CN1064088A - 可固化的聚苯氧树脂组合物及由此可获得的已固化树脂组合物 - Google Patents
可固化的聚苯氧树脂组合物及由此可获得的已固化树脂组合物 Download PDFInfo
- Publication number
- CN1064088A CN1064088A CN92100858A CN92100858A CN1064088A CN 1064088 A CN1064088 A CN 1064088A CN 92100858 A CN92100858 A CN 92100858A CN 92100858 A CN92100858 A CN 92100858A CN 1064088 A CN1064088 A CN 1064088A
- Authority
- CN
- China
- Prior art keywords
- curable
- resin composition
- component
- polyhydroxyether
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
- C08F290/142—Polyethers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
- C08L71/126—Polyphenylene oxides modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
- Y10S525/905—Polyphenylene oxide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Epoxy Resins (AREA)
Abstract
Description
Claims (25)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1258291A JPH0737568B2 (ja) | 1991-01-11 | 1991-01-11 | 新規な硬化性ポリフェニレンエーテル・エポキシ樹脂組成物並びにこれを用いた複合材料および積層体 |
| JP12582/91 | 1991-01-11 | ||
| JP12581/91 | 1991-01-11 | ||
| JP3012581A JPH0737567B2 (ja) | 1991-01-11 | 1991-01-11 | 硬化性樹脂組成物並びにこれを用いた複合材料および積層体 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97110280A Division CN1081658C (zh) | 1991-01-11 | 1997-04-04 | 包含至少一个已固化聚苯氧树脂组合物层的叠层结构 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1064088A true CN1064088A (zh) | 1992-09-02 |
| CN1036402C CN1036402C (zh) | 1997-11-12 |
Family
ID=26348206
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN92100858A Expired - Lifetime CN1036402C (zh) | 1991-01-11 | 1992-01-10 | 可固化的聚苯氧树脂组合物及由它制成的薄膜 |
| CN97110280A Expired - Lifetime CN1081658C (zh) | 1991-01-11 | 1997-04-04 | 包含至少一个已固化聚苯氧树脂组合物层的叠层结构 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97110280A Expired - Lifetime CN1081658C (zh) | 1991-01-11 | 1997-04-04 | 包含至少一个已固化聚苯氧树脂组合物层的叠层结构 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5352745A (zh) |
| EP (1) | EP0494722B1 (zh) |
| KR (1) | KR950013821B1 (zh) |
| CN (2) | CN1036402C (zh) |
| DE (1) | DE69204689T2 (zh) |
| HK (1) | HK20597A (zh) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100363425C (zh) * | 2001-03-27 | 2008-01-23 | 通用电气公司 | 粉末形式的含聚亚芳基醚的热固性组合物、其制备方法以及由其制得的制品 |
| CN103467967A (zh) * | 2013-09-16 | 2013-12-25 | 广东生益科技股份有限公司 | 一种热固性树脂组合物及其用途 |
| CN101268522B (zh) * | 2005-09-21 | 2014-09-17 | 沙伯基础创新塑料知识产权有限公司 | 通过涂布聚亚芳基醚组合物的电绝缘方法及绝缘的电导体 |
| TWI616475B (zh) * | 2012-11-19 | 2018-03-01 | Nitto Denko Corporation | 樹脂片材 |
| CN109294215A (zh) * | 2018-08-08 | 2019-02-01 | 万华化学集团股份有限公司 | 一种聚氨酯树脂组合料及用途和一种高强度高模量聚氨酯材料 |
| WO2021026987A1 (zh) * | 2019-08-13 | 2021-02-18 | 瑞声声学科技(深圳)有限公司 | 树脂组合物、预浸料及相关基板 |
| WO2021135789A1 (zh) * | 2019-12-31 | 2021-07-08 | 山东圣泉新材料股份有限公司 | 一种新型聚亚芳基醚树脂及其制备方法 |
| CN114207021A (zh) * | 2019-07-17 | 2022-03-18 | 松下知识产权经营株式会社 | 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板以及布线板 |
Families Citing this family (67)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR970705590A (ko) * | 1994-09-08 | 1997-10-09 | 샬크비즈크 피이터 코르넬리스; 페트 귄터 | 에틸렌성 불포화 무수물과 비닐 화합물의 공중합체로 구성된 알릴-함유 에폭시 수지 조성물(allyl-containing epoxy resin composition comprising a copolymer of an ethylenically unsaturated anhydride and a vinyl compound) |
| DE69629061T2 (de) * | 1996-06-07 | 2004-05-13 | Asahi Kasei Kabushiki Kaisha | Harztragender metallfolie für mehrschichtige leiterplatte, verfahren zu deren herstellung, mehrschichtige leiterplatte, und elektronische vorrichtung |
| US6197898B1 (en) | 1997-11-18 | 2001-03-06 | General Electric Company | Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent |
| CN1101420C (zh) * | 1997-11-25 | 2003-02-12 | 通用电气公司 | 聚(亚苯基醚)热固性组合物 |
| KR100356080B1 (ko) * | 1998-02-23 | 2002-10-12 | 아사히 가세이 가부시키가이샤 | 열경화성 폴리페닐렌에테르 수지 조성물, 이것에서얻어지는 경화 수지 조성물 및 적층 구조체 |
| SG80588A1 (en) * | 1998-04-04 | 2001-05-22 | Gen Electric | A curable polyphenylene ether-thermosetting resin composition and process |
| US6387990B1 (en) | 1999-09-10 | 2002-05-14 | General Electric Company | Curable epoxy resin compositions with brominated triazine flame retardants |
| EP1218178B1 (en) * | 1999-09-16 | 2004-01-07 | Ga-Tek Inc. | An adhesion promoting layer for use with epoxy prepregs |
| US6878782B2 (en) * | 1999-12-01 | 2005-04-12 | General Electric | Thermoset composition, method, and article |
| US7235192B2 (en) | 1999-12-01 | 2007-06-26 | General Electric Company | Capped poly(arylene ether) composition and method |
| US6627704B2 (en) | 1999-12-01 | 2003-09-30 | General Electric Company | Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom |
| US6812276B2 (en) * | 1999-12-01 | 2004-11-02 | General Electric Company | Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom |
| US6352782B2 (en) * | 1999-12-01 | 2002-03-05 | General Electric Company | Poly(phenylene ether)-polyvinyl thermosetting resin |
| US6905637B2 (en) | 2001-01-18 | 2005-06-14 | General Electric Company | Electrically conductive thermoset composition, method for the preparation thereof, and articles derived therefrom |
| US6521703B2 (en) | 2000-01-18 | 2003-02-18 | General Electric Company | Curable resin composition, method for the preparation thereof, and articles derived thereform |
| JP4231976B2 (ja) * | 2000-03-30 | 2009-03-04 | 日本ゼオン株式会社 | 硬化性組成物及び多層回路基板 |
| US6306963B1 (en) | 2000-05-08 | 2001-10-23 | General Electric Co. | Thermosetting resins and laminates |
| US6906120B1 (en) * | 2000-06-20 | 2005-06-14 | General Electric | Poly(arylene ether) adhesive compositions |
| US6384176B1 (en) | 2000-07-10 | 2002-05-07 | General Electric Co. | Composition and process for the manufacture of functionalized polyphenylene ether resins |
| US6897282B2 (en) * | 2000-07-10 | 2005-05-24 | General Electric | Compositions comprising functionalized polyphenylene ether resins |
| JP2002265777A (ja) | 2001-03-12 | 2002-09-18 | Matsushita Electric Works Ltd | ポリフェニレンオキサイド樹脂組成物、プリプレグ、積層板、プリント配線板、多層プリント配線板 |
| US6593391B2 (en) | 2001-03-27 | 2003-07-15 | General Electric Company | Abrasive-filled thermoset composition and its preparation, and abrasive-filled articles and their preparation |
| US7022777B2 (en) * | 2001-06-28 | 2006-04-04 | General Electric | Moldable poly(arylene ether) thermosetting compositions, methods, and articles |
| US20030078347A1 (en) | 2001-08-28 | 2003-04-24 | General Electric Company | Triazine compounds, polymers comprising triazine structural units, and method |
| US6620885B2 (en) | 2001-08-30 | 2003-09-16 | General Electric Company | Copolymers of functionalized polyphenylene ether resins and blends thereof |
| US6608166B2 (en) | 2001-08-30 | 2003-08-19 | General Electric Company | Three-dimensional copolymers of polyphenylene ether resinsand sytrenic resins |
| US6500529B1 (en) | 2001-09-14 | 2002-12-31 | Tonoga, Ltd. | Low signal loss bonding ply for multilayer circuit boards |
| US6783841B2 (en) | 2001-09-14 | 2004-08-31 | Tonoga, Inc. | Low signal loss bonding ply for multilayer circuit boards |
| US6826830B2 (en) * | 2002-02-05 | 2004-12-07 | International Business Machines Corporation | Multi-layered interconnect structure using liquid crystalline polymer dielectric |
| US20030215588A1 (en) * | 2002-04-09 | 2003-11-20 | Yeager Gary William | Thermoset composition, method, and article |
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| US7250330B2 (en) * | 2002-10-29 | 2007-07-31 | International Business Machines Corporation | Method of making an electronic package |
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Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4034136A (en) * | 1969-06-30 | 1977-07-05 | Fmc Corporation | Flame-retardant resin compositions |
| CA927032A (en) * | 1969-06-30 | 1973-05-22 | H. Beacham Harry | Flame-retardant resin compositions |
| JPS5869052A (ja) * | 1981-10-21 | 1983-04-25 | 旭化成株式会社 | 新規な積層板及びその成形法 |
| US4533727A (en) * | 1983-04-06 | 1985-08-06 | Mitsubishi Gas Chemical Company, Inc. | Process for producing a curable resin from cyanate ester compound and unsaturated 1,2-epoxy compound |
| JPS61287739A (ja) * | 1985-06-15 | 1986-12-18 | 松下電工株式会社 | 積層板 |
| CA1285675C (en) * | 1985-03-25 | 1991-07-02 | Takaaki Sakamoto | Method of preparing polyphenylene oxide composition and laminate using the composition |
| US4978715A (en) * | 1985-08-02 | 1990-12-18 | General Electric Company | Solvent-resistant, compatible blends of polyphenylene ethers and linear polyesters |
| US4806297A (en) * | 1986-02-11 | 1989-02-21 | General Electric Company | Solvent-resistant, compatible blends of polyphenylene ethers and linear polyesters |
| US4786664A (en) * | 1987-03-26 | 1988-11-22 | General Electric Company | Compatible polyphenylene ether-linear polyester blends having improved coefficient of thermal expansion |
| JPS643223A (en) * | 1987-06-25 | 1989-01-09 | Mazda Motor | Swirl chamber for internal combustion engine |
| US4912172A (en) * | 1987-09-03 | 1990-03-27 | General Electric Company | Compositions comprising polyphenylene ethers, polyepoxides and aluminum or zinc diketone salt |
| EP0315829A3 (en) * | 1987-11-10 | 1991-04-03 | General Electric Company | Drill back-up material for small bore drilling of circuit boards |
| CA1336464C (en) * | 1988-07-14 | 1995-07-25 | John Edward Hallgren | Polyepoxide and polyphenylene ether-polyepoxide compositions useful in printed circuit board production |
| US4853423A (en) * | 1988-07-14 | 1989-08-01 | General Electric Company | Curable polyphenylene ether-polyepoxide compositions useful in printed circuit board production |
| DE3931809C2 (de) * | 1988-10-03 | 1998-09-17 | Gen Electric | Härtbare Polyphenylenäther/Polyepoxid-Zubereitungen und deren Verwendung |
| US5001010A (en) * | 1988-10-11 | 1991-03-19 | General Electric Company | Curable polyphenylene ether-polyepoxide compositions from melt processed polyphenylene ethers, and laminates prepared therefrom |
| US5043367A (en) * | 1988-12-22 | 1991-08-27 | General Electric Company | Curable dielectric polyphenylene ether-polyepoxide compositions useful in printed circuit board production |
| US5218030A (en) * | 1989-02-08 | 1993-06-08 | Asahi Kasei Kogyo Kabushiki Kaisha | Curable polyphenylene ether resin composition and a cured resin composition obtainable therefrom |
| US5162450A (en) * | 1989-02-17 | 1992-11-10 | General Electric Company | Curable dielectric polyphenylene ether-polyepoxide compositions |
| KR920701362A (ko) * | 1989-10-06 | 1992-08-11 | 아더 엠.킹 | 전기 적층품을 위한 폴리페닐렌 옥시드/하이브리드 에폭시 수지계 |
-
1992
- 1992-01-10 CN CN92100858A patent/CN1036402C/zh not_active Expired - Lifetime
- 1992-01-10 DE DE69204689T patent/DE69204689T2/de not_active Expired - Lifetime
- 1992-01-10 EP EP19920200062 patent/EP0494722B1/en not_active Expired - Lifetime
- 1992-01-11 KR KR1019920000310A patent/KR950013821B1/ko not_active Expired - Lifetime
-
1993
- 1993-11-03 US US08/145,655 patent/US5352745A/en not_active Expired - Lifetime
-
1997
- 1997-02-20 HK HK20597A patent/HK20597A/en not_active IP Right Cessation
- 1997-04-04 CN CN97110280A patent/CN1081658C/zh not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100363425C (zh) * | 2001-03-27 | 2008-01-23 | 通用电气公司 | 粉末形式的含聚亚芳基醚的热固性组合物、其制备方法以及由其制得的制品 |
| CN101268522B (zh) * | 2005-09-21 | 2014-09-17 | 沙伯基础创新塑料知识产权有限公司 | 通过涂布聚亚芳基醚组合物的电绝缘方法及绝缘的电导体 |
| TWI616475B (zh) * | 2012-11-19 | 2018-03-01 | Nitto Denko Corporation | 樹脂片材 |
| CN103467967A (zh) * | 2013-09-16 | 2013-12-25 | 广东生益科技股份有限公司 | 一种热固性树脂组合物及其用途 |
| CN109294215A (zh) * | 2018-08-08 | 2019-02-01 | 万华化学集团股份有限公司 | 一种聚氨酯树脂组合料及用途和一种高强度高模量聚氨酯材料 |
| CN114207021A (zh) * | 2019-07-17 | 2022-03-18 | 松下知识产权经营株式会社 | 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板以及布线板 |
| CN114207021B (zh) * | 2019-07-17 | 2024-06-11 | 松下知识产权经营株式会社 | 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板以及布线板 |
| WO2021026987A1 (zh) * | 2019-08-13 | 2021-02-18 | 瑞声声学科技(深圳)有限公司 | 树脂组合物、预浸料及相关基板 |
| WO2021135789A1 (zh) * | 2019-12-31 | 2021-07-08 | 山东圣泉新材料股份有限公司 | 一种新型聚亚芳基醚树脂及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| HK20597A (en) | 1997-02-20 |
| CN1036402C (zh) | 1997-11-12 |
| KR920014881A (ko) | 1992-08-25 |
| EP0494722A3 (en) | 1993-07-21 |
| DE69204689T2 (de) | 1996-05-09 |
| US5352745A (en) | 1994-10-04 |
| KR950013821B1 (ko) | 1995-11-16 |
| EP0494722A2 (en) | 1992-07-15 |
| CN1174861A (zh) | 1998-03-04 |
| DE69204689D1 (de) | 1995-10-19 |
| EP0494722B1 (en) | 1995-09-13 |
| CN1081658C (zh) | 2002-03-27 |
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| C15 | Extension of patent right duration from 15 to 20 years for appl. with date before 31.12.1992 and still valid on 11.12.2001 (patent law change 1993) | ||
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