CN201053659Y - Multi-layer heat-conducting plate radiator for LED - Google Patents

Abstract

The utility model relates to a multi-layer heat-conducting plate heat dissipation device of a light-emitting diode, which is a heat dissipation device combining the light-emitting diode and the multi-layer heat-conducting plate, the device is provided with more than one fixed heat dissipation frames, and a light source substrate or a heat-conducting plate is respectively clamped between the fixed heat dissipation frames; the light source substrate is provided with current leads and a plurality of light emitting diodes which are electrically connected with the current leads and are arranged in a certain array, the heat conducting plates are provided with openings respectively, the openings are inserted with heat conducting columns which are staggered mutually, and the other ends of the heat conducting columns are contacted with the light source substrate respectively.

Description

Multi-layer heat conduction plate cooling device for light-emitting diodes

technical field

The utility model relates to a multi-layer heat conduction plate cooling device for light-emitting diodes, which conducts heat to heat conduction plates of different layers through heat conduction columns, so that the heat generated by light-emitting diodes and matching drive circuits can be layered. , Three-dimensional, dispersed cooling method quickly dissipates to the outside world.

Background technique

The most commonly used light sources in daily life are old-fashioned light bulbs, quartz light bulbs, fluorescent light bulbs, and mercury lamps. Time, fast response and other advantages, coupled with its small size, vibration resistance, suitable for mass production, easy to meet the needs of the application to make extremely small and array components, so LEDs are used in the indication of information, communication and consumer products , Display devices have become an indispensable and important component in daily life. Similarly, high-brightness light-emitting diodes as light sources for backlighting or lighting will also receive more and more attention.

However, high-brightness light-emitting diodes are used as light sources for backlight or lighting. Due to conversion efficiency problems, high heat will be generated during use, and continuous high heat will cause damage to electronic components. A plurality of light-emitting diodes, so the generated heat will be higher, in order to solve the heat dissipation problem of the backlight or lighting fixture, please refer to as shown in Figure 1, it is provided with a heat dissipation base 100, and this heat dissipation base 100 is provided with a plurality of arrays on one side Neat heat dissipation fins 101, these heat dissipation fins 101 and the heat dissipation base 100 are in a vertical shape, and on the heat dissipation base 100 and the side opposite to the heat dissipation fins 101, a light source substrate 102 is attached, and the light source substrate 102 is provided with There are a plurality of light emitting diodes 103, and these light emitting diodes 103 are respectively electrically connected to the light source substrate 102. In this way, although the heat generated by the light emitting diodes 103 can be removed by the light source substrate 102 and the heat sink 100, the light emitting diodes 103 are all installed on the same light source substrate 102, so the heat generated is also concentrated on the light source substrate 102 first, although the heat is conducted to the outside through the heat sink 100 that is in close contact with the light source substrate 102, but often the light emitting diodes on the light source substrate 102 103 Factors with high distribution density cannot dissipate heat quickly from a single plane, and heat retention will occur, which cannot dissipate heat quickly, so that the light source of the backlight or lighting source is too hot. At the same time, the heat sink 100 The design of the cooling fins 101 will increase the size and production cost of the lamp, which is not ideal for use.

In view of the above-mentioned shortcoming, the inventor began to seek improvement for the crux of the problem, to make up for the lack of it, in order to seek a reasonable solution, and through countless times of research and design, finally completed the utility model. Multi-layer heat conduction plate cooling device for light-emitting diodes.

Contents of the invention

The purpose of this utility model is to provide a multi-layer heat conduction plate cooling device for light-emitting diodes. The heat generated by the light-emitting diodes is dispersed and arranged on the heat conduction plates of different layers by the heat conduction of the heat conduction columns, so that the The generated heat is not only conducted and dissipated by the light source substrate and the fixed heat dissipation frame, but also by layered, three-dimensional, and dispersed heat conduction plates to increase the heat dissipation area, thereby achieving the purpose of rapid heat dissipation.

Another object of the present invention is to provide a multi-layer heat-conducting plate cooling device for light-emitting diodes, in which an optical light-increasing and uniforming plate is provided on the periphery of the fixed heat-dissipating frame of the outer layer to uniformly increase the brightness of the light source.

Another object of the present utility model is to provide a multi-layer heat-conducting plate cooling device for light-emitting diodes. The heat-conducting columns can be integrally formed with any layer of heat-conducting plates, and the heat-conducting columns respectively pass through the stacked heat-conducting plates of other layers. The openings of the light source substrate are in contact with the inner side of the light source substrate, so that the heat generated by the light emitting diodes can be conducted to the heat conduction plate of each layer through the heat conduction column.

The purpose of this utility model is achieved like this, a kind of multi-layer heat conduction plate cooling device of light-emitting diode, and this device comprises:

More than one fixed cooling frame, the fixed cooling frames are stacked and fixed together;

A light source substrate, which is sandwiched between the fixed heat dissipation frames of the outer layer, and a plurality of light-emitting diodes in a certain arrangement are respectively inserted on the light source substrate;

At least one heat conduction plate, which is respectively sandwiched between the fixed heat dissipation frames, and located under the light source substrate. The heat conduction plates are provided with heat conduction columns that are in contact with the light source substrate. Guided to the heat conduction plates of different layers, and the fixed heat dissipation frame, the light source substrate and the heat conduction plate stacked together can distribute the heat generated by the light emitting diodes so that they are not distributed on the same plane, but can pass through The fixed heat dissipation frame, light source substrate and heat conduction plate on different planes conduct heat conduction and heat dissipation in a layered, three-dimensional, and decentralized manner.

The heat conducting plate is composed of graphite.

The fixed cooling frame is made of metal with good heat dissipation.

An opening is provided in the fixed cooling frame.

A plurality of openings are arranged on the heat conducting plate, and the openings are used for passing through the heat conducting column.

The heat conduction column is integrally formed with the heat conduction plate on the same layer.

The heat conduction column is formed integrally with the heat conduction plates of different layers.

The fixed heat dissipation frame is provided with a lock hole, and the fixed heat dissipation frame is locked by a locking piece inserted into the lock hole so as to be fixedly stacked together.

The inner periphery of the outermost fixed cooling frames stacked on top of each other is provided with an optical light-increasing and light-enhancing plate.

From the above, the multi-layer heat conducting plate cooling device for light-emitting diodes of the present invention is a cooling device for light-emitting diodes used as backlight or lighting. The device is provided with more than one fixed heat dissipation frame with heat dissipation effect. A light source substrate or a heat conduction plate is respectively interposed between the fixed heat dissipation frames; wherein, a light source substrate is arranged between the fixed heat dissipation frames of the outer layer, and a plurality of light emitting diodes arranged in a certain arrangement are respectively arranged on the light source substrate. There are current leads electrically connected to the light-emitting diodes, and heat-conducting pillars in contact with each other are provided on the inside of the light source substrate, and the other ends of the heat-conducting pillars are respectively in contact with heat-conducting plates of different layers. In this way, the The heat conduction of these heat conduction columns disperses the heat generated by the light-emitting diodes to the heat conduction plates of different layers stacked on top of each other, so that the heat generated can not only be conducted and dissipated by the light source substrate and the fixed heat dissipation frame, but also The heat dissipation area can be increased by layered, three-dimensional, and dispersed heat conduction plates, and the effect of rapid heat dissipation can be achieved.

Description of drawings

Fig. 1: is the three-dimensional schematic diagram of known technology.

Fig. 2: is a three-dimensional schematic diagram of the first embodiment of the present invention.

Fig. 3: It is a three-dimensional exploded schematic view of the first embodiment of the present invention.

Fig. 4: It is a cross-sectional schematic diagram of the first embodiment of the present utility model.

FIG. 5 : is a three-dimensional exploded schematic view of the second embodiment of the present invention.

Fig. 6: It is a three-dimensional exploded schematic view of the third embodiment of the present invention.

Fig. 6a: A schematic diagram showing an enlarged section of A-A of the third embodiment of the present invention.

Fig. 7 is a three-dimensional exploded schematic view of the fourth embodiment of the present invention.

Fig. 7a: is a B-B enlarged cross-sectional schematic view of the fourth embodiment of the present invention.

Figure number:

Fixed cooling frame 10

opening 11

Keyhole 12

Lock 13

Light source substrate 20

Perforation 21, 32

Heat conduction plate 30

Hole 31

LED 40

Thermal column 50

Optical brightening uniform plate 60

Detailed ways

Please refer to Fig. 2, Fig. 3 and Fig. 4, which are the first embodiment of the present utility model. The generated heat is dissipated by dispersed and layered heat conduction plates to increase the heat dissipation area; the device is provided with more than one fixed heat dissipation frame 10 with heat dissipation effect, and an opening 11 is respectively provided in the fixed heat dissipation frames 10, and the The ends of the fixed heat dissipation frame 10 are respectively provided with opposite locking holes 12, and a locking member 13 can be threaded through the locking holes 12, which is a locking bar in this embodiment, so that the fixed heat dissipation frames 10 can be Through the locking of the locking parts 13 inserted in the locking holes 12, they are stacked together.

In addition, a light source substrate 20 is connected to the fixed heat dissipation frame 10 of the outer layer. The light source substrate 20 is made of a heat-conducting material, so that the light source substrates 20 have a rapid heat conduction effect, and the light source substrate 20 is provided with a plurality of A certain array of light emitting diodes 40, these light emitting diodes 40 are electrically connected with the drive circuit (not shown in the figure) through the current lead, and the end edge of the light source substrate 20 is respectively provided with the through hole 21 opposite to the lock hole 12 So that the heat generated by the light emitting diodes 40 can be conducted to the outside through the light source substrate 20 and the fixed heat dissipation frame 10 .

Furthermore, at least one layer of heat conduction plates 30 (two in this embodiment, made of graphite with a specific heat conduction direction) are provided under the light source substrate 20, and these heat conduction plates 30 are made of heat conduction materials. , and the heat conduction plates 30 are provided with a plurality of openings 31, and the openings 31 are respectively inserted with heat conduction columns 50, and the other ends of the heat conduction columns 50 are respectively in contact with the light source substrate 20, and different layers of heat conduction plates The heat conduction pillars 50 on 30 are in the shape of misalignment with each other, so that the heat generated by the light emitting diodes 40 in the light source substrate 20 can be passed through the opening and the upper layer of the fixed heat dissipation frame 10 through these heat conduction pillars 50 respectively. The openings 31 of the heat conduction plate 30 disperse and conduct heat conduction to different layers of the heat conduction plate 30 , further increasing the rapid heat conduction effect.

Also, an optical intensification and uniformity plate 60 is provided on the periphery of the fixed heat dissipation frame 10 stacked on the outermost layer, so that the light-emitting diodes 40 on the light source substrate 20 can increase the brightness of the light source evenly by the effect of the optical intensification and uniformity plate 60 .

Please refer to Fig. 5, which is the second embodiment of the present invention. The difference between this embodiment and the above-mentioned embodiment is that a plurality of The integrally formed heat conduction columns 50, the heat conduction columns 50 between the heat conduction plates 30 of different layers are mutually misaligned, and the other ends of the heat conduction columns 50 respectively pass through the openings 31 of the upper heat conduction plate 30, and are connected to the light source substrate 20 contacts, in this way, the heat generated by the light emitting diodes 40 in the light source substrate 20 can be passed through the openings 31 of the fixed heat dissipation frame 10 and the inner heat conduction plate 30 through the heat conduction column 50, and the heat can be divided into two parts. layered, three-dimensional, and dispersed ways to conduct heat to different heat conducting plates 30 , and then quickly dissipate heat outward through different fixed heat dissipation frames 10 .

Please refer to Figure 6 and Figure 6a, which is the third embodiment of the present utility model, which is mainly provided with a plurality of heat conduction columns 50 integrally formed with it on any layer of heat conduction plate 30, and the heat conduction columns 50 One end is in contact with the inner side of the light source substrate 20, and the other end is sheathed through the opening 31 on the fixed heat dissipation frame 10 and the heat conduction plate 30, and is in contact with the heat conduction plate 30 of different layers, so that the heat is distributed in a layered, three-dimensional, and dispersed manner. Conducted to each fixed heat dissipation frame 10 , and then quickly dissipates heat outward through the fixed heat dissipation frames 10 .

Please refer to Fig. 7 and Fig. 7a, which is the fourth embodiment of the present utility model, which is mainly provided with a plurality of integrally formed heat-conducting columns 50 on the outermost heat-conducting plate 30, and these heat-conducting columns The other end of 50 passes through the opening 31 of the fixed heat dissipation frame 10 and the different inner heat conducting plates 30, and contacts the inner side of the light source substrate 20, and conducts heat from the heat conducting column 50 in a layered, three-dimensional, and dispersed manner to the Each heat conduction plate 30 , these heat conduction plates 30 conduct to each fixed heat dissipation frame 10 again, and dissipate heat outward rapidly through these fixed heat dissipation frames 10 .

In addition, the end edge of the heat conduction plate 30 of the present utility model is provided with a perforation 32. When in use, it can be sandwiched by the fixed heat dissipation frame 10 to keep a certain distance from the light source substrate 20. At the same time, the heat conduction plate 30, the light source substrate 20 and the fixed The cooling frames 10 can be stacked together by locking the locking pieces 13 inserted in the locking holes 12 and the through holes 21 and 32 (as shown in FIG. 2 and FIG. 4 ).

Claims (9)

1. A multi-layer heat conduction plate cooling device for light-emitting diodes, characterized in that the device includes: More than one fixed cooling frame, the fixed cooling frames are stacked and fixed together; A light source substrate, which is sandwiched between the fixed heat dissipation frames of the outer layer, and a plurality of light-emitting diodes in a certain arrangement are respectively inserted on the light source substrate; At least one heat conduction plate is respectively interposed between the fixed heat dissipation frames and located under the light source substrate. The heat conduction plates are provided with heat conduction columns in contact with the light source substrate. 2 . The multi-layer heat-conducting plate cooling device for light-emitting diodes according to claim 1 , wherein the heat-conducting plate is made of graphite. 3 . 3 . The multi-layer heat-conducting plate cooling device for light-emitting diodes according to claim 1 , wherein the fixed cooling frame is made of metal with good heat dissipation. 4 . 4 . The multi-layer heat-conducting plate cooling device for light-emitting diodes according to claim 1 , wherein an opening is provided in the fixed cooling frame. 5 . The multi-layer heat-conducting plate cooling device for light-emitting diodes according to claim 1 , wherein the heat-conducting plate is provided with a plurality of openings, and the openings are used for passing through the heat-conducting columns. 6 . 6 . The multi-layer heat conduction plate cooling device for light emitting diodes as claimed in claim 1 , wherein the heat conduction column is integrally formed with the heat conduction plate of the same layer. 6 . 7 . The multi-layer heat conduction plate cooling device for light emitting diodes according to claim 1 , wherein the heat conduction column is integrally formed with heat conduction plates of different layers. 8. The multi-layer heat conduction plate cooling device for light-emitting diodes as claimed in claim 1, wherein the fixed heat dissipation frame is provided with a lock hole, and the fixed heat dissipation frame is locked by a locking piece inserted into the lock hole to be fixedly stacked together. 9 . The multi-layer heat conduction plate cooling device for light emitting diodes according to claim 1 , characterized in that: the inner periphery of the outermost fixed heat dissipation frames stacked on each other is provided with an optical light-increasing and uniform light plate. 10 .

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