CN107132726B - 一种蓝宝石图形衬底掩膜版的图形结构和曝光方法 - Google Patents
一种蓝宝石图形衬底掩膜版的图形结构和曝光方法 Download PDFInfo
- Publication number
- CN107132726B CN107132726B CN201610113391.7A CN201610113391A CN107132726B CN 107132726 B CN107132726 B CN 107132726B CN 201610113391 A CN201610113391 A CN 201610113391A CN 107132726 B CN107132726 B CN 107132726B
- Authority
- CN
- China
- Prior art keywords
- area
- opaque
- mask
- pattern
- mask plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/42—Alignment or registration features, e.g. alignment marks on the mask substrates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/76—Patterning of masks by imaging
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/90—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof prepared by montage processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
- G03F7/2063—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam for the production of exposure masks or reticles
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (7)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610113391.7A CN107132726B (zh) | 2016-02-29 | 2016-02-29 | 一种蓝宝石图形衬底掩膜版的图形结构和曝光方法 |
| PCT/CN2017/075010 WO2017148350A1 (zh) | 2016-02-29 | 2017-02-27 | 一种蓝宝石图形衬底掩膜版的图形结构和曝光方法 |
| US16/080,396 US10747100B2 (en) | 2016-02-29 | 2017-02-27 | Pattern structure and exposure method of patterned sapphire substrate mask |
| JP2018544523A JP6577149B2 (ja) | 2016-02-29 | 2017-02-27 | パターン化サファイア基板マスクのパターン構造および露光方法 |
| KR1020187027628A KR102094930B1 (ko) | 2016-02-29 | 2017-02-27 | 패터닝된 사파이어 기판 마스크의 패턴 구조 및 노광 방법 |
| SG11201807220XA SG11201807220XA (en) | 2016-02-29 | 2017-02-27 | Pattern structure and exposure method of patterned sapphire substrate mask |
| TW106106718A TWI627496B (zh) | 2016-02-29 | 2017-03-01 | Graphic structure and exposure method of patterned sapphire substrate mask |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610113391.7A CN107132726B (zh) | 2016-02-29 | 2016-02-29 | 一种蓝宝石图形衬底掩膜版的图形结构和曝光方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107132726A CN107132726A (zh) | 2017-09-05 |
| CN107132726B true CN107132726B (zh) | 2019-11-26 |
Family
ID=59721428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610113391.7A Active CN107132726B (zh) | 2016-02-29 | 2016-02-29 | 一种蓝宝石图形衬底掩膜版的图形结构和曝光方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10747100B2 (zh) |
| JP (1) | JP6577149B2 (zh) |
| KR (1) | KR102094930B1 (zh) |
| CN (1) | CN107132726B (zh) |
| SG (1) | SG11201807220XA (zh) |
| TW (1) | TWI627496B (zh) |
| WO (1) | WO2017148350A1 (zh) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6940757B2 (ja) * | 2017-06-30 | 2021-09-29 | 日亜化学工業株式会社 | パターン化基板の製造方法および半導体装置の製造方法 |
| CN108520121B (zh) * | 2018-03-27 | 2021-09-17 | 信利半导体有限公司 | 网格图案生成方法和装置及计算机装置和可读存储介质 |
| CN111381434B (zh) * | 2018-12-28 | 2022-01-28 | 上海微电子装备(集团)股份有限公司 | 掩膜板及曝光方法 |
| CN109491218B (zh) * | 2018-12-29 | 2019-10-01 | 成都中电熊猫显示科技有限公司 | 降低曝光图形拼接处色差的方法及装置 |
| CN111961766B (zh) * | 2020-07-02 | 2022-08-12 | Ummily集团股份有限公司 | 一种拼接单元、拼接结构及皮具制作方法 |
| CN113033723B (zh) * | 2021-03-08 | 2023-06-16 | 山东大学 | 环形掩膜版、光场调控方法、单像素成像方法及系统 |
| CN114779569B (zh) * | 2022-03-10 | 2024-07-19 | 威科赛乐微电子股份有限公司 | 一种光刻板及其应用与芯片 |
| CN116027628B (zh) * | 2023-01-10 | 2026-02-10 | 业成光电(深圳)有限公司 | 掩膜版组件及曝光方法、显示面板、显示装置 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0936505A1 (en) * | 1997-09-03 | 1999-08-18 | Dai Nippon Printing Co., Ltd. | Method of producing phase mask for fabricating optical fiber and optical fiber with bragg's diffraction grating produced by using the phase mask |
| CN202563242U (zh) * | 2011-11-25 | 2012-11-28 | 宏濂科技有限公司 | 曝光机光罩 |
| CN103412468A (zh) * | 2013-08-27 | 2013-11-27 | 中国电子科技集团公司第四十四研究所 | 光刻大尺寸ccd芯片拼接曝光方法 |
| CN102520576B (zh) * | 2011-11-18 | 2014-02-05 | 中国电子科技集团公司第五十五研究所 | 图形化衬底工艺用步进光刻掩膜版数据拼接方法和修正法 |
| CN104698769A (zh) * | 2013-12-10 | 2015-06-10 | 上海微电子装备有限公司 | 蓝宝石衬底的拼接曝光方法 |
| CN103869606B (zh) * | 2014-04-04 | 2016-06-08 | 深圳市华星光电技术有限公司 | 曝光光罩以及彩色滤光片的制作方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5222916B2 (ja) | 2010-09-17 | 2013-06-26 | シャープ株式会社 | 半導体基材の製造方法、半導体装置、および電気機器 |
| KR20120069009A (ko) * | 2010-11-05 | 2012-06-28 | 서울옵토디바이스주식회사 | 포토 마스크 |
| US8323857B2 (en) | 2010-12-21 | 2012-12-04 | Ultratech, Inc. | Phase-shift mask with assist phase regions |
| JP2012133280A (ja) * | 2010-12-24 | 2012-07-12 | Mejiro Precision:Kk | 基板パターンの製造方法及び露光装置 |
| TWM427591U (en) | 2011-10-31 | 2012-04-21 | Sino American Silicon Prod Inc | Photomask with increased arrangement density of mask patterns |
| CN103365070B (zh) | 2012-03-29 | 2015-05-06 | 山东浪潮华光光电子股份有限公司 | 一种pss图形的相移掩膜版及其制备方法 |
| DE112013004996T5 (de) * | 2012-10-15 | 2015-07-09 | Seoul Viosys Co., Ltd. | Halbleitervorrichtung und Verfahren zu deren Herstellung |
| CN103337566A (zh) | 2013-06-19 | 2013-10-02 | 上海大学 | 一种图形化衬底制作方法 |
| CN103576440B (zh) | 2013-10-11 | 2017-01-25 | 西安神光安瑞光电科技有限公司 | 梅花型掩膜版以及利用梅花型掩膜版制造图形化衬底的方法 |
| CN105717748B (zh) * | 2014-12-04 | 2017-12-29 | 上海微电子装备(集团)股份有限公司 | 一种背面曝光工艺优化方法 |
-
2016
- 2016-02-29 CN CN201610113391.7A patent/CN107132726B/zh active Active
-
2017
- 2017-02-27 KR KR1020187027628A patent/KR102094930B1/ko active Active
- 2017-02-27 US US16/080,396 patent/US10747100B2/en active Active
- 2017-02-27 SG SG11201807220XA patent/SG11201807220XA/en unknown
- 2017-02-27 WO PCT/CN2017/075010 patent/WO2017148350A1/zh not_active Ceased
- 2017-02-27 JP JP2018544523A patent/JP6577149B2/ja active Active
- 2017-03-01 TW TW106106718A patent/TWI627496B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0936505A1 (en) * | 1997-09-03 | 1999-08-18 | Dai Nippon Printing Co., Ltd. | Method of producing phase mask for fabricating optical fiber and optical fiber with bragg's diffraction grating produced by using the phase mask |
| CN102520576B (zh) * | 2011-11-18 | 2014-02-05 | 中国电子科技集团公司第五十五研究所 | 图形化衬底工艺用步进光刻掩膜版数据拼接方法和修正法 |
| CN202563242U (zh) * | 2011-11-25 | 2012-11-28 | 宏濂科技有限公司 | 曝光机光罩 |
| CN103412468A (zh) * | 2013-08-27 | 2013-11-27 | 中国电子科技集团公司第四十四研究所 | 光刻大尺寸ccd芯片拼接曝光方法 |
| CN104698769A (zh) * | 2013-12-10 | 2015-06-10 | 上海微电子装备有限公司 | 蓝宝石衬底的拼接曝光方法 |
| CN103869606B (zh) * | 2014-04-04 | 2016-06-08 | 深圳市华星光电技术有限公司 | 曝光光罩以及彩色滤光片的制作方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017148350A1 (zh) | 2017-09-08 |
| KR102094930B1 (ko) | 2020-03-30 |
| TWI627496B (zh) | 2018-06-21 |
| JP2019511005A (ja) | 2019-04-18 |
| KR20180118706A (ko) | 2018-10-31 |
| TW201741763A (zh) | 2017-12-01 |
| JP6577149B2 (ja) | 2019-09-18 |
| CN107132726A (zh) | 2017-09-05 |
| SG11201807220XA (en) | 2018-09-27 |
| US20190339611A1 (en) | 2019-11-07 |
| US10747100B2 (en) | 2020-08-18 |
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Effective date of registration: 20250710 Address after: 3 / F, building 19, building 8, No. 498, GuoShouJing Road, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai, 201203 Patentee after: Shanghai Xinshang Microelectronics Technology Co.,Ltd. Country or region after: China Address before: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Patentee before: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) Co.,Ltd. Country or region before: China |
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