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CN107852817B - 印制布线板的制造方法以及用于所述方法的印制布线板保护膜及片状层叠体 - Google Patents

印制布线板的制造方法以及用于所述方法的印制布线板保护膜及片状层叠体 Download PDF

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Publication number
CN107852817B
CN107852817B CN201680041579.3A CN201680041579A CN107852817B CN 107852817 B CN107852817 B CN 107852817B CN 201680041579 A CN201680041579 A CN 201680041579A CN 107852817 B CN107852817 B CN 107852817B
Authority
CN
China
Prior art keywords
wiring board
printed wiring
adhesive layer
film
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201680041579.3A
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English (en)
Chinese (zh)
Other versions
CN107852817A (zh
Inventor
月山秀之
田岛宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Publication of CN107852817A publication Critical patent/CN107852817A/zh
Application granted granted Critical
Publication of CN107852817B publication Critical patent/CN107852817B/zh
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN201680041579.3A 2015-09-04 2016-08-30 印制布线板的制造方法以及用于所述方法的印制布线板保护膜及片状层叠体 Active CN107852817B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015174645 2015-09-04
JP2015-174645 2015-09-04
PCT/JP2016/075330 WO2017038818A1 (ja) 2015-09-04 2016-08-30 プリント配線板の製造方法ならびに該方法に用いられるプリント配線板保護フィルムおよびシート状積層体

Publications (2)

Publication Number Publication Date
CN107852817A CN107852817A (zh) 2018-03-27
CN107852817B true CN107852817B (zh) 2020-05-12

Family

ID=58188759

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680041579.3A Active CN107852817B (zh) 2015-09-04 2016-08-30 印制布线板的制造方法以及用于所述方法的印制布线板保护膜及片状层叠体

Country Status (6)

Country Link
JP (2) JP6422586B2 (ja)
KR (1) KR102136542B1 (ja)
CN (1) CN107852817B (ja)
HK (1) HK1248965A1 (ja)
TW (1) TWI713426B (ja)
WO (1) WO2017038818A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102334426B1 (ko) * 2020-08-24 2021-12-14 (주)아이엠 Emi 이형 필름 제거 방법
US11445619B2 (en) * 2020-10-28 2022-09-13 Matrix Electronics Limited System and method for high-temperature lamination of printed circuit boards
CN115416393A (zh) * 2022-09-26 2022-12-02 珠海景旺柔性电路有限公司 离型膜去除方法及柔性电路板

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3014173B2 (ja) * 1991-07-26 2000-02-28 シャープ株式会社 フレキシブルプリント配線板の製造方法
JP3156419B2 (ja) * 1993-02-15 2001-04-16 松下電器産業株式会社 異方性導電フィルム保護用セパレータの剥離方法
JP3962119B2 (ja) 1997-03-31 2007-08-22 株式会社きもと 多層プリント配線板製造用シート
JP2000101220A (ja) * 1998-09-22 2000-04-07 Hitachi Ltd 電子部品の実装方法およびそのシステム
JP4718031B2 (ja) * 2001-04-05 2011-07-06 イビデン株式会社 プリント配線板及びその製造方法
JP3461172B2 (ja) * 2001-07-05 2003-10-27 日東電工株式会社 多層配線回路基板の製造方法
JP2004079743A (ja) * 2002-08-16 2004-03-11 Nec Kansai Ltd 半導体基板の表面保護用の粘着テープ及びその剥離方法
US20060048963A1 (en) * 2002-12-05 2006-03-09 Masaru Nishinaka Laminate, printed circuit board, and preparing method thereof
JP2004273531A (ja) * 2003-03-05 2004-09-30 Shinko Electric Ind Co Ltd プリント配線板用銅箔複合板およびその銅箔複合板を使用したプリント配線板の製造方法
TWI476103B (zh) 2003-07-01 2015-03-11 Sumitomo Bakelite Co A release film and a method of manufacturing a flexible printed wiring board using the release film
JP5168838B2 (ja) * 2006-07-28 2013-03-27 大日本印刷株式会社 多層プリント配線板及びその製造方法
JP2008091463A (ja) * 2006-09-29 2008-04-17 Nippon Steel Chem Co Ltd 両面フレキシブル銅張積層基板及びキャリア付両面フレキシブル銅張積層基板の製造方法
US8956732B2 (en) * 2006-10-04 2015-02-17 Hitachi Chemical Company, Ltd. Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board
JP2009289840A (ja) * 2008-05-28 2009-12-10 Toyo Ink Mfg Co Ltd 電磁波シールド性接着フィルム
JP2010283300A (ja) * 2009-06-08 2010-12-16 Panasonic Corp 突起電極付き配線基板及び突起電極付き配線基板の製造方法
CN104487534B (zh) * 2012-07-11 2016-11-09 大自达电线股份有限公司 硬化导电胶组成物、电磁波屏蔽膜、导电胶膜、黏合方法及线路基板
TWI774043B (zh) * 2013-05-29 2022-08-11 日商大自達電線股份有限公司 電磁波遮蔽膜的製造方法

Also Published As

Publication number Publication date
KR20180048816A (ko) 2018-05-10
JPWO2017038818A1 (ja) 2018-04-26
JP6422586B2 (ja) 2018-11-14
KR102136542B1 (ko) 2020-07-22
WO2017038818A1 (ja) 2017-03-09
JP6663463B2 (ja) 2020-03-11
TWI713426B (zh) 2020-12-11
TW201713179A (zh) 2017-04-01
JP2018197001A (ja) 2018-12-13
CN107852817A (zh) 2018-03-27
HK1248965A1 (zh) 2018-10-19

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