CN106409706A - Method and mechanism for detecting dispensing condition - Google Patents

Abstract

The embodiment of the invention discloses a method and a mechanism for detecting the dispensing condition, which are used for detecting the colloid condition of a to-be-glued part of a workpiece and comprise at least the following steps: extracting a first image from the part to be glued, which faces the workpiece in the forward direction; extracting a second image along the tangential direction of the periphery of the workpiece passing through the part to be glued; and comparing the first image and the second image of the same to-be-glued part to detect the condition of the colloid. The invention also provides a detection mechanism for dispensing condition, which comprises a bearing platform for bearing a workpiece with a to-be-glued position, a first lens which faces the to-be-glued position of the workpiece forward to extract a first image, and a second lens which faces the workpiece along the tangential direction of the periphery of the workpiece passing through the to-be-glued position to extract a second image. The technical scheme of the embodiment of the invention can confirm whether the glue point of the part to be glued of the workpiece is sealed.

Description

The detection method of dispensing status and the detection mechanism of dispensing status

technical field

The present invention relates to a detection method of dispensing status and a detection mechanism of dispensing status, in particular to a method for detecting the adherence of colloids after horizontally spraying glue droplets for workpieces with a side to be glued. and sealing conditions.

Background technique

The use of three-dimensional stacking technology to manufacture three-dimensional ICs (3D ICs) has three advantages: small package size, high electrical performance, and cost factors, which will drive the next generation of electronic products to be manufactured with three-dimensional chip technology. In the assembly technology, the stacking technology between chips is an important key.

In the construction technology of three-dimensional wafers, the bonding technology between wafers is an important key. Through the specific connection method and chip thinning technology, the space and density can be effectively increased, the transmission distance can be shortened, the performance of the circuit system can be improved and the energy consumption can be reduced. There are three types of wafer bonding: chip to wafer (Chip to Wafer; C2W), chip to chip (Chip to Chip; C2C), and wafer to wafer (Wafer to Wafer; W2W).

Briefly speaking, the methods of bonding two wafers include oxide fusion bonding, metal-metal bonding, and polymer adhesive bonding. After that, use a glue dispenser to seal the gap around the two wafers for the next step of the process.

After bonding, the joints of the two wafers to be glued are completely horizontal and need to be dispensed on the side. The lifting device that previously controlled the movement of the dispensing head only adjusted the position of the dispensing head from the vertical direction. The traditional dispensing The glue method is no longer applicable, and it is difficult to meet the needs of three-dimensional chips. Not only is vertical dispensing unsuitable, but also inclined dispensing devices are also difficult to handle. Slanted dispensing can only spray glue droplets obliquely, and a slight deviation may cause the glue to fall on the wafer, which will affect the dispensing quality and even damage the wafer assembly.

In order to properly ignite the glue on the place where the two wafers are to be glued, the applicant has proposed a "glue dispensing device" of the Republic of China New Patent Publication No. M480428 to seal the gap around the two wafers for the following one step process. After the dispensing is completed, how to accurately detect the status of the glue spots where the two wafers are to be glued is a new issue for the industry.

Contents of the invention

The technical problem to be solved by the present invention is to provide a method for detecting the glue dispensing condition, so as to confirm whether the glue spot condition of the parts to be glued is really sealed. Furthermore, the present invention is more suitable for the wafer (substrate) assembly of the wafer bonding technology in the three-dimensional integrated structure. After dispensing glue, it is detected whether the glue has sealed the above-mentioned to-be-glued place.

For reaching above-mentioned object, the present invention provides a kind of detection method of dispensing condition, in order to detect the colloid condition of the to-be-glued place of a workpiece, comprise at least the following steps:

extracting a first image facing the to-be-glued portion of the workpiece in a forward direction;

extracting a second image along the tangent direction around the workpiece and passing through the glued place; and comparing the first image and the second image of the same glued place to detect the condition of the colloid.

In one embodiment, it further includes providing a man-machine interface module, the man-machine interface module including a display, and transmitting the first image and the second image to the display.

In one embodiment, it includes using a first lens to face the part to be glued to capture the first image, and using a second lens to capture the second image along the tangential direction.

In one embodiment, it includes using a first lens to face the workpiece to be glued to extract the first image, and using a light emitting and receiving module to obtain the second image, wherein the light emitting and receiving module The group emits strong light along the tangential direction and receives light and shadow to form the second image.

In one embodiment, comprising using a first lens to face the workpiece to be glued to extract the first image; and moving the first lens to face the workpiece along the tangential direction to The second image is extracted.

In one embodiment, include steps:

Facing the workpiece directly and coordinating with rotating the workpiece one turn to extract a plurality of first images of the entire circle of the workpiece;

Cooperate with recording the coordinates of each first image of the workpiece;

moving the first lens to face the workpiece along the tangent direction around the workpiece passing through the place to be glued, and rotating the workpiece one turn to extract a plurality of second images of the entire circle of the workpiece;

Cooperate with recording the coordinates of each second image of the workpiece; and

The first image and the second image of the same position or angle coordinates are taken out and compared to detect whether the colloid is completely adhered to each of the parts to be glued around the workpiece.

In one embodiment, it includes using a first lens to face the to-be-glued part of the workpiece to capture the first image; and a second lens to capture the second image along the tangential direction, wherein the The second image is transmitted to an image sensor together with the first image through reflection and light splitting.

In one embodiment, include steps:

Facing the workpiece directly and coordinating with rotating the workpiece one turn to extract a plurality of first images of the entire circle of the workpiece;

Cooperate with recording the coordinates of each first image of the workpiece;

moving the first lens to face the workpiece along the tangent direction around the workpiece passing through the place to be glued, and rotating the workpiece one turn to extract a plurality of second images of the entire circle of the workpiece;

Cooperate with recording the coordinates of each second image of the workpiece; and

The first image and the second image of the same position or angle coordinates are taken out and compared to detect whether the colloid is completely adhered to each of the parts to be glued around the workpiece.

In one embodiment, the following steps are included:

setting a shielding dodge door between the first lens and the second lens;

closing the shutter to block light coming from the second lens; and

and extracting a plurality of first images of a circle of the workpiece.

In order to achieve the above purpose, the present invention provides a glue dispensing detection mechanism according to one of the solutions of the present invention, which includes a carrying platform, a first lens and a second lens. The above-mentioned carrying platform carries a workpiece to be inspected, and the workpiece has at least one place to be glued. The above-mentioned first camera is facing the part to be glued to capture a first image. The above-mentioned second camera faces the workpiece along the tangent direction around the workpiece and passes through the place to be glued to extract a second image.

In one embodiment, it further includes a man-machine interface module including a display to receive the first image and the second image.

In one embodiment, the viewing directions of the first lens and the second lens are perpendicular to each other and located on the same horizontal plane.

In one embodiment, the second lens also includes a front reflector and a rear reflector, the first lens includes a beam splitter and an image sensor; wherein the second image passes through the front reflector and the rear reflector , projected toward the beam splitter and partially reflected to the image sensor.

In one embodiment, a shielding movable door is further included, which is arranged between the first lens and the second lens.

In order to achieve the above purpose, the present invention provides a detection mechanism for dispensing status according to one solution of the present invention, which includes a carrying platform and a first lens. The above-mentioned carrying platform carries a workpiece to be inspected, and the workpiece has at least one place to be glued. The above-mentioned first lens is facing the workpiece to be glued to extract a first image; wherein the first lens can be moved to face the workpiece along the tangential direction passing through the workpiece to be glued to extract a second image.

The present invention has the following beneficial effects: the detection method of the dispensing status of the present invention is obtained by extracting the first image after dispensing the front side of the part to be glued of the above-mentioned processed parts, plus extracting the part to be glued of the above-mentioned processed parts and dispensing along the tangential direction After the second image. Comparing the first image and the second image of the same place to be glued to detect the condition of the glue. The comparison and cooperation of the two images can prevent the single image from affecting the inspection yield due to unevenness around the workpiece, resulting in out-of-focus and blurred images. After frontal detection and tangential detection, it can ensure whether each joint to be glued has been sealed by glue dots, thereby improving the accuracy of product quality inspection.

In order to further understand the technology, method and effect that the present invention adopts to achieve the intended purpose, please refer to the following detailed description and accompanying drawings of the present invention. It is believed that the purpose, characteristics and characteristics of the present invention can be deeply and concretely However, the accompanying drawings and appendices are provided for reference and illustration only, and are not intended to limit the present invention.

Description of drawings

FIG. 1 is a perspective view of a dispensing device 100 according to the ROC New Patent Publication No. M480428.

Fig. 2 is a flow chart of the method for detecting the dispensing status of the present invention.

FIG. 3 is a schematic top view of the first embodiment of the detection mechanism for dispensing status of the present invention.

FIG. 4 is a schematic front view of the first embodiment of the detection mechanism for dispensing status of the present invention.

FIG. 5 is a schematic top view of the second embodiment of the detection mechanism for dispensing status of the present invention.

FIG. 6 is a schematic top view of a third embodiment of a detection mechanism for dispensing status of the present invention.

FIG. 7 is a schematic top view of a fourth embodiment of a detection mechanism for dispensing status of the present invention.

FIG. 8 is a schematic top view of a fifth embodiment of a detection mechanism for dispensing status of the present invention.

Wherein, the reference signs are explained as follows:

Dispensing device 100

Workpiece 9, 9’

Wafer 9a, 9b

To be glued 90

Starting point 90B

Identify gaps 92

Base 10

Human Machine Interface Module 12

monitor 121

keyboard 122

mouse 123

Recording and control device 14

Carrier platform 20

Camera Module 30

Overlook Shot 31

side view lens 32

First Shot 35, 45

Second lens 33, 36

First image Pa

Second image Pb, Pc

Jet Dispensing Head 40

first shot 51

Convex lens 511

Beamsplitter 512

image sensor 514

Second shot 52

Convex lens 521

Front reflector 522

Condenser lens 523

rear reflector 524

Covering the trap door 53

Colloid G

Robotic Arm R

Detection mechanism of dispensing status 200, 300, 400, 500

Optical transmitter and receiver module L

detailed description

The embodiments described below have mentioned numbers or the like, and unless otherwise specified, the scope of application of the present invention should not be limited by the numbers or the like. The direction terms mentioned in the present invention, such as: left, right, front or rear, etc., are only referring to the directions of the attached drawings, and are used for illustration rather than limitation of the present invention.

FIG. 1 is a perspective view of a dispensing device 100 according to the ROC New Patent Publication No. M480428. In this embodiment, a three-dimensionally integrated wafer (substrate) assembly bonded to two wafers is used as an example to illustrate the workpiece 9 . However, the present invention is not limited to wafer assemblies, but can also be applied to other workpieces with side bonding. The surrounding gaps of the bonded wafers need to be glued, including notches or flats of the wafers.

The dispensing device 100 has a base 10 , and a man-machine interface module 12 is disposed on one side of the base 10 . The man-machine interface module 12 includes a display 121 , a keyboard 122 and a mouse 123 , but is not limited thereto. For example, it can also be a touch screen. The dispensing process is briefly described as follows. First, the workpiece 9 to be dispensed is moved to a carrying platform 20 of the dispensing device 100 . The purpose of performing visual scanning on the workpiece 9 is to obtain the position information of the to-be-glued part 90 of the workpiece 9 before dispensing.

In this embodiment, the camera module 30 is used to extract the position information of the to-be-glued part 90 of the above workpiece. Wherein the camera module 30 includes a bird's-eye view lens 31 that is arranged on the top of the workpiece 9 and extracts the horizontal position information of the plurality of places to be glued 90, and a side-view lens 32 placed on the side of the workpiece 9, the bird's-eye view lens 31 Extract the vertical position information of the plurality of places to be glued 90 . The process of extracting the position includes rotating the workpiece 9 on the carrying platform 20 and recording it in a recording and control device 14 (as shown in FIG. 3 ).

Referring to FIG. 1 , a jet dispensing head 40 is used to spray a plurality of glue drops toward the plurality of places 90 to be glued on the workpiece 9 along the horizontal direction. The starting point 90B of spraying glue can be based on the turning point of the identification notch 92 of the wafer. During the process, according to the center rotation of the workpiece 9 (for example, the substrate assembly), continue to rotate the workpiece 9 and spray the plurality of colloids G until the workpiece 9 has rotated 360 degrees, and then stop the above-mentioned injection dispensing head 40 . So far, the dispensing process of the above workpiece 9 is completed.

[The first embodiment of detection mechanism]

Please refer to FIG. 2 and FIG. 3 , FIG. 2 is a flow chart of the method for detecting the dispensing status of the present invention, and FIG. 3 is a schematic top view of the first embodiment of the detection mechanism for the dispensing status of the present invention. The method for detecting the dispensing status of the present invention firstly includes step S10 , loading a workpiece 9 that has been dispensed to be glued 90 . Wherein the detection mechanism of the dispensing status of the present invention can be combined with the horizontal dispensing device 100 in FIG. In another way, the detection mechanism of the dispensing status of the present invention may be an independent detection machine. In this situation, the workpiece 9 of the glued portion 90 after dispensing is loaded into another independent inspection machine.

As shown in Figure 2, the detection method of dispensing condition of the present invention also includes step S20, extracts a first image along the to-be-glued place 90 facing above-mentioned workpiece 9 along the forward direction; And step S30, along above-mentioned workpiece 9 surrounding A second image is extracted through the tangential direction of the joint to be glued 90 .

According to the detection mechanism of dispensing status in FIG. 3 of the present invention, the above-mentioned first image can be extracted by using the above-mentioned side-view lens 32 placed on the side of the workpiece 9 as the first lens. In addition, the detection mechanism of the dispensing status of the present invention is also provided with a second lens 33 facing the workpiece 9 along the tangential direction around the workpiece 9 passing through the place to be glued 90 to extract a second image.

Please refer to FIG. 4 , which is a schematic front view of the first embodiment of the detection mechanism for dispensing status of the present invention. The first image Pa captured by the side view lens 32 as the first lens is output to the display 121 of the man-machine interface module 12 . The second image Pb captured by the second lens 33 is output to the display 121 of the man-machine interface module 12 . The viewing directions of the first lens (that is, the side view lens 32 ) and the second lens 33 are perpendicular to each other and located on the same horizontal plane. It is supplemented that the first lens (ie, the side view lens 32 ) and the second lens 33 may be a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS, Complementary Metal-Oxide Semiconductor). In addition, in order to obtain a clear image, it is usually necessary to cooperate with supplementary light to illuminate the above-mentioned workpiece 9 .

Afterwards, in conjunction with FIG. 4 and step S40 shown in FIG. 2 , the first image Pa and the second image Pb of the same place to be glued are compared to detect the condition of the colloid G. The advantages of the detection method of this embodiment are as follows. For the wafer (substrate) assembly of two wafers 9a, 9b, the surroundings of the wafers 9a, 9b, as shown in the second image Pb, are generally not completely flat, and may present an irregular arc shape , so it is easy to cause the light of the supplementary light to be diffused outward, resulting in a blurry image that is not easy to focus clearly. Especially in the first image Pa, in the situation of the above-mentioned wafers 9a, 9b, the upper and lower surface boundaries of the wafers 9a, 9b in the first image Pa may not be clearly imaged, so it is difficult to clearly determine whether the colloid G has indeed been attached to the wafer. Between the wafers 9a, 9b. Therefore, this embodiment cooperates with the second image Pb. The second image Pb is extracted from the tangential direction of the wafers 9a and 9b, and can assist each other in detecting whether there is colloid G on the outermost edges of the two wafers 9a and 9b.

[Second Embodiment of Detection Mechanism]

Please refer to FIG. 5 , which is a schematic top view of the second embodiment of the detection mechanism for dispensing status of the present invention. This embodiment illustrates that the detection mechanism 200 of the dispensing status is an independent detection machine, which is separated from the dispensing device 100 . Similar to the previous embodiment, the detection mechanism 200 of the glue dispensing condition includes a first lens 35 and a second lens 36 to extract the first image Pa and the second image Pb respectively.

After the glue dispensing of the workpiece 9 is completed, in this embodiment, a robot arm R can be used to transfer the workpiece 9 to the detection mechanism 200 for dispensing status. The dispensing device 100 can continue the dispensing process of another workpiece 9'. In this way, the process of dispensing and testing can be accelerated by division of labor. In general, the detection process is slightly faster than the dispensing process, so the present invention can also set a dispensing status detection mechanism 200 to cooperate with multiple dispensing devices 100 .

[The third embodiment of detection mechanism]

Please refer to FIG. 6 , which is a schematic top view of a third embodiment of a detection mechanism for dispensing conditions of the present invention. This embodiment illustrates that the detection mechanism 300 of dispensing status is provided with a first lens 35 facing the part to be glued of the workpiece 9 to capture the first image Pa. The difference from the above-mentioned embodiment is that this embodiment uses a light emitting and receiving module L to obtain the second image Pc, wherein the light emitting and receiving module L emits strong light along the above-mentioned tangential direction and receives light and shadow to form the above-mentioned The second image Pc. The light emitting and receiving module L can be a laser emitting and receiving module, which uses strong light to project on the workpiece 9 along the tangential direction of the workpiece 9, and then forms a light shadow covered by the workpiece 9, and receives the above light and shadow As the second image Pc, it is as shown in the second image Pc of FIG. 6 . If the image of glue is not definitely attached, there will be no image of glue dispensing on the outer edge of the two wafers 9a, 9b, so as to assist the first image Pa to judge whether the glue is indeed attached. The above-mentioned light emitting element and receiving element can be combined with the light emitting and receiving module L, or can be separated and located on two sides of the workpiece 9 respectively.

[The fourth embodiment of the detection mechanism]

Please refer to FIG. 7 , which is a schematic top view of a fourth embodiment of a detection mechanism for dispensing status of the present invention. The difference with the above-mentioned embodiment is that this embodiment utilizes the same first lens 45 to face the to-be-glued part of the workpiece 9 to extract the first image Pa; and move the first lens 45 to face the workpiece 9 surrounding along the above-mentioned tangential direction to extract the second image Pb. In other words, on the one hand, the first camera lens 45 is facing the workpiece 9 to be glued, and in addition, the first lens 45 can be moved to face the workpiece 9 along the tangent direction around the workpiece 9 through the glued place to extract the second lens 45. Image Pb.

The process of extracting images in this embodiment may firstly face the workpiece 9 and cooperate with rotating the workpiece 9 to extract a plurality of first images Pa of the entire circle of the workpiece 9. During the process, each The first image Pa may record the position or angular coordinates of the workpiece 9 , for example, the recognition notch 92 of the wafer is used as a reference point. Then, move the first lens 45 to face the workpiece 9 along the tangent direction around the workpiece 9 and pass through the place to be glued to extract the second image, and cooperate with rotating the workpiece 9 to extract the entire circle of the workpiece 9 Multiple second images Pb of . Similarly, during the process, each second image Pb can record the position or angle coordinates of the workpiece 9 , for example, the identification notch 92 of the wafer is used as a reference point. Then, the first image Pa and the second image Pb at the same position or angle coordinates are taken out, and compared to detect whether the colloid is indeed completely attached to each of the parts to be glued around the workpiece 9 .

[Fifth Embodiment of Detection Mechanism]

Please refer to FIG. 8 , which is a schematic top view of a fifth embodiment of a detection mechanism for dispensing status of the present invention. The difference from the above embodiments is that the second lens 52 further includes a front reflector 522 and a rear reflector 524 , and the first lens 51 includes a beam splitter 512 and an image sensor 514 . The first image Pa can be imaged on the image sensor 514 through the beam splitter 512 . The second image Pb passes through the front reflector 522 and the rear reflector 524 , is projected toward the beam splitter 512 and is partially reflected to the image sensor 514 . The first lens 51 may further include a convex lens 511 . The second lens 52 may further include a convex lens 521 and a condenser lens 523 .

In other words, in this embodiment, the first lens 51 is used to face the to-be-glued part of the workpiece 9 to extract the first image Pa to be imaged to the image sensor 514; and the second lens 52 is used to extract the second image Pb along the above-mentioned tangential direction. , wherein the second image Pb is transmitted to an image sensor 514 together with the first image Pa through reflection and light splitting. In this embodiment, only one image sensor 514 is required to record the first image Pa and the second image Pb.

In order to separately extract the first image Pa and the second image Pb, in this embodiment, a shielding movable door 53 may be further provided between the first lens 51 and the second lens 52 . First, a plurality of first images Pa of a circle of the workpiece 9 are extracted, and the above-mentioned shielding dodge door 53 can be closed during the process to shield the light from the second lens 52 . Then, a plurality of second images Pb of a circle of the workpiece 9 are extracted. During the process, each image can record the position or angle coordinates of the workpiece 9 relative to the identification gap 92 . Then, the first image Pa and the second image Pb of the same position or angle coordinates are taken out, and compared to detect whether the colloid is indeed completely attached to each of the parts to be glued around the workpiece 9 .

The above descriptions are only preferred feasible embodiments of the present invention, and all equal changes and modifications made according to the scope of the patent application of the present invention shall fall within the scope of the present invention.

Claims (15)

1. A detection method of a dispensing situation, used to detect the colloid situation of a workpiece to be glued, it is characterized in that, comprising at least the following steps: extracting a first image facing the to-be-glued portion of the workpiece in a forward direction; extracting a second image along a tangential direction around the workpiece passing through the to-be-glued place; and Comparing the first image and the second image of the same place to be glued to detect the condition of the glue in the place to be glued. 2. the detection method of dispensing situation as claimed in claim 1, is characterized in that, further comprises providing a man-machine interface module, and this man-machine interface module comprises a display, and described first image and described second The image is sent to the display. 3. The detection method of dispensing situation as claimed in claim 1, it is characterized in that, comprise utilizing a first lens to face this to be glued place of this workpiece to extract this first image, utilize a second lens along and extracting the second image along the tangential direction. 4. the detection method of dispensing situation as claimed in claim 1, it is characterized in that, comprise utilizing a first lens to face this to be glued place of this processing piece to extract this first image, utilize a light emission receiving mode to obtain the second image, wherein the light emitting and receiving module emits strong light along the tangential direction and receives light and shadow to form the second image. 5. The detection method of dispensing situation as claimed in claim 1, is characterized in that, comprises utilizing a first lens to face this to be glued place of this workpiece to extract this first image; And move this first lens and extract the second image along the tangential direction facing the periphery of the workpiece. 6. the detection method of dispensing situation as claimed in claim 5, is characterized in that, comprises the step: Facing the workpiece directly and coordinating with rotating the workpiece one turn to extract a plurality of first images of the entire circle of the workpiece; Cooperate with recording the coordinates of each first image of the workpiece; moving the first lens to face the workpiece along the tangent direction around the workpiece passing through the place to be glued, and rotating the workpiece one turn to extract a plurality of second images of the entire circle of the workpiece; Cooperate with recording the coordinates of each second image of the workpiece; and The first image and the second image of the same position or angle coordinates are taken out and compared to detect whether the colloid is completely adhered to each of the parts to be glued around the workpiece. 7. The detection method of dispensing situation as claimed in claim 1, is characterized in that, comprises utilizing a first lens to face this to be glued place of this workpiece to extract this first image; And a second lens along The second image is extracted along the tangential direction, wherein the second image is transmitted to an image sensor together with the first image through reflection and light splitting. 8. the detection method of dispensing situation as claimed in claim 7, is characterized in that, comprises the step: Facing the workpiece directly and coordinating with rotating the workpiece one turn to extract a plurality of first images of the entire circle of the workpiece; Cooperate with recording the coordinates of each first image of the workpiece; moving the first lens to face the workpiece along the tangent direction around the workpiece passing through the place to be glued, and rotating the workpiece one turn to extract a plurality of second images of the entire circle of the workpiece; Cooperate with recording the coordinates of each second image of the workpiece; and The first image and the second image of the same position or angle coordinates are taken out and compared to detect whether the colloid is completely adhered to each of the parts to be glued around the workpiece. 9. the detection method of dispensing situation as claimed in claim 8, is characterized in that, comprises the following steps: setting a shielding dodge door between the first lens and the second lens; closing the shutter to block light coming from the second lens; and and extracting a plurality of first images of a circle of the workpiece. 10. A detection mechanism for dispensing conditions, comprising: A carrying platform to carry a workpiece to be inspected, the workpiece has at least one place to be glued; A first camera, facing the to-be-glued part of the workpiece to extract a first image; and A second lens faces the workpiece along the tangent direction around the workpiece and passes through the place to be glued to extract a second image. 11. The detection mechanism of dispensing situation as claimed in claim 10, is characterized in that, further comprises a man-machine interface module, and this man-machine interface module comprises a display to receive described first image and described second image . 12 . The detection mechanism of dispensing status according to claim 10 , wherein the viewing directions of the first lens and the second lens are perpendicular to each other and located on the same horizontal plane. 13 . 13. The detection mechanism of dispensing situation as claimed in claim 10, it is characterized in that, this second lens also comprises a front reflector and a rear reflector, and this first lens comprises a beam splitter and an image sensor; Wherein The second image passes through the front reflector and the rear reflector, projects to the beam splitter and is partially reflected to the image sensor. 14 . The detection mechanism of dispensing status according to claim 13 , further comprising a shielding dodge door, which is arranged between the first lens and the second lens. 15. A detection mechanism for dispensing conditions, characterized in that it comprises: a carrying platform to carry a workpiece to be inspected, the workpiece has at least one place to be glued; and A first camera, facing the to-be-glued part of the workpiece to extract a first image; Wherein the first lens can be moved to face the workpiece along the tangent direction around the workpiece passing through the place to be glued to extract a second image.