CN107814507A - 一种石墨烯基导热复合材料及其制备方法与应用 - Google Patents
一种石墨烯基导热复合材料及其制备方法与应用 Download PDFInfo
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 68
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 63
- 239000002131 composite material Substances 0.000 title claims abstract description 27
- 238000002360 preparation method Methods 0.000 title claims description 18
- 229910052802 copper Inorganic materials 0.000 claims abstract description 37
- 239000010949 copper Substances 0.000 claims abstract description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 28
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000002105 nanoparticle Substances 0.000 claims abstract description 22
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 22
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 14
- 239000002861 polymer material Substances 0.000 claims abstract description 13
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- 239000006185 dispersion Substances 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 239000002994 raw material Substances 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000003638 chemical reducing agent Substances 0.000 claims description 6
- 229910002804 graphite Inorganic materials 0.000 claims description 6
- 239000010439 graphite Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 239000012286 potassium permanganate Substances 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- 238000005406 washing Methods 0.000 claims description 4
- 229920000180 alkyd Polymers 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920002521 macromolecule Polymers 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 2
- 150000001879 copper Chemical class 0.000 claims description 2
- 229910001882 dioxygen Inorganic materials 0.000 claims description 2
- 239000011261 inert gas Substances 0.000 claims description 2
- 239000007800 oxidant agent Substances 0.000 claims description 2
- 230000001590 oxidative effect Effects 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 239000002243 precursor Substances 0.000 claims description 2
- 239000003223 protective agent Substances 0.000 claims description 2
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
- 239000010408 film Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 238000010792 warming Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000013074 reference sample Substances 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000010828 elution Methods 0.000 description 2
- 239000012065 filter cake Substances 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 230000036571 hydration Effects 0.000 description 2
- 238000006703 hydration reaction Methods 0.000 description 2
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- -1 graphite Alkene Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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Abstract
本发明涉及一种石墨烯基导热复合材料,其特征在于:该复合材料中,包括石墨烯,钯或铂,铜纳米粒子及树脂高分子材料;所述复合材料中石墨烯的质量百分比例为40‑90%,钯或铂0.1‑10%,铜纳米粒子的百分比为9‑50%,树脂高分子的百分比为1‑20%。本发明的石墨烯基导热复合材料具有导热性好、价格低廉的特点。
Description
技术领域
本发明专利属于纳米材料制备与应用领域,更具体而言,涉及一种石墨烯基导热复合材料及其制备与应用。
背景技术
石墨烯是一种二维碳材料,具有很多优异的特性,如高强度,高透光性,高导电性以及高导热性能等。由于石墨烯具有很好的导热性能,因此石墨烯作为导热材料受到了很大关注。石墨烯导热膜可应用于电子器件中用于电子元件散热,具有广泛的应用前景。然而,石墨烯的高导热性主要在单片层石墨烯薄膜测试得到,而利用石墨烯组装得到的多层石墨烯薄膜却只能得到很差的导热性能。其主要原因是石墨烯片层在组装过程中其方向不一致,且方向不一致导致的传热缺陷导致其传热性能相比于理论值有很大的差距。另外一种制备石墨烯导热膜的途径是以聚酰亚胺膜为原材料,经历多步骤碳化过程,得到类石墨烯薄膜材料。不论是以石墨烯为原料,还是以聚酰亚胺膜为原料,所得到的石墨烯膜除了柔性外,还具有脆性,很易断裂,其强度普遍不高,这对于石墨烯基导热膜的使用非常不利。使用聚酰亚胺进行高温碳化工艺需要耗费大量能量,其成本非常高,不适于其广泛推广使用。而采用石墨烯作为原材料,其制备难度较大,且其缺陷已成其作为导热材料的瓶颈及主要问题。
利用石墨烯作为导热材料的主要成分,添加材料提高石墨烯膜的导热性能以及强度成为一种选择。通过物理法或化学气相沉积法得到的石墨烯不但产量低,而且成本非常高。而采用石墨为原料,采用化学法剥离得到氧化石墨烯再经历还原步骤,不但成本低廉,且易于批量生产。在金属材料中,铜材料具有很好的导热性能,因此铜材料是一种非常理想的添加剂。另外,铜材料容易氧化,利用石墨烯进行包覆还可以使铜不易氧化。而为了增加石墨烯膜的强度,高韧性的添加剂必不可少。为了提高石墨烯基导热材料的导热性能,必须发展新型组成的石墨烯导热材料。
发明内容
本发明的目的之一是克服上述不足,提供一种导热性好、成本低的石墨烯基导热复合材料。
本发明的目的之二是提供一种导热性好、成本低的石墨烯基导热复合材料的制备方法。
本发明的目的之三是提供一种导热性好、成本低的石墨烯基导热复合材料应用。
本发明解决上述问题所采用的技术方案为:一种石墨烯基导热复合材料,该复合材料中,包括石墨烯,金属钯或铂,铜纳米粒子及树脂高分子材料;所述复合材料中石墨烯的百分比例为40-90%,金属钯或铂的百分比例为0.1-10%,铜纳米粒子的百分比为8.9-50%,树脂高分子的百分比为1-20%。
优选地,石墨烯的百分比例为50-80%,金属钯或铂的百分比例为0.5-5%,铜纳米粒子百分比例为10-30%,树脂高分子的百分比为5-15%;
所述树脂高分子包括环氧树脂,醇酸树脂,聚丙烯酸树脂,酚醛树脂以及ABS树脂。
一种石墨烯基导热复合材料的制备方法,所述制备方法的步骤为:
(1)氧化石墨烯的制备
以石墨为原料,浓硫酸为溶剂,高锰酸钾为氧化剂,将所得氧化石墨烯用双氧水处理后,用盐酸和水洗涤后分散,备用;
(2)铜纳米粒子制备
以金属铜盐为原料,以高分子为保护剂,乙二醇为还原剂和溶剂,在惰性气体保护下,120到160℃反应,得到铜纳米粒子溶胶,洗涤后分离得到铜纳米粒子分散液,备用
(3)石墨烯-铜纳米材料-树脂高分子材料复合物的制备
将氧化石墨烯分散液、氯化钯或氯铂酸、铜纳米粒子分散液与树脂高分子材料按比例混合均匀后,通过加热使溶剂挥发,得到复合物材料前体,通过加热处理或还原剂还原,得到石墨烯-铜纳米材料-树脂高分子材料复合物。
其中还原剂可以是水合肼,硼氢化钠或氢气中的一种或多种。
一种石墨烯基导热复合材料的应用,该材料可用于电子产品的散热。
与现有技术相比,本发明的优点在于:
本发明采用化学剥离法得到氧化石墨烯,以液相还原法得到铜纳米粒子,树脂采用商业用树脂,铂或钯充当氧化石墨烯还原的催化剂,有利于导热性能的提升。本发明的创新点在于四种成分的组合可解决石墨烯薄膜成本高且导热性能差的问题。
具体实施方式
以下结合实施例对本发明作进一步详细描述。
实施例1
(1)氧化石墨烯的制备
取10克石墨,分散于200毫升浓硫酸中,将温度降至0度,搅拌条件下加入1.5克高锰酸钾,搅拌30分钟后,加入30克高锰酸钾,升温至40度反应2小时后,得到粘稠样品,慢慢滴加水,之后加入30毫升30%双氧水,过滤后得到氧化石墨烯滤饼,之后用盐酸洗涤,并用水洗涤,最后分散于10升水中,备用;
(2)铜纳米粒子的制备
取17g二水合绿化铜溶于1000ml乙二醇中,同时加入30克PVP溶于该溶液中,滴加0.5M的NaOH乙二醇溶液,调节pH>10,搅拌30min,在氮气保护下,升温至160度,加热3小时后得到红棕色溶液。冷却后,加入丙酮得到沉淀,用水洗涤后,得到铜纳米粒子分散液,备用;
(3)石墨烯-铜纳米材料-树脂高分子材料复合物的制备
取6升氧化石墨烯分散液,0.83克氯化钯,2.5克铜纳米粒子,1克环氧树脂混合均匀,涂膜后加热烘干,得到复合材料膜,利用水合肼作为还原剂还原该复合膜,得到石墨烯-钯-铜纳米材料-树脂高分子材料复合物。
实施例2
(1)氧化石墨烯的制备
取10克石墨,分散于200毫升浓硫酸中,将温度降至0度,搅拌条件下加入1.5克高锰酸钾,搅拌30分钟后,加入30克高锰酸钾,升温至40度反应2小时后,得到粘稠样品,慢慢滴加水,之后加入30毫升30%双氧水,过滤后得到氧化石墨烯滤饼,之后用盐酸洗涤,并用水洗涤,最后分散于10升水中,备用;
(2)铜纳米粒子的制备
取17g二水合绿化铜溶于1000ml乙二醇中,同时加入20克PVP溶于该溶液中,滴加0.5M的NaOH乙二醇溶液,调节pH>10,搅拌30min,在氮气保护下,升温至160度,加热3小时后得到红棕色溶液。冷却后,加入丙酮得到沉淀,用水洗涤后,得到铜纳米粒子分散液,备用;
(3)石墨烯-铜纳米材料-树脂高分子材料复合物的制备
取9升氧化石墨烯分散液,0.027克六水氯铂酸, 0.89克铜纳米粒子,0.1克醇酸树脂混合均匀,涂膜后加热烘干,得到复合材料膜,在管式炉中氮气气氛下加热至500度,处理3小时后,得到石墨烯-铂-铜纳米材料-树脂高分子材料复合物。
为了说明加入贵金属钯或铂对于石墨烯基导热膜材料的优势,我们在实施例1和实施例2的基础上进行了参比实验。与实施例1和2不同的是,参比样品中没有加入贵金属钯或铂。经过对得到样品的导热系数测量,我们发现,实施例1所得样品导热率为2200W/m/K,而参照样品导热率为1600 W/m/K;同样地,我们发现实施例2所得样品导热率为1900 W/m/K,而参照样品导热率为1200 W/m/K。因此实验结果表明,加入贵金属可以大幅提升导热性能。
除上述实施例外,本发明还包括有其他实施方式,凡采用等同变换或者等效替换方式形成的技术方案,均应落入本发明权利要求的保护范围之内。
Claims (5)
1.一种石墨烯基导热复合材料,其特征在于:该复合材料中,包括石墨烯,钯或铂,铜纳米粒子及树脂高分子材料;所述复合材料中石墨烯的质量百分比例为40-90%,钯或铂0.1-10%,铜纳米粒子的百分比为9-50%,树脂高分子的百分比为1-20%。
2.根据权利要求1所述的石墨烯基导热复合材料,其特征在于:所述石墨烯的百分比例为50-80%,钯或铂0.5-5%,铜纳米粒子百分比例为10-30%,树脂高分子的百分比为5-15%。
3.根据权利要求1或2所述的石墨烯基导热复合材料,其特征在于:所述树脂高分子包括环氧树脂,醇酸树脂,聚丙烯酸树脂,酚醛树脂以及ABS树脂。
4. 一种石墨烯基导热复合材料的制备方法,其特征在于:所述方法包括如下步骤:
(1)氧化石墨烯的制备
以石墨为原料,浓硫酸为溶剂,高锰酸钾为氧化剂,将所得氧化石墨烯用双氧水处理后,用盐酸和水洗涤后分散,备用;
(2)铜纳米粒子制备
以金属铜盐为原料,以高分子为保护剂,乙二醇为还原剂和溶剂,在惰性气体保护下,120-160℃反应,得到铜纳米粒子溶胶,洗涤后分离得到铜纳米粒子分散液,备用;
(3)石墨烯-铜纳米材料-树脂高分子材料复合物的制备
将氧化石墨烯分散液、钯或铂、铜纳米粒子分散液与树脂高分子材料按比例混合均匀后,通过加热使溶剂挥发,得到复合物材料前体,通过加热处理或还原剂还原,得到石墨烯-铜纳米材料-树脂高分子材料复合物。
5.一种石墨烯基导热复合材料的应用,其特征在于:将权利要求1或2的石墨烯基导热复合材料应用于电子产品的散热。
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