CN106476402A - Method for manufacturing buffer board of treadmill - Google Patents

Abstract

The invention discloses a method for manufacturing a treadmill buffer plate, which comprises the steps of gluing, drying in the shade, presetting, die assembly, heating and compression molding, cooling, die opening and molding and the like, can simply manufacture the required treadmill buffer plate, and can manufacture treadmill buffer plates with different structures only by replacing different dies according to different designs such as convex points, flat or concave arc arrangement of an upper die and a lower die of a die set so as to reduce the manufacturing cost.

Description

How to make treadmill bumper

technical field

The invention relates to related fields of treadmills, in particular to a method for manufacturing a treadmill bumper used for treadmills.

Background technique

Generally, treadmills use a buffer board as the support under the running belt. However, when running, the pedaling force exerts a great force on the buffer board. If there is no buffer elastic force, it will be quite unfavorable to the runner. A buffer device is installed outside the pad, and a layer of foam layer is adhered on the buffer plate, and a layer of woven cloth layer is adhered on the foam layer, so that the running cycle belt can rotate smoothly and simultaneously The role of the buffer.

The existing treadmill buffer board can refer to Taiwan Invention Patent No. I406686, which discloses a treadmill buffer board made of bamboo strips of appropriate thickness and width, which divides the bamboo strips into warp bamboo strips and weft threads Bamboo strips, at least one warp bamboo strip and at least one weft bamboo strip are overlapped and woven to form a woven bamboo plywood; the bamboo plywood can be stacked to a desired thickness to form a woven bamboo plywood board, to enhance the strength and retain the cushioning elasticity; it is also possible to directly stack the above-mentioned warp bamboo strips side by side and the parallel weft bamboo strips to form a stack of bamboo plywood.

In addition, the bamboo chip structure of the buffer plate of the current treadmill is manufactured by first cutting the bamboo pole into quarters longitudinally, and then axially cutting into flat strip-shaped bamboo chips in the quarters.

Afterwards, individual bamboo pieces are woven in an interlaced manner to form a cushioning board.

Due to the small area of the bamboo slices produced by the existing production method, and too much bamboo material is wasted, too much waste is generated, resulting in a lot of cost increase, and the weaving and production time is relatively lengthy; and, because the buffer board is woven from bamboo slices , the gap between each bamboo slice is larger, and the cushioning effect is poor.

Contents of the invention

In order to solve the above problems, the purpose of the present invention is to provide a treadmill bumper manufacturing method, which can easily manufacture the required treadmill bumper, and can be used according to the bumps, flatness or With different designs such as concave arc settings, treadmill bumpers with different structures can be manufactured by only changing different molds, so as to reduce manufacturing costs.

For reaching above-mentioned object, the present invention provides a kind of method for making treadmill buffer plate, and its step comprises:

Step SA1: Put a plurality of production materials into a glue pool for soaking or coating for a predetermined gluing time;

Step SA2: After the scheduled gluing time is up, pick up or place each production material and dry it in the shade;

Step SA3: Stack the glued production materials according to the stacking order to form a plate body, and put it into a mold set of a hydraulic press;

Step SA4: The mold group of the hydraulic press performs mold clamping and heating and compression molding on the plate body, heating to a predetermined heating temperature, and continuing for a predetermined mold clamping time;

Step SA5: Stop heating the plate when the predetermined mold closing time is reached, and then cool the plate until it reaches a predetermined cooling temperature, and the cooling lasts for a predetermined cooling time; and

Step SA6: after the predetermined cooling time is reached, open the mold set.

In some embodiments, the predetermined gluing time is 10-30 minutes.

In some embodiments, the panels are dried before being put into the glue pool or coated.

In some embodiments, the board body can be composed of the following materials stacked in the order of anti-skid board, film board (cloth), wood chip, wood chip, five-layer long curtain and short curtain bamboo chip, wood chip, wood chip, Thin film board (cloth) and anti-skid board; Among them, the manufacturing process of the bamboo chips shown is to split a bamboo pole axially, and roll it into a flat plate, and form it after overlapping. The wood chips include sawdust plywood or solid wood board;

In some embodiments, the predetermined heating temperature is 100°C-180°C, and the predetermined mold clamping time is 5-30 minutes.

In some embodiments, the predetermined cooling temperature is 0°C-40°C, and the predetermined cooling time is 10-60 minutes.

In some embodiments, the mold set has a fluid circuit, and the fluid circuit is communicated with a hot and cold water valve, and the hot and cold water valve can respectively control a hot fluid or a cold fluid to enter the fluid circuit, and the mold set For heating or cooling.

In some embodiments, the mold set has a fluid circuit, and the fluid circuit communicates with a hot and cold water valve, and the hot and cold water valve is connected with an electric heater (not shown in the drawing), and the hot and cold water valve can be connected with a The electric heater is connected to control the cold fluid to enter the fluid circuit through the electric heater to heat the mold set, and the electric heater is cut off to cool the cold fluid to the mold set.

In some embodiments, the mold set has an upper mold and a lower mold, the upper mold is located above the lower mold and is movably spaced apart from each other, the upper mold and the lower mold are arranged flat or parallel to each other The recesses are arranged parallel to each other.

In some embodiments, a surface of the upper mold facing the lower mold is provided with a plurality of bumps.

In some embodiments, a plurality of protrusions are uniformly arranged on a surface of the upper mold and the lower mold facing each other.

Description of drawings

Figure 1: An exploded schematic view of a treadmill buffer plate manufacturing method in which the plate body is placed on a hydraulic press.

Figure 2: Schematic diagram of the appearance of Figure 1.

Fig. 3: a schematic diagram of Fig. 1 using the mold set of the first embodiment when the molds are clamped.

Figure 4: Schematic cross-sectional view of Figure 2.

Figure 5: A schematic cross-sectional view of Figure 3.

Fig. 6: A schematic diagram of a treadmill bumper manufactured by the treadmill bumper manufacturing method of the present invention using the mold set of the first embodiment.

Fig. 7: A schematic diagram of the appearance of the treadmill buffer board in the manufacturing method of the present invention where the board body is placed in a hydraulic press.

FIG. 8 : An exploded view of the mold set using a second embodiment in FIG. 7 .

Fig. 9: A schematic diagram of a treadmill bumper manufactured by the treadmill bumper manufacturing method of the present invention using the mold set of the second embodiment.

FIG. 10 : An exploded schematic view of a treadmill bumper plate manufacturing method of the present invention where the plate body is placed on a hydraulic press with a mold set according to a third embodiment.

Fig. 11: A schematic diagram of a treadmill bumper manufactured by the manufacturing method of the treadmill bumper of the present invention using the mold set of the third embodiment.

Fig. 12: An exploded schematic view of a treadmill bumper plate manufacturing method of the present invention where the plate body is placed on a hydraulic press with a mold set of a fourth embodiment.

Fig. 13: A schematic diagram of a treadmill bumper manufactured by the treadmill bumper manufacturing method of the present invention using the mold set of the fourth embodiment.

Fig. 14: the flowchart of the manufacturing method of the treadmill bumper plate of the present invention.

Explanation of reference signs

1 plate body

2 treadmill bumpers

100 hydraulic press

200 Die Sets

210 upper mold

220 lower mold

230 drives

240 hot and cold water valve

300 bumps

Steps SA1-SA6 The manufacturing method provided by the present invention.

detailed description

Please refer to Fig. 1 to Fig. 14 at the same time, the treadmill bumper plate manufacturing method provided by the present invention, its steps include:

Step SA1 (gluing): Put a plurality of production materials into a glue pool to soak or apply for a predetermined gluing time. Preferably, the predetermined gluing time can be 10-30 minutes, but it does not limit;

Step SA2 (drying in the shade): after the scheduled gluing time is up, pick up the production materials and dry them in the shade;

Step SA3 (presetting): Stack the glued materials in a stacking order to form a plate body 1, and put it into a mold set 200 of a hydraulic press 100, wherein the plate body 1 can be formed by the following Materials (that is, the above-mentioned production materials) are stacked, and the stacking sequence is slippery board, film board (cloth), wood chip, wood chip, five-layer long curtain and short curtain bamboo chip, wood chip, wood chip, film board (cloth) And anti-skid boards; wherein, the manufacturing process of bamboo chips is to split a plurality of bamboo poles axially, and roll them into flat plates, which are formed after overlapping, and the wood chips include sawdust plywood or solid wood boards;

Step SA4 (mold clamping and heating molding): the mold set 200 of the hydraulic press 100 performs mold clamping and heating molding on the plate body 1, heats to a predetermined heating temperature, and lasts for a predetermined mold clamping time, preferably, the The preset heating temperature is 100°C-180°C, and the preset mold clamping time is 10-20 minutes, wherein, the hydraulic press 100 can be equipped with multiple mold sets 200 at the same time, so as to perform mold clamping and heating molding at the same time;

Step SA5 (cooling): When the predetermined mold clamping time is reached, stop heating the plate body 1, and then cool the plate body 1 to a predetermined cooling temperature, and the cooling lasts for a predetermined cooling time; and

Step SA6 (mold opening and forming): after the predetermined cooling time is reached, the mold set 200 can open the mold to form a treadmill bumper plate 2 .

Preferably, the plate body 1 in the above step SA1 can be dried before being put into the glue pool or coated.

In the above step SA5, the predetermined cooling temperature may be set at 0° C.-40° C., and the predetermined cooling time is preferably 10-60 minutes, but not limited thereto.

The mold set 200 can have an upper mold 210 and a lower mold 220, the upper mold 210 can be located above the lower mold 220 and can move with each other through a driver 230 (which can be driven by oil pressure or air pressure, but not limited thereto) The upper mold 210 and the lower mold 220 are arranged at intervals, and the upper mold 210 and the lower mold 220 are arranged flat and parallel to each other (as shown in Figures 1 to 5). setting (as shown in Figure 12), the treadmill buffer plate 2 can be as shown in Figure 13; at the same time, a surface of the upper mold 210 facing the lower mold 220 is provided with a plurality of bumps 300 (as shown in Figure 8), Its treadmill buffer plate 2 can be as shown in Figure 9, or a surface facing each other of the upper mold 210 and the lower mold 220 is evenly provided with a plurality of bumps 300 (as shown in Figure 10), and its treadmill buffer plate 2 can be As shown in Figure 11.

Die set 200 can have a fluid circuit, and this fluid circuit can be worn in the upper mold 210 and in the lower mold 220, and fluid circuit can be communicated with a hot and cold water valve 240, and cold and hot water valve 240 can control a hot fluid or a Cool fluid enters the fluid circuit to heat or cool the die set 200 .

The aforementioned mold set 200 has a fluid circuit, which can be passed through the upper mold 210 and the lower mold 220, and the fluid circuit can be communicated with a hot and cold water valve 240, and the hot and cold water valve 240 can be connected with an electric heater A cold fluid is controlled to enter the fluid circuit for heating, and after the electric heater (set in the fluid circuit, not shown) is cut off, a cold fluid enters the fluid circuit to cool the mold set 200 .

Through the above-mentioned manufacturing method, the required treadmill buffer board can be easily manufactured, and can be changed according to the different designs of the upper mold 210 and the lower mold 220 of the mold set 200, such as bumps 300, flat or concave arc settings, etc., only different The mold can produce treadmill buffer boards 2 with different structures, as shown in Fig. 6, Fig. 9, Fig. 11 and Fig. 13, so as to reduce the manufacturing cost.

On the basis of the foregoing embodiments, other embodiments of the present invention can be further designed, and these embodiments do not violate the technical solution of the present invention, and the protection scope of the present invention is determined by the claims. Although the present invention has been described in relation to preferred embodiments, this is not intended to limit the invention. It should be noted that those skilled in the art can construct many other similar embodiments according to the idea of the present invention, and these all belong to the protection scope of the present invention.

Claims (10)

1. A method for making a treadmill buffer plate is characterized in that: its steps comprise: Step SA1: Put a plurality of production materials into a glue pool for soaking or coating for a predetermined gluing time; Step SA2: After the predetermined gluing time is up, dry each production material in the shade; Step SA3: Stack the glued production materials according to the stacking order to form a plate body, and put it into a mold set of a hydraulic press; Step SA4: The mold group of the hydraulic press performs mold clamping and heating and compression molding on the plate body, heating to a predetermined heating temperature, and continuing for a predetermined mold clamping time; Step SA5: Stop heating the plate when the predetermined mold closing time is reached, and then cool the plate until it reaches a predetermined cooling temperature, and the cooling lasts for a predetermined cooling time; and Step SA6: After the predetermined cooling time is reached, open the mold set to form a treadmill bumper. 2. The manufacturing method of the treadmill buffer board according to claim 1, characterized in that: the predetermined gluing time is 10-30 minutes. 3. The manufacturing method of the treadmill buffer board according to claim 1, characterized in that: the board body is dried before being put into the glue pool or coated. 4. The manufacturing method of treadmill buffer board according to claim 1, characterized in that: the board body can be formed by stacking the following materials, and the stacking sequence is slide-resistant board, film board, wood chip, wood chip, five-layer long curtain And short curtain bamboo chips, wood chips, wood chips, film boards and sliding boards, wherein the bamboo chips split a plurality of bamboo rods axially, and roll them into flat plates, which are formed after lapping, and the wood chips include sawdust plywood or solid wood panels. 5. The manufacturing method of the treadmill buffer board according to claim 1, characterized in that: the preset heating temperature is 100°C-180°C, and the preset mold closing time is 5-30 minutes. 6. The manufacturing method of the treadmill buffer board according to claim 1, characterized in that: the predetermined cooling temperature is 0°C-40°C, and the predetermined cooling time is 10-60 minutes. 7. The manufacturing method of treadmill bumper plate as claimed in claim 1, characterized in that: the mold set has a fluid circuit, and the fluid circuit is communicated with a hot and cold water valve, and the hot and cold water valve can respectively control a hot fluid Or a cold fluid enters the fluid circuit to heat or cool the mold set. 8. The manufacturing method of treadmill buffer board as claimed in claim 7, characterized in that: the mold set has a fluid circuit, and the fluid circuit communicates with a hot and cold water valve, and the hot and cold water valve can be connected with an electric heater , to control the cold fluid to enter the fluid circuit through the electric heater for heating, to heat the mold set, and to cut off the electric heater to cool the cold fluid to the mold set. 9. The manufacturing method of a treadmill bumper plate as claimed in claim 1, wherein the mold set has an upper mold and a lower mold, the upper mold is positioned above the lower mold and is mutually movable at intervals, the upper mold The mold and the lower mold are arranged flat or parallel to each other in depressions. 10 . The manufacturing method of the treadmill buffer board according to claim 9 , wherein a plurality of bumps are arranged on a surface of the upper mold facing the lower mold. 11 .