CN107801303B - Flexible circuit board - Google Patents
Flexible circuit board Download PDFInfo
- Publication number
- CN107801303B CN107801303B CN201711316197.XA CN201711316197A CN107801303B CN 107801303 B CN107801303 B CN 107801303B CN 201711316197 A CN201711316197 A CN 201711316197A CN 107801303 B CN107801303 B CN 107801303B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- thickness
- area
- temperature sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 21
- 239000011889 copper foil Substances 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 238000003466 welding Methods 0.000 claims abstract description 20
- 238000012544 monitoring process Methods 0.000 claims abstract description 4
- 230000003014 reinforcing effect Effects 0.000 claims description 24
- 239000010410 layer Substances 0.000 claims description 15
- 230000001681 protective effect Effects 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 238000013459 approach Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 abstract description 5
- 238000005476 soldering Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a flexible circuit board, which comprises a copper foil substrate, wherein the front surface of the copper foil substrate is provided with a circuit and an element welding area, a first nickel sheet terminal and a temperature sensor are welded in the first element welding area, and a second nickel sheet terminal is welded in the second element welding area; the temperature sensor is covered with a cured heat-conducting glue layer. The temperature sensor is protected by the heat-conducting glue, the overcurrent and temperature rise of the nickel sheet terminal is monitored, and the purpose of protecting the circuit cell is achieved by monitoring the temperature.
Description
Technical Field
The invention relates to the technical field of flexible circuits, in particular to a flexible circuit board.
Background
A Flexible Printed Circuit (FPC) is one of the most complex and versatile Circuit board products, and particularly, because it has characteristics of being light, thin, bendable, low voltage, low power consumption, and the like, it can perform three-dimensional wiring in a three-dimensional space according to the size and shape of an internal space of an electronic product, and thus, it is widely used in products such as notebook computers, liquid crystal displays, hard disks, printers, and automobiles. Particularly, for a flexible circuit board used on an automotive power battery, when the output of the power battery to a control system is over-current, a chip of the control system is damaged, so that a current value or heating caused by over-current must be monitored, and a feasible scheme of the part is lacking at present.
Disclosure of Invention
The invention aims to solve the technical problem of the prior art and provides a flexible circuit board for monitoring the overcurrent and temperature rise of a nickel sheet terminal, and the flexible circuit board can protect a circuit cell by monitoring the temperature.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows: the flexible circuit board comprises a copper foil substrate, wherein a circuit and an element welding area are arranged on the front surface of the copper foil substrate, a first nickel sheet terminal and a temperature sensor are welded in the first element welding area, and a second nickel sheet terminal is welded in the second element welding area; the temperature sensor is covered with a cured heat-conducting glue layer.
In the above technical scheme, the first nickel sheet terminal is provided with a hollow area, the bottom of the hollow area is the first element welding area, and the temperature sensor is welded on the first element welding area in the hollow area.
In the above technical scheme, the hollow area includes a through hole and a protruding edge protruding from two opposite sides of the through hole to the front side and approaching to the center.
In the above technical solution, the surface of the wiring is covered with an insulating film, the insulating film is provided with an opening to expose the copper sheet of the component bonding area, and the thickness of the insulating film is 60 μm.
In the technical scheme, the reverse side of the copper foil substrate and the surface of the insulating film are respectively covered with a protective film, and the thickness of the protective film is 100 mu m.
In the technical scheme, a first reinforcing sheet and a second reinforcing sheet are attached to the back surface of the copper foil substrate, and the first reinforcing sheet is attached to the back surface position corresponding to the first element welding area; the second reinforcing sheet is partially attached to the stitch region and partially suspended, a mounting hole is formed in the suspended position, and the plug connector 14 is locked on the mounting hole through a locking piece.
In the above technical solution, the thickness of the first reinforcing sheet is 0.3mm, and the thickness of the second reinforcing sheet is 2.0 mm.
In the technical scheme, the thickness of the copper foil substrate is 80 μm, and the copper foil substrate comprises a copper base layer with the thickness of 35 μm, an ADH layer with the thickness of 20 μm and a PI layer with the thickness of 25 μm.
The invention has the beneficial effects that: a first nickel sheet terminal and a temperature sensor are welded in the first element welding area, and a second nickel sheet terminal is welded in the second element welding area; the temperature sensor covers has the heat-conducting glue layer of solidification, monitors the nickel piece terminal and overflows the temperature rise problem, through the control temperature in order to reach protection circuit electricity core.
Drawings
FIG. 1 is a schematic view of the combined structure of the present invention;
FIG. 2 is a schematic diagram of a front side etched circuit according to the present invention;
FIG. 3 is a schematic view of the structure of the front side covered with an insulating film and a window of the present invention;
FIG. 4 is a schematic view of the front side of the present invention covered with a protective film;
FIG. 5 is a schematic view of the structure of the reverse side protective film of the present invention;
FIG. 6 is a schematic view of the structure of the reverse-side reinforcing patch of the present invention;
FIG. 7 is a schematic view of a portion of the enlarged structure of FIG. 1;
FIG. 8 is a schematic structural view of a second reinforcing sheet of the present invention;
FIG. 9 is a schematic view of a first reinforcing sheet according to the present invention;
FIG. 10 is a schematic view of a side view of a portion of a first reinforcing patch according to the present invention;
FIG. 11 is a schematic view of the laminated structure of the combination of the present invention.
In the figure, 1, a copper foil substrate; 2. a line; 3. a first component bonding area; 4. a first nickel plate terminal; 5. a temperature sensor; 6. a second component weld area; 7. a second nickel plate terminal; 8. a hollowed-out area; 9. a through hole; 10. a projecting edge; 11. an insulating film; 12. an opening; 13. a protective film; 14. a plug-in unit; 15. mounting holes; 16. a stitch area; 17. a bar code; 18. a first reinforcing sheet; 19. a second reinforcing sheet; 20. and (6) tinning treatment.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1 to 11, the flexible circuit board includes a copper foil substrate 1, a circuit 2 and a component soldering area are provided on the front surface of the copper foil substrate 1, a first nickel tab terminal 4 and a temperature sensor 5 are soldered in a first component soldering area 3, and a second nickel tab terminal 7 is soldered in a second component soldering area 6; the temperature sensor 5 is covered with a heat conductive adhesive layer cured by UV. In this embodiment, 5 temperature sensors 5 are provided, and the temperature sensors 5 are surface mount NTC devices. The first nickel tab terminal 4 and the second nickel tab terminal 7 are soldered after the pre-tinning process 20 is required.
The first nickel sheet terminal 4 is provided with a hollow area 8, the bottom of the hollow area 8 is the first element welding area 3, and the temperature sensor 5 is welded on the first element welding area 3 in the hollow area 8. The hollow area 8 comprises a through hole 9 and convex edges 10 which protrude from two opposite side edges of the through hole 9 towards the front side and approach to the center.
Wherein the surface of the wiring 2 is covered with an insulating film 11 composed of a PI layer and an ADH layer, the insulating film 11 is provided with an opening 12 to expose a copper sheet of the component bonding region, and the thickness of the insulating film 11 is 60 μm. The reverse surface of the copper foil substrate 1 and the surface of the insulating film 11 are covered with a protective film 13 composed of a PI layer and an ADH layer, respectively, and the thickness of the protective film 13 is 100 μm.
Wherein, a first reinforcing sheet 18 and a second reinforcing sheet 19 are pasted on the back surface of the copper foil substrate 1, and the first reinforcing sheet 18 is pasted on the back surface position corresponding to the first element welding area; the second reinforcing plate 19 is partially attached to the stitch region 16 and partially suspended, a mounting hole 15 is formed in the suspended position, and the plug 14 is locked on the mounting hole 15 through a locking member. The front and back sides of the splicing part both need key glue. The reverse side of the copper foil substrate 1 is also adhered with a bar code 17 for storing the test and parameter information of the flexible circuit board.
The thickness of the first reinforcing sheet 18 is 0.3mm, and the thickness of the second reinforcing sheet 19 is 2.0 mm.
The copper foil substrate 1 is 80 μm thick and comprises a 35 μm thick copper base layer, a 20 μm thick ADH layer and a 25 μm thick PI layer.
The above examples are intended to illustrate rather than to limit the invention, and all equivalent changes and modifications made by the methods described in the claims of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. A flexible circuit board, characterized in that: the temperature sensor comprises a copper foil substrate, wherein a circuit and an element welding area are arranged on the front surface of the copper foil substrate, a first nickel sheet terminal and a temperature sensor are welded in the first element welding area, and a second nickel sheet terminal is welded in the second element welding area; the temperature sensor is covered with a solidified heat-conducting adhesive layer; the first nickel sheet terminal is provided with a hollow area, the bottom of the hollow area is the first element welding area, and the temperature sensor is welded on the first element welding area in the hollow area; the temperature sensor is used for monitoring the temperature of the first nickel sheet terminal.
2. A flexible circuit board according to claim 1, wherein: the hollow area comprises a through hole and convex edges which protrude from two opposite side edges of the through hole to the front side and approach to the center.
3. A flexible circuit board according to claim 1, wherein: the wiring surface is covered with an insulating film provided with an opening to expose the copper sheet of the component bonding area, the insulating film having a thickness of 60 μm.
4. A flexible circuit board according to claim 3, wherein: and protective films are respectively covered on the reverse side of the copper foil substrate and the surface of the insulating film, and the thickness of each protective film is 100 micrometers.
5. The flexible circuit board of claim 4, wherein: a first reinforcing sheet and a second reinforcing sheet are attached to the back surface of the copper foil substrate, and the first reinforcing sheet is attached to the back surface position corresponding to the first element welding area; the second reinforcing sheet is partially attached to the stitch area and partially suspended, a mounting hole is formed in the suspended position, and the plug connector is locked on the mounting hole through the locking piece.
6. The flexible circuit board of claim 5, wherein: the thickness of the first reinforcing sheet is 0.3mm, and the thickness of the second reinforcing sheet is 2.0 mm.
7. A flexible circuit board according to claim 1, wherein: the copper foil substrate is 80 mu m thick and comprises a copper base layer with the thickness of 35 mu m, an ADH layer with the thickness of 20 mu m and a PI layer with the thickness of 25 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711316197.XA CN107801303B (en) | 2017-12-12 | 2017-12-12 | Flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711316197.XA CN107801303B (en) | 2017-12-12 | 2017-12-12 | Flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107801303A CN107801303A (en) | 2018-03-13 |
| CN107801303B true CN107801303B (en) | 2019-12-27 |
Family
ID=61538288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711316197.XA Active CN107801303B (en) | 2017-12-12 | 2017-12-12 | Flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107801303B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN211320199U (en) | 2019-12-31 | 2020-08-21 | 宁德时代新能源科技股份有限公司 | Sampling assembly, battery module, battery pack and device |
| CN112615073B (en) * | 2020-12-31 | 2023-05-26 | 上海捷新动力电池系统有限公司 | FFC temperature sampling structure in power battery pack and process flow thereof |
| CN114211074A (en) * | 2021-12-15 | 2022-03-22 | 盐城维信电子有限公司 | A method for laser welding of vehicle-mounted flexible board and nickel sheet |
| CN118921881A (en) * | 2024-10-08 | 2024-11-08 | 深圳市盛鸿运科技有限公司 | Preparation method of flexible circuit board and flexible circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102792513A (en) * | 2010-03-01 | 2012-11-21 | 波士顿电力公司 | Thermal sensor device with average temperature and hot spot feedback |
| CN205946356U (en) * | 2016-07-26 | 2017-02-08 | 赛恩斯能源科技有限公司 | Voltage temperature data collection connecting device |
| CN206164968U (en) * | 2016-11-08 | 2017-05-10 | 扬州宝珠电器有限公司 | Temperature sensor for circuit board |
| CN106912166A (en) * | 2017-03-16 | 2017-06-30 | 苏州经贸职业技术学院 | A kind of welding circuit board heating means with temperature-adjusting circuit |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205016469U (en) * | 2015-10-19 | 2016-02-03 | 扬州宝珠电器有限公司 | Temperature sensor for circuit board |
-
2017
- 2017-12-12 CN CN201711316197.XA patent/CN107801303B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102792513A (en) * | 2010-03-01 | 2012-11-21 | 波士顿电力公司 | Thermal sensor device with average temperature and hot spot feedback |
| CN205946356U (en) * | 2016-07-26 | 2017-02-08 | 赛恩斯能源科技有限公司 | Voltage temperature data collection connecting device |
| CN206164968U (en) * | 2016-11-08 | 2017-05-10 | 扬州宝珠电器有限公司 | Temperature sensor for circuit board |
| CN106912166A (en) * | 2017-03-16 | 2017-06-30 | 苏州经贸职业技术学院 | A kind of welding circuit board heating means with temperature-adjusting circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107801303A (en) | 2018-03-13 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 523000, Dongguan, Guangdong province Dongcheng District sand science and Technology Industrial Park Patentee after: Yidong Electronic Technology Co.,Ltd. Address before: 523000, Dongguan, Guangdong province Dongcheng District sand science and Technology Industrial Park Patentee before: DONGGUAN YIDONG TECHNOLOGY Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220620 Address after: 523000 Tongsha Science and Technology Industrial Park, Dongcheng District, Dongguan City, Guangdong Province Patentee after: Yidong Electronic Technology Co.,Ltd. Patentee after: Hubei Yihong Precision Manufacturing Co., Ltd Address before: 523000 Tongsha Science and Technology Industrial Park, Dongcheng District, Dongguan City, Guangdong Province Patentee before: Yidong Electronic Technology Co.,Ltd. |
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| TR01 | Transfer of patent right |