CN107801358B - Pass-through structure of cooling unit - Google Patents

Abstract

The present invention provides a straight-through structure of a heat dissipation unit, comprising: a first plate body and a second plate body; the first and second plate bodies are correspondingly covered to form a closed chamber, the surface of which is provided with a hydrophilic layer, and a capillary structure is provided in the closed chamber, and the first plate body forms a first recess, a first hole and a second recess toward the second plate body, the first recess is engaged with the capillary structure provided on the third side of the second plate body, one end of the second recess abuts against the capillary structure, and the capillary structure does not contact the first recess, and the second plate body has a second hole corresponding to the first hole. The straight-through structure of the heat dissipation unit of the present invention can provide that the heat dissipation unit can still maintain vacuum airtightness when it needs to be penetrated.

Description

Pass-through structure of cooling unit

technical field

The present invention relates to a straight-through structure of a heat dissipation unit, in particular to an airtight through structure of a heat dissipation unit that provides a heat dissipation unit that ensures vacuum airtightness in an internal airtight chamber after the heat dissipation unit penetrates.

Background technique

With the improvement of the performance of current electronic equipment, the electronic components that process signals and operations also generate higher heat than the previous electronic components. The most commonly used general heat dissipation components include heat pipes, radiators, vapor chambers and other components. , and further increase the heat dissipation efficiency by directly contacting the electronic components that will generate heat, preventing the electronic components from being overheated and burning.

Vapor chamber is a large-scale surface-to-surface heat conduction application, which is different from the point-to-point heat conduction method of heat pipes, and is suitable for use in narrow spaces.

In the prior art, the vapor chamber is used in combination with a substrate, and the heat of the heating element on the substrate is conducted through the vapor chamber. The prior art is mainly based on the location of the vapor chamber that avoids the chamber, that is, the vapor chamber is closed. Each of the four couplings outside is formed with a through hole and a copper column with an internal screw thread is penetrated. At least one hole is opened on the base plate relative to the position where the copper column is arranged on the temperature equalizing plate, and then a screw lock element is used to screw at the same time. The above-mentioned copper posts and holes are pierced to fix the temperature equalizing plate on the substrate. However, in this fixing method, since the copper posts are arranged at the four couplings of the temperature equalizing plate, the distance from the heating element is relatively long, and the heating element is far away from the heating element. After the temperature plate is fixed, it cannot be closely attached to the heating element, resulting in thermal resistance. In order to improve the aforementioned problem of not being closely attached, the manufacturer directly sets the copper column corresponding to the position adjacent to the position where the temperature equalizing plate and the heating element are attached. Therefore, these copper pillars directly penetrate the part of the vapor chamber with the chamber. Although the tightness during assembly can be increased to prevent the occurrence of thermal resistance, the chamber of the vapor chamber is penetrated by the copper pillars. After the destruction, the airtightness is lost, and the interior of the chamber no longer has a vacuum state, and because the copper column penetrates and destroys the chamber, the flow path of the working fluid in the chamber may be hindered, resulting in reduced heat transfer efficiency, or even serious damage. Leaks may occur, thereby rendering the vapor chamber ineffective for heat transfer.

The above-mentioned existing vapor chamber penetration structure is mainly applicable to the general existing thicker vapor chamber penetration structure, and cannot be applied to the vapor chamber of the ultra-thin structure, because the overall thickness of the ultra-thin vapor chamber is only (0.8 mm), additional support columns cannot be placed, and if copper columns are used, copper columns with extremely thin size and thickness are bound to be used. It is difficult to position the copper columns because the thickness is too thin, and the small size of the copper columns is not easy to process. After punching holes on the existing vapor chamber, the concave part is combined with the lower plate, and the combined area is not provided with a capillary structure, which affects the heat transfer performance of the vapor chamber. The wall must also be provided with a capillary structure. The capillary structure of the side wall of the concave part of the plate on the temperature equalizing plate is connected to the capillary structure of the lower plate, so the existing thick type temperature equalizing plate in the overall view cannot be applied to the thinned temperature equalizing plate.

In addition, there are also manufacturers who manufacture ultra-thin vapor chambers by etching, and then use etching to remove materials on the plate to set up grooves or support structures. Because of the need for material removal, the thickness of the plate itself must be predetermined. The material can be removed only when there is enough thickness. Moreover, the parts where the material is removed are prone to have poor structural strength. Therefore, the processing of ultra-thin vapor chambers by etching still has problems such as missing.

SUMMARY OF THE INVENTION

In this way, in order to solve the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide a through structure that solves the problem of the existing heat dissipation unit having an airtight chamber and a lack of vacuum airtight leakage.

In order to achieve the above-mentioned purpose, the present invention provides a straight-through structure of a heat dissipation unit, which is characterized by comprising:

A first plate body has a first side, a second side, a first concave portion, a first hole and a second concave portion, the first concave portion and the second concave portion are from the second side to the first side formed by a depression, the first hole is arranged in the first depression part and penetrates the first side and the second side;

A second plate body has a third side, a fourth side and a second hole, the third side is covered with the first side correspondingly, and the first plate body and the second plate body together define an airtight a chamber, the second hole penetrates the third side and the fourth side of the second plate body and corresponds to the first hole;

a hydrophilic layer disposed on the first side surface of the first plate body;

A capillary structure layer is disposed in the closed chamber, the second concave portion abuts the capillary structure layer, and the capillary structure layer does not contact the first concave portion.

The straight-through structure of the heat dissipation unit, wherein: the capillary structure layer is a mesh body or a fiber body or other structures with porous properties.

In the straight-through structure of the heat dissipation unit, wherein: the material of the grid body is copper or aluminum or stainless steel or titanium.

In the straight-through structure of the heat dissipation unit, wherein: the first plate body and the second plate body are made of copper or aluminum, stainless steel or titanium.

The straight-through structure of the heat dissipation unit, wherein: the first plate body has a lip and a connecting part, the lip is arranged on the periphery of the first plate body, and both ends of the connecting part are connected to the first plate body. A concave portion and the lip, the connecting portion and the first concave portion are both concave.

The straight-through structure of the heat dissipation unit, wherein: there is a heat receiving area, and the heat receiving area is protruded from the fourth side of the second plate body.

The through structure of the heat dissipation unit of the present invention can ensure that the airtightness of the airtight chamber inside the heat dissipation unit can still be maintained when the heat dissipation device is arranged in the through structure, and the airtight through structure is suitable for any kind of temperature chamber. , the second concave part of the first plate body itself can be used as a support to replace the support copper column in the existing vapor chamber, which can further improve the ultra-thin vapor chamber that cannot be provided with a support structure, and improve the existing etching method. The ultra-thin vapor chamber with grooves has defects such as poor structural strength, and at the same time, a through structure can be provided on the ultra-thin vapor chamber while maintaining air tightness.

Description of drawings

1 is an exploded perspective view of the first embodiment of the straight-through structure of the heat dissipation unit of the present invention;

FIG. 2 is a combined cross-sectional view of the first embodiment of the straight-through structure of the heat dissipation unit of the present invention;

FIG. 3 is a combined cross-sectional view of the second embodiment of the straight-through structure of the heat dissipation unit of the present invention;

4 is a combined cross-sectional view of the third embodiment of the straight-through structure of the heat dissipation unit of the present invention.

Description of reference numerals: straight-through structure of heat dissipation unit 1; first plate body 11; first side 111; second side 112; first concave part 113; first hole 114; second concave part 115; second plate body 12; The third side 121; the fourth side 122; the second hole 123; the second recess 124; the closed chamber 13; the hydrophilic layer 14; the capillary structure layer 15;

Detailed ways

Please refer to FIG. 1 and FIG. 2 , which are three-dimensional exploded combined cross-sectional views of the first embodiment of the airtight through structure of the heat dissipation device of the present invention. As shown in the figures, the straight through structure 1 of the heat dissipation unit of the present invention includes: a first plate body 11 , a second plate body 12;

The first plate body 11 has a first side 111 and a second side 112, a first recess 113, a first hole 114 and a second recess 115. The first and second recesses 113 and 115 are formed by the The two sides 112 are formed by being recessed toward the first side 111 , and the first hole 114 is formed in the first recess 113 and penetrates the first and second sides 111 and 112 .

The second plate body 12 has a third side 121, a fourth side 122 and a second hole 123. The third side 121 is correspondingly covered with the first side 111, and the first and second plates are closed together. The bodies 11 and 12 together define a closed chamber 13 . The second hole 123 penetrates through the third and fourth sides 121 and 122 of the second plate body 12 and corresponds to the first hole 114 .

A hydrophilic layer 14 is disposed on the surface of the first side 111 of the first plate body 11 .

A capillary structure layer 15 is disposed on the third side 121 of the second plate body 12 in the closed chamber 13, and one end of the second recess 115 abuts the capillary structure layer 15, and the capillary structure layer 15 does not contact the first A concave part 113, the capillary structure layer 15 is any one of a mesh body, a fibrous body or a structure body with porous properties.

A lip portion 16 is formed at the junction of the peripheral edge of the first plate body 11 and the peripheral edge of the second plate body 12 , and the lip portion 16 and the aforementioned first concave portion 113 are joined with the third side 121 of the second plate body 12 . By means of diffusion bonding or welding, the closed chamber 13 is sealed to keep vacuum airtight, and the first hole 114 and the second hole 123 are selected to be located in the first concave portion 113 or the lip portion 16 , so that the sealed chamber 13 is not damaged to maintain vacuum airtightness.

The first plate body 11 is a part used as a condensation effect, and can be combined with other heat dissipation units to conduct heat to increase the effect of condensation. The second plate body 12 is used as a heat absorption and heating part effect and can be used with at least one The heat source 2 is in contact for heat conduction.

Please refer to FIG. 3 , which is a combined cross-sectional view of the second embodiment of the through structure of the heat dissipation unit of the present invention. As shown in the figure, some structural and technical features of this embodiment are the same as those of the aforementioned first embodiment, so they will not be repeated here. The difference between this embodiment and the aforementioned first embodiment is that the surface of the capillary structure layer 15 has the hydrophilic layer 14 , and a heat receiving area 17 is protruded from the fourth side 122 of the second plate body 12 , so The heat receiving area 17 is used as a part directly in contact with the heat source 2 , and the heat receiving area 17 can be either a thick copper sheet or a thin copper sheet, which is selected according to the height of the corresponding heat source 2 .

Please refer to FIG. 4 , which is a combined cross-sectional view of the third embodiment of the straight-through structure of the heat dissipation unit of the present invention. As shown in the figure, some structural and technical features of this embodiment are the same as those of the aforementioned first embodiment, so they will not be repeated here. The difference between this embodiment and the aforementioned first embodiment is that the first plate body 11 has a lip 16 and a connecting portion 18 . Both ends of the portion 18 are connected to the first concave portion 113 and the lip 16 . The connecting portion 18 is concave in the direction of the third side 121 of the second plate 12 , the same as the first concave portion 113 . And the first concave portion 113 and the connecting portion 18 are sealed with the second plate body 12 by welding or diffusion bonding.

In the aforementioned first, second, and third embodiments, the capillary structure layer 15 is formed by etching trenches or sintering copper powder, and the material of the mesh body is any of copper, aluminum, stainless steel, or titanium. The first and second plate bodies 11 and 12 are made of copper, aluminum, stainless steel or titanium.

If the mesh body is selected as the capillary structure layer, the material of the mesh body is any one of copper, aluminum, stainless steel, or titanium, and of course, it can also be set by mixing and matching layers of materials.

The main purpose of the present invention is to provide a heat dissipation unit with a vacuum airtight chamber, which has a through structure that penetrates and maintains vacuum airtightness when a screw lock element needs to be disposed through, and is directly connected to the first and second plate bodies 11 , 12 form a penetrating and joining structure (the first recess 113 ) and a supporting effect (the second recess 115 ), which can not only realize the structure of the ultra-thin vapor chamber with support but also maintain the airtight effect during penetration.

The first and second concave portions 113 and 115 of the first plate body 11 of the present case are not limited to be formed in any processing form, and may be formed by embossing or embossing, or by mechanical cutting or non-traditional processing. The structure formed by the processing method.

Claims (6)

1. a kind of bypass structure of heat-sink unit, it is characterized in that comprising:

One first plate body has one first side, a second side, one first recess portion, one first hole and one second recess portion, this first Side and the second side are on first plate body towards two sides of opposite direction, first recess portion, the second recess portion by this second Lateral first side recess is formed, which is set to first recessed portion and runs through first side, second side；

One second plate body, has a third side, one the 4th side and one second hole, and the third side and the 4th side are second plate Towards two sides of opposite direction on body, third side lid corresponding with aforementioned first side is closed, first plate body, the second plate body Define an airtight chamber jointly, second hole run through second plate body third side, the 4th side, and with first hole pair It answers；

One hydrophilic layer, set on the first side surface of first plate body；

One capillary structure layer is set in the airtight chamber, and aforementioned second recess portion supports the capillary structure layer, the capillary structure layer First recess portion is not contacted.

2. the bypass structure of heat-sink unit as described in claim 1, it is characterised in that: the capillary structure layer be grid body or Corpus fibrosum or other structural bodies with porous property.

3. the bypass structure of heat-sink unit as claimed in claim 2, it is characterised in that: the material of the grid body is copper or aluminium Or stainless steel or titanium matter.

4. the bypass structure of heat-sink unit as described in claim 1, it is characterised in that: first plate body, the second plate body are Copper or aluminium or stainless steel or titanium matter.

5. the bypass structure of heat-sink unit as described in claim 1, it is characterised in that: first plate body have a lip and One interconnecting piece, the lip are set to the periphery of part between the first side and second side of first plate body, the interconnecting piece two End connects first recess portion and the lip, the interconnecting piece and first recess portion are recessed.

6. the bypass structure of heat-sink unit as described in claim 1, it is characterised in that: have a heat affected zone, the heat affected zone It is convexly equipped in the 4th side of second plate body.