CN107303707A - Resin molding apparatus, resin molding method, the manufacture method of the manufacture method of synthetic resin and product - Google Patents

Abstract

An object of the present invention is to provide a resin molding apparatus for a fluid resin capable of reducing variations in resin thickness of molded products. In order to achieve the above object, the resin molding device of the present invention is characterized in that it includes: a coating mechanism (520) for coating a fluid resin for resin molding in a coating area on the coating object (11), and using A compression molding mechanism (530) that compresses and molds the object to be coated (11) with a fluid resin by the coating mechanism (520); the coating mechanism (520) includes: at least a part in the coating area a resin discharge mechanism that discharges the fluid resin upward, and a resin expansion mechanism that applies force to the fluid resin discharged by the resin discharge mechanism to expand the fluid resin.

Description

Resin molding apparatus, resin molding method, manufacturing method of resin molded product, and product manufacturing method

technical field

The present invention relates to a resin molding device, a resin molding method, a method for manufacturing a resin molded product, and a method for manufacturing a product.

Background technique

Electronic components such as integrated circuits (ICs) and semiconductor electronic components are often molded into resin-sealed resin-sealed electronic components (resin molded products) and used.

In order to reduce the variation in the thickness of the resin for resin encapsulation, for example, Patent Document 1 describes that the resin drop point is relatively moved with respect to the release film to distribute the resin. In addition, Patent Document 2 describes that a liquid resin is discharged while scanning a workpiece in the X-Y-Z direction.

Prior art literature:

patent documents

Patent Document 1: Japanese Patent Laid-Open No. 2015-122446

Patent Document 2: Japanese Patent Laid-Open No. 2003-165133

Contents of the invention

The problem to be solved by the invention

In recent years, wafer-level molding represented by Fan-Out Wafer Level Package (FO-WLP) is performed by compression molding. In this case, it is preferable to use a high-viscosity liquid resin (fluid resin) for reasons such as that the resin is not easily spilled.

However, in the case of high-viscosity fluid resin, the thickness tends to vary. If compression molding is performed with variations in the thickness of the resin, for example, due to heating during compression molding, a portion of the resin with a small thickness becomes relatively easy to flow and a portion of the resin with a large thickness becomes relatively difficult to flow. In this case, the resin thickness of the molded product may vary.

As described above, both Patent Documents 1 and 2 describe methods for distributing or discharging resin in order to reduce thickness variation of liquid resin (fluid resin). However, in order to reduce the variation in resin thickness of molded products in response to large-sized wafers, etc., a technology that is more suitable for fluid resins is required. In addition, although Patent Document 2 describes that liquid resin is discharged while vibrating the workpiece, as described in paragraph [0029], it is only possible to fill the liquid resin between the leads.

Therefore, an object of the present invention is to provide a resin molding device for a fluid resin, a resin molding method, a method for manufacturing a resin molded article, and a method for manufacturing a product that can reduce variation in resin thickness of a molded product.

Solution to the problem

In order to achieve the above object, the resin encapsulating device of the present invention is characterized by comprising: a coating mechanism for coating a fluid resin for resin molding in a coating area on an object to be coated; and a compression molding mechanism for using the The coating means compresses and molds the object to be coated with the fluid resin, and the coating means includes: a resin discharge mechanism configured to discharge the fluid resin to at least a part of the coating area; and a resin expanding mechanism that applies force to the fluid resin discharged by the resin discharging mechanism to expand the fluid resin.

The resin molding method of the present invention is characterized by comprising: a coating step of applying a fluid resin for resin molding to a coating area on the coating object; and a compression molding step of coating the coating object with a performing compression molding on the fluid resin, and the coating process includes: a resin discharge process of discharging the fluid resin for resin encapsulation to at least a part of the coating area; and a resin expansion process of applying force to the The discharged fluid resin expands the fluid resin.

The method of manufacturing a resin molded article of the present invention is characterized in that resin molding is performed according to the resin molding method of the present invention.

The method for producing a product of the present invention is characterized in that a product is produced using the resin molded product produced by the method for producing a resin molded product of the present invention.

The effect of the invention

According to the present invention, variations in resin thickness of molded articles can be reduced.

Description of drawings

FIG. 1 is a side view schematically showing an example of a coating mechanism of a resin molding apparatus according to the present invention.

Fig. 2 is a side view schematically showing an example of a compression molding mechanism of the resin molding apparatus of the present invention.

Fig. 3 is a plan view schematically showing an example of the resin molding apparatus of the present invention.

Fig. 4 is a plan view schematically showing another example of the resin molding apparatus of the present invention.

Fig. 5 is a side view schematically showing an example when a release film (coating object) is moved in a resin spreading step.

FIG. 6 is a side view schematically showing an example of injecting gas to a fluid resin in a resin spreading step.

7 is a side view schematically showing an example of a fluid resin discharge pattern in the resin discharge step of the resin molding method of the present invention.

8 is a plan view schematically showing another example of a fluid resin discharge pattern in the resin discharge step.

9 is a plan view schematically showing yet another example of a fluid resin discharge pattern in the resin discharge step.

10 is a plan view schematically showing yet another example of a fluid resin discharge pattern in the resin discharge step.

11 is a plan view schematically showing yet another example of a fluid resin discharge pattern in the resin discharge step.

12 is a plan view schematically showing still another example of a fluid resin discharge pattern in the resin discharge step.

13 is a plan view schematically showing yet another example of a fluid resin discharge pattern in the resin discharge step.

14 is a plan view schematically showing yet another example of a fluid resin discharge pattern in the resin discharge step.

15 is a plan view schematically showing yet another example of a fluid resin discharge pattern in the resin discharge step.

16 is a plan view schematically showing yet another example of a fluid resin discharge pattern in the resin discharge step.

17 is a plan view schematically showing yet another example of a fluid resin discharge pattern in the resin discharge step.

18 is a plan view schematically showing yet another example of a fluid resin discharge pattern in the resin discharge step.

FIG. 19 is a plan view schematically showing an example of a spreading pattern when the fluid resin is spread by injecting gas to the fluid resin in the resin spreading step.

FIG. 20 is a plan view schematically showing another example of the spreading pattern when the fluid resin is spread by injecting gas to the fluid resin in the resin spreading step.

FIG. 21 is a plan view schematically showing still another example of the spreading pattern when the fluid resin is spread by injecting gas to the fluid resin in the resin spreading step.

FIG. 22 is a plan view schematically showing an example of a step of injecting gas to the fluid resin to expand the fluid resin in the resin spreading step.

Fig. 23 is a plan view schematically showing another step of the same resin spreading step as in Fig. 22 .

FIG. 24 is a plan view schematically showing yet another step of the same resin spreading step as in FIG. 22 .

FIG. 25 is a plan view schematically showing yet another step of the same resin spreading step as in FIG. 22 .

Fig. 26 is a cross-sectional view schematically showing an example of the steps of the compression molding step of the resin molding method of the present invention.

Fig. 27 is a cross-sectional view schematically showing another step of the same compression molding step as in Fig. 26 .

Fig. 28 is a cross-sectional view schematically showing yet another step of the same compression molding step as in Fig. 26 .

Fig. 29 is a cross-sectional view schematically showing yet another step of the same compression molding step as in Fig. 26 .

detailed description

Next, the present invention will be described in more detail with an example. However, the present invention is not limited by the following description.

In the present invention, the "fluid resin" is not particularly limited as long as it is a fluid resin, and examples thereof include liquid resin, molten resin, and the like. In addition, in the present invention, "liquid" means to have fluidity at normal temperature (room temperature), and to flow due to the action of force, and does not involve the level of fluidity, in other words, does not involve the degree of viscosity. That is, in the present invention, "liquid resin" means a resin that has fluidity at normal temperature (room temperature) and flows due to force. In addition, in the present invention, "molten resin" means, for example, a resin that is in a liquid or fluid state by melting. The form of the molten resin is not particularly limited, but is, for example, a form that can be supplied to cavities, grooves, and the like of a molding die.

In the present invention, "compression molding" refers to supplying resin to a cavity of a molding die, and molding by applying force to the resin in the cavity in a state where the molding die is closed.

In the resin molding apparatus of the present invention, for example, the coating mechanism may further include a movement mechanism for relatively moving the discharge position of the fluid resin with respect to the object to be coated. The moving mechanism may be, for example, a coating object moving mechanism that moves the object to be coated to relatively move the discharge position of the fluid resin with respect to the object to be coated. The coating target object moving mechanism can move the coating target object in a substantially horizontal direction, for example.

The resin molding apparatus of the present invention may include, for example, a moving mechanism control mechanism that controls movement of the moving mechanism by a computer program.

In the resin molding apparatus of the present invention, for example, the resin spreading mechanism can continuously spread from the landing position toward the peripheral portion of the coating area for at least a part of the fluid resin discharged by the resin discharging mechanism. The fluidity resin.

In the resin molding device of the present invention, for example, the resin spreading mechanism can rotate the object to be coated and apply centrifugal force to the fluid resin to spread the fluid resin.

The resin molding apparatus of the present invention may further include, for example, a resin spreading mechanism control mechanism that controls the operation of the resin spreading mechanism through a computer program.

In the resin molding device of the present invention, for example, the resin expanding mechanism may inject gas to the fluid resin, and the gas may act on the fluid resin to expand the fluid resin. In addition, the shape of the gas discharge port of the resin expanding mechanism may be, for example, a shape in which the minor axis and the major axis are substantially equal, or a slit shape.

In the resin molding apparatus of the present invention, for example, the resin expanding mechanism may inject heated gas as the gas.

The resin molding apparatus of the present invention may include, for example, a gas injection control mechanism that controls the injection of the gas by a computer program.

In the resin molding apparatus of the present invention, for example, the coating means may further include a resin heating means for heating the fluid resin discharged to the coating area.

The resin molding device of the present invention may further include, for example, a fluid resin metering mechanism for metering the fluid resin.

In the resin molding apparatus of the present invention, for example, the coating mechanism may further include a sensor for detecting the fluid resin in the coating area in order to control the resin spreading mechanism.

The resin molding apparatus of the present invention may further include, for example, a conveyance mechanism for conveying the object to be coated to the compression molding mechanism.

In the resin molding device of the present invention, for example, the object to be coated may be a release film, and may further include a cutting mechanism for cutting the release film, and the resin discharge mechanism may be cut by the cutting mechanism. The fluid resin is discharged on the release film.

In the resin molding apparatus of the present invention, for example, the coating mechanism may further include the film fixing table for fixing the release film.

In the resin molding device of the present invention, for example, a plurality of the compression molding mechanisms are divided into individual modules and arranged, and at least one of the resin discharge mechanism and the resin expansion mechanism is arranged in conjunction with the compression molding As for the modules with different mechanisms, at least one of the modules can be mounted and detached from each other relative to at least one of the other modules.

In the resin molding device of the present invention, for example, at least one of the resin discharge mechanism, the resin expansion mechanism, and the compression molding mechanism is divided into different modules from the other at least one, and at least one of the modules One is mutually attachable and detachable relative to the other at least one said module.

In the resin molding apparatus of the present invention, for example, the coating mechanism may further include a moving mechanism that relatively moves the discharge position of the fluid resin with respect to the object to be coated, and the moving mechanism, the At least one of the resin discharge mechanism, the resin expansion mechanism, and the compression molding mechanism is divided into different modules from the other at least one. At least one of the modules is mutually attachable and detachable relative to the other at least one of the modules. The moving mechanism may be, for example, a coating target moving mechanism that moves the coating target to relatively move the discharge position of the fluid resin with respect to the coating target as described above.

The resin molding apparatus of the present invention may further include, for example, a movement mechanism control mechanism that controls movement of the movement mechanism by a computer program, the movement mechanism control mechanism, the movement mechanism, the resin discharge mechanism, the At least one of the resin expansion mechanism and the compression molding mechanism is divided into different modules relative to the other at least one, and at least one of the modules is mutually attachable and detachable relative to the other at least one of the modules.

In the resin molding device of the present invention, for example, the resin expanding mechanism injects gas to the fluid resin, and the gas acts on the fluid resin to expand the fluid resin. A computer program controls a gas injection control mechanism for the gas injection, at least one of the gas injection control mechanism, the resin discharge mechanism, the resin expansion mechanism, and the compression molding mechanism is classified differently from the other at least one modules, at least one of which is attachable and detachable relative to at least one of the other modules.

In the resin molding device of the present invention, for example, the coating mechanism further includes a resin heating mechanism that heats the fluid resin discharged to the coating area, the resin heating mechanism, the resin discharge mechanism, the At least one of the resin expansion mechanism and the compression molding mechanism is configured relative to the other at least one module that is divided into different modules, and at least one of the modules is mutually attachable and detachable relative to the other at least one module.

The resin molding device of the present invention may further include, for example, a fluid resin metering mechanism for metering the fluid resin, at least one of the fluid resin metering mechanism, the resin discharge mechanism, the resin expansion mechanism, and the compression molding mechanism. One is divided into different modules relative to the other at least one, and at least one of the modules is mutually attachable and detachable relative to the other at least one of the modules.

The resin molding apparatus of the present invention may further include, for example, a transfer mechanism for transferring the object to be coated to the compression molding mechanism, the transfer mechanism, the resin discharge mechanism, the resin expansion mechanism, and the compression molding mechanism At least one of the modules is divided into different modules relative to the other at least one module, and at least one of the modules is mutually attachable and detachable relative to the other at least one of the modules.

In the resin molding device of the present invention, for example, the object to be coated may be a release film, and may further include a cutting mechanism for cutting the release film, the cutting mechanism, the resin discharge mechanism, the At least one of the resin expansion mechanism and the compression molding mechanism is divided into different modules relative to the other at least one, and at least one of the modules is mutually attachable and detachable relative to the other at least one of the modules.

In the resin molding method of the present invention, for example, the discharge position of the fluid resin in the resin discharge step can be relatively moved with respect to the object to be coated. In this case, for example, the object to be coated may be moved to relatively move the discharge position of the fluid resin with respect to the object to be coated.

In the resin molding method of the present invention, for example, in the resin spreading step, the spreading of the resin can be controlled by a computer program.

In the resin molding method of the present invention, for example, in the resin spreading step, there may be a portion where the fluid resin continuously spreads from the landing position of the fluid resin toward the peripheral portion of the application region. In a manner, the expansion of the fluidity resin is carried out.

In the resin molding method of the present invention, for example, in the resin spreading step, the object to be coated is rotated, and centrifugal force acts on the fluid resin to spread the fluid resin.

In the resin molding method of the present invention, for example, in the resin spreading step, gas may be injected onto the fluid resin, and the fluid resin may be expanded by applying a force to the fluid resin by the gas. . For example, heated gas may be injected as the gas. In addition, the injection of the gas can be controlled, for example, by a computer program. In addition, for example, in the resin spreading step, it may be controlled so that the distance between the gas discharge port and the surface of the fluid resin is constant. In addition, the said gas is not specifically limited, For example, air is preferable from viewpoints, such as cost and convenience.

In the resin molding method of the present invention and the resin molding apparatus of the present invention, for example, the application area may be approximately circular, or approximately rectangular or approximately square.

In the resin molding method of the present invention, for example, in the resin discharging step, at least a part of the fluid resin discharged in the resin discharging step may be moved from the landing position toward the periphery of the application region. part continuously expands the fluid resin.

In the resin molding method of the present invention, for example, in the resin discharging step, the fluid resin may be discharged to the center portion and the peripheral portion of the application region, respectively.

In the resin molding method of the present invention, for example, in the resin discharge step, by dropping the fluid resin on the application area, the discharge position of the fluid resin can be aligned with the position of the fluid resin. The fluid resin is discharged by moving in a direction substantially in the same direction as the outer peripheral direction of the coating area.

In the resin molding method of the present invention, for example, in the resin discharging step, the fluid resin may be discharged while moving the discharge position of the fluid resin in a spiral shape.

In the resin molding method of the present invention, for example, in the resin discharge step, a plurality of dummy areas on the application area may be divided, and the fluid resin may be discharged in each dummy area. A virtual area is an area surrounded by the outer circumference, center, and radius of the coating area, and in terms of the discharge of the fluid resin in the virtual area, within the virtual area, from the center of the coating area The discharge position of the fluid resin is snaked toward the peripheral portion or from the peripheral portion of the coating area toward the central portion.

In the resin molding method of the present invention, for example, in the resin discharge step, the discharge position of the fluid resin may be moved in a direction substantially in line with the outer peripheral direction of the application region, from the The central portion of the coating area moves toward the peripheral portion or moves from the peripheral portion of the coating area toward the central portion.

In the resin molding method of the present invention, for example, in the resin discharging step, the moving speed of the discharge position of the fluid resin can be kept substantially constant.

In the resin molding method of the present invention, for example, in the resin discharge step, the angular velocity of movement of the discharge position of the fluid resin may be set so that it becomes slower from the center of the application region toward the peripheral edge. .

In the resin molding method of the present invention, for example, in the resin discharging step, movement of the discharge position of the fluid resin can be controlled by a computer program.

In the resin molding method of the present invention, for example, in the resin discharge step, the discharge position of the fluid resin may be relatively moved with respect to the object to be coated. For example, the object to be coated may be moved to move the discharge position of the fluid resin relative to the object to be coated. For example, the object to be coated may be moved substantially horizontally. In addition, the movement of the discharge position of the fluid resin can be controlled, for example, by a computer program.

The resin molding method of the present invention may further include, for example, a resin heating step of heating the fluid resin discharged to the coating region. The resin heating step can be performed, for example, by spraying the heated gas.

The resin molding method of the present invention may further include, for example, a resin metering step of metering the fluid resin.

In the resin molding method of the present invention, for example, the object to be coated may be a release film. Moreover, the said coating process can be performed in the state which fixed the said release film to the film fixing table.

In the resin molding method of the present invention, for example, a frame may be placed on the object to be coated, and the resin may be discharged inside the frame as the coating area.

In the resin molding method of the present invention, for example, the shape of the fluid resin may be liquid or paste. In addition, for example, the fluid resin may be a liquid resin having fluidity at normal temperature.

The resin molding method of the present invention may, for example, perform the coating step and the compression molding step at different places, and may further include transferring the coating target object to the compression molding step before the compression molding step. The handling process of the place. In addition, the conveying step may be performed, for example, while expanding the fluid resin, that is, it may be performed simultaneously with the resin expansion process, or may be performed in a state where the fluid resin has been expanded, that is, in the resin Carried out after the expansion process.

The first method of manufacturing an electronic component of the present invention is the method of manufacturing a resin molded product of the present invention, wherein the resin molded product is an electronic component, and in the compression molding step, the chip is resin-encapsulated by compression molding. And the electronic parts are manufactured.

The second method of manufacturing an electronic component of the present invention is a method of manufacturing an electronic component as a finished product, characterized by including an intermediate product manufactured by using the electronic component as an intermediate product by the first method of manufacturing an electronic component of the present invention. A manufacturing process and a finished product manufacturing process of manufacturing other electronic components as the finished product from the intermediate product. In addition, the second method of manufacturing an electronic component of the present invention is to use, as an intermediate product, manufactured by the first method of manufacturing an electronic component of the present invention (one embodiment of the method of manufacturing a resin molded product of the present invention) The said electronic component (resin molded product) of a product, and a method of manufacturing another product (other electronic component as a finished product). Therefore, the manufacturing method of the 2nd electronic component of this invention can be one embodiment of the manufacturing method of the product of this invention mentioned above.

As described above, the second method of manufacturing an electronic component of the present invention is a method of manufacturing an electronic component as the finished product, and is characterized by comprising using the electronic component as a An intermediate product manufacturing process of intermediate product manufacturing and a finished product manufacturing process of manufacturing other electronic components as finished products from the intermediate product. In the second method of manufacturing an electronic component of the present invention, for example, the intermediate product may include the chip, the object to be coated, and an encapsulating resin encapsulating the chip, and in the finished product manufacturing process, The object to be coated is removed from the chip and the encapsulating resin. In addition, for example, in the finished product manufacturing process, after removing the object to be coated from the chip and the encapsulating resin, a wiring member may be connected to the chip.

In addition, in general, "electronic parts" refer to the case of chips before resin encapsulation and the state of resin encapsulating chips, but in the present invention, unless otherwise specified, only "electronic parts" refer to An electronic part in which the chip has been resin-packaged (an electronic part as a finished product). In the present invention, "chip" refers to a chip in a state where at least part of it is not encapsulated by resin, and includes a chip before resin encapsulation, a chip partially encapsulated by resin, and at least one of a plurality of chips that is not encapsulated by resin. Chip in exposed state. Specifically, the "chip" of the present invention includes, for example, chips such as integrated circuits (ICs), semiconductor chips, and semiconductor elements for power control. In the present invention, a chip in a state in which at least a part is exposed without being resin-encapsulated is referred to as a "chip" for convenience in order to distinguish it from resin-encapsulated electronic components. However, the "chip" in the present invention is not particularly limited as long as at least a part thereof is exposed without being encapsulated with a resin, and may not be in the form of a chip.

Next, specific embodiments of the present invention will be described based on the drawings. For convenience of description, each drawing is schematically described by appropriately omitting, exaggerating, and the like.

Example 1

In this embodiment, examples of the resin molding apparatus, resin molding method (manufacturing method of resin molded product) and product manufacturing method of the present invention will be described.

1. Resin molding device

First, an example of the resin molding apparatus of the present invention will be described.

(1) Coating mechanism

FIG. 1 is a side view schematically showing an example of the coating mechanism of the resin molding apparatus of the present invention. As shown in the figure, this coating mechanism has a table (fixed table) 12 and a dispenser 14 . The release film 11 is mounted and fixed on the upper surface of the table (fixed table) 12 . The release film 11 may be a resin film, for example. The release film 11 corresponds to a "coating object" on which a fluid resin for resin encapsulation is coated on the coating area on the upper surface. The mold release film 11 prevents the cured resin (encapsulation resin) in which the fluid resin is cured after resin encapsulation molding from adhering to the molding die, and facilitates the removal of the resin molded product. The table 12 can move or rotate, for example, in the biaxial direction of X-Y (approximately horizontal direction), and can also move in the triaxial direction of X-Y-Z (that is, any direction including at least one component of the horizontal direction and the vertical direction). The mold release film 11 can be sucked and fixed on the upper surface of the table 12 by, for example, suction holes (not shown) on the upper surface of the table 12 by a suction mechanism (not shown, such as a decompression pump, etc.). The dispenser 14 is a mechanism for discharging fluid resin onto the release film 11, and corresponds to a "resin discharge mechanism". A nozzle 15 is attached to the dispenser 14 , and the fluid resin can be discharged onto the release film 11 from the discharge port at the front end of the nozzle 15 . The distributor 14 is movable in the X-Y biaxial direction (approximately horizontal direction) together with the nozzle 15, whereby the discharge position of the fluid resin can be moved. In addition, it is also possible to move the discharge position of the fluid resin by moving the table 12 in the X-Y biaxial direction (approximately horizontal direction), or instead of moving the discharge position of the fluid resin described above, The discharge position of the fluid resin is moved by moving the table 12 in the X-Y biaxial direction (approximately horizontal direction). In addition, the coating mechanism in FIG. 1 further includes a resin spreading mechanism that acts a force on the fluid resin discharged onto the release film 11 to expand the fluid resin. As will be described later, the resin spreading mechanism may be a mechanism that applies force to the fluid resin to spread it by moving the table 12 together with the release film 11 (coating object), or may be a A mechanism for injecting gas onto the fluid resin, and applying force to the fluid resin by the gas to expand the fluid resin. In addition, when a force is applied to the fluid resin by the movement of the table 12 to expand the fluid resin, the table 12 functions as a part of the resin expanding mechanism.

(2) Compression molding mechanism

Fig. 2 is a cross-sectional view schematically showing an example of the compression molding mechanism of the resin molding apparatus of the present invention. As shown in the figure, the compression molding mechanism has a molding die 531 and a mold clamping mechanism 115 . The molding die 531 is composed of an upper die 101 and a lower die 102 . The upper end of the upper die 101 is fixed to the fixed platen 111 and hangs down from the lower surface of the fixed platen 111 . The lower die 102 is placed on a movable platen 112 . The movable platen 112 can be raised and lowered in the vertical direction as will be described later.

As shown in the figure, the lower mold 102 has a lower mold base member 103 , a lower mold cavity side member 104 , an elastic member 105 and a lower mold cavity bottom surface member 106 . The lower mold base member 103 is placed on the upper surface of the movable platen 112 . The bottom surface part 106 of the lower mold cavity is installed on the upper surface of the lower mold base part 103 to form the bottom surface of the lower mold cavity 532 . The lower cavity side member 104 is a frame-shaped member disposed so as to surround the lower cavity bottom member 106 , and is attached to the upper surface of the lower base member 103 through the elastic member 105 to form a side surface of the lower cavity 532 . The lower mold 102 forms a lower mold cavity 532 by the lower mold cavity bottom surface member 106 and the lower mold cavity side member 104 . In addition, lower mold 102 is provided with, for example, a heating mechanism (not shown) for heating lower mold 102 . By heating the lower mold 102 with the heating mechanism, for example, the resin in the lower mold cavity 532 is heated and cured.

The mold clamping mechanism 115 is a mechanism for clamping and opening the molding mold, and has a driving source 116 and a transmission member 117 for transmitting the driving force of the driving source 116 as shown in the figure. Also, the lower surface (lower end) of the movable platen 112 is connected to the driving source 116 through the transmission member 117 . In addition, the driving source 116 is provided on the base 113 . The movable platen 112 is moved up and down by the driving source 116, and the lower mold 102 provided thereon can be moved up and down. That is, the mold clamping mechanism 115 can perform mold clamping of the forming mold by driving the movable platen 112 upward, and can perform mold opening of the forming mold by driving the movable platen 112 downward. The driving source 116 is not particularly limited, and for example, a conduction motor such as a servo motor can be used. The transmission member 117 is also not particularly limited, and may be formed using a ball screw, for example. In addition, for example, a hydraulic cylinder can be used as the driving source 116 and a rod can be used as the transmission member 117 to constitute the mold clamping mechanism 115 . Furthermore, the mold clamping mechanism 115 can be configured using a toggle mechanism.

Further, tie rods (column members) 114 as holding members are disposed on the four corners of the base 113, the movable platen 112, and the fixed platen 111, respectively. Specifically, the upper ends of the four tie rods 114 are fixed on the four corners of the fixed platen 111 , and the lower ends are fixed on the four corners of the base 113 . In addition, holes are opened at four corners of the movable platen 112 , and holding members 114 penetrate through each of them. Also, the movable platen 112 can move up and down along the tie rod 114 . In addition, as the tie bar (holding member) 114, for example, a wall member such as a hold frame (registered trademark) may be used instead of the tie bar (column member). The wall member may be provided, for example, between the surfaces of the movable platen 112 and the fixed platen 111 facing each other.

In addition, in FIG. 2, although the structure which used the mold clamping mechanism 115 to raise and lower the lower cavity bottom surface member 106 was shown, this invention is not limited to this. For example, in addition to the mold clamping mechanism 115, another driving mechanism for raising and lowering the lower cavity bottom surface member 106 may be provided, and in this configuration, the elastic member 105 may not be used.

(3) The overall structure of the resin molding device

Next, a plan view of FIG. 3 schematically shows an example of the structure of the resin molding apparatus of the present invention. The resin molding apparatus in this figure is an apparatus for manufacturing electronic components (resin molded products). As shown in the figure, in this apparatus, a release film cutting module (release film cutting mechanism) 510, a coating mechanism (coating module) 520, a compression molding mechanism ( compression molding module) 530 , a transport mechanism (transportation module) 540 and a control unit 550 . Although the modules are separated from each other, they can be attached and detached from adjacent modules. The coating module 520 includes a coating mechanism for coating a fluid resin for resin molding on a coating area on a release film (coating object), as will be described later. In addition, the coating module 520 includes a resin discharge mechanism (resin discharge module) that discharges fluid resin and a resin expansion mechanism (resin expansion module) that expands fluid resin, as will be described later.

The release film cutting module (release film cutting mechanism) 510 can cut and separate a circular release film from a long release film. As shown in the figure, the release film cutting module 510 includes a film fixing stand mounting mechanism 511 , a rolled release film 512 , and a film clamp 513 . The table 12 (not shown in FIG. 3 ) in FIG. 1 is placed on the upper surface of the film fixing table mounting mechanism 511 . The table 12 is a fixing table for fixing the film 11 as described above, and may be referred to as a "film fixing table". As shown in the figure, the front end of the release film 11 can be pulled out from the roll-shaped release film 512 to cover the upper surface of the table 12 placed on the film fixing table mounting mechanism 511, and fixed on the table 12. The above release film. The film clamp 513 can fix the front end of the release film pulled out from the roll release film 512 on the opposite side of the roll release film 512 viewed from the position of the film fixing table mounting mechanism 511, and at the same time, can hold the front end of the roll release film 512 The release film is pulled out from the roll-shaped release film 512 . On the film fixing stand mounting mechanism 511, the release film can be cut with a cutter (not shown) to form a circular release film 11 . Furthermore, the release film cutting module 510 includes a waste disposal mechanism (not shown) for processing the release film (scrap) remaining after cutting and separating the circular release film 11 .

The coating module 520 includes a coating mechanism, a resin loader (resin transport mechanism) 521 , and a post-processing mechanism 522 . As described in FIG. 1 , the coating mechanism includes a release film 11 , a table (fixed table) 12 , and a dispenser 14 (resin discharge mechanism) to which a nozzle 15 is attached. In addition, since FIG. 3 is a plan view (top view), the table 12 is hidden by the release film 11 and cannot be seen, so it is not shown. In addition, in FIG. 3 , the coating device further includes a film fixing table moving mechanism 523 . The table 12 and the release film 11 are placed on the film fixing table moving mechanism 523 . By moving or rotating the film fixing table moving mechanism 523 in the horizontal direction, the table 12 placed thereon including the release film 11 can be moved or rotated. In this figure, the film fixing table moving mechanism 523 is the same as the above-mentioned film fixing table mounting mechanism 511 , and can move between the release film cutting module 510 and the coating module 520 . In addition, the film fixing stage moving mechanism 523 moves or rotates the stage 12 including the release film 11 to apply force to and expand the fluid resin. Therefore, the film fixing table moving mechanism 523 corresponds to the "resin spreading mechanism" of the resin molding apparatus in FIG. 3 . In addition, as the resin expanding mechanism that applies force to expand the fluid resin, an air blowing nozzle (not shown in FIG. 3 ) and the like may be included as will be described later. Furthermore, the coating module 520 may include a camera (sensor), a heater, and the like as described later. In addition, the resin loader 521 and the post-processing mechanism 522 are integrally formed. Using the resin loader 521, it is possible to supply the fluid resin 21 (not shown in FIG. 3 ) on the release film 11 (on the resin container) that is suction-fixed to the lower end surface of the frame member (circular frame). , combined frame parts (circular frame) and release film 11. In this state, a fluid resin can be supplied and set in a state where the mold release film 11 is applied to a lower mold cavity for compression molding described later in the compression molding module 530 .

As shown in the figure, the compression molding module 530 includes a molding die 531 . The molding die 531 is not particularly limited, but may be, for example, a metal die. The molding die 531 is an upper die and a lower die (not shown) as main components, and the lower die cavity 532 is circular as shown in the figure. The molding die 531 is further provided with an upper die substrate setting portion (not shown) and a lower die cavity bottom surface member (not shown) for resin pressurization. In the compression molding module 530, a chip (such as a semiconductor chip) mounted on a resin-encapsulated pre-substrate (pre-molding substrate) described later can be resin-encapsulated in the encapsulating resin (resin encapsulating) in the lower mold cavity to form a resin-encapsulated Substrate (formed substrate). The compression molding module 530 can be, for example, the compression molding mechanism shown in FIG. 2 , and the molding die 531 can be, for example, the molding die 531 shown in FIG. 2 .

The transport mechanism (transfer module) 540 can transport the chip (resin-encapsulation object) including the substrate before resin encapsulation, and can transport the electronic component (resin molded product) after resin encapsulation. As shown in the figure, the transfer mechanism (transfer module) 540 includes a substrate loader 541 , a rail 542 , and a robot arm 543 . The rail 542 protrudes from the transfer mechanism (transfer module) 540 and reaches the areas of the compression molding module 530 and the fluid resin discharge module 520 . The substrate loader 541 may mount a substrate 544 thereon. The substrate 544 may be a substrate before resin encapsulation (substrate before molding) 544a, or a substrate after resin encapsulation (substrate after molding) 544b. The substrate loader 541 and the resin loader 521 (the post-processing mechanism 522 ) can move on the rail 542 between the fluid resin discharge module 520 , the compression molding module 530 and the transfer module 540 . In addition, as shown in the drawing, the transfer module 540 includes a substrate housing portion, and can accommodate a pre-resin-encapsulated substrate (pre-molded substrate) 544a and a resin-encapsulated substrate (molded substrate) 544b. A chip (not shown, for example, a semiconductor chip) is mounted on the pre-molded substrate 544a. In the molded substrate 544b, the chip is packaged with a resin (encapsulation resin) cured by a fluid resin to form an electronic component (resin molded product). The robot arm 543 can be used, for example, as follows. That is, first, the pre-molding substrate 544a taken out from the housing portion of the pre-molding substrate 544a is placed on the substrate loader 541 by inverting the front and back sides so that the chip mounting surface side faces downward. Second, the molded substrate 544b can be housed in the molded substrate accommodating portion by taking out the molded substrate 544b from the substrate mounter 541 and turning over the front and back sides so that the sealing resin side faces upward.

The control unit 550 controls the cutting of the release film, the discharge of the fluid resin, the expansion of the fluid resin, the conveyance of the pre-encapsulated substrate and the encapsulated substrate, the conveyance of the resin material, the conveyance of the release film, the heating of the molding die, and the transfer of the molding die. mold closing and mold opening etc. In other words, the control unit 550 controls the respective operations of the release film cutting module 510 , the coating module 520 , the molding module 530 , and the conveyance module 540 . Thus, the resin molding apparatus of this invention can control each said member by a control part, and can function as a fully automatic machine. Alternatively, the resin molding apparatus of the present invention may function as a manual machine without relying on the control unit, but it is efficient to control the above-mentioned components by the control unit.

The arrangement position of the control unit 550 is not limited to the position shown in FIG. 3 , and is arbitrary. For example, it may be arranged on at least one of the modules 510 , 520 , 530 , and 540 , or may be arranged outside each module. In addition, the control unit 550 may be configured as a plurality of control units at least partially separated according to an operation to be controlled.

In addition, the plan view of FIG. 4 schematically shows another example of the structure of the resin molding apparatus of this invention. The resin molding apparatus in this figure is the same as the resin molding apparatus in FIG. 3 except that it has two compression molding modules 530 and that the two compression molding modules 530 are adjacently arranged between a coating module 520 and a transfer module 540 . In addition, in the resin molding apparatus of FIG. 4 , the transfer module 540 and the adjacent molding module 530 are detachable, or the coating module 520 and the adjacent molding module 530 are detachable, or both are detachable. Further, the two forming modules 530 can be installed and detached from each other.

In the resin molding apparatus shown in FIGS. 3 and 4 , as described above, the transfer module 540 for supplying substrates and the fluid resin discharge module 520 for discharging fluid resin on the release film are arranged facing each other with the compression molding module 530 interposed therebetween. Furthermore, a release film cutting module 510 for forming a circular release film is arranged outside the fluid resin discharge module 520 . This resin molding device is a separate type resin molding device in which the modules are arranged separately. In addition, the arrangement of each module of the resin molding apparatus of the present invention is not particularly limited, and arrangements other than those shown in FIGS. 3 and 4 may be used. For example, it is possible to adopt a structure in which compression molding modules are configured in a required number and can be mounted and detached. In addition, a release film cutting module (circular release film forming module), a fluid resin discharge module, and a transfer module (substrate module) can be arranged close to the compression molding module. In this case, the release film module, the fluid resin discharge module, and the substrate module become the mother module, and the compression molding module becomes the child module (mother-child type). In this case, a required number of compression molding modules can be arranged side by side sequentially. In addition, the release film cutting module, fluid resin discharge module, and transfer module (substrate module) can be integrated. In addition, the release film cutting module, the fluid resin discharge module, and the transfer module (substrate module) can be integrated into one mold, and these components are integrated as a resin molding device (for example, a compression molding device) function alone.

In addition, when a plurality of compression molding modules are arranged between the transfer module (substrate module) and the fluid resin discharge module, or when a plurality of compression molding modules are arranged sequentially with respect to the mother module, it is preferable to arrange them as follows. That is, the molding modules are arranged in parallel along the direction in which a rail used for moving components including the substrate loader, the resin loader, and the post-processing mechanism extends. In addition, the modules of the resin molding device of the present invention can be attached and detached from each other, for example, using a connection mechanism such as bolts and nuts, or using an appropriate positioning mechanism. In addition, other compression molding modules may be configured so as to be attachable and detachable to the compression molding module. This allows compression molding modules to be added or removed afterwards.

2. Resin molding method, method of manufacturing resin molded products, and method of manufacturing products

Next, examples of the resin molding method, the manufacturing method of the resin molded article, and the manufacturing method of the product of the present invention will be described. More specifically, an example of a resin molding method (manufacturing method of a resin molded article) using the resin molding apparatus described in FIGS. 1 to 4 will be described, and further an example of a method of manufacturing a product using the same will be described.

(1) Coating process

An example of the coating step of the resin molding method of the present invention will be described using FIG. 1 , FIG. 5 and FIG. 6 .

First, a resin discharge process is performed. That is, at least a part of the fluid resin in the coating area on the release film 11 is discharged from the outlet at the tip of the nozzle 15 in FIG. 1 . In addition, the coating area|region on the release film 11 will be mentioned later. In this resin discharge step, for example, the discharge position of the fluid resin can be moved by simultaneously moving the distributor 14 and the nozzle 15 in the X-Y biaxial direction (approximately horizontal direction). In addition, it is also possible to move the discharge position of the fluid resin by moving the table 12 in the biaxial direction of X-Y (approximately horizontal direction), or instead of the above-mentioned method of moving the discharge position of the fluid resin, by moving the table 12 moves in the X-Y biaxial direction (approximately horizontal direction) to move the discharge position of the fluid resin. In addition, for example, the mold release film 11 (coating object) and the table 12 may be vibrated simultaneously while discharging the fluid resin from the nozzle 15, or the nozzle 15 may be vibrated instead of simultaneously vibrating the mold release film 11 (coating object). Cloth object) and workbench 12, can vibrate nozzle 15.

In addition, the fluid resin is not particularly limited, and may be liquid resin or molten resin. The definitions of "liquid resin" and "molten resin" are as above. The fluid resin is preferably a liquid resin from the viewpoint of handling convenience and the like. The liquid resin is as defined above, and its viscosity is not limited as long as it has fluidity at normal temperature (room temperature). For example, it may be liquid or pasty. In addition, the fluid resin may be, for example, a thermoplastic resin or a thermosetting resin. A thermosetting resin is, for example, a liquid resin at room temperature, its viscosity decreases when heated, and it polymerizes and solidifies to become a cured resin when heated further.

In addition, for example, before the resin discharge process, a fluid resin measurement process of measuring the fluid resin using a fluid resin measurement mechanism may be performed. Thereby, a predetermined amount of fluid resin without excess or deficiency can be discharged on the release film 11 . The flowable resin metering mechanism is not particularly limited, and for example, the metering mechanism for granular resin described in Patent Document 2 (for example, a load cell for metering) and the like can be applied. The metering mechanism may, for example, be disposed adjacent to the dispenser 14 or the like.

Next, FIG. 5 and FIG. 6 each show an example of the resin spreading process. According to these examples, for example, the fluid resin (not shown) can be continuously spread from the landing position of the fluid resin (not shown) toward the peripheral portion of the coating area, but the method of spreading the fluid resin is not limited to this. In addition, specific examples of the resin discharge pattern are, for example, FIGS. 7 to 18 described later, and specific examples of the expansion pattern of the fluid resin are, for example, FIGS. 19 to 25 described later.

Here, the continuous spread of the fluid resin from the landing position of the fluid resin toward the peripheral portion of the coating area means, for example, that the flow of the fluid resin toward the coating area is included when the landing position of the fluid resin is near one end side of the coating area. The case where the peripheral portion near the other end side of the cloth region is expanded. Therefore, in this case, it includes the case where the fluid resin continuously spreads from the vicinity of one end side of the application area toward the central part, and also includes the case where the fluid resin continuously spreads from the center part of the application area toward the peripheral part near the other end side. Case.

First, FIG. 5 shows an example of the resin spreading process. In this step, a force is applied to and spreads the fluid resin (not shown) discharged to the upper surface of the release film 11 . For example, the release film 11 and the table 12 are moved by moving the table 12 in the X-Y biaxial direction (approximately horizontal direction) by a drive mechanism (not shown). Thereby, a force is applied to and expands the discharged fluid resin. That is, the above-mentioned driving mechanism of the table 12 corresponds to a "coating object driving mechanism" that applies a force to and expands the discharged fluid resin by moving the release film 11 (coating object). The movement of the table 12 may be, for example, horizontal movement or rotation. For example, the table 12 may be rotated by the driving mechanism, and a centrifugal force may be applied to and expand the fluid resin. As a drive mechanism for the rotary table 12, it is not particularly limited, but for example, a spin coater or the like can be used. At this time, a resin heating step of heating the fluid resin discharged on the release film 11 by the heater (resin heating means) 13 may be performed. Thereby, the viscosity of the fluid resin can be lowered to promote expansion (expansion) of the fluid resin. In addition, the resin heating step may be performed, for example, simultaneously with the resin spreading step, or may be performed before the resin spreading step. The heater 13 is not particularly limited, but for example, an infrared lamp (such as a far infrared lamp), a halogen lamp (halogen heater), a warm air (heated gas) blowing mechanism, an electric heater built into a table, etc. can be used. At this time, for example, the camera (sensor) 16 detects the spread of the fluid resin, and based on the detection result, the movement of the table 12 (for example, the number of rotations, etc.), the amount of gas blowing, and the like are controlled. Thereby, for example, it is possible to prevent the fluid resin from spreading excessively and overflowing from the application area. The movement of the table 12 can be controlled by a computer program, for example. In addition, the control by the camera (sensor) 16 can be performed in advance at the condition setting stage, and the resin coating process can be performed based on the conditions at the time of actual resin molding.

In addition, FIG. 6 shows another example of the resin spreading process. In this figure, instead of moving the table 12, gas is sprayed to the fluid resin (not shown) discharged to the upper surface of the release film 11 through the blowing nozzle (gas injection mechanism) 17, and the force is applied by the gas. Acts on and expands the fluid resin. In the blowing nozzle 17, the shape of the gas discharge port is not particularly limited, but may be, for example, a hole shape in which the minor axis and major axis are substantially equal, or a slender slit shape. The gas injected through the blowing nozzle 17 is not particularly limited, and may be, for example, high-pressure gas such as compressed air (compressed air) or compressed nitrogen. At this time, if the heated gas is sprayed, it can simultaneously lower the viscosity of the liquid resin and facilitate spreading. At this time, as in the method of FIG. 5 , the spread of the fluid resin is detected by the camera (sensor) 16 , and the injection of gas through the blowing nozzle 17 is controlled based on the detection result. For example, in the resin spreading process, it is possible to control so that the distance between the gas discharge port of the blowing nozzle 17 and the surface of the fluid resin is constant. Thereby, for example, the gas pressure applied to the surface of the fluid resin becomes constant, so that the spreading deviation of the fluid resin can be reduced. In addition, for example, in the resin spreading step, the fluid resin can be expanded by injecting gas to the fluid resin while moving one or both of the blowing nozzle 17 and the fixing table 12 in the X-Y direction.

In addition, for example, in the resin spreading step, the method of moving the release film (coating object) 11 as shown in FIG. 5 and the method of spraying gas to the fluid resin as shown in FIG. 6 can be used together. As a result, the fluid resin becomes easier to flow and expand.

As mentioned above, the coating process of coating the fluid resin for resin molding in the coating area|region on the release film (coating object) 11 can be performed.

7 to 13 schematically show examples of resin discharge patterns in the resin discharge step. 7 to 13 are all plan views showing a state in which the fluid resin 21 is discharged on the release film 11 which is the object to be coated. All of FIGS. 7-13 are the example in which the release film 11 which is a coating target object is circular, and the application|coating area|region 11a is circular. In FIGS. 7-13, the inside of the area|region (concentric circle slightly smaller than the circle of the outer edge of the release film 11) shown by the dotted line is the application|coating area|region 11a. The peripheral portion of the release film 11 (outside of the application area 11 a ) is not coated with the fluid resin 21 , but is used for holding the release film in a compression molding process described later.

FIG. 7 shows an example in which the release film 11 and the application area 11a are circular, and the fluid resin 21 is discharged only at the center of the application area 11a. Fig. 7 (a) is a plan view, and Fig. 7 (b) is a cross-sectional view viewed from the I-I' direction of Fig. 7 (a).

FIG. 8 shows an example in which the release film 11 and the application area 11 a are circular, and the fluid resin 21 is discharged in a spiral shape. Fig. 8(a) is a plan view, and Fig. 8(b) is a cross-sectional view viewed from the II-II' direction of Fig. 8(a). In the resin discharge step of discharging the fluid resin 21 spirally, for example, it may be discharged from the center of the application area 11a toward the periphery, or vice versa.

The plan view of FIG. 9 shows that the mold release film 11 and the application area 11a are circular, and the fluid resin 21 is discharged in the center of the application area 11a, and is discharged in a circular (annular) manner surrounding its periphery. example of. In FIG. 9 , the number of rings of the fluid resin 21 is one, but it is not limited to this, and a plurality of rings may be discharged concentrically. The plan view of Figure 10 shows one such example. FIG. 10 is the same as FIG. 9 except that two rings of the fluid resin 21 are concentrically discharged so as to surround the fluid resin 21 at the center. In addition, although the number of rings of the fluid resin 21 is two in FIG. 10 , it is not limited thereto, and may be three or more.

The plan view of FIG. 11 is an example in which the release film 11 and the application area 11 a are circular, and the fluid resin 21 is discharged in dots so as to spread over almost the entire application area 11 a.

The plan view of FIG. 12 is an example in which the release film 11 and the application area 11a are circular, and the fluid resin 21 is discharged radially around the center of the application area 11a. In the resin discharge step of radially discharging the fluid resin 21 , for example, it may be discharged from the center of the coating area 11 a toward the periphery, or conversely, may be discharged from the periphery toward the center.

The plan view of FIG. 13 is an example in which the release film 11 and the application area 11a are circular, and the fluid resin 21 is discharged in a sheet form at the center of the application area 11a. This figure is the same as that of FIG. 7 in that the fluid resin 21 is discharged at the center of the coating area 11 a. However, compared to FIG. 7 , the discharge range of the fluid resin 21 is wide and the fluid resin 21 is sheet-like.

7 to 13 show examples in which the release film 11 and the application area 11 a are circular, but FIGS. 14 to 18 show examples in which the release film 11 and the application area 11 a are square. In FIGS. 14 to 18 , the inner side of the region (concentric square slightly smaller than the square of the outer edge of the release film 11 ) indicated by the dotted line is the application region 11 a. The peripheral portion of the release film 11 (outside the application area 11 a ) is not coated with the fluid resin 21 , and is used for holding the release film in a compression molding process described later. In addition, in the present invention, the shape of the coating region is not limited thereto, and may be any shape such as a substantially circular shape, a substantially rectangular shape, a substantially square shape, a substantially elliptical shape, a substantially triangular shape, a substantially hexagonal shape, substantially any other polygonal shape, and the like. shape. In addition, in the present invention, the shape of the object to be coated is not particularly limited, and may be any shape such as a substantially circular shape, a substantially rectangular shape, a substantially square shape, a substantially elliptical shape, a substantially triangular shape, a substantially hexagonal shape, substantially any other polygonal shape, and the like. The shape is preferably approximately circular, approximately rectangular, or approximately square from the viewpoint of ease of handling and the like. In addition, in the present invention, the shape of the object to be coated and the shape of the coated area may be the same as those shown in FIGS. 7 to 13 and FIGS. 14 to 18 , but may be different.

FIG. 14 shows an example in which the release film 11 and the application area 11a are square, and the fluid resin 21 is discharged only at the center of the application area 11a. Fig. 14(a) is a plan view, and Fig. 14(b) is a cross-sectional view viewed from the III-III' direction of Fig. 14(a).

FIG. 15 shows an example in which the release film 11 and the application area 11 a are square, and the fluid resin 21 is discharged in a spiral shape. Fig. 15(a) is a plan view, and Fig. 15(b) is a cross-sectional view viewed from the IV-IV' direction of Fig. 15(a). The spiral shape of the fluid resin 21 is substantially circular in FIG. 8 , but in FIG. 15 , it is a substantially square spiral substantially along the outer peripheral shape of the release film 11 as shown. In FIG. 15 , in the resin discharge step of discharging the fluid resin 21 in a spiral shape, as in FIG. 8 , for example, it may be discharged from the center of the coating area 11 a toward the peripheral edge, and conversely, it may be discharged from the peripheral portion toward the center. Department discharge.

The plan view of FIG. 16 is an example in which the release film 11 and the application area 11a are square, and the fluid resin 21 is discharged in dots so as to spread over almost the entire application area 11a.

The plan view of FIG. 17 is an example in which the release film 11 and the application area 11a are square, and the fluid resin 21 is discharged radially around the center of the application area 11a. In the resin discharge step of discharging the fluid resin 21 radially, for example, it may be discharged from the center portion of the release die 11 toward the peripheral portion, or conversely, may be discharged from the peripheral portion toward the center portion.

The plan view of FIG. 18 is an example in which the release film 11 and the application area 11a are square, and the fluid resin 21 is discharged in a sheet form at the center of the application area 11a. This figure is the same as that of FIG. 14 in that the fluid resin 21 is discharged at the center of the coating area 11 a. However, compared to FIG. 14 , the discharge range of the fluid resin 21 is wide and the fluid resin 21 is sheet-like.

Next, FIGS. 19 to 25 show examples of spreading patterns of the fluid resin using the resin spreading process by gas injection. FIG. 19 shows an example in which the release film 11 and the application area 11a are circular, and the fluid resin 21 is discharged only to the center of the application area 11a, similarly to FIG. 7 . 19( a ) is a longitudinal sectional view of the blowing nozzle 17 , FIG. 19( b ) is a cross-sectional view of the blowing nozzle 17 , and FIG. 19( c ) is a plan view schematically showing the form of the resin spreading step. As shown in the figure, in this example, the shape of the gas discharge port of the blowing nozzle 17 is a substantially circular hole shape. In this example, by moving one or both of the blowing nozzle 17 and the fixed table 12 in the X-Y direction, the gas is sprayed to the fluid resin, as shown in the figure, and the fluid resin 21 is blown from the coating area 11a. The central portion expands toward the peripheral portion.

Fig. 20 shows an example in which the release film 11 and the application area 11a are square, and the fluid resin 21 is discharged only to one end (near one side of the square) of the application area 11a. 20( a ) is a longitudinal sectional view of the blowing nozzle 17 , FIG. 20( b ) is a cross-sectional view of the blowing nozzle 17 , and FIG. 20( c ) is a plan view schematically showing the form of the resin spreading step. As shown in the figure, in this example, the shape of the gas discharge port of the blowing nozzle 17 is an elongated slit shape. In this example, by moving one or both of the air blowing nozzle 17 and the fixed table 12 (not shown) in the X-Y direction, the gas is injected to the fluid resin, as shown in FIG. 20(c), and the The fluid resin 21 spreads from one end toward the other end of the application area 11a.

FIG. 21 shows an example in which the release film 11 and the application area 11a are square, and the fluid resin 21 is discharged to the center and four corners of the application area 11a. 21( a ) is a longitudinal sectional view of the blowing nozzle 17 , FIG. 21( b ) is a cross-sectional view of the blowing nozzle 17 , and FIG. 21( c ) is a plan view schematically showing the form of the resin spreading step. As shown in the figure, in this example, the shape of the gas discharge port of the blowing nozzle 17 is a substantially circular hole shape. In addition, in this example, air blow nozzles 17 are provided at respective positions corresponding to the center portion of the coating area 11 a and the resin discharge portions at the four corners. In FIG. 21 , the amount of fluid resin discharged to the central portion is larger than that of the four corners, and correspondingly, the expected discharge port of the blowing nozzle 17 is also larger in the central portion than in the four corners. Then, as shown in FIG. 20( c ), the fluid resin 21 is expanded by injecting gas from each air blowing nozzle 17 to the fluid resin 21 .

22 to 25 are process plan views showing an example in which the release film 11 and the application area 11a are square, and only the fluid resin 21 is discharged at the center of the application area 11a. In this example, the shape of the gas discharge port of the blowing nozzle 17 is an elongated slit shape. First, as shown in FIG. 22 , only the fluid resin 21 is discharged at the center of the coating area 11 a. Then, as shown in the figure, one or both of the blowing nozzle 17 and the fixing table 12 (not shown) are moved along the height direction of the square of the coating area 11a (the vertical direction on the paper). Thereby, as shown in FIG. 23 , the fluid resin 21 spreads along the height direction of the square of the application area 11 a. Next, the release film 11 is rotated 90 degrees together with the fixing table 12 (not shown), and the height direction and width direction of the square of the application|coating area 11a are switched. Then, as shown in FIG. 24 , one or both of the blowing nozzle 17 and the fixing table 12 (not shown) is moved again along the height direction of the square of the coating area 11 a (the vertical direction on the paper). Thereby, as shown in FIG. 25 , the fluid resin 21 spreads over the entire application region 11 a on the release film 11 .

As mentioned above, various examples of the resin spreading process which injects gas to the fluid resin 21, and acts force on the fluid resin 21 by the gas to continuously expand the fluid resin 21 are shown using FIGS. 19-25. However, in the present invention, the resin spreading step is not limited thereto, and can be changed arbitrarily.

In addition, in the present invention, the object to be coated is not limited to the release film. For example, a plate-shaped member (a heat sink for heat insulation, a barrier metal for blocking electromagnetic waves, etc.) may be used as an object to be coated, and the fluid resin may be discharged and spread thereon. For example, a plate-shaped member may be placed on a release film, and a fluid resin may be discharged and expanded on the plate-shaped member. Then, the conveying process of conveying the said plate-shaped member together with a mold release film to the place where the said resin sealing process is performed may be performed, and the said compression molding process may be further performed. Moreover, the said resin discharge process using the said plate-shaped member, the said resin expansion process, the said conveyance process, and the said compression molding process can be performed without using a release film.

As described above, in the present invention, although the object to be coated is not particularly limited, it is more preferably not a substrate (work). For example, as described above, by coating a release film, a plate-shaped member, etc., which are parts on the substrate (work) side that are not resin molded products, with a fluid resin, even if a force is applied to the resin in the resin spreading step, The above-mentioned fluid resin will not apply unnecessary force to the substrate (workpiece). Thus, for example, damage to components (for example, chips, leads, etc.) disposed on the substrate (work) can be prevented.

Furthermore, the size of the coating object (release film etc.) is not specifically limited, either. However, since the present invention can reduce thickness variation of fluid resin, it is particularly suitable for large-sized coating objects. For example, the major axis of the coating region of the object to be coated (release film, etc.) may be 300 mm or more.

(2) Compression molding process

Next, an example of the compression molding process of the resin molding method of the present invention will be described using FIGS. 26 to 29 . In the compression molding process shown in FIGS. 26 to 29 , the compression molding mechanism shown in FIG. 2 is used. However, in FIGS. 26 to 29 , for the sake of simplification, illustration of parts other than the molding die 531 is omitted.

First, as shown in FIG. 26 , a substrate (substrate before molding) 544 a is supplied to the lower surface of the upper mold 101 and fixed. The substrate 544a may be fixed to the lower surface of the upper mold 101 by, for example, a jig (not shown) or the like. In addition, on the lower surface of the substrate 544a (the side opposite to the fixing surface of the upper mold 101 ), as shown in the figure, the chip 1 is fixed.

Next, as shown in FIG. 26 , the release film 11 coated with the fluid resin 21 is conveyed to the molding die 544 a by the resin loader (resin conveying mechanism) 521 (conveying process). At this time, for example, as shown in the drawing, the frame member 701 is placed on the release film 11 and the fluid resin 21 is placed on the release film 11 in the through hole of the frame member 701 .

Then, as shown in FIG. 27 , the resin loader 521 places the release film 11 of the fluid resin 21 in the cavity 532 of the lower mold 102 . At this time, the release film 11 can be sucked onto the cavity 532 by a suction mechanism (not shown). Thus, the fluid resin 21 is supplied to the cavity 532 of the lower mold 102 together with the release mold 11 .

Next, as shown in FIGS. 28 to 29 , in the lower mold 102 of the molding die 531 , one surface of the substrate 2 is resin-encapsulated with the encapsulation resin 21 b. Specifically, for example, first, as shown in FIG. 28 , the lower mold 102 is raised in the direction of arrow Y1 by the mold clamping mechanism 115 (not shown in FIG. 28 ) of FIG. The chip 1 mounted on the lower surface of the substrate 2 is impregnated in the fluid resin. Afterwards, the fluid resin 21 is heated and cured to become the encapsulation resin. At this time, the fluid resin 21 can be heated by the lower mold 102 whose temperature has been raised in advance by a heating mechanism (not shown). Thus, as shown in FIG. 29 , a resin-sealed substrate (molded substrate, electronic component) 544b in which the chip 1 fixed to the substrate 544a is encapsulated with the sealing resin 21b can be manufactured. Thereafter, as shown in FIG. 29 , the lower mold 102 is lowered in the direction of arrow Y2 by the mold clamping mechanism 115 (not shown in FIG. 29 ) to open the mold.

Although examples of the compression molding step and the transfer step have been described above, the compression molding step and the transfer step are not particularly limited, and may be performed, for example, according to a general resin sealing method.

(3) Resin molding method

Next, an example of all steps of the resin molding method using the compression molding apparatus shown in FIG. 3 or 4 will be described.

First, in the release film cutting module (release film cutting mechanism) 510, as described above, the leading end of the release film is pulled out from the roll-shaped release film 512 through the film holder 513, and placed on the film fixing stand. On the upper surface of the table 12 on the loading mechanism 511 , the release film is fixed on the table 12 . In this state, as described above, the release film is cut with a cutter (not shown) to obtain a circular release film 11 . The release film (scrap) remaining after cutting and separating the circular release film 11 is disposed of by a waste disposal mechanism (not shown).

Next, the film fixing table mounting mechanism 511 (film fixing table moving mechanism 523) is moved to the nozzle 15 in the coating module 520 together with the stage 12 (not shown) and the release film 11 mounted thereon. Below the resin supply port. In this state, in the application area on the release film 11, for example, the fluid resin 21 is discharged (resin discharge step) and expanded (resin spreading step). The resin discharge process and the resin expansion process can be performed, for example as mentioned above. At this time, the resin discharge position can be moved by, for example, moving (or rotating) the film fixing table moving mechanism 523 together with the table 12 (not shown) and the release film 11 placed thereon.

Next, the release film 11 and the fluid resin in the coating area coated thereon are moved from the film fixing table moving mechanism 523 and held by the resin loader (resin conveying mechanism) 521 . The release film 11 can be moved from the film fixing table moving mechanism 523 to the resin loader 521 by holding the release film 11 by a holding mechanism (not shown) included in the resin loader 521 .

Next, the front and back of the pre-molding substrate 544a taken out from the storage portion of the pre-molding substrate 544a are reversed by the robot arm 543 as described above. As a result, the pre-molding substrate 544 a is placed on the substrate loader 541 with the chip mounting surface facing downward, and is transported into the compression molding module 530 . At this time, the pre-molding substrate 544a is supplied and set on the mold surface of the upper mold (molding mold 531). Next, as illustrated in FIG. 26 , the resin loader 521 holding the release film 11 and the fluid resin and the post-processing mechanism 522 integrated with the resin loader 521 are moved on the rail 542 and transported to Inside the compression molding module 530 (transfer mechanism). At this time, as described in FIG. 27 , by placing the release film 11 on the die surface of the lower die, the release film 11 and the fluid resin can be supplied into the lower mold cavity 532 having a circular opening.

In addition, as explained in FIG. 28 , in the compression molding module 530 , the molding die 531 (upper die and lower die) are clamped. As a result, the chip mounted on the pre-molding substrate 544a provided on the upper mold is immersed in the fluid resin in the lower mold cavity 532, and the fluid resin in the lower mold cavity 532 can be pressurized by the cavity bottom surface member. . Then, as illustrated in FIG. 29, the fluid resin is cured (for example, cured by heating) in the mold 531 (lower mold cavity 532), and the electronic components are packaged with the cured resin (encapsulation resin) 21b. part. In this way, the resin-sealed substrate 544b (molded substrate, electronic component) is formed. Next, as explained in FIG. 29 , the molding die 531 (upper die and lower die) is opened. Then, the resin-encapsulated substrate 544 b is taken out by the substrate loader 541 , and is further transported to the transport module 540 side for storage. In addition, after the resin-encapsulated substrate (molded substrate, electronic component) 544b is taken out from the molding die 531 by the substrate loader 541, the upper mold surface cleaner (not shown) of the post-processing mechanism 522 is used to clean the substrate setting portion of the upper mold. . Simultaneously or at a different time, the release film removal mechanism (not shown) of the post-processing mechanism can be used to take out the unused release film from the lower mold surface.

In addition, the substrate loader 541 on which the resin-sealed substrate 544 b (electronic component) is mounted can be moved from the compression molding module 530 to the transfer module 540 . At this time, the robot arm 543 takes out the resin-encapsulated substrate (molded substrate, electronic component) 544b from the substrate loader 541 as described above, and reverses the front and back sides. Thereby, the resin-encapsulated substrate (molded substrate, electronic component) 544b is accommodated in the accommodating portion of the resin-encapsulated substrate (molded substrate, electronic component) with the sealing resin side facing upward. In this way, electronic components (resin molded products) can be produced.

In addition, in FIG. 3 and FIG. 4, the manufacturing apparatus of the electronic component and the manufacturing method of the electronic component using it were demonstrated. However, the present invention is not limited to electronic components, and is applicable to the manufacture of any other resin molded products. For example, the present invention can be applied to the case of manufacturing optical parts such as lenses, optical modules, light guide plates, or other resin products by compression molding.

In addition, according to the resin molding method of the present invention, since the thickness variation of the fluid resin can be reduced, the resin thickness variation of the resin molded article can be reduced. Therefore, the present invention can be applied in Wafer Level Package (WLP). When the present invention is used for WLP, it is not particularly limited except for the above-mentioned resin discharge step and the above-mentioned resin expansion step, and can be performed according to a general WLP method. Specifically, for example, as described above, first, the electronic component is produced as an intermediate product by the above-mentioned first electronic component manufacturing method of the present invention (intermediate product manufacturing process). Then, another electronic component is manufactured as a finished product from the intermediate product (finished product manufacturing process, the second electronic component manufacturing method of the present invention). In the manufacturing method of the 2nd electronic component of this invention, as mentioned above, for example, in the manufacturing process of a finished product, the object to be coated can be removed from the chip|tip and sealing resin of an intermediate product. When the manufacturing method of the second electronic component of the present invention is applied to WLP, for example, in the electronic component as a finished product, the chip can be attached only on the substrate (carrier) as the object to be packaged without being electrically connected (lead wire). bonding, flip chip bonding, etc.). In addition, for example, as described above, the wiring member may be connected to the chip after the object to be coated is removed from the chip and the encapsulating resin of the intermediate product. Although it does not specifically limit as a wiring member, For example, a lead wire, a solder ball (bump), a flip chip, etc. are mentioned.

The manufacturing process when the manufacturing method of the 2nd electronic component of this invention is applied to WLP can be specifically performed as follows, for example. That is, first, an intermediate product is produced by resin-encapsulating a chip attached to a carrier such as a semiconductor substrate such as a silicon wafer, a glass substrate, or a metal substrate by applying the resin molding method of the above-mentioned embodiment (intermediate product manufacturing process). For this intermediate product, the carrier is taken out, the chip is wired (rewiring process), separated into individual electronic components by a cutting process, and a finished product is manufactured (finished product manufacturing process). In addition, in addition to this, the following examples are also possible. That is, using an article in which a wiring layer is formed on a semiconductor substrate such as a silicon wafer as a carrier, first electrically connecting a chip on the wiring layer of the semiconductor substrate, and applying the resin molding method of the embodiment to the chip to manufacture Intermediate products (intermediate product manufacturing process). The intermediate product can be manufactured by removing the carrier while the wiring layer is connected to the chip, leaving the wiring layer, and performing a cutting process to separate it into individual electronic components (finished product manufacturing process).

Although it does not specifically limit as a manufacturing process when the manufacturing method of the 2nd electronic component of this invention is applied to other than WLP, For example, it can carry out as follows. That is, first, an intermediate product is manufactured by applying the resin molding method of the above-described embodiment to resin-encapsulation of a semiconductor substrate such as a silicon wafer or a printed circuit board to which the chip is electrically connected (intermediate product manufacturing process) . This intermediate product can be separated into individual electronic components by performing a cutting process to manufacture a finished product (finished product manufacturing process).

Moreover, as mentioned above, the manufacturing method of the 2nd electronic component of this invention is one embodiment of the product manufacturing method of this invention mentioned above. In addition, the manufacturing method of the product of this invention mentioned above is not limited only to the manufacturing method of the 2nd electronic component of this invention, For example, it is applicable also to manufacture of the product other than an electronic component.

According to the present invention, since the spread variation of the fluid resin can be reduced, problems such as the following (1) to (5) of the resin molded article can be suppressed or prevented. However, these effects are examples and do not limit the present invention at all.

(1) flow marks

(2) Filler segregation in resin

(3) Voids (bubbles) in the resin

(4) Thickness deviation of package (resin molded product)

(5) Inclination of package (resin molded product)

The present invention is not limited to the above-described embodiments, and may be arbitrarily and appropriately combined, changed, or selectively employed as needed without departing from the gist of the present invention.

This application claims priority based on Japanese application Japanese Patent Application No. 2016-087503 filed on April 25, 2016, and the entire disclosure thereof is incorporated in this application.

Explanation of reference signs

1 chip

11 Release film (coating object)

11a Coating area

12 work table (fixed table)

13 heater

14 Dispenser (fluid resin discharge mechanism)

15 nozzles

16 camera (sensor)

17 Blowing nozzle (air injection mechanism)

21 Liquid resin

21b Encapsulation resin

101 upper mold

102 Lower mold

103 Die basic parts

104 Lower mold cavity side parts

105 Elastic parts

106 Bottom part of the lower mold cavity

111 Fixed platen

112 movable platen

113 base

114 tie rod (holding part)

115 Clamping mechanism

116 drive source

117 Transmission parts

510 Release Film Cutting Module (Release Film Cutting Mechanism)

511 film fixing table loading mechanism

512 roll release film

513 Membrane Clamp

520 coating module (resin discharge module and resin expansion module)

521 Resin Loader

522 post-processing mechanism

523 Membrane fixed table moving mechanism

530 Compression Molding Mechanism (Compression Molding Module)

531 forming die

532 lower mold cavity

540 Handling mechanism (handling module)

541 Substrate Loader

542 tracks

543 Mechanical Arm

544a Resin-encapsulated front substrate (before molding substrate)

544b Resin-encapsulated substrate (molded substrate)

701 frame parts

Claims (18)

1. a kind of resin molding apparatus, it is characterised in that include：

Coating mechanism, the liquid resin of the dispensing area coating resin shaping in coating object, and

Compression forming mechanism, is carried out using the coating object that the liquid resin is coated with by the coating mechanism Compression forming；

The coating mechanism is included：

The liquid resin is discharged in resin ejection mechanism, at least a portion in the dispensing area；With

Resin extension mechanism, power is acted on described in being extended by the liquid resin that the resin ejection mechanism is discharged Liquid resin.

2. the resin molding apparatus according to claim 1, wherein, the coating mechanism, which is further included, makes the flowing The drain position of property resin is relative to the travel mechanism that the coating object is relatively moved.

3. the resin molding apparatus according to claim 1 or 2, wherein, for being discharged by the resin ejection mechanism The liquid resin at least a portion, the resin extension mechanism is from landing place towards the periphery of the dispensing area Portion continuously extends the liquid resin.

4. the resin molding apparatus according to claim 1 or 2, wherein, the resin extension mechanism makes the coating pair As thing rotation, and centrifugal action is extended into the liquid resin in the liquid resin.

5. the resin molding apparatus according to described in claim 1 or 2, wherein, the resin extension mechanism is to the mobility Resin gas injection, and power is acted on by the liquid resin by the gas and the liquid resin is extended.

6. the resin molding apparatus according to claim 5, wherein, the resin extension mechanism injection is used as the gas Heated gas.

7. the resin molding apparatus according to claim 1 or 2, wherein, the coating mechanism is further comprising heating row Go out to the resin heating arrangements of the liquid resin of the dispensing area.

8. the resin molding apparatus according to claim 1 or 2, wherein, the coating mechanism further includes to control The resin extension mechanism is made, and detects the sensor of the liquid resin on the dispensing area.

9. the resin molding apparatus according to claim 1 or 2, it further includes and is carried to the coating object The carrying mechanism of the compression forming mechanism.

10. the resin molding apparatus according to claim 1 or 2, wherein,

The coating object is mold release film,

The resin molding apparatus further includes the shut-off mechanism of the cut-out mold release film,

The resin ejection mechanism discharges the liquid resin in the mold release film cut off by the shut-off mechanism.

11. the resin molding apparatus according to claim 1 or 2, wherein,

Multiple compression forming mechanisms are divided into modules and configured, meanwhile, the resin ejection mechanism and the tree At least one of fat extension mechanism is configured as the modules different from the compression forming mechanism,

At least one described module mutually can installing/dismounting relative to other at least one of the module.

12. a kind of resin molding method, it is characterised in that include：

Painting process, the liquid resin of the dispensing area coating resin shaping in coating object；With

Compression forming process, shaping is compressed using the liquid resin for being coated on the coating object,

The painting process is included：

Resin discharges the liquid resin that resin-encapsulated is discharged in process, at least a portion in the dispensing area；With

Resin extends process, and power is acted on to the liquid resin discharged and the liquid resin is extended.

13. the resin molding method according to claim 12, wherein, the resin is discharged the mobility of process The drain position of resin is relatively moved relative to the coating object.

14. the resin molding method according to claim 12 or 13, wherein, in resin extension process, with from There is the liquid resin and continuously extend in the peripheral part of the landing place of the liquid resin towards the dispensing area Part mode, carry out the extension of the liquid resin.

15. the resin molding method according to claim 12 or 13, wherein, in resin extension process, make institute Coating object rotation is stated, and centrifugal action is extended into the liquid resin in the liquid resin.

16. the resin molding method according to claim 12 or 13, wherein, in resin extension process, to institute Liquid resin gas injection is stated, and power is acted on by the liquid resin by the gas and the mobility tree is extended Fat.

17. a kind of manufacture method of synthetic resin, it is characterised in that the tree according to any one of claim 12 to 16 Fat forming method is molded with resin.

18. a kind of manufacture method of product, it is characterised in that manufactured using the manufacture method according to claim 17 Synthetic resin manufactures product.