CN107911956A - A kind of production method of pcb board for high voltage power distribution device - Google Patents
A kind of production method of pcb board for high voltage power distribution device Download PDFInfo
- Publication number
- CN107911956A CN107911956A CN201711127420.6A CN201711127420A CN107911956A CN 107911956 A CN107911956 A CN 107911956A CN 201711127420 A CN201711127420 A CN 201711127420A CN 107911956 A CN107911956 A CN 107911956A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- pcb
- high voltage
- voltage power
- power distribution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009826 distribution Methods 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 19
- 238000004140 cleaning Methods 0.000 claims abstract description 10
- 238000003825 pressing Methods 0.000 claims abstract description 10
- 238000009413 insulation Methods 0.000 claims abstract description 9
- 239000000155 melt Substances 0.000 claims abstract description 4
- 239000000843 powder Substances 0.000 claims abstract description 4
- 238000005507 spraying Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000012774 insulation material Substances 0.000 claims 1
- 230000008901 benefit Effects 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulators (AREA)
Abstract
The invention discloses a kind of production method of the pcb board for high voltage power distribution device, including 1. by main PCB plate and from insulation processing between pcb board；2. simultaneously pressed according to main PCB plate and from the connection relation between PCB plate through hole, corresponding aligned through holes；3. the pcb board after pressing is clamped；4. use scaling powder spraying through hole；5. putting into tin stove, main PCB plate is established into articulamentum between the corresponding through hole of pcb board；6. cleaning treatment melts tin unnecessary in the PCB plate through hole after tin；The invention has the fabrication processing that complicated high cost is substituted with the improved structure of low cost, and reaches Low ESR, improves the advantages of PCB electric conductivity.
Description
Technical field
The invention belongs to the technical field of new-energy automobile high voltage power distribution device, is related to a kind of PCB for high voltage power distribution device
The production method of plate.
Background technology
New-energy automobile is grown rapidly under the support energetically of national policy.Usually transported in powerful vehicle electric power
OK, voltage is up to more than 700VDC, and electric current is up to 400A, and the selection of design and high pressure spare part to high tension distribution system has huge
Big challenge.From vehicle space, the complexity and cost consideration of vehicle framework, the widely used centralized high-voltage electrical apparatus system of industry
System framework distribution.High voltage power power supply electrically produces after being directly entered high voltage distribution box according to the system high pressure that needs to be assigned to of system
Product, the security to how to ensure whole high-pressure system and its each electrical equipment.It is system insulation, electromagnetic interference and shielding, close
Envelope and vibration resistance etc. have very high requirement.
PCB is important electronic unit, is the supporter of electronic component, is the offer of electronic component electrical connection
Person.It is high pressure high current device since component used is most of, so the electric conductivity to PCB in existing high voltage distribution box
Have higher requirements, existing pcb board using thicken copper foil, high current cabling covers the modes such as tin and increases its electric conductivity, but usually by
Cost of manufacture and security are perplexed.
The content of the invention
In view of this, it is contemplated that overcoming at least one in drawbacks described above of the prior art, a kind of structure is proposed
Simply, stability is strong, has shield effectiveness, a kind of system of good, the corrosion resistant pcb board for high voltage power distribution device of waterproof seal
Make method, it comprises the following steps：
1. by main PCB plate and from insulation processing between pcb board；
2. simultaneously pressed according to main PCB plate and from the connection relation between PCB plate through hole, corresponding aligned through holes；3. after pressing
Pcb board clamping；
4. use scaling powder spraying through hole；
5. putting into tin stove, main PCB plate is established into articulamentum between the corresponding through hole of pcb board；
6. cleaning treatment melts tin unnecessary in the PCB plate through hole after tin.
According in this patent background technology to described in the prior art, PCB is important electronic unit, be electronic component
Supporter, is the supplier of electronic component electrical connection.In existing high voltage distribution box, since component used is largely
High pressure high current device, so having higher requirements to the electric conductivity of PCB, existing pcb board is covered using thickening copper foil, high current cabling
The modes such as tin increase its electric conductivity, but are usually produced cost and security is perplexed；And one kind disclosed by the invention is used for
The production method of the pcb board of high voltage power distribution device, is formed by main PCB plate, articulamentum, through hole and from pcb board, the production method is significantly
The electric conductivity of PCB is added, pcb board is realized the manufacture craft stream for substituting complicated high cost with the improved structure of low cost
Journey, and achieve the purpose that Low ESR, improve PCB electric conductivity, there is clear advantage.
In addition, the production method of the disclosed pcb board for high voltage power distribution device also has additional skill as follows according to the present invention
Art feature：
Further, the main PCB plate and from pcb board be N layers, N >=2.
Further, the insulation processing for brush, paste or dissolving method, by megohmite insulant be filled in main PCB and
From between PCB.
Further, the megohmite insulant is plasma polymer PTFE.
Further, the articulamentum is stagnant tin layers.
Further, the pcb board and it is maintained at from gap between pcb board between 0.3~1.1mm.
Further, the pressing is the pressing that temperature control carries out in the range of 224-236 DEG C.
Further, the cleaning treatment is to use heat gun cleaning treatment.
The additional aspect of the present invention and advantage will be set forth in part in the description, and will partly become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention will become from the following description of the accompanying drawings of embodiments
Substantially and it is readily appreciated that, wherein：
Fig. 1 is the pcb board cross-sectional view of the structure for high voltage power distribution device.
In Fig. 1,1 is main PCB plate, and 2 be through hole, and 3 be articulamentum, and 4 be from pcb board.
Embodiment
The embodiment of the present invention is described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning to end
Same or similar label represents same or similar element or has the function of same or like element.Below with reference to attached
The embodiment of figure description is exemplary, and is only used for explaining the present invention, and is not construed as limiting the claims.
In the description of the present invention, it is to be understood that term " on ", " under ", " bottom ", " top ", "front", "rear", " interior ",
The orientation or position relationship of the instruction such as " outer ", " horizontal stroke ", " perpendicular " are based on orientation shown in the drawings or position relationship, merely to just
In the description present invention and simplify description, rather than instruction or imply signified device or element must have specific orientation, with
Specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In the description of the present invention, it is necessary to which explanation, unless otherwise clearly defined and limited, term " connection ", " connect
It is logical ", " connected ", " connection ", " cooperation " should be interpreted broadly, for example, it may be fixedly connected, be integrally connected or
It is detachably connected；It can be the connection inside two elements；It can be directly connected, the indirect phase of intermediary can also be passed through
Even；" cooperation " can be the cooperation in face and face or point and the cooperation in face or line and face, for the ordinary skill of this area
For personnel, the concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.
The inventive concept of the present invention further includes, can be in line layer by using plasma surface chemical plating stannum treatment process
The effective depositing ultrathin in surface, transparent and insulation anti-aging plasma polymerization coating, and electronic device is selectively protected, it is special
It is not pcb board circuit layer surface.The coating has efficient protection iris action, can not only extend the service life of pcb board product, improve
The security of product, will also significantly reduce cost, therefore have clear advantage.
The present invention is described below with reference to accompanying drawings, wherein Fig. 1 is the pcb board cross-sectional view of the structure for high voltage power distribution device.
According in this patent background technology to described in the prior art, PCB is important electronic unit, be electronic component
Supporter, is the supplier of electronic component electrical connection.In existing high voltage distribution box, since component used is largely
High pressure high current device, so having higher requirements to the electric conductivity of PCB, existing pcb board is covered using thickening copper foil, high current cabling
The modes such as tin increase its electric conductivity, but are usually produced cost and security is perplexed；And one kind disclosed by the invention is used for
The production method of the pcb board of high voltage power distribution device, is formed by main PCB plate, articulamentum, through hole and from pcb board, the production method is significantly
The electric conductivity of PCB is added, pcb board is realized the manufacture craft stream for substituting complicated high cost with the improved structure of low cost
Journey, and achieve the purpose that Low ESR, improve PCB electric conductivity, there is clear advantage.
As shown in Figure 1, according to an embodiment of the invention, its manufacture craft comprises the following steps：
1. by main PCB plate and from insulation processing between pcb board；
2. simultaneously pressed according to main PCB plate and from the connection relation between PCB plate through hole, corresponding aligned through holes；
3. the pcb board after pressing is clamped；
4. use scaling powder spraying through hole；
5. putting into tin stove, main PCB plate is established into articulamentum between the corresponding through hole of pcb board；
6. cleaning treatment melts tin unnecessary in the PCB plate through hole after tin.
In addition, the production method of the disclosed pcb board for high voltage power distribution device also has additional skill as follows according to the present invention
Art feature：
According to some embodiments of the present invention, the main PCB plate and from pcb board be N layers, N >=2.
According to some embodiments of the present invention, the insulation processing is the method brushed, paste or dissolved, by megohmite insulant
It is filled in main PCB and between PCB.
Preferably, the megohmite insulant is plasma polymer PTFE.
According to some embodiments of the present invention, the articulamentum is stagnant tin layers.
According to some embodiments of the present invention, the pcb board and it is maintained at from gap between pcb board between 0.3~1.1mm.
According to some embodiments of the present invention, the pressing is the pressing that temperature control carries out in the range of 224-236 DEG C.
According to some embodiments of the present invention, the cleaning treatment is to use heat gun cleaning treatment.
It is any to refer to that " one embodiment ", " embodiment ", " illustrative examples " etc. mean to combine embodiment description
Specific component, structure or feature are contained at least one embodiment of the present invention.This specification everywhere this is schematic
Statement is not necessarily referring to identical embodiment.Specific component, structure or feature are described with reference to any embodiment moreover, working as
When, advocated, component, structure or feature with reference to as being realized other embodiments all fall within those skilled in the art
Within the scope of.
Although detailed retouch is carried out to the embodiment of the present invention with reference to multiple illustrative examples of the present invention
State, it must be understood that those skilled in the art can be designed that various other improvement and embodiment, these improve and implement
Example will fall within spirit and scope.Specifically, in the scope of foregoing disclosure, attached drawing and claim
Within, rational variations and modifications can be made in terms of the arrangement that parts and/or sub-combination are laid out, without departing from
The spirit of the present invention.Except the variations and modifications in terms of parts and/or layout, its scope is by appended claims and its is equal
Thing limits.
Claims (8)
1. the production method of a kind of pcb board for high voltage power distribution device, it is characterised in that comprise the following steps：
1. by main PCB plate and from insulation processing between pcb board；
2. simultaneously pressed according to main PCB plate and from the connection relation between PCB plate through hole, corresponding aligned through holes；
3. the pcb board after pressing is clamped；
4. use scaling powder spraying through hole；
5. putting into tin stove, main PCB plate is established into articulamentum between the corresponding through hole of pcb board；
6. cleaning treatment melts tin unnecessary in the PCB plate through hole after tin.
2. the production method of the pcb board according to claim 1 for high voltage power distribution device, it is characterised in that the main PCB
Plate and from pcb board be N layers, N >=2.
3. the production method of the pcb board according to claim 1 for high voltage power distribution device, it is characterised in that the insulation
The method to brush, pasting or dissolve is handled, megohmite insulant is filled in main PCB and between PCB.
4. the production method of the pcb board according to claim 3 for high voltage power distribution device, it is characterised in that the insulation
Material is plasma polymer PTFE.
5. the production method of the pcb board according to claim 1 for high voltage power distribution device, it is characterised in that the connection
Layer is stagnant tin layers.
6. the production method of the pcb board according to claim 1 for high voltage power distribution device, it is characterised in that the pcb board
And it is maintained at from gap between pcb board between 0.3~1.1mm.
7. the production method of the pcb board according to claim 1 for high voltage power distribution device, it is characterised in that the pressing
It is the pressing that temperature control carries out in the range of 224-236 DEG C.
8. the production method of the pcb board according to claim 1 for high voltage power distribution device, it is characterised in that the cleaning
Handle as using heat gun cleaning treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711127420.6A CN107911956A (en) | 2017-11-15 | 2017-11-15 | A kind of production method of pcb board for high voltage power distribution device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711127420.6A CN107911956A (en) | 2017-11-15 | 2017-11-15 | A kind of production method of pcb board for high voltage power distribution device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107911956A true CN107911956A (en) | 2018-04-13 |
Family
ID=61845425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711127420.6A Pending CN107911956A (en) | 2017-11-15 | 2017-11-15 | A kind of production method of pcb board for high voltage power distribution device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107911956A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007129034A (en) * | 2005-11-02 | 2007-05-24 | Sharp Corp | Wiring board and liquid crystal module including the wiring board |
| US20140111908A1 (en) * | 2011-05-31 | 2014-04-24 | Server Technology, Inc. | Method and apparatus for multiple input power distribution to adjacent outputs |
| CN105161879A (en) * | 2015-09-24 | 2015-12-16 | 上海埃而生电气有限公司 | Multilayer PCB (Printed Circuit Board) central distribution box |
| CN105592621A (en) * | 2014-10-23 | 2016-05-18 | 深南电路有限公司 | PCB manufacturing method and PCB |
| CN106058515A (en) * | 2016-07-18 | 2016-10-26 | 中国科学院微电子研究所 | Electrical connector for flexible circuit board and rigid circuit board |
| CN206061284U (en) * | 2016-09-11 | 2017-03-29 | 深圳市国科动力新能源技术有限公司 | A kind of anti-tampering pcb board for high voltage distribution box |
-
2017
- 2017-11-15 CN CN201711127420.6A patent/CN107911956A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007129034A (en) * | 2005-11-02 | 2007-05-24 | Sharp Corp | Wiring board and liquid crystal module including the wiring board |
| US20140111908A1 (en) * | 2011-05-31 | 2014-04-24 | Server Technology, Inc. | Method and apparatus for multiple input power distribution to adjacent outputs |
| CN105592621A (en) * | 2014-10-23 | 2016-05-18 | 深南电路有限公司 | PCB manufacturing method and PCB |
| CN105161879A (en) * | 2015-09-24 | 2015-12-16 | 上海埃而生电气有限公司 | Multilayer PCB (Printed Circuit Board) central distribution box |
| CN106058515A (en) * | 2016-07-18 | 2016-10-26 | 中国科学院微电子研究所 | Electrical connector for flexible circuit board and rigid circuit board |
| CN206061284U (en) * | 2016-09-11 | 2017-03-29 | 深圳市国科动力新能源技术有限公司 | A kind of anti-tampering pcb board for high voltage distribution box |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180413 |