CN107527876A - Package structure - Google Patents

Abstract

The invention provides a packaging structure which comprises a substrate, a sensing chip, a base, a lead frame, a plurality of through holes and a patterned circuit layer. The substrate comprises a component arrangement area and a plurality of electrode contacts. The sensing chip is arranged in the component arrangement area and is electrically connected with the electrode contact through the patterned circuit layer. The base covers the substrate through the joint mask and comprises an accommodating groove, a step part, an extending inclined plane and a plurality of electrodes. The step part protrudes out of the bottom surface of the accommodating groove. The extending inclined plane extends from the top surface of the step part to the joint surface. The electrodes are arranged on the joint surface and are respectively electrically connected with the electrode contacts. The sensing chip is positioned in the accommodating groove. The lead frame is respectively arranged on the base and the substrate. The via hole penetrates through the step part and is electrically connected to the lead frame. The patterned circuit layer is arranged on the extending inclined plane to electrically connect the via hole and the electrode. The packaging structure has simple processing steps and thinner whole thickness.

Description

Package structure

technical field

The invention relates to a packaging structure, and in particular to a packaging structure of a sensor chip.

Background technique

With the advancement of technology, all electronic products are developing towards the trend of light weight and miniaturization. Taking a microphone as an example, MEMS sensors have been widely used in this field. A traditional microphone includes a MEMS sensor chip, a driver chip for driving the MEMS sensor chip, and a circuit board for carrying the MEMS sensor chip and the driver chip. In addition to the conductive layer and the dielectric layer, the circuit board also has some conductive through vias, and the driver chip in the microphone is usually electrically connected to these conductive through vias.

In the prior art, the manufacturer first separately manufactures the sensing component and the circuit board for carrying the electronic component. Afterwards, the sensing component is packaged on the circuit board to form a sensing component packaging structure. This method is labor-intensive and time-consuming, and the overall thickness of the sensing element packaging structure is not easy to reduce. Therefore, how to improve the packaging of the existing sensing components is one of the goals that developers want to achieve.

Contents of the invention

The invention provides a packaging structure with simple manufacturing steps and thin overall thickness.

A packaging structure of the present invention includes a substrate, a sensor chip, a base, a first lead frame, a plurality of first via holes, a first patterned circuit layer, a second lead frame, a plurality of second via holes and The second patterned circuit layer. The substrate includes a component setting area and a plurality of electrode contacts. The electrode contacts are arranged on one side of the component setting area. The sensing chip is arranged in the component setting area and is electrically connected with the driving chip and the electrode contacts. The base is covered on the substrate with a bonding mask and includes a receiving groove, an extending slope and a plurality of electrodes. The extending slope is connected between the bottom surface of the accommodating groove and the joint surface. The electrodes are arranged on the joint surface and electrically connected with the electrode contacts respectively. The sensing chip is located in the corresponding area of the accommodating groove. The first lead frame is disposed on the base. The first via hole passes through the base and is electrically connected to the first lead frame. The first patterned circuit layer is disposed on the extending slope, the bottom surface of the accommodating groove and the joint surface to electrically connect the first via hole and the electrode. The second lead frame is disposed on the substrate. The second via hole penetrates the substrate and is electrically connected to the second lead frame. The second patterned circuit layer is disposed on the substrate and electrically connected to the second via hole and the electrode contact.

In an embodiment of the present invention, the above-mentioned base includes a stepped portion protruding from the bottom surface of the accommodating groove, the extending inclined surface extends from the top surface of the stepped portion to the bonding surface, and the first via hole penetrates the stepped portion for electrical connection. Sexually connect the first lead frame.

In an embodiment of the present invention, the above-mentioned base and substrate materials include selectively plateable dielectric materials, including non-conductive metal composites.

In one embodiment of the present invention, the above-mentioned selective plating dielectric material includes epoxy resin, polyester, acrylate, fluoropolymer, polyphenylene oxide, polyimide, phenolic resin, poly Sulfone, silica polymer, BT resin (Bismaleimide-Triazine modified epoxy resin), cyanate polyester, polyethylene, polycarbonate resin, acrylonitrile-butadiene-styrene copolymer, polyethylene terephthalate (PET), polybutylene terephthalate (PBT), liquid crystal polymer (liquid crystal polyester, LCP), polyamide (PA), nylon 6, polyoxymethylene copolymer (POM), polyphenylene sulfide (PPS) Or cyclic olefin copolymer (COC).

In one embodiment of the present invention, the metals in the above-mentioned non-conductive metal compound include zinc, copper, silver, gold, nickel, palladium, platinum, cobalt, rhodium, iridium, indium, iron, manganese, aluminum, chromium , tungsten, vanadium, tantalum, titanium or any combination thereof.

In an embodiment of the present invention, the above package structure further includes a driving chip disposed on the substrate, and the driving chip is electrically connected to the sensing chip and the electrode contacts.

In an embodiment of the present invention, the aforementioned sensor chip includes a microelectromechanical systems (MEMS) sensor chip, and the driver chip includes an application specific integrated circuit (ASIC).

In an embodiment of the present invention, the above-mentioned substrate further includes a plurality of electrode openings, the electrode contacts are respectively embedded in the electrode openings, and the upper surfaces of the electrode contacts are lower than the bonding surface of the substrate.

In an embodiment of the present invention, the above-mentioned electrodes protrude from the joint surface so as to fit into the electrode openings and contact the electrode contacts.

In an embodiment of the present invention, the above-mentioned second lead frame includes a plurality of external pads electrically connected to the sensor chip.

In an embodiment of the present invention, the above-mentioned first lead frame includes a plurality of external pads electrically connected to the sensor chip, and the back surface of the base relative to the bonding surface exposes the external pads.

In an embodiment of the present invention, the above-mentioned second lead frame covers the back surface of the substrate away from the base.

In an embodiment of the present invention, the above package structure further includes a through hole penetrating through the substrate and the second lead frame to expose part of the sensing chip.

In an embodiment of the present invention, the above-mentioned second lead frame further includes a stop ring surrounding the through hole and maintaining a distance from the outer peripheral edge of the through hole.

In an embodiment of the present invention, the above package structure further includes a substrate grounding/shielding layer and a base grounding/shielding layer, the substrate grounding/shielding layer covers the peripheral side of the substrate and is connected to the second lead frame, and the base grounding/shielding layer The layer covers the surrounding sides of the base and/or the inner surface of the accommodating groove, and is connected to the first lead frame.

In an embodiment of the present invention, the above-mentioned second lead frame further includes a plurality of stepped through holes penetrating to the second lead frame, and the substrate further includes a plurality of stepped protrusions to correspond to the corresponding stepped through holes Fitting, wherein each stepped through hole includes a top cover part and a connection part connecting the top cover part, and the minimum diameter of the top cover part is larger than the maximum diameter of the connection part.

In an embodiment of the present invention, the above-mentioned second lead frame includes a plurality of external pads electrically connected to the sensor chip.

In an embodiment of the present invention, the above-mentioned first lead frame is disposed on the back side relative to the bonding surface, and completely covers the back side of the first lead frame.

In an embodiment of the present invention, in the above-mentioned package structure, the first lead frame further includes a plurality of stepped through holes penetrating to the first lead frame, and the base further includes a plurality of stepped protrusions to correspond to the corresponding steps. The stepped through holes are embedded, wherein each stepped through hole includes a top cover part and a connection part connecting the top cover part, and the minimum diameter of the top cover part is larger than the maximum diameter of the connection part.

In an embodiment of the present invention, the above-mentioned package structure further includes an adhesive material, which may be non-conductive adhesive or conductive adhesive, and is disposed between the bonding surface and the substrate to bond the base and the substrate.

In an embodiment of the present invention, the bottom surface of the above-mentioned first patterned circuit layer is lower than the extending slope and the top surface of the base, and the bottom surface of the second patterned circuit layer is lower than the top surface of the substrate.

Based on the above, the packaging structure of the present invention utilizes the design of the stepped part to effectively connect the circuit to the joint surface of the base and the back surface of the opposite joint surface, thereby improving the design flexibility of the circuit, and the stepped part can be used to accommodate the driver chip of the package structure , improving the space utilization of the packaging structure. Moreover, the material of the base and/or substrate of the present invention includes a selective electroplating dielectric material, so as to directly form a patterned circuit layer by direct electroplating and electroplating on its surface by utilizing its selective electroplating characteristics. A conductive structure such as a via hole or a pad. Moreover, the patterned circuit layer formed according to this method can meet the standard of fine circuits, and also provides flexibility in the design of the connection circuit on the packaging structure. Moreover, the optional electroplating dielectric material can be shaped by molding, so it has greater design flexibility in its thickness and shape, and the thickness of the base/substrate can be easily controlled below 100 microns Therefore, the packaging structure of the present invention can not only improve its design flexibility, but also easily meet the standard of thin lines, and can effectively reduce the process steps and reduce the overall thickness of the packaging structure.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

Description of drawings

1A is a schematic cross-sectional view of a packaging structure according to an embodiment of the present invention;

1B is a schematic cross-sectional view of a packaging structure according to another embodiment of the present invention;

2 is a schematic top view of a base and a substrate according to an embodiment of the present invention;

3 is a schematic diagram of a base according to an embodiment of the present invention;

4 is a schematic cross-sectional view of a base according to an embodiment of the present invention;

5 is a schematic cross-sectional view of a substrate according to an embodiment of the present invention;

6 is a schematic diagram of a substrate according to an embodiment of the present invention;

7 is a schematic bottom perspective view of a packaging structure according to an embodiment of the present invention;

8 is a schematic cross-sectional view of a packaging structure according to an embodiment of the present invention;

FIG. 9 is a schematic top view of a lead frame according to an embodiment of the present invention;

Fig. 10 is a schematic cross-sectional view of the lead frame of Fig. 9;

Fig. 11 is another schematic cross-sectional view of the lead frame of Fig. 9;

12 is a schematic cross-sectional view of the combination of the lead frame and the substrate of FIG. 11;

FIG. 13 is a schematic top view of the combination of the lead frame and the substrate of FIG. 12 .

Explanation of reference signs:

100, 100a: package structure

110: Substrate

112: electrode contact

114: Electrode opening

120: sensor chip

130: Base

132: joint surface

134: accommodating groove

136: Ladder Department

138: Extend Bevel

139: electrode

140: first lead frame

144, 182: External pads

142, 184: stepped through holes

142a, 184a: top cover part

142b, 184b: connection part

150: first via hole

160: the first patterned circuit layer

170: Driver chip

180: second lead frame

186: stop ring

190: Substrate ground/shield

192: Base ground/shield

200: Motherboard

G1: Spacing

GL: adhesive glue

H1: through hole

detailed description

FIG. 1A is a schematic cross-sectional view of a package structure according to an embodiment of the present invention. FIG. 1B is a schematic cross-sectional view of a package structure according to another embodiment of the present invention. FIG. 2 is a schematic top view of a base and a substrate according to an embodiment of the invention. Please refer to FIG. 1A, FIG. 1B to FIG. 2 at the same time. In this embodiment, the packaging structure 100 includes a substrate 110, a sensor chip 120, a base 130, a first lead frame 140, a plurality of first via holes 150, a first A patterned circuit layer 160 , a second lead frame 180 , a plurality of second via holes 189 and a second patterned circuit layer 188 . The substrate 110 includes a device arrangement area and a plurality of electrode contacts 112 . The electrode contacts 112 are arranged on one side of the component installation area as shown in FIG. 2 . The sensing chip 120 is disposed in the device arrangement area and is electrically connected to the driving chip 170 and the electrode contacts 112 . The second via hole 189 penetrates the substrate 110 and is electrically connected to the second lead frame 180, and the second patterned circuit layer 188 is disposed on the substrate 110 as shown in FIG. Electrode contacts 112 . As shown in FIGS. 1A and 1B , the base 130 covers the substrate 110 with the bonding surface 132 , wherein the base 130 includes a receiving groove 134 , an extending slope 138 and a plurality of electrodes 139 . The extending slope 138 extends from the bottom surface of the receiving groove 134 to the joint surface 132 of the base 130 as shown in FIG. 1A . The first lead frame 140 is disposed on the base 130 . The first via hole 150 passes through the base and is electrically connected to the first lead frame 140 .

In this embodiment, the base 130 may further include a stepped portion 136 as shown in FIG. 1B , and the stepped portion 136 protrudes from the bottom surface of the receiving groove 134 . Moreover, the extending inclined surface 138 extends from the top surface of the stepped portion 136 to the joint surface 132 of the base 130 as shown in FIG. 1B . With such a configuration, the first via hole 150 can pass through the stepped portion 136 to be electrically connected to the first lead frame 140 . It should be noted that the stepped portion 136 of this embodiment can be optionally configured, and the present invention is not limited thereto.

In this embodiment, the electrodes 139 are disposed on the bonding surface 132 and electrically connected to the electrode contacts 112 of the substrate 110 respectively. In this embodiment, the substrate 110 may include a plurality of electrode openings 114 , the electrode contacts 112 are respectively embedded in the electrode openings 114 , and the upper surfaces of the electrode contacts 112 are lower than the bonding surface of the substrate 110 . Correspondingly, the electrodes 139 of the base 130 protrude from the joint surface 132 to fit into the electrode openings 114 and contact the electrode contacts 112 to form an electrical connection. In this embodiment, the sensor chip 120 may be disposed on the substrate 110 as shown in FIG. 1 and located in a corresponding area of the receiving groove 134 . The first lead frame 140 is disposed on the base 130 , and the first via hole 150 passes through the stepped portion 136 to be electrically connected to the first lead frame 140 . In this way, the first patterned circuit layer 160 is disposed on the extending slope 138 to electrically connect the first via hole 150 and the electrode 139 .

FIG. 3 is a schematic diagram of a base according to an embodiment of the invention. FIG. 4 is a schematic cross-sectional view of a base according to an embodiment of the invention. Please refer to FIG. 3 and FIG. 4 at the same time. In this embodiment, the material of the base 130 and/or the substrate 110 includes a selective plating dielectric material, which includes a non-conductive metal composite. In this way, the packaging structure 100 of this embodiment can utilize the selective plating characteristics of the selective plating dielectric material to directly form the first patterned circuit layer as shown in FIG. 1A , FIG. 1B and FIG. 2 on its surface. 160 , the first patterned circuit layer 160 is directly disposed on the extending inclined surface 138 of the base 130 , the bottom surface of the accommodating groove 134 and the bonding surface 132 , and is electrically connected to the corresponding electrode 139 and the first via hole 150 . In the present embodiment, the package structure 100 may further include an adhesive material GL, which may be non-conductive glue or conductive glue, disposed between the bonding surface 132 and the substrate 110 to bond the base 130 and the substrate 110 .

Specifically, the selective plating dielectric material may include epoxy resin, polyester, acrylate, fluoropolymer, polyphenylene oxide, polyimide, phenolic resin, polysulfone, silica polymer, BT resin (Bismaleimide-Triazinemodified epoxy resin), cyanate polyester, polyethylene, polycarbonate resin, acrylonitrile-butadiene-styrene copolymer, polyethylene terephthalate (PET), polyethylene terephthalate Butylenedicarboxylate (PBT), liquid crystal polymer (liquid crystalpolyester, LCP), polyamide (PA), nylon 6, polyoxymethylene copolymer (POM), polyphenylene sulfide (PPS) or cyclic olefin copolymer (COC )Wait. Metals in non-conductive metal complexes may include zinc, copper, silver, gold, nickel, palladium, platinum, cobalt, rhodium, iridium, indium, iron, manganese, aluminum, chromium, tungsten, vanadium, tantalum, titanium or any combination thereof.

In detail, the step of forming the first patterned circuit layer 160 by electroplating selectively on the extended inclined surface 138 of the base 130 may include: using laser on the extended inclined surface 138 of the base 130 to form the first patterned circuit layer. The path of the wiring layer 160 is carved out corresponding to the wiring groove of the first patterned wiring layer 160, so that the non-conductive metal compound on the wiring groove is destroyed and the heavy metal crystal nucleus having high activity for reduction metallization is released, and then, Selective plating is then performed on the selective plating dielectric material after laser, so as to form the first patterned circuit layer 160 directly on the circuit trench by chemical plating and electroplating. Therefore, the first patterned circuit layer 160 formed according to the above process is embedded in the extended slope 138 of the base 130 , and the extended slope 138 of the base 130 exposes the upper surface of the first patterned circuit layer 160 . Moreover, since this embodiment utilizes laser to directly engrave circuit grooves corresponding to the first patterned circuit layer 160 on the extended inclined surface 138 of the base 130, and then directly electroplating and electroplating on the circuit grooves to form the first The patterned wiring layer 160 , therefore, the upper surface of the first patterned wiring layer 160 may be lower than the extending inclined surface 138 of the base 130 , or be coplanar with the extending inclined surface 138 of the base 130 . In this embodiment, the bottom surface of the first patterned circuit layer 160 is lower than the extending slope 138 and the top surface of the base 130 . Similarly, the bottom surface of the second patterned circuit layer 188 is lower than the top surface of the substrate 110 . Moreover, the top surfaces of various patterned circuit layers formed directly on the surface of the base 130 in this way can be lower than the surface of the base 130 or be coplanar with the surface of the base 130 . Certainly, this embodiment is only used for illustration and is not limited thereto.

Moreover, in this embodiment, the base 130 and/or the substrate 110 in the package structure 100 can be molded by mold forming, so the thickness and shape of the base 130 and/or the substrate 110 can be freely adjusted according to product requirements. Therefore, the packaging structure 100 of this embodiment not only simplifies the manufacturing process, improves the flexibility of the design, but also effectively reduces the maximum thickness of the packaging structure 100 .

FIG. 5 is a schematic cross-sectional view of a substrate according to an embodiment of the invention. FIG. 6 is a schematic diagram of a substrate according to an embodiment of the invention. Please refer to FIG. 1A, FIG. 1B, FIG. 5 and FIG. 6 at the same time. In detail, the package structure 100 of this embodiment may also include a driver chip 170, which is disposed on the substrate 110 and corresponds to the stepped portion 136. The driver chip 170 may be, for example, It is electrically connected to the sensor chip 120 and the electrode contacts 112 through a plurality of wires. Specifically, in this embodiment, the package structure 100 can be a MEMS microphone package structure, so the sensor chip 120 can be a microelectromechanical system (microelectromechanicalsystems, MEMS) sensor chip, and the drive chip 170 can be used for An application specific integrated circuit (ASIC) that drives a MEMS sensor chip. The package structure 100 may further include a through hole H1 penetrating through the substrate 110 to expose part of the sensing chip 120 . In this embodiment, the through hole H1 may be a sound hole of the package structure of the MEMS microphone. Of course, this embodiment is only used for illustration, and the present invention does not limit the scope of application of the package structure 100 .

FIG. 7 is a schematic bottom perspective view of a packaging structure according to an embodiment of the present invention. Please refer to FIG. 1A, FIG. 1B and FIG. 7. In this embodiment, the first lead frame 140 may include a plurality of external pads 144 electrically connected to the sensor chip 120, and the back surface 133 of the base 130 is opposite to the bonding surface 132. External pads 144 are exposed. In this way, the package structure 100 shown in FIGS. 1A and 1B can be electrically connected to external electronic components, such as a motherboard, through the external pads 144 on the base 130 .

In this embodiment, the second lead frame 180 is disposed on the substrate 110 and the second lead frame 180 may be a metal layer to cover at least most of the back surface of the substrate 110 facing away from the base 130 . The aforementioned through hole H1 penetrates through the substrate 110 and the second lead frame 180 to expose part of the sensing chip 120 . In addition, in this embodiment, the package structure 100 may further include a substrate grounding/shielding layer 190 , which covers the peripheral side of the substrate 110 and connects to the second lead frame 180 as shown in FIGS. 1A and 1B . In this way, during the packaging and use of the sensing chip 120, when the static electricity accumulates to a certain extent and discharge occurs, since the driving chip 170 is electrically connected to the first via hole 150, the driving chip 170 is easily subjected to electrostatic discharge. Therefore, the above-mentioned second lead frame 180 and substrate grounding/shielding layer 190 can be used as a grounding layer or an electromagnetic shielding layer to reduce the influence of electrostatic discharge and electromagnetic interference. Moreover, the base 130 may further include a base grounding/shielding layer 192 covering the surrounding sides of the base 130 and/or the inner surface of the receiving groove 134 to achieve grounding and/or electromagnetic shielding effects.

Specifically, the grounding/shielding layer 190 of the substrate can be formed, for example, by molding the substrate 110 on the second lead frame 180 first, and using laser to metallize the non-conductive metal compound in the substrate 110 material. . The substrate 110 is then electroplated to form electrode contacts 112 and a substrate grounding/shielding layer 190 covering the surrounding sides of the substrate 110 . Base ground/shield layer 192 can also be formed using a method similar to that described above.

In addition, in order to prevent de-lamination between the substrate 110 and the second lead frame 180, the second lead frame 180 may further include a plurality of stepped through holes 184 as shown in FIG. 1A and FIG. In the second lead frame 180 , each stepped through hole 184 includes a top cover portion 184 a and a connecting portion 184 b connecting the top cover portion 184 a. The smallest diameter of the top cover portion 184a is larger than the largest diameter of the connection portion 184b. In this way, when the substrate 110 is formed on the second lead frame 180 by mold molding, the substrate 110 can be filled into the stepped through hole 184, that is to say, the substrate 110 will include a plurality of stepped protrusions corresponding to the corresponding The stepped through hole 184 fits. In this way, the package structure 100 can enhance the bonding force between the substrate 110 and the second lead frame 180 through the stepped through hole 184 to reduce the occurrence of delamination.

Likewise, the first lead frame 140 may further include a stepped through hole 142 whose structure is the same as that of the stepped through hole 184 . In this way, when the base 130 is formed on the first lead frame 140 by mold molding, the base 130 can be filled into the stepped through holes 142 to fit with the corresponding stepped through holes 142 . The package structure 100 can enhance the bonding force between the base 130 and the first lead frame 140 through the stepped through hole 142 to reduce delamination.

FIG. 8 is a schematic cross-sectional view of a packaging structure according to an embodiment of the present invention. It must be noted here that the packaging structure 100a of this embodiment is similar to the packaging structure 100 of FIG. 1A and FIG. or similar components, and descriptions of the same technical content are omitted. For the description of the omitted part, reference may be made to the foregoing embodiments, and this embodiment will not be repeated. Referring to FIG. 8 , the following will describe the differences between the package structure 100 a of this embodiment and the package structure 100 shown in FIGS. 1A and 1B .

In this embodiment, the packaging structure 100 a includes a second lead frame 180 disposed on the substrate 110 and including a plurality of external pads 182 electrically connected to the sensing chip 120 . In this way, the package structure 100 a can be electrically connected to an external electronic component, such as a motherboard 200 , through the external pad 182 on the substrate 110 as shown in FIG. 8 . Under such a structural configuration, the first lead frame 140 is disposed on the back side relative to the bonding surface 132 , and the first lead frame 140 may be a metal layer to cover at least most of the back side of the first lead frame 140 . In addition, the package structure 100 a may further include a base ground/shield layer 192 covering the peripheral side of the base 130 and/or the inner surface of the receiving groove 134 and connected to the first lead frame 140 . In this way, during the packaging and use of the sensing chip 120, when the static electricity accumulates to a certain extent and discharge occurs, since the driving chip 170 is electrically connected to the first via hole 150, the driving chip 170 is easily subjected to electrostatic discharge. Therefore, the above-mentioned first lead frame 140 and base ground/shield layer 192 can be used as a ground layer or an electromagnetic shielding layer to reduce the influence of electrostatic discharge and electromagnetic interference. Moreover, the substrate 110 may further include a substrate grounding/shielding layer 190 that completely covers the surrounding sides of the substrate 110 to achieve grounding and/or electromagnetic shielding effects.

Specifically, the grounding/shielding layer 192 of the base can be formed on the first lead frame 140 by molding the base 130 firstly, and the non-conductive metal compound in the material of the base 130 is treated with a laser. Metallize. Then, electroplating is performed on the base 130 to form the electrodes 139 , the first patterned circuit layer 160 and the base grounding/shielding layer 192 covering the surrounding sides of the base 130 and/or the inner surface of the receiving groove 134 . Substrate ground/shield layer 190 can also be formed using a method similar to that described above.

In addition, in order to prevent delamination between the base 130 and the layered first lead frame 140, the first lead frame 140 may further include a plurality of stepped through holes 142 as shown in FIG. 1A and FIG. The first lead frame 140 , wherein each stepped through hole 142 includes a top cover portion 142 a and a connection portion 142 b connecting the top cover portion 142 a. The smallest diameter of the top cover portion 142a is greater than the largest diameter of the connecting portion 142b. In this way, when the base 130 is formed on the first lead frame 140 by molding, the base 130 can be filled into the stepped through hole 142, that is to say, the base 130 will correspondingly include a plurality of stepped protrusions. To fit with the corresponding stepped through hole 142 . In this way, the package structure 100a can enhance the bonding force between the base 130 and the first lead frame 140 through the stepped through hole 142 to reduce the occurrence of delamination.

Likewise, the second lead frame 180 may further include a stepped through hole 184 whose structure is the same as that of the stepped through hole 142 . In this way, when the substrate 110 is formed on the second lead frame 180 by molding, the substrate 110 can be filled into the stepped through holes 184 to be fitted into the corresponding stepped through holes 184 . The package structure 100a can enhance the bonding force between the substrate 110 and the second lead frame 180 through the stepped through hole 184, thereby reducing the occurrence of delamination.

FIG. 9 is a schematic top view of a lead frame according to an embodiment of the present invention. FIG. 10 is a schematic cross-sectional view of the lead frame in FIG. 9 . FIG. 11 is another schematic cross-sectional view of the lead frame in FIG. 9 . Please refer to FIGS. 9 to 11 first. In detail, the second lead frame 180 of this embodiment may include a plurality of stepped through holes 184 and stop rings 186 as shown in FIG. 9 , which are shown in FIG. 9 Surrounding the through hole H1 as shown and maintaining a distance G1 from the outer periphery of the through hole H1, the setting of the stop ring 186 can prevent overflow when the glue is poured to form the substrate 110 on the second lead frame 180 through mold molding. Glue to make the colloid flow into the through hole H1.

FIG. 12 is a schematic cross-sectional view of the combination of the lead frame and the substrate of FIG. 11 . FIG. 13 is a schematic top view of the combination of the lead frame and the substrate of FIG. 12 . It should be noted that, in order to distinguish the lead frame and the substrate more clearly, the area of the lead frame in FIG. 12 and FIG. 13 is marked with oblique lines. Please refer to FIG. 12 and FIG. 13 at the same time. In this embodiment, the stepped through holes 184 can penetrate to the second lead frame 180, wherein each stepped through hole 184 includes a top cover portion 184a and a connection connecting the top cover portion 184a. Section 184b. The connection portion 184b may be located on a surface facing the base 130 , and the top cover portion 184a is located on a surface facing away from the base 130 , and the smallest diameter of the top cover portion 184a is greater than the largest diameter of the connecting portion 184b. In this way, when the substrate 110 is poured in the direction of the arrow shown in FIG. The stepped through-holes 184 of 180 fit the substrate 110 with each other, thereby enhancing the bonding force between the substrate 110 and the second lead frame 180 and reducing the occurrence of delamination. In summary, the packaging structure of the present invention utilizes the design of the stepped portion to effectively connect the circuit to the bonding surface of the base and the back surface of the opposite bonding surface, thereby improving the design flexibility of the circuit, and the stepped portion can be used to accommodate the package structure. Drive the chip and improve the space utilization of the packaging structure. In addition, the material of the base and/or the substrate of the present invention includes a selective electroplating dielectric material, so as to directly form a patterned circuit layer, conduction, etc. Conductive structures such as holes or pads. Moreover, the patterned circuit layer formed according to this method can meet the standard of fine circuits, and also provides flexibility in the design of the connection circuit on the packaging structure. Moreover, the optional electroplating dielectric material can be shaped by molding, so it has greater design flexibility in its thickness and shape, and can easily control the thickness of the base/substrate below 100 microns Therefore, the packaging structure of the present invention can not only improve its design flexibility, but also easily meet the standard of thin lines, and can effectively reduce the process steps and reduce the overall thickness of the packaging structure.

Although the present invention has been disclosed as above with the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention should be defined by the claims.

Claims (25)

1. A packaging structure, characterized in that, comprising: The substrate includes a component setting area and a plurality of electrode contacts, and the plurality of electrode contacts are set on one side of the component setting area; A sensor chip is arranged in the component setting area and is electrically connected to a plurality of the electrode contacts; The base is covered on the substrate with a bonding mask and includes an accommodating groove, an extending slope and a plurality of electrodes, the extending slope is connected between the bottom surface of the accommodating groove and the bonding surface, and the plurality of electrodes are arranged The sensor chip is located in the corresponding area of the accommodating groove on the bonding surface and is electrically connected to a plurality of the electrode contacts respectively; a first lead frame disposed on the base; and a plurality of first via holes passing through the base and electrically connected to the first lead frame; and a first patterned circuit layer, disposed on the extending slope to electrically connect a plurality of the first via holes and a plurality of the electrodes; a second lead frame disposed on the substrate; a plurality of second via holes penetrating through the substrate and electrically connected to the second lead frame; and The second patterned circuit layer is arranged on the substrate and electrically connected to the plurality of second via holes and the plurality of electrode contacts. 2. The packaging structure according to claim 1, wherein the base comprises a stepped portion protruding from the bottom surface of the accommodating groove, the extending inclined surface extends from the top surface of the stepped portion to the bonding surface, And a plurality of first via holes penetrate through the stepped portion to electrically connect the first lead frame. 3. The package structure according to claim 1, wherein the material of the base and the substrate comprises a selectively plateable dielectric material including a non-conductive metal compound. 4. The packaging structure according to claim 3, characterized in that, the selective plating dielectric material comprises epoxy resin, polyester, acrylate, fluoropolymer, polyphenylene oxide, polyimide Amine, phenolic resin, polysulfone, silica polymer, bismaleimide-triazine resin, cyanate polyester, polyethylene, polycarbonate resin, acrylonitrile-butadiene-styrene copolymer, polypara Ethylene phthalate, polybutylene terephthalate, liquid crystal polymer, polyamide, nylon 6, polyoxymethylene copolymer, polyphenylene sulfide or cyclic olefin copolymer. 5. The packaging structure according to claim 3, wherein the metal in the non-conductive metal compound comprises zinc, copper, silver, gold, nickel, palladium, platinum, cobalt, rhodium, iridium, indium, iron , manganese, aluminum, chromium, tungsten, vanadium, tantalum, titanium or any combination thereof. 6 . The package structure according to claim 1 , further comprising a driving chip disposed on the substrate, the driving chip being electrically connected to the sensor chip and the plurality of electrode contacts. 7 . The package structure according to claim 6 , wherein the sensor chip comprises a MEMS sensor chip, and the driving chip comprises an application specific integrated circuit. 8. The package structure according to claim 1, wherein the substrate further comprises a plurality of electrode openings, a plurality of the electrode contacts are respectively embedded in the plurality of electrode openings, and the plurality of electrode contacts The upper surface is lower than the bonding surface of the substrate. 9 . The package structure according to claim 8 , wherein a plurality of the electrodes protrude from the bonding surface to fit into the plurality of electrode openings and contact with the plurality of electrode contacts. 10. The package structure according to claim 1, wherein the first lead frame comprises a plurality of external pads electrically connected to the sensor chip, and the backside of the base relative to the bonding surface exposes a plurality of the bonding pads. described external pads. 11. The package structure according to claim 10, wherein the second lead frame covers the back surface of the substrate facing away from the base. 12. The package structure according to claim 11, further comprising a substrate ground/shield layer and a base ground/shield layer, the substrate ground/shield layer covers the peripheral side of the substrate and is connected to the second lead frame , the base grounding/shielding layer covers the surrounding sides of the base and/or the inner surface of the receiving groove, and is connected to the first lead frame. 13. The package structure according to claim 11, wherein the second lead frame further comprises a plurality of stepped through holes penetrating through the second lead frame, and the substrate further comprises a plurality of stepped protrusions to Fitting with the corresponding stepped through holes, wherein each of the stepped through holes includes a top cover part and a connection part connecting the top cover part, and the minimum diameter of the top cover part is larger than the maximum diameter of the connection part. 14. The package structure according to claim 10, wherein the first lead frame further comprises a plurality of stepped through holes, which penetrate to the first lead frame, and the base further comprises a plurality of stepped protrusions To fit with the corresponding stepped through holes, wherein each of the stepped through holes includes a top cover part and a connection part connecting the top cover part, and the minimum diameter of the top cover part is larger than the maximum diameter of the connection part. 15. The package structure according to claim 11, further comprising a through hole penetrating through the substrate and the second lead frame to expose part of the sensor chip. 16 . The package structure according to claim 15 , wherein the second lead frame further comprises a stop ring surrounding the through hole and maintaining a distance from the outer periphery of the through hole. 17. The package structure according to claim 1, wherein the second lead frame comprises a plurality of external pads electrically connected to the sensor chip. 18. The package structure according to claim 17, further comprising a through hole penetrating through the substrate and the second lead frame to expose part of the sensor chip. 19. The package structure according to claim 18, wherein the second lead frame further comprises a stop ring surrounding the through hole and maintaining a distance from the outer periphery of the through hole. 20 . The package structure according to claim 17 , wherein the first lead frame is disposed on the back side relative to the bonding surface and covers the back side of the first lead frame. 21 . 21. The package structure according to claim 20, further comprising a substrate ground/shield layer and a base ground/shield layer, the substrate ground/shield layer covers the peripheral side of the substrate and is connected to the second lead frame , the base grounding/shielding layer covers the surrounding sides of the base and/or the inner surface of the receiving groove, and is connected to the first lead frame. 22. The package structure according to claim 20, wherein the first lead frame further comprises a plurality of stepped through holes penetrating to the first lead frame, and the base further comprises a plurality of stepped protrusions To fit with the corresponding stepped through holes, wherein each of the stepped through holes includes a top cover part and a connection part connecting the top cover part, and the minimum diameter of the top cover part is larger than the maximum diameter of the connection part. 23. The package structure according to claim 17, wherein the second lead frame further comprises a plurality of stepped through holes penetrating to the second lead frame, and the substrate further comprises a plurality of stepped protrusions to Fitting with the corresponding stepped through holes, wherein each of the stepped through holes includes a top cover part and a connection part connecting the top cover part, and the minimum diameter of the top cover part is larger than the maximum diameter of the connection part. 24. The packaging structure according to claim 1, further comprising an adhesive material, the adhesive material is a non-conductive adhesive or a conductive adhesive, and is disposed between the bonding surface and the substrate to adhere to the substrate. seat with the substrate. 25. The package structure according to claim 1, wherein the bottom surface of the first patterned circuit layer is lower than the extending slope and the top surface of the base, and the bottom surface of the second patterned circuit layer is lower than the top surface of the substrate.