CN107801303A - A kind of flexible PCB - Google Patents
A kind of flexible PCB Download PDFInfo
- Publication number
- CN107801303A CN107801303A CN201711316197.XA CN201711316197A CN107801303A CN 107801303 A CN107801303 A CN 107801303A CN 201711316197 A CN201711316197 A CN 201711316197A CN 107801303 A CN107801303 A CN 107801303A
- Authority
- CN
- China
- Prior art keywords
- flexible pcb
- clad laminate
- reinforcing chip
- welding region
- copper clad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 40
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910052802 copper Inorganic materials 0.000 claims abstract description 24
- 239000010949 copper Substances 0.000 claims abstract description 24
- 238000003466 welding Methods 0.000 claims abstract description 23
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 20
- 239000003292 glue Substances 0.000 claims abstract description 7
- 238000007711 solidification Methods 0.000 claims abstract description 4
- 230000008023 solidification Effects 0.000 claims abstract description 4
- 230000003014 reinforcing effect Effects 0.000 claims description 24
- 239000011800 void material Substances 0.000 claims description 12
- -1 35 μ m-thicks Chemical compound 0.000 claims 1
- 238000012544 monitoring process Methods 0.000 abstract description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses flexible PCB, it includes copper clad laminate, the front of copper clad laminate is provided with circuit and element welding region, and the first nickel sheet terminal and temperature sensor are welded with the first element welding region, the second nickel sheet terminal is welded with the second element welding region；Heat-conducting glue layer of the temperature sensor covered with solidification.The present invention protects temperature sensor by heat-conducting glue and monitors the excessively stream problem of temperature rise of nickel sheet terminal, reaches the purpose of protection circuit battery core by monitoring temperature.
Description
Technical field
The present invention relates to flexible circuit technology field, particularly a kind of flexible PCB.
Background technology
FPC（Flexible Printed Circuit, flexible printed circuit board）It is most complicated, purposes in circuit panel products
Most wide one kind, especially because it has the characteristic such as frivolous, flexible, low-voltage, low consumpting power, it can be produced with electronics
The size and shape of product inner space carry out the three-dimensional wiring of three dimensions, therefore, are widely used in notebook computer, liquid crystal
In the products such as display, hard disk, printer and automobile.The flexible PCB used on automobile power cell is particularly directed to,
When situation of the electrokinetic cell to the output overcurrent of control system, the chip of control system will be caused to damage, so must deposit
It is monitored in the heating to current value or caused by excessively stream, is just lacking the feasible scheme of this part at present.
The content of the invention
The technical problem to be solved in the present invention is to be directed to above-mentioned the deficiencies in the prior art, there is provided one kind monitoring nickel sheet terminal mistake
Problem of temperature rise is flowed, reaches the flexible PCB of protection circuit battery core by monitoring temperature.
In order to solve the above technical problems, the technical solution used in the present invention is：Flexible PCB, it includes copper foil base
Plate, the front of copper clad laminate are provided with circuit and element welding region, the first nickel sheet are welded with the first element welding region
Terminal and temperature sensor, the second nickel sheet terminal is welded with the second element welding region；The temperature sensor covered with
The heat-conducting glue layer of solidification.
In above-mentioned technical proposal, the first nickel sheet terminal is provided with void region, and the bottom of the void region is above-mentioned the
One element welding region, the temperature sensor are welded on the first element welding region in the void region.
In above-mentioned technical proposal, the void region include through hole and it is prominent from the two opposite sides side of through hole towards front and to
The protrusion side that center is drawn close.
In above-mentioned technical proposal, for the circuit surface covered with dielectric film, dielectric film is provided with opening with by the element
The copper sheet of welding region exposes, and the thickness of the dielectric film is 60 μm.
In above-mentioned technical proposal, the reverse side and insulating film surface of the copper clad laminate have been covered each by diaphragm, diaphragm
Thickness be 100 μm.
In above-mentioned technical proposal, the first reinforcing chip and the second reinforcing chip have been sticked in the reverse side of the copper clad laminate, first
Reinforcing chip is affixed on reverse side position corresponding to the first element weld zone；The part of second reinforcing chip is covered on pin area, and part is outstanding
Sky, hanging part are provided with mounting hole, and plug connector 14 is locked on mounting hole by locking part.
In above-mentioned technical proposal, the thickness of first reinforcing chip is 0.3mm, and the thickness of the second reinforcing chip is 2.0mm.
In above-mentioned technical proposal, the thickness of the copper clad laminate is 80 μm, including the base copper of 35 μ m-thicks, 20 μm thick
The PI layers of ADH layers and 25 μ m-thicks.
The beneficial effects of the invention are as follows：The first nickel sheet terminal and TEMP are welded with the first element welding region
Device, the second nickel sheet terminal is welded with the second element welding region；Heat-conducting glue layer of the temperature sensor covered with solidification,
Nickel sheet terminal excessively stream problem of temperature rise is monitored, reaches protection circuit battery core by monitoring temperature.
Brief description of the drawings
Fig. 1 is the combining structure schematic diagram of the present invention；
Fig. 2 is the structural representation of front-side etch circuit of the present invention；
Fig. 3 is front covering dielectric film of the invention and the structural representation of windowing；
Fig. 4 is the structural representation of covering protection film in front of the present invention；
Fig. 5 is the structural representation of reverse side covering protection film of the present invention；
Fig. 6 is the structural representation of reverse side reinforcing piece of the present invention；
Fig. 7 is the partial enlargement structural representation in Fig. 1；
Fig. 8 is the structural representation of the second reinforcing chip of the invention；
Fig. 9 is the structural representation of the first reinforcing chip of the invention；
Figure 10 is the partial side structural representation of the first reinforcing chip of the invention；
Figure 11 is the stepped construction schematic diagram of the combination of the present invention.
In figure, 1, copper clad laminate；2nd, circuit；3rd, the first element welding region；4th, the first nickel sheet terminal；5th, TEMP
Device；6th, the second element welding region；7th, the second nickel sheet terminal；8th, void region；9th, through hole；10th, side is protruded；11st, dielectric film；
12nd, it is open；13rd, diaphragm；14th, plug connector；15th, mounting hole；16th, pin area；17th, bar code；18th, the first reinforcing chip；19th,
Two reinforcing chips；20th, tin plating processing.
Embodiment
The invention will now be described in further detail with reference to the accompanying drawings.
As shown in figs. 1-11, flexible PCB, it includes copper clad laminate 1, and the front of copper clad laminate 1 is provided with the He of circuit 2
Element welding region, the first nickel sheet terminal 4 and temperature sensor 5 are welded with the first element welding region 3, in the second element
The second nickel sheet terminal 7 is welded with welding region 6；The temperature sensor 5 is covered with the heat-conducting glue layer solidified by UV.This reality
Apply and 5 temperature sensors 5 are provided with example, temperature sensor 5 uses SMD NTC devices.First nickel sheet terminal 4 and the second nickel
Piece terminal 7 needs to be welded after pre-plating tin processing 20.
Wherein, the first nickel sheet terminal 4 is provided with void region 8, and the bottom of the void region 8 is welded for above-mentioned first element
Region 3 is connect, the temperature sensor 5 is welded on the first element welding region 3 in the void region 8.The void region 8
Including through hole 9 and from the two opposite sides of through hole 9 when being protruded towards front and to the protrusion that center is drawn close 10.
Wherein, the surface of circuit 2 is provided with out covered with the dielectric film 11 combined by PI layers and ADH layers, dielectric film 11
For mouth 12 so that the copper sheet of the element welding region to be exposed, the thickness of the dielectric film 11 is 60 μm.The reverse side of the copper clad laminate 1
The diaphragm 13 that is combined by PI layers and ADH layers is covered each by with the surface of dielectric film 11, the thickness of the diaphragm 13 is 100 μ
m。
Wherein, the first reinforcing chip 18 and the second reinforcing chip 19, the first reinforcing chip have been sticked in the reverse side of the copper clad laminate 1
18 are affixed on reverse side position corresponding to the first element weld zone；The part of second reinforcing chip 19 is covered on pin area 16, and part is outstanding
Sky, hanging part are provided with mounting hole 15, and plug connector 14 is locked on mounting hole 15 by locking part.The positive and negative of splicing position is both needed to
Put glue.Bar code 17 is also pasted with the reverse side of copper clad laminate 1, for storing test and the parameter information of flexible PCB.
Wherein, the thickness of first reinforcing chip 18 is 0.3mm, and the thickness of the second reinforcing chip 19 is 2.0mm.
Wherein, the thickness of the copper clad laminate 1 is 80 μm, including the base copper of 35 μ m-thicks, 20 μm thick of ADH layers and 25 μ
PI layers thick m.
Embodiment above is merely illustrative and not limiting to the invention, therefore all according to described in present patent application scope
The equivalent change or modification done of method, be included in the range of present patent application.
Claims (8)
- A kind of 1. flexible PCB, it is characterised in that：Including copper clad laminate, the front of copper clad laminate is provided with circuit and element welds Region is connect, the first nickel sheet terminal and temperature sensor are welded with the first element welding region, in the second element welding region In be welded with the second nickel sheet terminal；Heat-conducting glue layer of the temperature sensor covered with solidification.
- A kind of 2. flexible PCB according to claim 1, it is characterised in that：The first nickel sheet terminal is provided with vacancy section Domain, the bottom of the void region is above-mentioned first element welding region, and the temperature sensor is welded in the void region On first element welding region.
- A kind of 3. flexible PCB according to claim 2, it is characterised in that：The void region includes through hole and by leading to The two opposite sides in hole are while towards the protrusion that front is prominent and is drawn close to center.
- A kind of 4. flexible PCB according to claim 1, it is characterised in that：The circuit surface covered with dielectric film, Dielectric film is provided with opening so that the copper sheet of the element welding region to be exposed, and the thickness of the dielectric film is 60 μm.
- A kind of 5. flexible PCB according to claim 4, it is characterised in that：The reverse side and dielectric film of the copper clad laminate Surface has been covered each by diaphragm, and the thickness of diaphragm is 100 μm.
- A kind of 6. flexible PCB according to claim 5, it is characterised in that：Sticked in the reverse side of the copper clad laminate First reinforcing chip and the second reinforcing chip, the first reinforcing chip are affixed on reverse side position corresponding to the first element weld zone；Second reinforcing chip Part be covered on pin area, part is hanging, and hanging part is provided with mounting hole, and plug connector is by locking part locking in mounting hole On.
- A kind of 7. flexible PCB according to claim 6, it is characterised in that：The thickness of first reinforcing chip is 0.3mm, the thickness of the second reinforcing chip is 2.0mm.
- A kind of 8. flexible PCB according to claim 1, it is characterised in that：The thickness of the copper clad laminate is 80 μm, The PI layers of base copper including 35 μ m-thicks, 20 μm thick of ADH layers and 25 μ m-thicks.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711316197.XA CN107801303B (en) | 2017-12-12 | 2017-12-12 | Flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711316197.XA CN107801303B (en) | 2017-12-12 | 2017-12-12 | Flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107801303A true CN107801303A (en) | 2018-03-13 |
| CN107801303B CN107801303B (en) | 2019-12-27 |
Family
ID=61538288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711316197.XA Active CN107801303B (en) | 2017-12-12 | 2017-12-12 | Flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107801303B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112615073A (en) * | 2020-12-31 | 2021-04-06 | 上海捷新动力电池系统有限公司 | FFC temperature sampling structure in power battery pack and technological process thereof |
| CN114211074A (en) * | 2021-12-15 | 2022-03-22 | 盐城维信电子有限公司 | A method for laser welding of vehicle-mounted flexible board and nickel sheet |
| CN118921881A (en) * | 2024-10-08 | 2024-11-08 | 深圳市盛鸿运科技有限公司 | Preparation method of flexible circuit board and flexible circuit board |
| US12148900B2 (en) | 2019-12-31 | 2024-11-19 | Contemporary Amperex Technology (Hong Kong) Limited | Sampling component, battery module, battery pack, and device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102792513A (en) * | 2010-03-01 | 2012-11-21 | 波士顿电力公司 | Thermal sensor device with average temperature and hot spot feedback |
| CN205016469U (en) * | 2015-10-19 | 2016-02-03 | 扬州宝珠电器有限公司 | Temperature sensor for circuit board |
| CN205946356U (en) * | 2016-07-26 | 2017-02-08 | 赛恩斯能源科技有限公司 | Voltage temperature data collection connecting device |
| CN206164968U (en) * | 2016-11-08 | 2017-05-10 | 扬州宝珠电器有限公司 | Temperature sensor for circuit board |
| CN106912166A (en) * | 2017-03-16 | 2017-06-30 | 苏州经贸职业技术学院 | A kind of welding circuit board heating means with temperature-adjusting circuit |
-
2017
- 2017-12-12 CN CN201711316197.XA patent/CN107801303B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102792513A (en) * | 2010-03-01 | 2012-11-21 | 波士顿电力公司 | Thermal sensor device with average temperature and hot spot feedback |
| CN205016469U (en) * | 2015-10-19 | 2016-02-03 | 扬州宝珠电器有限公司 | Temperature sensor for circuit board |
| CN205946356U (en) * | 2016-07-26 | 2017-02-08 | 赛恩斯能源科技有限公司 | Voltage temperature data collection connecting device |
| CN206164968U (en) * | 2016-11-08 | 2017-05-10 | 扬州宝珠电器有限公司 | Temperature sensor for circuit board |
| CN106912166A (en) * | 2017-03-16 | 2017-06-30 | 苏州经贸职业技术学院 | A kind of welding circuit board heating means with temperature-adjusting circuit |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12148900B2 (en) | 2019-12-31 | 2024-11-19 | Contemporary Amperex Technology (Hong Kong) Limited | Sampling component, battery module, battery pack, and device |
| CN112615073A (en) * | 2020-12-31 | 2021-04-06 | 上海捷新动力电池系统有限公司 | FFC temperature sampling structure in power battery pack and technological process thereof |
| CN114211074A (en) * | 2021-12-15 | 2022-03-22 | 盐城维信电子有限公司 | A method for laser welding of vehicle-mounted flexible board and nickel sheet |
| CN118921881A (en) * | 2024-10-08 | 2024-11-08 | 深圳市盛鸿运科技有限公司 | Preparation method of flexible circuit board and flexible circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107801303B (en) | 2019-12-27 |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 523000, Dongguan, Guangdong province Dongcheng District sand science and Technology Industrial Park Patentee after: Yidong Electronic Technology Co.,Ltd. Address before: 523000, Dongguan, Guangdong province Dongcheng District sand science and Technology Industrial Park Patentee before: DONGGUAN YIDONG TECHNOLOGY Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220620 Address after: 523000 Tongsha Science and Technology Industrial Park, Dongcheng District, Dongguan City, Guangdong Province Patentee after: Yidong Electronic Technology Co.,Ltd. Patentee after: Hubei Yihong Precision Manufacturing Co., Ltd Address before: 523000 Tongsha Science and Technology Industrial Park, Dongcheng District, Dongguan City, Guangdong Province Patentee before: Yidong Electronic Technology Co.,Ltd. |
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| TR01 | Transfer of patent right |