amount of heat, and the situation of desoldering due to heat accumulation in the package body 6 caused by long-term use is avoided. The packaging process can be to place multiple substrates 1 combined with chips 3 and conductive films 5 in corresponding molds for injection molding packaging. The packaging process can simultaneously package multiple devices to improve production efficiency. After the packaging is completed, through the cutting process Cutting and separating into multiple independent packaged devices, that is, multiple finished packaged devices can be obtained at the same time through one packaging process, thereby increasing production capacity.

In one embodiment of the present invention, preferably, as shown in FIG. 9, the manufacturing method of the packaged device includes: as shown in FIG. 3 and FIG. 4, S201, setting the first pad 2 on the substrate 1; As shown, S202, a conductive film 5 is provided on the substrate 1, and the conductive film 5 is bonded to the first pad 2; as shown in FIG. 6, S203, the second pad 4 of the chip 3 is bonded to the conductive film 5 Above; S204, apply a first preset pressure to the chip 3, the direction of the first preset pressure is perpendicular to the substrate 1; as shown in FIG. 7, S205, package the chip 3 and the conductive film 5 to form a packaged device.

In this embodiment, the first pad 2 is provided on the substrate 1 to connect the second pad 4 of the chip 3; the conductive film 5 is provided on the substrate 1 to be attached to the first pad 2, and the chip The second pad 4 of 3 is pasted on the conductive film 5 to realize the electrical connection between the second pad 4 of the chip 3 and the corresponding first pad 2 on the substrate 1; the chip 3 and the conductive film 5 are packaged. The chip 3 and the conductive film 5 are firmly fixed on the substrate 1 to form a packaged device. This packaging method does not use wires and solder, and does not need to use solder to weld the first pad 2 and the second pad 4, so the bond between the first pad 2 and the second pad 4 will not be damaged by the bonding wire , There will be no bonding deformation, and there is no foreign matter involved in the processing process, thereby ensuring that the bonding surface is clean. At the same time avoid the high-temperature processing steps during the flip-chip welding process, the chip 3 and the substrate 1 will not be heated, avoiding the situation where the position of the chip 3 swings and shifts when a large amount of thermal stress is generated during thermal loading, and the packaged device is power When using the device, it is avoided that the power device generates a large amount of heat, and the situation of desoldering due to heat accumulation in the package body 6 caused by long-term use is avoided. At the same time, the packaging process can package multiple chips 3, conductive films 5 and corresponding multiple substrates 1 at the same time to improve production efficiency. After the packaging is completed, multiple packaged packaged devices are separated into independent packaged devices through a cutting process. , can further increase production capacity.

Apply a first preset pressure perpendicular to the substrate 1 to the chip 3, the first preset pressure is less than the minimum pressure that will cause damage to the chip 3, so as to ensure that the chip 3 will not be damaged during the packaging process, and at the same time make the second pressure of the chip 3 The pad 4, the conductive film 5 and the first pad 2 of the substrate 1 are more closely bonded to ensure the reliability of the electrical connection between the second pad 4 of the chip 3, the conductive film 5 and the first pad 2 of the substrate 1 .

In one embodiment of the present invention, preferably, as shown in FIG. 10 , the manufacturing method of the packaged device includes: as shown in FIG. 3 and FIG. 4 , S301, setting the first pad 2 on the substrate 1; As shown, S302, a conductive film 5 is provided on the substrate 1, and the conductive film 5 is attached to the first pad 2; as shown in FIG. 6, S303, the second pad 4 of the chip 3 is attached to the conductive film 5 on; as shown in FIG. 7, S304, package the chip 3 and the conductive film 5 to form a packaged device, S305, set the third pad 7 on the substrate 1; as shown in FIG. 1, S306, install the third pad 7 Set solder 8 on.

In this embodiment, the first pad 2 is provided on the substrate 1 to connect the second pad 4 of the chip 3; the conductive film 5 is provided on the substrate 1 to be attached to the first pad 2, and the chip The second pad 4 of 3 is pasted on the conductive film 5 to realize the electrical connection between the second pad 4 of the chip 3 and the corresponding first pad 2 on the substrate 1; the chip 3 and the conductive film 5 are packaged. The chip 3 and the conductive film 5 are firmly fixed on the substrate 1 to form a packaged device. This packaging method does not use wires and solder, and does not need to use solder to weld the first pad 2 and the second pad 4, so the bond between the first pad 2 and the second pad 4 will not be damaged by the bonding wire , There will be no bonding deformation, and there is no foreign matter involved in the processing process, thereby ensuring that the bonding surface is clean. At the same time avoid the high-temperature processing steps during the flip-chip welding process, the chip 3 and the substrate 1 will not be heated, avoiding the situation where the position of the chip 3 swings and shifts when a large amount of thermal stress is generated during thermal loading, and the packaged device is power When using the device, it is avoided that the power device generates a large amount of heat, and the situation of desoldering due to heat accumulation in the package body 6 caused by long-term use is avoided. At the same time, the packaging process can package multiple chips 3, conductive films 5 and corresponding multiple substrates 1 at the same time to improve production efficiency. After the packaging is completed, multiple packaged packaged devices are separated into independent packaged devices through a cutting process. , can further increase production capacity.

The third pad 7 correspondingly connected to the first pad 2 is provided on the substrate 1 to realize the electrical connection between the second pad 4 of the chip 3 and the third pad 7 of the packaging device substrate 1, and the third pad The solder 8 is arranged on the plate 7, so that the installation of the packaged device is more convenient and quick.

In one embodiment of the present invention, preferably, as shown in FIG. 11 , the manufacturing method of the packaged device includes: as shown in FIG. 3 and FIG. 4 , S401, setting the first pad 2 on the substrate 1; As shown, S402, a conductive film 5 is provided on the substrate 1, and the conductive film 5 is attached to the first pad 2; as shown in FIG. 6, S403, the second pad 4 of the chip 3 is attached to the conductive film 5 As shown in FIG. 7, S404, package the chip 3 and the conductive film 5 to form a packaged device, S405, trim the burrs of the packaged device; S406, clean the packaged device.

In this embodiment, the first pad 2 is provided on the substrate 1 to connect the second pad 4 of the chip 3; the conductive film 5 is provided on the substrate 1 to be attached to the first pad 2, and the chip The second pad 4 of 3 is pasted on the conductive film 5 to realize the electrical connection between the second pad 4 of the chip 3 and the corresponding first pad 2 on the substrate 1; the chip 3 and the conductive film 5 are packaged. The chip 3 and the conductive film 5 are firmly fixed on the substrate 1 to form a packaged device. This packaging method does not use wires and solder, and does not need to use solder to weld the first pad 2 and the second pad 4, so the bond between the first pad 2 and the second pad 4 will not be damaged by the bonding wire , There will be no bonding deformation, and there is no foreign matter involved in the processing process, thereby ensuring that the bonding surface is clean. At the same time avoid the high-temperature processing steps during the flip-chip welding process, the chip 3 and the substrate 1 will not be heated, avoiding the situation where the position of the chip 3 swings and shifts when a large amount of thermal stress is generated during thermal loading, and the packaged device is power When using the device, it is avoided that the power device generates a large amount of heat, and the situation of desoldering due to heat accumulation in the package body 6 caused by long-term use is avoided. At the same time, the packaging process can package multiple chips 3, conductive films 5 and corresponding multiple substrates 1 at the same time to improve production efficiency. After the packaging is completed, multiple packaged packaged devices are separated into independent packaged devices through a cutting process. , can further increase production capacity.

After packaging the chip 3, the conductive film 5, and the package body 6 are solidified and separated into independent packaged devices, the burrs of the packaged devices are trimmed and the packaged devices are cleaned to improve the workmanship quality of the packaged devices and further improve the user's satisfaction with the product.

In the description of the present invention, the term "plurality" refers to two or more than two. Unless otherwise clearly defined, the orientation or positional relationship indicated by the terms "upper", "lower" and so on is based on the orientation shown in the accompanying drawings. Orientation or positional relationship is only for the convenience of describing the present invention and simplifying the description, but does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as limiting the present invention; The terms "connection", "installation" and "fixation" should be understood in a broad sense, for example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or through an intermediate Media connected. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In the description of the present invention, descriptions of the terms "one embodiment", "some embodiments", "specific embodiments" and the like mean that a specific feature, structure, material or characteristic described in connection with the embodiment or example is included in the present invention In at least one embodiment or example of . In the present invention, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims (14)

1. A packaging device, characterized in that, comprising: a substrate, one side of the substrate is provided with a first pad; a chip including a second pad; A conductive film, one side of the conductive film is attached to the first pad, the other side of the conductive film is attached to the second pad, and the first pad is attached to the second pad. The two pads are set relative to each other; A packaging body, the packaging body at least covers the outside of the chip and the conductive film. 2. The packaged device according to claim 1, wherein the conductive film comprises: insulating carrier; A conductor, the conductor extending along the thickness direction of the insulating carrier. 3. The packaged device according to claim 2, characterized in that, A plurality of the conductors are distributed in an array on the insulating carrier. 4. The packaged device according to claim 3, characterized in that, There are multiple first pads, and the number of the second pads is equal to the number of the first pads; Any width of the cross-section of the conductor is smaller than the distance between adjacent first pads; and/or Any width of the cross-section of the conductor is smaller than the distance between adjacent second pads. 5. The packaged device according to claim 3, characterized in that, The first pad and the second pad are directly provided with one or more conductors. 6. The packaging device according to claim 1, further comprising: A third pad, the third pad is disposed on the other side of the substrate and connected to the first pad. 7. The packaging device according to claim 6, further comprising: solder, and the solder is disposed on the third pad. 8. The packaged device according to claim 7, characterized in that, The solder is tin solder or brazing material. 9. The packaged device according to any one of claims 1 to 8, characterized in that, The first pad is embedded in the substrate, so that the surface of the first pad is flush with the surface of the substrate. 10. The packaged device according to any one of claims 1 to 8, characterized in that, The substrate is a ceramic substrate or a PCB. 11. A method of manufacturing a packaged device, comprising: setting a first pad on the substrate; disposing a conductive film on the substrate, the conductive film is bonded to the first pad; Bonding the second pad of the chip on the conductive film; The chip and the conductive film are packaged to form a packaged device. 12. The manufacturing method of a packaged device according to claim 11, characterized in that, in the bonding of the second pad of the chip on the conductive film, and the packaging of the chip and the conductive film , to form between packaged devices, the manufacturing method of said packaged device also includes: A first preset pressure is applied to the chip, and the direction of the first preset pressure is perpendicular to the substrate. 13. The method for manufacturing a packaged device according to claim 11, characterized in that, after the packaging of the chip and the conductive film to form a packaged device, the method for manufacturing the packaged device further comprises: setting a third pad on the substrate; Solder is provided on the third pad. 14. The manufacturing method of a packaged device according to any one of claims 11 to 13, characterized in that, after said packaging said chip and said conductive film to form a packaged device, said packaged device is manufactured Methods also include: trimming the burrs of the packaged device; The packaged device is cleaned.