CN107801358A - Straight-through structure of heat dissipation unit - Google Patents
Straight-through structure of heat dissipation unit Download PDFInfo
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 229910052802 copper Inorganic materials 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 20
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 229910001220 stainless steel Inorganic materials 0.000 claims description 7
- 239000010935 stainless steel Substances 0.000 claims description 7
- 239000010936 titanium Substances 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 239000000835 fiber Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000035515 penetration Effects 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000008093 supporting effect Effects 0.000 description 3
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000004049 embossing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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Abstract
Description
技术领域technical field
本发明涉及一种散热单元的直通结构，尤指一种提供一种确保散热单元贯穿后内部气密腔室保有真空气密的散热单元的直通结构气密贯穿结构。The invention relates to a straight-through structure of a heat dissipation unit, in particular to an airtight through-through structure of a heat dissipation unit that ensures that the internal airtight chamber remains vacuum-tight after the heat dissipation unit penetrates.
背景技术Background technique
现行电子设备随着效能提高，其中作为处理信号及运算的电子元件相对的也较以前的电子元件产生较高的热量，最常被使用的一般散热元件包含热管、散热器、均温板等元件，并通过直接与会发热的电子元件接触后进一步增加散热效能，防止电子元件温度过高而烧毁等情事。As the efficiency of current electronic equipment improves, the electronic components used for signal processing and calculation also generate higher heat than the previous electronic components. The most commonly used general heat dissipation components include heat pipes, radiators, vapor chambers and other components. , and further increase the heat dissipation performance by directly contacting the electronic components that will generate heat, so as to prevent the electronic components from being burned due to excessive temperature.
均温板是一种较大范围面与面的热传导应用，其有别于热管的点对点的热传导方式，并适用于空间较为窄小的处使用。Vapor chamber is a heat conduction application with a wide range of surface to surface, which is different from the point-to-point heat conduction method of heat pipes, and is suitable for use in places with relatively narrow spaces.
现有系将均温板与一基板结合使用并通过均温板传导该基板上的发热元件的热量，现有技术主要系于均温板避开该腔室的部位，即该均温板闭合处外的四耦各形成有穿孔并穿设一具有内螺牙的铜柱，基板相对该均温板设置铜柱的位置系开设至少一孔洞，再通过一螺锁元件以螺锁的方式同时穿设所述的这些铜柱及孔洞将该均温板固定于该基板上，但此一固定方式因铜柱设置于该均温板的四耦处，与该发热元件距离较远，该均温板固定后与发热元件无法紧密贴合，进而产生热阻现象；为改善前述无法紧密贴合的问题，则业者将铜柱直接对应设置于该均温板与发热元件贴设的部位的邻近处，故所述的这些铜柱系直接贯穿均温板具有腔室的部位，虽可增加组装时紧密度防止热阻现象产生，但该均温板的腔室受所述的这些铜柱贯穿破坏后失去气密性，其腔室内部不再具有真空状态，并且因铜柱贯穿破坏该腔室，则其内部的工作流体的流动路径可能因此受阻碍，造成热传效率降低，甚至严重也可能产生泄漏，进而令该均温板失去热传效用。In the existing system, the vapor chamber is used in combination with a substrate and the heat of the heating element on the substrate is conducted through the vapor chamber. The existing technology is mainly based on the position where the vapor chamber avoids the chamber, that is, the vapor chamber is closed. Each of the four couplings outside the center is formed with a perforation and a copper column with internal threads. At least one hole is opened on the base plate relative to the position of the copper column on the uniform temperature plate, and then a screw lock element is used to screw lock simultaneously. The above-mentioned copper pillars and holes are used to fix the vapor chamber on the substrate, but this fixing method is far away from the heating element because the copper pillars are arranged at the four couplings of the vapor chamber. After the temperature plate is fixed, it cannot be tightly attached to the heating element, resulting in thermal resistance; in order to improve the aforementioned problem of not being able to fit tightly, the industry will directly arrange the copper pillars in the vicinity of the position where the temperature chamber and the heating element are attached Therefore, the copper pillars mentioned above directly penetrate through the parts of the chambers of the chamber. Although the compactness during assembly can be increased to prevent thermal resistance, the chamber of the chamber is penetrated by the copper pillars mentioned above. After the destruction, the airtightness is lost, and the inside of the chamber no longer has a vacuum state, and because the copper pillar penetrates through the chamber, the flow path of the working fluid inside it may be blocked, resulting in a decrease in heat transfer efficiency, or even serious damage. Leaks may develop, rendering the vapor chamber useless for heat transfer.
上述现有均温板贯穿结构主要仅能适用一般现有较厚的均温板贯穿结构，若使用于超薄结构的均温板则无法适用，因超薄均温板整体厚度仅为(0.8mm以下)，无法额外置入支撑柱，且若使用铜柱，则势必需要使用尺寸厚度极薄的铜柱，其置入铜柱定位因厚度太薄具有困难，且铜柱尺寸小加工不易，现有均温板上板冲孔后，凹陷部位和下板结合，结合的区域并没有设置毛细结构，则影响均温板热传的性能，所以厚型的均温板的凹陷部上盖侧壁也必须设置毛细结构，均温板上板的凹陷部侧墙的毛细结构连通下板的毛细结构，则整体观的现有厚型均温板并无法适用于薄型化的均温板。The above-mentioned existing vapor chamber penetration structure can only be applied to generally existing thicker vapor chamber penetration structures. If it is used in ultra-thin structure vapor chambers, it cannot be applied, because the overall thickness of ultra-thin vapor chambers is only (0.8 mm), it is impossible to place additional supporting columns, and if copper columns are used, it is necessary to use copper columns with extremely thin dimensions and thickness. After the existing vapor chamber is punched, the recessed part is combined with the lower plate, and there is no capillary structure in the joint area, which affects the heat transfer performance of the vapor chamber. Therefore, the upper cover side of the recessed part of the thick vapor chamber The wall must also be equipped with a capillary structure. The capillary structure of the side wall of the concave part of the upper plate is connected to the capillary structure of the lower plate. The existing thick vapor chamber as a whole cannot be applied to a thinner vapor chamber.
另外，也有业者通过蚀刻方式进行制造超薄型均温板，并由蚀刻加工于板材上进行除料设置沟槽或支撑结构，又因需进行除料的加工，故本身板材厚度则是必须预留足够的厚度始可以进行除料，再者，进行除料的部位容易产生结构强度不佳的情况发生，故通过蚀刻的方式进行超薄均温板的加工仍具有缺失等问题。In addition, there are also manufacturers who manufacture ultra-thin vapor chambers by etching, and then remove material on the plate by etching to set up grooves or support structures. Because of the need for material removal, the thickness of the plate itself must be pre-determined. Only enough thickness can be removed before material removal can be carried out. Furthermore, the part where material removal is performed is prone to poor structural strength. Therefore, the processing of ultra-thin vapor chambers by etching still has problems such as missing.
发明内容Contents of the invention
如此，为解决上述现有技术的缺点，本发明的主要目的，是提供一种解决现有贯穿具有气密腔室造成真空气密泄漏缺失的散热单元的直通结构。In this way, in order to solve the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide a straight-through structure that solves the lack of vacuum airtight leakage caused by the existing airtight chamber.
为达上述的目的，本发明提供一种散热单元的直通结构，其特征是包含：In order to achieve the above-mentioned purpose, the present invention provides a straight-through structure of a heat dissipation unit, which is characterized in that it includes:
一第一板体，具有一第一侧、一第二侧、一第一凹部、一第一孔洞及一第二凹部，该第一凹部、第二凹部由该第二侧向该第一侧凹陷所形成，该第一孔洞设于该第一凹陷部并贯穿该第一侧、第二侧；A first plate body has a first side, a second side, a first recess, a first hole and a second recess, the first recess and the second recess are from the second side to the first side Formed by a depression, the first hole is provided in the first depression and runs through the first side and the second side;
一第二板体，具有一第三侧、一第四侧及一第二孔洞，所述第三侧与前述第一侧对应盖合，该第一板体、第二板体共同界定一密闭腔室，该第二孔洞贯穿该第二板体的第三侧、第四侧，并与该第一孔洞对应；A second plate body has a third side, a fourth side and a second hole, the third side is covered with the first side correspondingly, the first plate body and the second plate body jointly define a closed a chamber, the second hole runs through the third side and the fourth side of the second plate, and corresponds to the first hole;
一亲水性层，设于该第一板体的第一侧表面；a hydrophilic layer arranged on the first side surface of the first board;
一毛细结构层，设于该密闭腔室内，前述第二凹部抵顶该毛细结构层，所述毛细结构层不接触该第一凹部。A capillary structure layer is arranged in the airtight chamber, the aforementioned second recess is against the capillary structure layer, and the capillary structure layer does not contact the first recess.
所述的散热单元的直通结构，其中：所述毛细结构层是网格体或纤维体或其他具有多孔性质的结构体。The straight-through structure of the heat dissipation unit, wherein: the capillary structure layer is a mesh body or a fiber body or other porous structures.
所述的散热单元的直通结构，其中：所述网格体的材质是铜或铝或不锈钢或钛材质。The straight-through structure of the heat dissipation unit, wherein: the grid body is made of copper or aluminum or stainless steel or titanium.
所述的散热单元的直通结构，其中：所述第一板体、第二板体是铜或铝或不锈钢或钛材质。The straight-through structure of the heat dissipation unit, wherein: the first board body and the second board body are made of copper or aluminum or stainless steel or titanium.
所述的散热单元的直通结构，其中：所述第一板体具有一唇边及一连接部，所述唇边设于所述第一板体的周缘，所述连接部两端连接该第一凹部及该唇边，该连接部与该第一凹部均呈凹陷状。The straight-through structure of the heat dissipation unit, wherein: the first plate has a lip and a connecting portion, the lip is set on the periphery of the first plate, and the two ends of the connecting portion connect the first A concave portion, the lip, the connecting portion and the first concave portion are all concave.
所述的散热单元的直通结构，其中：具有一受热区，所述受热区凸设于所述第二板体的第四侧。The straight-through structure of the heat dissipation unit includes: a heat receiving area protruding from the fourth side of the second plate body.
通过本发明的散热单元的直通结构可确保当散热装置进行贯穿结构的设置时仍可确实保有散热单元内部密闭腔室的气密性，并且此项气密贯穿结构适用于任一种均温板，第一板体自身的第二凹部即可做为支撑使用，取代现有均温板中的支撑铜柱使用，进一步可改善超薄均温板无法设置支撑结构，及改善现有通过蚀刻方式开设沟槽的超薄型均温板所产生结构强度不佳等缺失，同时可于超薄型均温板上设置贯穿结构同时保持气密性。The straight-through structure of the heat dissipation unit of the present invention can ensure that the airtightness of the airtight chamber inside the heat dissipation unit can still be maintained when the heat dissipation device is set through the structure, and this airtight penetration structure is applicable to any kind of vapor chamber , the second concave part of the first plate body itself can be used as a support, replacing the supporting copper pillars in the existing vapor chamber, which can further improve the support structure that cannot be installed on the ultra-thin vapor chamber, and improve the existing etching method The ultra-thin vapor chamber with grooves has defects such as poor structural strength, and at the same time, a penetrating structure can be set on the ultra-thin vapor chamber while maintaining airtightness.
附图说明Description of drawings
图1是本发明散热单元的直通结构的第一实施例立体分解图；Fig. 1 is a three-dimensional exploded view of the first embodiment of the straight-through structure of the heat dissipation unit of the present invention;
图2是本发明散热单元的直通结构的第一实施例组合剖视图；Fig. 2 is a combined cross-sectional view of the first embodiment of the straight-through structure of the heat dissipation unit of the present invention;
图3是本发明散热单元的直通结构的第二实施例组合剖视图；Fig. 3 is a combined cross-sectional view of the second embodiment of the straight-through structure of the heat dissipation unit of the present invention;
图4是本发明散热单元的直通结构的第三实施例组合剖视图。Fig. 4 is a combined cross-sectional view of the third embodiment of the straight-through structure of the heat dissipation unit of the present invention.
附图标记说明：散热单元的直通结构1；第一板体11；第一侧111；第二侧112；第一凹部113；第一孔洞114；第二凹部115；第二板体12；第三侧121；第四侧122；第二孔洞123；第二凹部124；密闭腔室13；亲水性层14；毛细结构层15；唇部16；受热区17；连接部18；热源2。Explanation of reference numerals: straight-through structure 1 of heat dissipation unit; first plate body 11; first side 111; second side 112; first recess 113; first hole 114; second recess 115; Three sides 121 ; fourth side 122 ; second hole 123 ; second recess 124 ; closed chamber 13 ; hydrophilic layer 14 ; capillary structure layer 15 ; lip 16 ;
具体实施方式Detailed ways
请参阅图1、图2，是本发明散热装置气密贯穿结构的第一实施例立体分解组合剖视图，如图所示，本发明散热单元的直通结构1，包含：一第一板体11、一第二板体12；Please refer to Fig. 1 and Fig. 2, which are three-dimensional exploded and combined cross-sectional views of the first embodiment of the airtight penetration structure of the heat dissipation device of the present invention. As shown in the figure, the straight-through structure 1 of the heat dissipation unit of the present invention includes: a first plate body 11, a second plate body 12;
所述第一板体11具有一第一侧111及一第二侧112及一第一凹部113及一第一孔洞114及一第二凹部115，该第一、二凹部113、115由该第二侧112向该第一侧111凹陷所形成，该第一孔洞114设于该第一凹部113并贯穿该第一、二侧111、112。The first plate body 11 has a first side 111, a second side 112, a first recess 113, a first hole 114, and a second recess 115, the first and second recesses 113, 115 are defined by the first The two sides 112 are recessed toward the first side 111 , and the first hole 114 is disposed in the first recess 113 and passes through the first and second sides 111 , 112 .
所述第二板体12具有一第三侧121及一第四侧122及一第二孔洞123，所述第三侧121与前述第一侧111相对应盖合，并该第一、二板体11、12共同界定一密闭腔室13，该第二孔洞123贯穿该第二板体12的第三、四侧121、122，并与该第一孔洞114对应。The second plate body 12 has a third side 121, a fourth side 122 and a second hole 123, the third side 121 is correspondingly covered with the aforementioned first side 111, and the first and second plates The bodies 11 , 12 jointly define a closed chamber 13 , and the second hole 123 runs through the third and fourth sides 121 , 122 of the second plate body 12 and corresponds to the first hole 114 .
一亲水性层14设于该第一板体11的第一侧111表面。A hydrophilic layer 14 is disposed on the surface of the first side 111 of the first board 11 .
一毛细结构层15设于该密闭腔室13内的第二板体12的第三侧121，并前述第二凹部115一端抵顶该毛细结构层15，所述毛细结构层15不接触该第一凹部113，所述毛细结构层15是网格体或纤维体或具有多孔性质的结构体其中任一。A capillary structure layer 15 is arranged on the third side 121 of the second plate body 12 in the airtight chamber 13, and one end of the aforementioned second recess 115 is against the capillary structure layer 15, and the capillary structure layer 15 does not contact the first A recess 113, the capillary structure layer 15 is any one of mesh body or fiber body or a porous structure.
所述第一板体11周缘与该第二板体12周缘结合处具有一唇部16，并该唇部16及前述第一凹部113与该第二板体12的第三侧121相接合处系透扩散接合或焊接的方式结合，进而密闭前述密闭腔室13保持真空气密，并因所述第一孔洞114及该第二孔洞123选择设置于前述第一凹部113或唇部16的部位，可令该密闭腔室13不受破坏保有真空气密性。There is a lip 16 at the junction of the periphery of the first plate 11 and the periphery of the second plate 12, and the junction of the lip 16 and the first recess 113 with the third side 121 of the second plate 12 It is combined by diffusion bonding or welding, and then the aforementioned airtight chamber 13 is kept vacuum-tight, and because the first hole 114 and the second hole 123 are selected to be arranged in the aforementioned first recess 113 or the position of the lip 16 , the airtight chamber 13 can be kept vacuum-tight without being damaged.
所述第一板体11是一作为冷凝效果使用的部位，可与其他散热单元进行结合传导热量增加冷凝的效果，所述第二板体12作为吸热受热部位效果的使用并可与至少一热源2接触进行热传导。The first plate body 11 is a part used as a condensation effect, and can be combined with other heat dissipation units to conduct heat to increase the effect of condensation. The second plate body 12 is used as a heat-absorbing and heat-receiving part effect and can be combined with at least one The heat source 2 is in contact for heat conduction.
请参阅图3，是本发明散热单元的直通结构的第二实施例组合剖视图，如图所示，本实施例部分结构技术特征与前述第一实施例相同故在此将不再赘述，惟本实施例与前述第一实施例的不同处在于所述毛细结构层15的表面具有所述亲水性层14，一受热区17凸设于所述第二板体12的第四侧122，所述受热区17作为直接与热源2接触的部位，所述受热区17可为一厚铜片或一薄铜片其中任一，依照对应的热源2高度进行选用。Please refer to Fig. 3, which is a combined cross-sectional view of the second embodiment of the straight-through structure of the heat dissipation unit of the present invention. The difference between this embodiment and the aforementioned first embodiment is that the surface of the capillary structure layer 15 has the hydrophilic layer 14, and a heat receiving area 17 is protruded on the fourth side 122 of the second plate body 12, so The heat receiving area 17 is a part directly in contact with the heat source 2 , and the heat receiving area 17 can be either a thick copper sheet or a thin copper sheet, which is selected according to the height of the corresponding heat source 2 .
请参阅图4，是本发明散热单元的直通结构的第三实施例组合剖视图，如图所示，本实施例部分结构技术特征与前述第一实施例相同故在此将不再赘述，惟本实施例与前述第一实施例的不同处在于所述第一板体11具有一唇边16及一连接部18，所述唇边16设于所述第一板体11的周缘，所述连接部18两端连接该第一凹部113及该唇边16，该连接部18与该第一凹部113相同呈向该第二板体12的第三侧121的方向凹陷状，并前述唇边16及该第一凹部113与该连接部18系通过焊接或扩散接合的方式与该第二板体12进行密封接合。Please refer to Fig. 4, which is a combined cross-sectional view of the third embodiment of the straight-through structure of the heat dissipation unit of the present invention. The difference between this embodiment and the aforementioned first embodiment is that the first plate 11 has a lip 16 and a connecting portion 18, the lip 16 is arranged on the periphery of the first plate 11, and the connection Both ends of the portion 18 are connected to the first concave portion 113 and the lip 16, the connecting portion 18, like the first concave portion 113, is concave toward the third side 121 of the second plate body 12, and the aforementioned lip 16 And the first concave portion 113 and the connecting portion 18 are hermetically bonded to the second plate body 12 by welding or diffusion bonding.
前述第一、二、三实施例中所述毛细结构层15系通过蚀刻沟槽或烧结铜粉所形成，所述网格体的材质是铜或铝或不锈钢或钛材质其中任一，所述第一、二板体11、12是铜或铝或不锈钢或钛材质其中任一。The capillary structure layer 15 in the aforementioned first, second, and third embodiments is formed by etching grooves or sintering copper powder, and the material of the grid body is any one of copper, aluminum, stainless steel, or titanium. The first and second plate bodies 11 and 12 are any one of copper, aluminum, stainless steel or titanium.
若选用网格体作为毛细结构层时所述网格体的材质是铜或铝或不锈钢或钛材质其中任一，当然也可通过迭层材料混搭的方式设置。If the mesh body is selected as the capillary structure layer, the material of the mesh body is any one of copper, aluminum, stainless steel, or titanium, and of course it can also be set by mixing and matching laminated materials.
本发明主要目的在于提供一种具有真空气密腔室的散热单元当需要进行贯穿设置螺锁元件时，具有贯穿且保持真空气密性的贯穿结构，并由于直接于第一、二板体11、12形成贯穿及接合的结构(第一凹部113)以及具有支撑效果的(第二凹部115)，不仅可实现超薄型均温板具有支撑同时贯穿时保持气密效果的结构。The main purpose of the present invention is to provide a heat dissipation unit with a vacuum airtight chamber. When it is necessary to install screw lock elements through through, it has a through structure that penetrates and maintains vacuum airtightness. , 12 form a penetrating and joint structure (the first recess 113) and a supporting effect (the second recess 115), not only can realize the structure that the ultra-thin vapor chamber has the support and maintains the airtight effect when penetrating.
本案的第一板体11的第一、二凹部113、115并不局限以任何加工形式所形成，可为压浮花或压凸印的冲压方式形成，也可通过机械切销加工或非传统加工方式所形成的结构体。The first and second recesses 113, 115 of the first plate 11 in this case are not limited to be formed in any form of processing, they can be formed by embossing or embossing, or by mechanical cutting or non-traditional The structure formed by the processing method.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108882644A (en) * | 2018-07-25 | 2018-11-23 | 奇鋐科技股份有限公司 | Heat radiation unit |
| CN111010858A (en) * | 2019-12-30 | 2020-04-14 | Oppo广东移动通信有限公司 | Heat-dissipating device, preparation method of heat-dissipating device, and electronic equipment |
| CN113464871A (en) * | 2021-06-30 | 2021-10-01 | 江西展耀微电子有限公司 | Lamp film, preparation method thereof and electronic equipment |
| US11910574B2 (en) | 2018-08-05 | 2024-02-20 | Asia Vital Components Co., Ltd. | Heat dissipation unit |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080224019A1 (en) * | 2007-03-14 | 2008-09-18 | Shi-Ping Luo | Support device for heat dissipation module |
| CN201904323U (en) * | 2010-11-17 | 2011-07-20 | 深圳东桥华瀚科技有限公司 | Heat homogenizing plate |
| CN106813525A (en) * | 2017-02-08 | 2017-06-09 | 锘威科技(深圳)有限公司 | A kind of flat-plate heat pipe structure and its manufacture method |
| CN207491438U (en) * | 2017-11-09 | 2018-06-12 | 奇鋐科技股份有限公司 | Straight-through structure of cooling unit |
-
2017
- 2017-11-09 CN CN201711098570.9A patent/CN107801358B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080224019A1 (en) * | 2007-03-14 | 2008-09-18 | Shi-Ping Luo | Support device for heat dissipation module |
| CN201904323U (en) * | 2010-11-17 | 2011-07-20 | 深圳东桥华瀚科技有限公司 | Heat homogenizing plate |
| CN106813525A (en) * | 2017-02-08 | 2017-06-09 | 锘威科技(深圳)有限公司 | A kind of flat-plate heat pipe structure and its manufacture method |
| CN207491438U (en) * | 2017-11-09 | 2018-06-12 | 奇鋐科技股份有限公司 | Straight-through structure of cooling unit |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108882644A (en) * | 2018-07-25 | 2018-11-23 | 奇鋐科技股份有限公司 | Heat radiation unit |
| US11910574B2 (en) | 2018-08-05 | 2024-02-20 | Asia Vital Components Co., Ltd. | Heat dissipation unit |
| CN111010858A (en) * | 2019-12-30 | 2020-04-14 | Oppo广东移动通信有限公司 | Heat-dissipating device, preparation method of heat-dissipating device, and electronic equipment |
| WO2021136073A1 (en) * | 2019-12-30 | 2021-07-08 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method for heat dissipation device, and electronic apparatus |
| CN111010858B (en) * | 2019-12-30 | 2021-11-16 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method of heat dissipation device and electronic equipment |
| CN113464871A (en) * | 2021-06-30 | 2021-10-01 | 江西展耀微电子有限公司 | Lamp film, preparation method thereof and electronic equipment |
| CN113464871B (en) * | 2021-06-30 | 2023-08-15 | 江西新菲新材料有限公司 | Lamp film, preparation method thereof, and electronic device |
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