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CN1064088A - Curable polyphenoxy resin composition and cured resin composition obtainable therefrom - Google Patents

Curable polyphenoxy resin composition and cured resin composition obtainable therefrom Download PDF

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Publication number
CN1064088A
CN1064088A CN92100858A CN92100858A CN1064088A CN 1064088 A CN1064088 A CN 1064088A CN 92100858 A CN92100858 A CN 92100858A CN 92100858 A CN92100858 A CN 92100858A CN 1064088 A CN1064088 A CN 1064088A
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Prior art keywords
curable
resin composition
component
polyhydroxyether
weight
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CN92100858A
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CN1036402C (en
Inventor
片寄照雄
石井义行
小田弘治
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Asahi Kasei Corp
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Asahi Kasei Kogyo KK
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Priority claimed from JP1258291A external-priority patent/JPH0737568B2/en
Priority claimed from JP3012581A external-priority patent/JPH0737567B2/en
Application filed by Asahi Kasei Kogyo KK filed Critical Asahi Kasei Kogyo KK
Publication of CN1064088A publication Critical patent/CN1064088A/en
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/142—Polyethers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/905—Polyphenylene oxide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Epoxy Resins (AREA)

Abstract

A novel curable polyphenylene ether resin composition comprising: at least one curable polyphenylene oxide resin comprising the reaction product of a polyphenylene oxide with an unsaturated carboxylic acid or anhydride, (b) at least one cyanurate selected from the group consisting of triallylisocyanurate and triallylcyanurate, optionally (c) a resin composition comprising an epoxy resin and a curing agent, and/or (d) a compound having at least one unsaturated double bond and at least one epoxy group, and/or (e) a reinforcing material. The resin composition has excellent film-forming properties, resin fluidity under pressure, and storage stability. The cured polyphenylene oxide resin composition obtained by curing the curable polyphenylene oxide resin composition has excellent chemical resistance, heat resistance, dielectric properties, and dimensional stability.

Description

Curable polyhydroxyether resin composition and obtainable thus curable resin composition
The present invention relates to a kind of curable polyhydroxyether resin composition, a kind of polyhydroxyether resin of solidified composition, and a kind of rhythmo structure.More particularly, the present invention relates to a kind of containing by the reaction product of polyphenylene oxides and a kind of unsaturated carboxylic acid or anhydride reaction gained and the curable polyhydroxyether resin composition of at least a cyanurate.The invention still further relates to a kind of composition that contains Resins, epoxy or also contain a kind of strongthener if necessary, and the solidify material of this composition.In addition, the present invention relates to comprise a sheet metal and at least one lip-deep one deck at least that places this sheet metal rhythmo structure of curable resin composition layer.
Curable polyhydroxyether resin composition of the present invention has good storing stability, film-forming properties and melting model plasticity.The polyhydroxyether resin composition that solidified of the present invention has good chemical resistance, electric property (for example low-k and low dielectric dispersion coefficient), flame retardant resistance, dimensional stability, and thermotolerance.Therefore, solidified polyhydroxyether resin composition can be used as dielectric materials, insulating material, and heat-stable materials etc. perform well in for example electricity and electronic industry, space flight and aircraft industry etc.
Rhythmo structure of the present invention can be used as single-clad board, double-sided printed-circuit board, multilayer printed circuit board, flexible printed circuit board or the like and using well.
In recent years, in the electron device of usefulness such as communication, family expenses and industry, wish very much the installation of microminiaturization and high assembled density.Therefore, in technology, very wish to have good thermotolerance, these devices of dimensional stability and electric property.For example, the deposited copper laminated plate by the base material system that contains a kind of thermosetting resin such as a kind of resol and a kind of Resins, epoxy has been used as printed circuit board (PCB).But this thermosetting resin has a shortcoming, and Here it is, and this resin has undesirable electric property, particularly at undesirable high-k of high-frequency range, although this resin has the well balanced of every performance.
In order to overcome above-mentioned shortcoming, polyphenylene oxides arouses attention as a kind of novel material, and has attempted polyphenylene oxides is used for applying the copper laminated plate.No doubt, polyphenylene oxides is a kind of typical engineering plastics, and it not only has good mechanical property, and has desirable electrical property, and for example low specific inductivity and low dielectric dispersion coefficient also have good thermotolerance.But when polyphenylene oxides was used as substrate for printed circuit board, its thermotolerance was not enough.The substrate for printed circuit board material therefor needs high thermotolerance, because when welding, substrate for printed circuit board must be exposed under the high temperature.But the base material that is obtained by general polyphenylene oxides is being higher than under about 200 ℃ temperature and can deforming, and causes the obvious reduction of mechanical property thus, and makes the Copper Foil as circuit on substrate surface peel off.In addition, polyphenylene oxides also has another shortcoming, and Here it is, and it has poor resistivity to aromatic hydrocarbon with by the hydrocarbon that halogen atom replaces, and finally can be dissolved in these hydrocarbon, although this polyphenylene oxides has excellent acid, alkaline-resisting and hot water resistance energy.
Thermotolerance and chemical resistant properties in order to improve polyphenylene oxides have proposed various suggestions, and wherein polyphenylene oxides is formulated into a kind of composition.For example, day disclosure special permission communique No.287739/1986 discloses a kind of composite structure, it comprises the cured resin as resin base material, and the latter comprises polyphenylene oxides and at least a resin combination that is selected from triallyl cyanurate and triallyl isocyanurate material gets through curing by a kind of.This cured resin has poor chemical resistant properties, and for example to the resistivity difference of boiling trieline, poor fire is not made printed circuit board (PCB) so this composition structure is suitable for.Prepare resin combination solution and with the casting method this solution is made in the method for film in a kind of comprising, resin combination solution has poor film forming properties, so that is difficult to make the film with smooth surface.
On the other hand, about comprising a kind of common printed circuit board of glass fiber reinforced epoxy resin base material, various suggestions have been proposed so that improve its resistance toheat and electric property.For example, advised comprising the resinous blending thing of polyphenylene oxides and Resins, epoxy, improved the resistance toheat and the electrical property of these printed circuit board (PCB)s by use.In this respect, can wherein disclose a kind of composite structure referring to day disclosure special permission communique No.69052/1983 and Japan special permission communique No.3223/1989, this structure comprises a resin layer and glass fabric, and this resin layer comprises polyphenylene oxides and Resins, epoxy.The chemical resistant properties of this composite structure resin layer is unsatisfactory, and therefore this composite structure is unsuitable for as printed circuit board (PCB).
Japan special permission communique No.3223/1989 and careful European patent No.315829 disclose combining of polyphenylene oxides and various Resins, epoxy.As Resins, epoxy, can use for example polymer with bis phenol A glycidyl ether of general Resins, epoxy, epoxy-Novolak resin, or the like.By using various known solidifying agent (comprising amine) that these compositions are solidified.Yet, being used for polyphenylene oxides of the present invention is on-chemically modified, therefore the performance of this trieline of anti-boiling of curing composition is obviously not enough, and this character needs for the material as printed circuit board (PCB), so this curing composition does not have chemical resistant properties.
U.S. Patent No. 4912172 discloses a kind of resin combination, and the latter comprises (ⅰ) polyphenylene oxides, (ⅱ) bis-phenol polyglycidyl ether and (ⅲ) aluminium or a kind of zinc salt of conduct improvement chemical-resistant material.In addition, do not examine European patent No.0350696, day disclosure special permission communique 55722/1990 and U.S. Patent No. 5043367 disclose a kind of resin combination, and the latter comprises: (ⅰ) polyphenylene oxides; (ⅱ) bromated composition epoxy resin; (ⅲ) a kind of novolac resin; (ⅳ) an a kind of imidazoles and a polyamine species; (ⅴ) zinc salt; (ⅵ) as the Sb of fire retardant material 2O 5
Do not examine European patent No.383178 and disclose a kind of resin combination, it comprises (ⅰ) low molecular weight polyphenylene oxygen, (ⅱ) bromated composition epoxy resin, (ⅲ) imidazoles and polyamines reach aluminium or a kind of zinc salt that (ⅳ) conduct improves the material of Resin Flow.
As the material that suffers the modification of polyphenylene oxides own, day disclosure special permission bulletin No.135216/1990 discloses a kind of resin combination, it comprises: (ⅰ) reaction product of polyphenylene oxides and unsaturated carboxylic acid or acid anhydrides, (ⅱ) polyepoxy compound, (ⅲ) curable epoxide catalyzer, and U.S. Patent No. 5001010 discloses a kind of resin combination, it comprises the polyphenylene oxides that (ⅰ) melt-processed is crossed, (ⅱ) polyepoxy compound and (ⅲ) curable epoxide catalyzer.
But, these compositions of in above-mentioned patent or patent application, advising, do not demonstrate sufficient improvement at the aspect of performance of anti-the trieline, therefore when this curable resin composition is tested, observed the considerable change of outward appearance (for example surfaceness or the like) in the boiling trieline.
A kind ofly can satisfy various performance requriementss simultaneously in order to develop, good chemical resistance for example, electrical property (as low-k and low dielectric dispersion coefficient), flame retardant resistance, dimensional stability, low Z-direction thermal expansivity and stable on heating polyhydroxyether resin composition, the inventor has done research extensively and profoundly.The result is, they have been surprised to find that a kind of comprising by polyphenylene oxides and a kind of unsaturated carboxylic acid or anhydride reaction reaction products resulting, at least a cyanurate, and the curable polyhydroxyether resin composition of optional Resins, epoxy, it has excellent in storage stability, film-forming properties and melt processable, and find, by curable polyhydroxyether resin composition is solidified, can obtain to have good chemical resistant properties, electrical property, dimensional stability, Z-direction thermal expansivity and the stable on heating polyhydroxyether resin composition that solidified.In addition, the inventor finds that by introduce fire retardant material and strongthener in composition, the flame retardant resistance of this polyhydroxyether resin composition and mechanical property have correspondingly been improved, but the above-mentioned premium properties of sacrificial compositions not.Based on these new discoveries, finished the present invention.
Therefore, an object of the present invention is to provide a kind of curable polyhydroxyether resin composition, it has excellent in storage stability, film-forming properties and melting model plasticity, and it can promptly solidify.
Another object of the present invention provides a kind of polyhydroxyether resin of solidified composition, it has good chemical resistance, electrical property (as low-k, low dielectric dispersion coefficient), flame retardant resistance, dimensional stability, low Z-direction thermal expansivity, and thermotolerance, it is in for example electricity and electronic industry, among space flight and the aircraft industry etc., well as dielectric materials, insulating material, heat-stable material etc.
Another purpose of the present invention provides a laminated material, it comprises a sheet metal and one deck solidified polyhydroxyether resin composition at least, and it can be used as single-clad board, double-sided printed-circuit board well, multilayer printed circuit board, flexible printed circuit board etc.
Above-mentioned and other purpose of the present invention, feature and advantage, from following detailed and appended claim, those skilled in the art will be appreciated that.
One aspect of the present invention provides a kind of curable polyhydroxyether resin composition, and it comprises:
(a) in the component (a) and (b) the curable polyhydroxyether resin of gross weight 98 to 40% weight, this resin comprise by polyphenylene oxides and unsaturated carboxylic acid or anhydride reaction and reaction product;
(b) in the component (a) and (b) at least a triallyl isocyanurate and the triallyl cyanurate of being selected from of gross weight 2 to 60% weight;
(c) with component (a), (b) and (c) a kind of resin combination of gross weight meter 0 to 90% weight, said composition comprises Resins, epoxy and solidifying agent, preferably the bis-phenol polyglycidyl ether Resins, epoxy of (ⅰ) bromination, (ⅱ) phenolic resin varnish and (ⅲ) phenol resins;
(d) with component (a), (b), (c) and (d) a kind of compound of gross weight meter 0 to 30% weight, this compound has at least one unsaturated double-bond and at least one epoxide group;
(e) with component (a), (b), (c), (d) and (e) strongthener of gross weight meter 0 to 90% weight.
Being used for polyphenylene oxides of the present invention can be represented by following logical formula I:
M is an integer of 1 or 2 in the formula, and J is the polyphenylene oxides chain, and the latter comprises the unit of being represented by following logical formula II;
Figure 921008589_IMG2
R in the formula 1, R 2, R 3And R 4Each represents a low alkyl group alone, an aryl, a haloalkyl, a halogen atom or a hydrogen atom;
When m was 1, Q represented a hydrogen, when m is 2, represented a bifunctional phenol compound's residue.This compound contains 2 phenolic hydroxyl groups, and in the ortho position and the contraposition of phenolic hydroxyl group not polymerisable substituting group is arranged.
In the logical formula II, R 1, R 2, R 3And R 4The example of low alkyl group comprises methyl, ethyl, n-propyl, sec.-propyl, normal-butyl, isobutyl-, sec-butyl etc.The example of aryl comprises phenyl etc.The example of haloalkyl comprises bromomethyl, chloro methyl etc.The example of halogen atom comprises bromine atoms, chlorine atom etc.
The representative example of Q comprise with following general formula (III-a) and (residue of expression of III-b):
A in the formula 1And A 2Each represents to contain the straight chained alkyl of 1 to 4 carbon atom alone; X represents replaced or unsubstituted aliphatic group, aryl that replaced or unsubstituted, aralkyl that replaced or unsubstituted, Sauerstoffatom, sulphur atom, alkylsulfonyl or carbonyl;
And straight line is represented across the key of a limit mid point of phenyl ring, as
Figure 921008589_IMG4
Shown in this example, the ortho position of expression phenolic hydroxyl group or the substituent bonding in the contraposition.
The special case of Q comprises the residue of representing with following general formula:
Figure 921008589_IMG5
Figure 921008589_IMG6
Can comprise by the polyphenylene oxides chain of the representative of the J in the logical formula I and to remove by leading to unit the unit that formula II represents, that represent by following logical formula IV:
Figure 921008589_IMG7
R in the formula 5, R 6, R 7, R 8And R 9Each represents hydrogen atom alone, halogen atom, low alkyl group, aryl or haloalkyl; And R 10And R 11Each represents hydrogen atom alone, alkyl, the alkyl of replacement, the aryl of aryl or replacement, but R 10And R 11Can not represent hydrogen atom simultaneously.
The unitary example of logical formula IV comprises:
Figure 921008589_IMG8
Except said units, the polyphenylene oxides chain can comprise such unit, and this unit is aggregated to polymerisable unsaturated link(age) monomer such as vinylbenzene, the methyl methacrylate-grafted of containing on the unit by top logical formula II and (IV) expression and obtains.
The preferred example of logical formula I polyhydroxyether resin only comprises by 2, the polymerization of 6-xylenol is resulting to gather (2,6-dimethyl-1,4-benzene oxygen), poly-(2,6-dimethyl-1,4-benzene oxygen) phenylethene grafted copolymer, 2,6-xylenol and 2,3, the multipolymer of 6-pseudocuminol, 2, the multipolymer of 6-xylenol and 2-methyl-6-phenylphenol, a kind of polyfunctional poly phenoxy resin, it is at bifunctional phenol compound Q(H) 2Exist down, make 2-methyl-6-phenylphenol polymerization and, for example be disclosed in and comprise logical formula II and (IV) unitary multipolymer in day disclosure special permission communique 301222/1988 and 297428/1989.
For the molecular weight of above-mentioned polyhydroxyether resin, preferably use 30 ℃ with 0.5 Grams Per Minute rise chloroformic solution measure viscosity number η sp/C be 0.1 to 1.0 polyphenylene oxides.As composition, mobile the taking seriously of molten resin wanted, for example soak material base as giving of multilayer circuit board, therefore preferably have the resin of little viscosity number.
Be used for component of the present invention (a) by above-mentioned polyphenylene oxides and unsaturated carboxylic acid or anhydride reaction and make.The suitable example of unsaturated carboxylic acid and acid anhydrides comprises vinylformic acid, methacrylic acid, maleic anhydride, fumaric acid, methylene-succinic acid, itaconic anhydride, glutaconic anhydride, citraconic anhydride etc.Wherein maleic anhydride, fumaric acid are preferred the uses.Reaction is carried out polyhydroxyether resin and unsaturated carboxylic acid or acid anhydrides heating 100 ℃ to 390 ℃ temperature range.In this reaction, free-radical initiator can coexist.Solution method and molten mixture method all can be used, but the molten mixture method is more suitable for purpose of the present invention, because implement this method easily with forcing machine.The consumption of unsaturated carboxylic acid or acid anhydrides calculates with 100 parts of polyphenylene oxides, is 0.01 to 5 weight part, and preferred value is 0.1 to 3.0 weight part.
Curable polyhydroxyether resin composition of the present invention comprises at least a cyanurate as another kind of effective ingredient, and the latter is selected from triallyl isocyanurate and triallyl cyanurate.Triallyl isocyanurate and triallyl cyanurate are the trifunctional monomers of using following general formula (V) and (VI) expression respectively:
Figure 921008589_IMG9
In the present invention, the triallyl isocyanurate of general formula (V) and the triallyl cyanurate of logical formula VI can use separately, also can use together.If use together, ratio of mixture is undemanding, and can change in wide scope.
As Resins, epoxy of the present invention (C), can use the known Resins, epoxy that contains at least two epoxide groups.The representative example of Resins, epoxy comprises by phenol or alcohol reacts with Epicholorohydrin and the Racemic glycidol ether type epoxy that makes, the Resins, epoxy of the glycidyl ester type that generates by amine or cyanuric acid and Epicholorohydrin reaction, the Resins, epoxy that forms through oxidation by the two keys in the molecular chain etc.They can use together.Can be about them with reference to Japan's " Resins, epoxy handbook " (editing) by Nikkan Kogyo Shimbunsha publication in 1987 by Masaki Shinpo.
In the present invention, among these Resins, epoxy, preferably bis-phenol polyglycidyl ether Resins, epoxy (ⅰ) is used with phenolic resin varnish (ⅱ), to obtain improved flame retardant resistance, chemical resistant properties etc.
General formula (VII) expression below brominated bisphenol polyglycidyl ether Resins, epoxy (ⅰ) (being used as the part of curable polyhydroxyether resin composition component (C) in the present invention) is available:
Figure 921008589_IMG10
P represents 0 to 4 integer in the formula, and q is that mean value is 0 to 1 number, A 3Representative contains the low alkyl group of 1 to 3 carbon atom.
In these combinations, most preferred combination is among the present invention: P equals 2, and q is actually 0, A 3It is an isopropylidene.
Can represent by following general formula (VIII) as the phenolic resin varnish of the some of component (C) with the brominated bisphenol polyglycidyl ether:
Figure 921008589_IMG11
N is that mean value is 0 to 10 number in the formula, A 4Represent hydrogen atom, methyl or bromine atoms.
Wherein most preferably using n is that mean value is 0 to 5 number, A 4That of expression hydrogen atom or methyl is a kind of.These novolac epoxys can use separately or together.
As solidifying agent, can use commonly used those of Resins, epoxy, Polyamine Type solidifying agent for example, anhydride type curing agent, polyphenol type solidifying agent, the anionoid polymerization catalytic curing agent, the cationoid polymerisation catalytic curing agent, latent curing agent, or the like.(about the detailed description of solidifying agent, can be referring to " the Resins, epoxy handbook " edit by Masaki Mr. Shimpo published by Nikkan Kogyo Shimbunsha in 1987, " Resins, epoxy introduction " of showing by Soichi Muroi and Syuichi Ishimura of publishing by Koubunshi Kankokai or the like).These solidifying agent can use separately or together.In these solidifying agent, phenol resins (ⅲ) is preferred.
Phenol resins (ⅲ) preferably has at least two phenolic hydroxyl groups in a molecule, and be known as novolac resin and first phase resin, they are by using phenol separately or altogether, cresols, xylenol, propyl phenoxy, amylic phenol, butylphenol, octyl phenol, phenylphenol, allyl phenol, dihydroxyphenyl propanes etc. are synthesized into, wherein most preferably use in the present invention by novolac resin or the first phase resin that uses butylphenol or phenylphenol to be synthesized into, because in these resins and component (a), (b), (c) (ⅰ) and (c) (ⅱ) have good consistency.They can use separately or together.
As the preferred example that Resins, epoxy combines with solidifying agent, they can be brominated bisphenol polyglycidyl ether Resins, epoxy (ⅰ), phenolic resin varnish (ⅱ), and the combination of phenol resins (ⅲ).
Brominated bisphenol polyglycidyl ether Resins, epoxy (ⅰ) plays fire retardation, and phenolic resin varnish (ⅱ) plays by the increase cross-linking density and improves chemical resistance and stable on heating effect.In addition, phenol resins (ⅲ) is as these curing agent for epoxy resin.In the storage process of these resins with mixture state, phenol resins has the feature better than other solidifying agent package stabilities.
Be used for the example with component (d) of at least one epoxy group(ing) and at least one unsaturated double-bond of the present invention and comprise allyl glycidyl ether, glycidyl acrylate, glycidyl methacrylate, or the like.
Curable polyphenylene oxides of the present invention (often abbreviating " PPE " later on as) resin combination comprises (a): in the curable polyhydroxyether resin of component (a) and 98 to 40% weight of gross weight (b), (b): at least a cyanurate of component (a) and 2 to 60% weight of gross weight (b), the latter is selected from triallyl isocyanurate, triallyl cyanurate.When the ratio of component (b) was less than 2% weight, solidified polyhydroxyether resin composition can not obtain satisfied chemical resistant properties improvement.On the other hand, when the ratio of component (b) surpassed 60% weight, the specific inductivity that solidifies the polyhydroxyether resin composition of gained had increased unfavourably, and is highly brittle.In addition, when component (a) and ratio (b) exceeded above-mentioned scope, the film that is formed by the casting method trended towards being highly brittle, and surfaces of tacky, no matter whether this film contains strongthener.
The ratio of component (c), in component (a) and (b) and gross weight (c), in the scope of 0 to 90% weight, preferred value is 10 to 90% weight, more preferably value is 40 to 80% weight.When the ratio of component (c) surpassed 90% weight, the PPE resin combination that solidifies of gained had poor dielectric properties unfavourably.
The ratio of brominated bisphenol polyglycidyl ether Resins, epoxy (ⅰ) and phenolic resin varnish (ⅱ) is determined with the chemical resistant properties of resin combination of the present invention and the whole machine balancing of flame retardant resistance.When the ratio of phenolic resin varnish increased, chemical resistant properties had obtained improvement.But preferably use brominated bisphenol polyglycidyl ether Resins, epoxy, so that make the amount of bromine, in component (a) and (b) and gross weight (c), in the scope of 5 to 20% weight.When the amount of bromine surpassed 20% weight, the PPE resin combination that solidifies of gained had poor thermostability unfavourably.
As for the ratio of the phenol resins (ⅲ) in the component (c), preferably, for the epoxy group(ing) total amount in the above-mentioned Resins, epoxy, the amount of phenolic hydroxyl group should be controlled at 0.6 to 1.5 in weight range, and preferred value is 0.6 to 1.2 equivalent.
The ratio of component (d), with component (a), (b), and total amount meter (c) and (d), in the scope of 0 to 30% weight, preferred value is 0.1 to 20% weight, more preferably value is 0.2 to 6% weight.When the ratio of component (d) surpasses 30% weight, can not obtain satisfied chemical resistant properties and improve.
In order to improve physical strength, comprise component (a) and (b) have a good film forming properties, handling property in the curable PPE resin combination of the present invention of package stability and melting model plasticity, adds the strongthener as component (e); Perhaps, except component (a) with (b), also comprise component (c) or also comprise in component (c) and the curable resin composition (d), add strongthener as component (e).
The representative example that can be used for strongthener of the present invention comprises glass fabric, roving fabric for example, woven fiber glass, severing of glass pad, glass surface pad and glass nonwoven fabric; Ceramic fiber fabric, asbestos fabric, metal fibre interlacement, and synthetic or natural inorganic fibre fabric; The fabric weaving of synthon or nonwoven, polyvinyl alcohol fiber for example, trevira, polytetrafluoroethylene fiber, acrylic fibre, and Kevlar; Natural textile fabric, for example cotton, burlap and felt; Carbon fibre fabric; And natural fiber cellulose fabric for example kraft paper, cotton paper and contain the paper of glass fibre.These strongtheners can separately or merge use.
In curable PPE resin combination of the present invention, the amount of component (e) is with component (a), (b), (c), total amount meter (d) and (e) is generally from 0 to 90% weight, preferred value from 5 to 90% weight more preferably are worth from 10 to 80% weight, most preferably are worth from 20 to 70% weight.Consider that from final dimensional stability of solidifying the PPE resin combination and physical strength preferably the amount of component (e) is not less than 5% weight.On the other hand, when the amount of component (e) surpassed 90% weight, the final dielectric properties of solidifying the PPE resin combination may be bad.
The sheet metal representative example that is used for formation parent metal thin slice of the present invention comprises copper foil, aluminum slice etc.Thickness to sheet metal is not done special restriction, in general, and from 5 to 200 microns of the thickness of sheet metal, from 5 to 100 microns of preferred values.
By component (a), (b), (c) not strict with the method that (d) obtains resin combination.Curable PPE resin combination of the present invention can be for example by component (a), (b), (c) and (d) makes through melt blending or solution blending.As component (a), (b), (c) and (d) ooze when mixing at mixture, the solvent of use is selected from hydrocarbon that halogen replaces for example methylene dichloride, chloroform and trieline, and tetrahydrofuran (THF), aromatic hydrocarbon be benzene, toluene and dimethylbenzene for example, and their mixture.
Curable PPE resin combination of the present invention can be shaped to or be cured as before be used for various application scenarios and give fixed shape.The method of moulding is unrestricted.Usually, moulding can be carried out with general casting mold method, and wherein curable PPE resin combination is dissolved in the above-mentioned solvent, and be shaped to and give fixed shape, or coming moulding with general heat fusing method, wherein curable PPE resin combination is heated fusion, is shaped to then to give fixed shape.
Under the situation of general casting method, curable PPE resin combination is dissolved in the solvent usually, becomes concentration 1 to 50% weight.The shape of moulded products is unrestricted.Usually, curable PPE resin combination of the present invention may be molded to sheet or film.In the occasion of film, coating of the solution of curable PPE resin combination or curtain coating arrive for example stainless steel plate of base material, sheet glass, and polyamide layer is on polyester film or the polyethylene film.The thickness of coating or the curtain coating PPE resin combination solution to the base material is unrestricted.The thickness that this thickness is desired to reach according to the gained film usually and the PPE resin combination substrate concentration of solution decide.After coating or the curtain coating, the solvent in the solution passes through dry air, hot-air dry, and vacuum-drying etc. are removed, and have so generated film.The film that so forms is peeled from base material.If desired, the film that obtains like this can be removed the solvent that remains in the film once more.But, always do not require from film, to remove fully and desolvate.Remove the temperature of desolvating and should not surpass the temperature that base material can stand.Usually, except that desolvating and under about 23 ℃ to about 150 ℃, carrying out.
When the situation of heat fusing method, the moulding of the PPE resin combination of heating and melting can be by common for example injection molding of melt molding method, and die casting is extruded, and pressure forming waits to be carried out.Melt molding begins to carry out under the solidified temperature but be lower than curable PPE resin usually at the second-order transition temperature that is higher than curable PPE resin.
Above-mentioned casting method and heat fusing method can be used separately, and these methods also can be used together.For example, the film of PPE resin combination can be obtained by the casting method, with several pieces or tens of film stack together, makes their mutual fusions with melt molding rule such as compression moulding method then, obtains the sheet of PPE resin combination thus.
Strongthener preferably is incorporated among the curable PPE resin combination, and this composition comprises component (a), (b), also can comprise component (c), and component (c) and (d) is as described below.Curable PPE resin combination at first is dissolved in the above-mentioned solvent, and the solution with gained floods strongthener then.Dipping normally floods strongthener in this solution, or this solution is coated on the strongthener and carries out.
If desired, dipping can repeat for several times, or carries out by this way, promptly prepares the solution of different ingredients and concentration, handles strongthener continuously with these solution, thinks strongthener with the giving of PPE resin combination that contain that obtains containing required amount of resin.
Curable PPE resin combination of the present invention can for example solidify by heating, and is as described below.In solidification process, take place crosslinked.In order to reduce the crosslinking reaction of temperature of reaction and promotion unsaturated double-bond, free radical polymerization initiator can be incorporated in the curable PPE resin combination that contains component of the present invention.
The amount that can be used for initiator of the present invention is 100 listed as parts by weight with component (a) and total amount (b), and preferred value is 0.1 to 10 weight part, and more preferably value is 0.1 to 8 weight part.
As free radical polymerization initiator, both can use superoxide as initiator, also can use non-peroxide initiator.The representation example of radical polymerization peroxide initiator comprises: superoxide, benzoyl peroxide for example, cumene hydroperoxide; 2,4-dimethyl-hexane-2,5-dihydro-peroxidase; 2,5-dimethyl-2,5-two (tert-butyl peroxide) hexin-3; two-tert-butyl superoxide, tert-butyl cumyl peroxide, α; α '-two (the tert-butyl peroxide--sec.-propyl) benzene; 2,5-dimethyl-2,5-two (tert-butyl peroxide) hexane; dicumyl peroxide; two-t-butyl peroxy isophthalic acid ester, tert-butyl peroxy benzoate, 2; two (tert-butyl peroxide) butane of 2-; 2, two (tert-butyl peroxide) octanes of 2-, 2; 5-dimethyl-2; 5-dibenzoyl peroxide) hexane, two (trimethyl silyl) superoxide and trimethyl silyl triphenyl silyl superoxide etc.The representative example of non-peroxide initiator comprises 2,3-dimethyl-2,3-diphenyl butane etc.But, the solidified free radical polymerization initiator that is used for the curable PPE resin of the present invention be not limited to above-mentioned these.
Except above-mentioned free-radical initiator, also can join and comprise component (c) or comprise component (c) and composition (d) being used for epoxy group(ing) solidified promotor, method be they to be joined comprise in component of the present invention (a) and the composition (b).
As being used for solidified promotor, can use known those, as amine compound, imidazolium compounds nitrogen-containing heterocycle compound (for example two heterocycle undecylenes of phenodiazine), organic phosphine compound, the complex compound of organic phosphine and organic boron, the complex compound of amine and organic boron, quaternary ammonium compound quaternary phosphonium compound, or the like.See also the chapter 4 of " Resins, epoxy: latest developments " edit by Hiroshi Kakiuchi that nineteen ninety published by Shokodo, and the catalogue about the detailed technology of epoxy resin cure usefulness promotor wherein.
Contain the situation of strongthener (e) at composition, coupling agent can be added in the resin combination, to improve the binding ability at the interface between resin combination and the strongthener.As coupling agent, can use general coupling agent, silane coupling agent for example, titanic acid ester type coupling agent, aluminium type coupling agent, zircoaluminate, or the like.
Comprising component (a) and (b), or component (a), in the curable PPE resin combination of the present invention (b) and (e), can add fire retardant to improve the flame retardant resistance of composition, and don't sacrifice its premium properties, for example film-forming properties, package stability and melting model plasticity etc.Fire retardant is selected from and contains inferior phosphorus fire retardant, chlorine-containing flame retardant, and brominated flame-retardant.They can merge use.For fire retardant, can be with reference to " flame retardant resistance of polymkeric substance " by Hitoshi Nishizawa work of publishing by Taiseisha in Japan in 1987 (" Polymer NO NannenKa(Fire retardation of polymer) ") book.
In these fire retardants, bromo-diphenyl ether is most preferred.The representative example of bromo phenyl ether comprises tetrabromodiphenyl ether, hexabromo phenyl ether, octabromodiphenyl ether, and decabromodiphynly oxide.
In curable PPE resin combination of the present invention, also can comprise auxiliary flame retardant, so that further improve composition, the flame retardant resistance that contains the strongthener composition that particularly describes below.Any auxiliary flame retardant commonly used all can be used for the present invention.Antimony compounds is preferred, for example Sb 2O 3, Sb 2O 5And NaSbO 31/4H 2O.
In composition of the present invention, if wish, also can add filler and/or additive, so that give composition, as long as these fillers and additive do not play a part bad to the performance of composition with other desirable performance.The representative example of filler comprises carbon black, silica, and alumina, talcum, mica, granulated glass sphere, Hollow Glass Sphere, or the like.The representative example of additive comprises oxidation inhibitor, softening agent, and pigment, dyestuff, tinting material, or the like.In addition, thermosetting resin or thermoplastic resin for example PPE can be separately or merge and add.
Solidified PPE resin combination can be cured foregoing curable PPE resin combination and obtain.The solidified method can be chosen wantonly, can for example use and heat, exposes to the open air under light, exposes to the open air in the inferior method of electron beam.
When using heating method to solidify, its temperature depends on whether have free-radical initiator or solidifying agent, and their type.Temperature is generally selected in 80 to 300 ℃ scope, preferably 120 to 250 ℃.Be 1 minute to 10 hours heat-up time, preferably 1 minute to 5 hours.
The PPE resin combination that solidified of the present invention can be used as film, or at least one the lip-deep one deck at least that comprises a sheet metal and place this sheet metal laminated material of curable resin composition layer.
The PPE of the curing resin combination that contains strongthener of the present invention can for example be made in the following method.The sheet that multilayer is contained the curable PPE resin combination of strongthener is stacked, and carries out pressure forming and is shaped to one, and carry out thermofixation simultaneously, to obtain the PPE of a curing resin combination that contains strongthener with desired thickness.When the curable PPE resin combination sheet that will contain strongthener was stacked, one or more layers is in type can be randomly to lump together with above-mentioned flap from the curable PPE resin combination film that does not contain strongthener.In addition, the PPE of the curing resin combination that the strongthener of various layer structure is arranged, can obtain by a complex body is carried out pressure forming, and this complex body comprise contain strongthener solidify PPE resin combination and curable PPE resin combination, and/or do not contain the curable PPE resin combination of strongthener.
As mentioned above, moulding and thermofixation are once finished at thermocompressor usually.But moulding and thermofixation also can separately be carried out.In other words, curable PPE resin combination is piled up and be depressed into together, make the complex body of moulding, heat-treat again, or the like.Influence curing with this.Moulding and curing are usually in temperature range similar to the above, in 0.1 to 500 kilograms per centimeter 2Pressure under carried out 1 minute to 10 hours, preferred value is in 1 to 100 kilograms per centimeter 2Pressure under carried out 1 minute to 5 hours.
Another aspect of the present invention provides a kind of rhythmo structure, and it comprises that parent metal thin slice and at least one place at least one lip-deep layer of curable resin composition of sheet metal.This solidified resin combination be the above-mentioned polyhydroxyether resin of curing composition.When having at least two on rhythmo structure at least one surface at metal base during solidified resin combination layer, solidified resin combination layer can be same or different, and this is placed on another above layer.
As mentioned above, rhythmo structure of the present invention can have a solidified resin combination layer.Another situation is that laminate structure also can have at least two solidified resin combination layers.When rhythmo structure of the present invention has at least two during solidified resin combination layer, these layers both can be same, also can be different, and this is placed on another above layer.
In addition, the curable resin composition layer can place on the surface of parent metal thin slice, also can place on two surfaces of parent metal thin slice.
Lamination of the present invention also can comprise the additional metals laminated layer.Constitute the lamellose sheet metal representative example of additional metals and be those identical with above-mentioned parent metal thin slice.When having one on rhythmo structure at least one surface at the parent metal thin slice during the curable resin composition layer, the additional metals laminated layer places the outside surface of curable resin composition layer.On the other hand, when laminate structure has at least two on curable resin composition layer at least one surface at the parent metal thin slice time, the additional metals laminated layer places the outside surface of the outmost layer of curable resin composition and/or at least one between curable resin composition layer and the layer of curable resin composition that is adjacent.
Prepare the method for rhythmo structure of the present invention and be not particularly limited.For example, the formation of rhythmo structure can be piled up the present invention who gives determined number curable PPE resin combination film and sheet metal, to form lamination, under pressure, heat, so that PPE resin combination film hardening, and simultaneously sheet metal is bonded on the film.Curable PPE resin combination film both can contain strongthener, also can not contain.The curable PPE resin combination film that contains strongthener can use with the curable PPE resin combination film that does not contain strongthener.Curable PPE resin combination film also can contain fire retardant or contain fire retardant and auxiliary flame retardant.
As mentioned above, the additional metals laminated layer can be provided on the surface of rhythmo structure.When rhythmo structure comprises at least two during the curable resin composition layer, the additional metals laminated layer can be provided on two surfaces of laminate structure, and/or the middle layer that the additional metals laminated layer also can be used as rhythmo structure provides.
In addition, following is possible: at least two the solidified rhythmo structure by curable PPE resin combination layer one is placed on another, then under pressure, solidify.
In addition, also be possible below: solidified rhythmo structure and sheet metal place on another one by curable PPE resin combination or tackiness agent, then solidify under pressure.The example of tackiness agent comprises epoxy resin binder, acrylic resin adhesive, phenol resin adhesive, cyanoacrylate adhesive etc.But the tackiness agent of cured laminate structure is not limited to above-mentioned example to can be used for bonding to sheet metal.
The formation of lamination and the curing of curable lamination are carried out simultaneously with pressing machine usually.On the other hand, the formation of lamination and curing also can separately be carried out, be that curable PPE resin combination and sheet metal pile up and mold pressing at a lower temperature, to form the lamination of uncured or semicure, then under higher temperature, heat-treat, high-energy ray irradiations etc. are so that lamination solidifies.Be used to make uncured or the thermal treatment of semicure lamination generation solidified is carried out in being similar to said temperature scope and pressure range usually.
Rhythmo structure of the present invention has the above-mentioned premium properties that the PPE resin combination is had that solidified of the present invention.In addition, rhythmo structure is in layer of metal foil with good bonding strength arranged between the curable resin composition layer.When using the curable PPE resin combination of Resins, epoxy, layer of metal foil and the bonding strength between the curable resin composition layer can be compared with only using the prepared rhythmo structure of Resins, epoxy.
The feature of curable polyhydroxyether resin composition of the present invention is as follows:
1. this curable polyphenylene oxides provides a kind of resin combination of economy well, because the reaction product of the polyphenylene oxides that curable PPE resin comprises and unsaturated carboxylic acid or acid anhydrides can make at low cost with forcing machine etc.
2. although general PPE has poor film forming properties aspect solvent cast, when above-mentioned reaction product used solvent to carry out film casting, above-mentioned reaction product had good film forming properties.Can obtain having for example non-adhering surfaces of good handling property, the film of smooth surface etc. and matrix material thus.
3. this curable polyhydroxyether resin composition has good flowability when mold pressing, because composition comprises the combination of Resins, epoxy and solidifying agent, preferred special Resins, epoxy combines with phenol resins, and comprises triallyl isocyanurate or the triallyl cyanurate with softening agent effect.In addition, when curable PPE resin comprised component (d), it had more good flowability.
4. this curable polyhydroxyether resin composition has good storing stability.When curable PPE resin combination when storing 3 months for 23 ℃, the PPE resin still can keep good flowability.When the resin combination of storing solidifies, do not observe its performance and reduce.
5. this curable polyhydroxyether resin composition when cured, have good thermotolerance and chemical resistant properties, this is because every kind of component that the PPE resin combination comprises has good consistency each other, and when cured, curable PPE resin has a second-order transition temperature.
By component of the present invention (a) and (b) or component (a), (b) and (e) PPE of the curing resin combination of preparation has following feature.Solidify the PPE resin combination at first, and had good chemical resistance.It is believed that this is that the reaction product of triallyl isocyanurate or triallyl cyanurate and polyphenylene oxides and unsaturated carboxylic acid or acid anhydrides can be compatible equably, forms the cause of interpenetrating polymer networks.Secondly, solidified the PPE resin combination and had superior dielectric properties.The 3rd, solidified the PPE resin combination and had good resistance toheat, the excellent heat resistance energy when particularly welding because when solidify fusion welding that the PPE resin combination is immersed in 260 ℃ bathe in the time, the outward appearance of not observing it has abnormal phenomena.When solidified PPE resin combination contains strongthener, solidified the PPE resin combination except showing above-mentioned performance, also show good mechanical property and dimensional stability.In addition, when using, solidified the PPE resin combination and become matrix material when fire retardant and auxiliary flame retardant (preferably polybromodiphenyl ether is as fire retardant, and weisspiessglanz is as auxiliary flame retardant) with excellent flame retardancy with strongthener.If the superimposed outermost layer at matrix material of copper foil, then laminated material can be used as deposited copper laminated plate etc.
By component (a), (b) and (c) or by component (a), (b), (c) and the curable resin composition of (e) making have following feature:
At first, because solidified PPE resin combination comprises component (c) Resins, epoxy and solidifying agent, because component (a), (b) and (c) can be compatible on molecular level, so solidified PPE resin combination has a second-order transition temperature.Solidified the PPE resin combination and had the same high second-order transition temperature of reaction product with polyphenylene oxides and unsaturated carboxylic acid or acid anhydrides, although it has comprised the low Resins, epoxy of second-order transition temperature.Therefore, solidify the PPE resin combination and when welding, had good thermotolerance and chemical resistant properties.Secondly, when solidified PPE resin combination comprised strongthener, solidified PPE resin combination had been because its PPE component has also shown good mechanical property, and dimensional stability and superior dielectric properties are for example greater than 4 specific inductivity.The 3rd, solidified the PPE resin combination and had good flame retardant resistance, because it comprises bromated Resins, epoxy.The 4th, solidify PPE resin combination and sheet metal and had good cementability and low water absorbability.
By component (a), (b), (c) and (d) or component (a), (b), (c), (d) with the PPE of the curing resin combination that (e) prepares, with by component (a), (b), (c) or by component (a), (b), (c) compare with the above-mentioned PPE resin combination that solidified of (e) system, except the above-mentioned feature of solidifying the PPE resin combination, also has better dimensional stability, low especially Z-axial thermal expansion coefficient.Promptly it is believed that, solidified PPE resin combination can form more intensive three-dimensional structure, because compatible each other component (a) on molecular level, (b), (c) and (d) in curing schedule, by component (d), between these components, produce chemical bond, and form a single polymkeric substance.
Material of the present invention can perform well in electricity and electronic industry owing to have above-mentioned feature, and fields such as space flight and aircraft industry are as dielectric materials, insulating material, heat-stable material and structured material.Specifically, material of the present invention can be used as single-clad board well, double-sided printed-circuit board, multilayer printed circuit board, flexible printed circuit board, semi-rigid circuit card, the circuit card with metal matrix, multilayer printed circuit board give the material that soaks material base etc.
In addition, material of the present invention can be no more than 100 microns high density circuit board as the width between circuit well, and layer insulation thickness is no more than 200 microns multilayer circuit board, the material of the adhesives that the packing circuit plate is used etc., because it has thermotolerance, low wet fastness and insulativity.
Below, the present invention is described in more detail with reference to embodiment, but these examples can not be interpreted as the restriction to invention scope.
Reference example 1
To be 0.54(rise chloroformic solution at 30 ℃ with 0.5 Grams Per Minute measures with 100 weight part viscosity number η sp/C) poly-(2,6-dimethyl-1,4-benzene oxygen), 1.5 the weight part maleic anhydride, 1.0 weight parts 2,5-dimethyl-2,5-two (tert-butyl peroxide) hexane (Perhexa 25B, make by Nof Corp. of Japan and to sell), at room temperature do blending, then mixture being 300 ℃ with twin screw extruder at barrel zone temperature is to extrude under 230 rev/mins the condition with screw speed.Resulting polymers is called polymer A.
Reference example 2
100 weight part difunctionality polyphenylene oxides (rise chloroformic solution at 30 ℃ with 0.5 Grams Per Minute, recording viscosity number η sp/c is 0.40) and 2 weight part maleic anhydrides are done blending.Polyphenylene oxides wherein is 2, and two (3, the 5-dimethyl-4-hydroxyphenyl) propane of 2-exist down, and by 2, the 6-dimethyl phenol obtains through oxypolymerization.Then mixture is extruded in the mode identical with reference example 1.Resulting polymers is called polymer B.
Reference example 3
100 weight parts are risen chloroformic solution at 30 ℃ with 0.5 Grams Per Minute, the viscosity number η sp/c that records be 0.31 poly-(2,6-dimethyl-1,4-benzene oxygen), 1.5 weight part maleic anhydrides, with 1.0 weight parts 2,5-dimethyl-2,5-two (tert-butyl peroxide) hexane (Perhexa 25B is sold by Nof Corp.'s manufacturing of Japan), at room temperature do blending, then this mixture is extruded in the mode identical with reference example 1.The polymkeric substance of gained is called polymkeric substance C.
The various components that are used for following each embodiment are as follows:
Resins, epoxy:
(1) (AER331 is by industrial of the Asahi Chemical Industry produce and market of Japan for the dihydroxyphenyl propane tetraglycidel ether epoxy resin; Epoxy equivalent (weight): 189),
(2) (AER711 is by industrial of the Asahi Chemical Industry produce and market of Japan for low brominated bisphenol A tetraglycidel ether epoxy resin; Epoxy equivalent (weight): 475; Bromine content: 20% weight),
(3) (AER735 is by industrial of the Asahi Chemical Industry produce and market of Japan for high brominated bisphenol A tetraglycidel ether epoxy resin; Epoxy equivalent (weight): 350; Bromine content: 48% weight),
(4) (ECN273 is sold by chemical industrial company of the Asahi Chemical Industry manufacturing of Japan cresol-novolak varnish Resins, epoxy; Epoxy equivalent (weight): 217),
(5) phenolic resin varnish (EPN1138 is sold by Japanese vapour Ba-Jia Ji company manufacturing of Japan).
Phenol resins:
(1) tert-butyl phenol-formaldehyde A (PS2657, PS2768 are sold by the manufacturing of the flourish chemical industrial company of the group of Japan),
(2) phenylphenol Novolac resin (PS2880 is sold by the manufacturing of the flourish chemical industrial company of the group of Japan),
Initiator:
2,5-dimethyl-2,5-two (tert-butyl peroxide) hexin-3(Perhexyne 25B is sold by Nof Corp.'s manufacturing of Japan).
Solidifying agent except that phenol resins:
2-methyl-4-methylimidazole: 2E4MZ,
Glyoxal ethyline: 2MZ,
4,4 '-diaminodiphenyl-methane: DDM.
Fire retardant:
Decabromodiphynly oxide (AFR-1021 is sold by Asahi Glass (glass) the company manufacturing of Japan).
Auxiliary flame retardant:
Sb 2O 3(PATOX-M is sold by the NSK company manufacturing of Japan),
Sb 2O 5(NA-4800 is sold by the daily output chemical industrial company manufacturing of Japan).
Woven fiber glass:
48 gram/rice 2Or 105 gram/rice 2Woven fiber glass, make by E glass.
87 gram/rice 2Woven fiber glass is made by D glass.
Embodiment 1～7
According to the prescription shown in the table 1 every kind of component is dissolved in the chloroform, this mixture is poured on the Teflon(trade mark) on the plate, to form film.The thickness of gained film is about 100 microns, and has good film-forming properties.Do not observe surfaces of tacky etc.
In air oven, after the drying,, be about 1 millimeter solidify material to obtain thickness film moulding and curing in vacuum press.In embodiment 1 to 4, film solidified 30 minutes at 200 ℃.In embodiment 5 to 7, film solidified 2 hours at 180 ℃.When solidify material boiled 5 minutes in trieline, the outward appearance of solidify material was not observed variation.
Comparative Examples 1 and 2
The polyphenylene oxides that is used as raw material in reference example 1 and 2, triallyl isocyanurate or triallyl cyanurate, and initiator according to the prescription shown in the table 1, mix with the Henschel mixing machine.This mixture carries out moulding and solidified 30 minutes with pressing machine at 200 ℃, is about 1 millimeter solidify material to obtain thickness.When solidify material boiled in trieline 5 minutes, observe to expand and warpage.
Comparative Examples 3
Except without triallyl isocyanurate and the initiator, carry out 7 identical operations with embodiment.When the solidify material of gained seethed with excitement in trieline 5 minutes the time, observe and expand and warpage.
Embodiment 8 to 13
According to the prescription shown in table 2 and the table 3, the dissolving of every kind of component or be dispersed in the trieline.Woven fiber glass is immersed in the solution of gained like this, so that flood with mixture, and dry in air ovens.In embodiment 8, use 48 gram/rice 2The E woven fiber glass, in embodiment 10 to 12, use 87 gram/rice 2The D woven fiber glass, in all the other embodiment, use 105 gram/rice 2The E woven fiber glass.All not being clamminess in the surface of the curable composites that the ownership system gets, and all has good handling property.
When the composite material solidification that piles up, above-mentioned matrix material is piled up thickness into about 0.8 millimeter.The copper foil of 35 micron thickness is placed on each surface of piling up matrix material.Carry out moulding and curing with pressing machine, to obtain to apply the copper laminated material.The condition of cure of each embodiment is shown in Table 4.In all embodiments, pressure is 40 kilograms per centimeter 2In all embodiments, Resin Flow is good when compression.
The performance of the rhythmo structure of Huo Deing is measured according to following method in the above described manner.As shown in table 4, obtained satisfied result.
1. the performance of anti-trieline
Cut out from the rhythmo structure of removing copper foil and to be of a size of 25 millimeters * 25 millimeters sample.Sample is immersed in the ebullient trieline 5 minutes.Its outward appearance that detects by an unaided eye is to have determined whether any variation.
2. specific inductivity and dielectric dispersion coefficient
Under 1MHz, measure.
3. in the thermotolerance of welding in bathing
Be of a size of 25 millimeters * 25 millimeters sample from the rhythmo structure cutting-out of removing copper foil.This sample is floated over 120 seconds on the fusion welding in weldering is bathed, the fused scolder is heated to 260 ℃.Its outward appearance that detects by an unaided eye is to have determined whether any variation.
4. copper foil stripping strength
Downcut the tape of 20 mm wides, 100 millimeters long from rhythmo structure.On copper foil, leave parallel groove with 10 millimeters interval.The speed of the copper foil between the adjacent slot, to tear continuously perpendicular to the direction on test copper foil surface with 50 mm/min.Measure the stress that copper foil takes place with the tension force checking machine when cured resin is torn.Stress value measured when copper is torn fluctuates.Be illustrated in table 4, the copper foil stripping strength in 7,9 and 11 is the minimum value of this stress.
5. fire-retardant value
The measurement of fire-retardant value is the test method according to UL-94, and with long 127 millimeters, wide 12.7 millimeters sample carries out.
Comparative Examples 4 and 5
Except not using triallyl isocyanurate, outside triallyl cyanurate and the initiator, according in fact preparing rhythmo structure to embodiment 11 mode similar with 13.When measuring the anti-trieline performance of rhythmo structure, observe that turn white in the surface and woven fiber glass exposes.
Embodiment 14 to 16
According to the prescription shown in the table 5, every kind of component is dissolved in the chloroform.This mixture is poured on the Teflon(trade mark) on the plate, to form film.Thick about 100 microns of gained film has good film forming properties.The gained film is not observed phenomenons such as surfaces of tacky.
In air ovens after the drying, film 220 ℃ of moulding and solidified 30 minutes, is about 1 millimeter solidify material to obtain thickness in vacuum press.When solidify material boiled 5 minutes in trieline, solidify material was not observed and is changed.
Comparative Examples 6
As shown in table 5, except with AER331 as Resins, epoxy and with 2E4MZ as solidifying agent, and do not use outside triallyl isocyanurate or triallyl cyanurate and the initiator, carry out in the mode similar to embodiment 14 to 16.When gained solidify material boils 5 minutes in trieline, observe and expand and warpage.
Embodiment 17 to 22
According to the prescription shown in the table 6, with the dissolving of various components or be dispersed among the trieline.Woven fiber glass be immersed in the solution that so makes, flood to use mixture, and in air ovens drying.In embodiment 20, use 48 gram/rice 2The E woven fiber glass, in embodiment 18, use 87 gram/rice 2The D woven fiber glass, in all the other embodiment, use 105 gram/rice 2The E woven fiber glass.All not being clamminess in the surface of the curable composites of all gained, and all has good handling property.
When the composite material solidification that piles up, above-mentioned matrix material piles up the thickness into about 0.8 millimeter.The copper foil of 35 micron thickness is placed on each face of the matrix material that has piled up, with pressing machine moulding and curing, to obtain to apply the copper rhythmo structure.The condition of cure of each embodiment is shown in Table 6.In all embodiments, pressure is 40 kilograms per centimeter 2In all embodiments, Resin Flow is good when compression.
The performance of the rhythmo structure of Huo Deing is as shown in table 7 in the above described manner, is good.
When storing 3 months for 23 ℃, curable composites keeps good Resin Flow by all curable composites of these embodiment gained.When the curable composites of having stored is made lamination, do not observe degradation.
Measured dynamic viscoelastic spectrum, only observed one 220 ℃ second-order transition temperature by embodiment 17 to 22 gained rhythmo structure.This statement of facts, above-mentioned component are extremely compatible.As a result of, it is believed that and to obtain the chemical resistant properties that high second-order transition temperature is become reconciled.
Embodiment 17 resulting resin melt fluiditys are defined as follows:
With three chip sizes is that the curable composites sheet of 10 centimetres of 10 cm x is stacked, and three weight note is made W 1These three curable composites that pile up at 170 ℃ in 22 kilograms per centimeter 2Down pressurization 10 minutes of pressure.Cut out the tape of 10 * 10 cm sizes from the matrix material of pressing.The weight note of this tape is made W 2The resin melt fluidity is calculated according to following formula:
Resin melt fluidity=(W 1-W 2) * 100/W 1(%)
Comparative Examples 7 to 11
Curable composites and rhythmo structure be all according to the proportioning shown in the table 6, prepares in the mode identical with embodiment 17 to 22.When measuring the anti-trieline of rhythmo structure, in all Comparative Examples 7 to 11, all observe the surface and turn white and expose woven fiber glass.The rhythmo structure of Comparative Examples 7 to 11 has two second-order transition temperatures, a second-order transition temperature that belongs to Resins, epoxy, and another belongs to the second-order transition temperature of PPE.In Comparative Examples 7 to 9, in the thermal test in scolder is bathed, observe the surface and turn white.When this curable composites when 23 ℃ are stored, Comparative Examples 10 is after about 1 week, Comparative Examples 11 was observed the Resin Flow variation of depressing adding after about 1 month.
Embodiment 23 to 25
By with 0.2 part, 5 parts, 0.5 part of allyl glycidyl ether is added to respectively in the composition of embodiment 17,21 and 22, and makes curable composites and rhythmo structure (note is made embodiment 23 to 25 respectively).Rhythmo structure has and embodiment 17,21 and one of 22 identical chemical resistant propertiess, the thermotolerance in the welding fluid, dielectricity or the like.Rhythmo structure has identical with 22 with embodiment 17,21 second-order transition temperature at 220 ℃.These rhythmo structure have 156ppm/ ℃ respectively, the coefficient of linear expansion on the thickness direction of 117ppm/ ℃ and 120ppm/ ℃.These rhythmo structure have low thermal expansivity on thickness direction.They are better than not containing the rhythmo structure of allyl glycidyl ether.Therefore this rhythmo structure is favourable to making multilayer printed circuit board.
Embodiment 26 to 31
According to the prescription shown in the table 8, prepare curable composites and rhythmo structure in the mode identical with embodiment 17 to 22.Table 9 shows, because added allyl glycidyl ether, so the thickness direction thermal expansivity has reduced.Therefore, comprise the rhythmo structure of allyl glycidyl ether for making the multilayer printed circuit board particularly advantageous.
Embodiment 32 to 37
Contain the curable composites of allyl glycidyl ether according to the formulation shown in the table 10, and contain the rhythmo structure of allyl glycidyl ether.In embodiment 32 to 34, use the mode identical with embodiment 17.In embodiment 35 to 37, use the mode identical with embodiment 28.
From the resin melt flow index of embodiment 17 be 4.0 with the contrast of the value (being shown in table 11) of embodiment 32 to 34, and from the resin melting index of embodiment 28 be 6.0 with the contrast of the value (being shown in table 11) of embodiment 35 to 37, can obviously find out, because add allyl glycidyl ether, the resin fusion fluidity of curable composites has increased.Therefore, use the printed circuit board (PCB) of the curable composites that contains allyl glycidyl ether to carry out lamination easily.In addition, owing to have low linear expansion with the rhythmo structure of the curable composites system that contains glycidyl allyl ether, the curable composites that therefore contains allyl glycidyl ether is preferably used as multilayer printed circuit board.
Figure 921008589_IMG12
Figure 921008589_IMG13
Figure 921008589_IMG14
Figure 921008589_IMG15
A) TAIC: triallyl isocyanurate,
TAC: triallyl cyanurate
Figure 921008589_IMG16
Figure 921008589_IMG17
A) TAIC: triallyl isocyanurate
TAC: triallyl cyanurate
Figure 921008589_IMG18
A) TAIC: triallyl isocyanurate
TAC: triallyl cyanurate
B) 0: outward appearance is good
X: observe and expand and warpage
Figure 921008589_IMG22
Figure 921008589_IMG23
A) TAIC: triallyl isocyanurate,
TAC: triallyl cyanurate.
Figure 921008589_IMG24
Figure 921008589_IMG25
A) TAIC: triallyl isocyanurate,
TAC: triallyl cyanurate
Table 7-a(is continuous)
A) store 3 months at 23 ℃
0: good
X: observe Resin Flow and reduce
B) 0: outward appearance is good
X: observe the surface turn white and woven fiber glass expose
C)-: do not survey
Figure 921008589_IMG28
Table 7-b(is continuous)
A) store 3 months at 23 ℃
0: good
X: observe Resin Flow and reduce
B) 0: outward appearance is good
X: observe the surface turn white and woven fiber glass expose
C)-: do not survey
Figure 921008589_IMG29
Figure 921008589_IMG30
Figure 921008589_IMG31
A) TAIC: triallyl isocyanurate
Figure 921008589_IMG32
Figure 921008589_IMG33
Figure 921008589_IMG34
Figure 921008589_IMG35
Figure 921008589_IMG36
Figure 921008589_IMG37
Figure 921008589_IMG38

Claims (25)

1, curable polyhydroxyether resin composition, it comprises:
(a). in component (a) and gross weight (b), the curable polyhydroxyether resin of the reaction product that contains polyphenylene oxides and one of unsaturated carboxylic acid and acid anhydrides of 98 to 40% weight;
(b). in component (a) and gross weight (b), at least a cyanurate that is selected from triallyl isocyanurate and triallyl cyanurate of 2 to 60% weight;
(c). with component (a), gross weight meter (b) and (c), the resin combination that contains Resins, epoxy and solidifying agent of 0 to 90% weight;
(d). with component (a), (b), gross weight meter (c) and (d), the compound with at least one unsaturated double-bond and at least one epoxy group(ing) of 0 to 30% weight;
(e). with component (a), (b), and (c), gross weight meter (d) and (e), the strongthener of 0 to 90% weight.
2, the curable polyhydroxyether resin composition of claim 1, component (c) wherein, (d) and (e) amount of each is 0.
3, by the curable polyhydroxyether resin composition prepared film of claim 2.
4, by the curable polyhydroxyether resin composition of claim 2 through solidifying the resulting polyhydroxyether resin composition that solidified.
5, by the curable polyhydroxyether resin composition prepared film of claim 4.
6, the curable polyhydroxyether resin composition of claim 1, with component (a), (b), (c), gross weight meter (d) and (e), wherein the amount of component (e) is 5 to 90% weight, component (c) and (d) each amount be 0.
7, by the curable polyhydroxyether resin composition of claim 6 through solidifying the resulting polyhydroxyether resin composition that solidified.
8, the curable polyhydroxyether resin composition of claim 1, wherein with component (a), (b), (c), gross weight meter (d) and (e), the amount of component (c) is 10 to 90% weight, component (d) and (e) each amount be 0.
9, claim 1 or 8 curable polyhydroxyether resin composition, wherein this Resins, epoxy comprises brominated bisphenol polyglycidyl ether resins (ⅰ) in the component (c), and phenolic resin varnish (ⅱ), and this solidifying agent is phenol resins (ⅲ).
10, the curable polyhydroxyether resin composition of claim 9, bromine content wherein is in 5 to 20% weight ranges.
11, by claim 8, the film of arbitrary curable polyhydroxyether resin preparation of compositions of claim 9 or claim 10.
12, by the arbitrary curable polyhydroxyether resin composition of claim 8,9 or 10 through curing and the polyhydroxyether resin of the curing composition with single glass transition temperature.
13, by the film that solidifies the polyhydroxyether resin preparation of compositions of claim 12.
14, claim 1, arbitrary curable polyhydroxyether resin composition of 8,9 or 10, wherein with component (a), (b), and (c), gross weight meter (d) and (e), the amount of component (e) is 5 to 90% weight, and the amount of component (d) is 0.
15, by the curable polyhydroxyether resin composition of claim 14 through curing and the polyhydroxyether resin of the curing composition with single glass transition temperature.
16, the curable polyhydroxyether resin composition of claim 1 is wherein with component (a), (b), (c), gross weight meter (d) and (e), the amount of component (c) is 10 to 90% weight, the amount of component (d) is 0.1 to 30% weight, and the amount of component (e) is 0.
17, the curable polyhydroxyether resin composition of claim 16, wherein in component (c), this Resins, epoxy comprises brominated bisphenol polyglycidyl ether resins (ⅰ), and phenolic resin varnish (ⅱ), and this solidifying agent is phenol resins (ⅲ).
18, the curable polyhydroxyether resin composition of claim 17, wherein the amount of bromine is in 5 to 20% weight ranges.
19, by arbitrary prepared film of curable polyhydroxyether resin composition of claim 16,17 or 18.
20, the polyhydroxyether resin of the curing composition that obtains through curing by arbitrary curable polyhydroxyether resin composition of claim 16,17 or 18 with single glass transition temperature.
21, by the film that solidifies the polyhydroxyether resin preparation of compositions of claim 20.
22, claim 1, arbitrary curable polyhydroxyether resin composition of 16,17 or 18, wherein with component (a), (b), and (c), gross weight meter (d) and (e), the amount of component (e) is 5 to 90% weight.
23, by the curable polyhydroxyether resin composition of claim 22 through curing and the polyhydroxyether resin of the curing composition with single glass transition temperature.
24, a kind of rhythmo structure, it comprises a parent metal thin slice and at least one places at least one lip-deep layer of curable resin composition of this sheet metal, this curable resin composition be claim 4,5,7,12,13,15, one of 20,21 or 23 the polyhydroxyether resin of curing composition, its prerequisite are when having at least two on composite structure at least one surface at this metal base during curing resin layer, these at least two the curable resin composition layer be the same or different, and these at least two of curable resin composition layer place on another.
25, the rhythmo structure of claim 24, it: (a). when one deck being arranged during curing resin layer on composite structure at least one surface at this parent metal thin slice,, the additional metals laminated layer is arranged being positioned on the outside surface of curable resin composition layer; (b). when two-layer at least curing resin layer is arranged on composite structure at least one surface at this parent metal thin slice, its all additional metals laminated layer is one of following: (ⅰ). be positioned at the outermost outside surface of curable resin composition layer, (ⅱ). and between one deck at least curable resin composition layer and the adjacent layer of curable resin composition.
CN92100858A 1991-01-11 1992-01-10 Curable polyphenoxy resin composition and film made therefrom Expired - Lifetime CN1036402C (en)

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JP3012581A JPH0737567B2 (en) 1991-01-11 1991-01-11 Curable resin composition and composite material and laminate using the same

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100363425C (en) * 2001-03-27 2008-01-23 通用电气公司 Thermosetting poly(arylene ether)-containing composition in powder form, process for its preparation and articles made therefrom
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CN101268522B (en) * 2005-09-21 2014-09-17 沙伯基础创新塑料知识产权有限公司 Electrical insulation method and insulated electrical conductor by coating poly(arylene ether) composition
TWI616475B (en) * 2012-11-19 2018-03-01 Nitto Denko Corporation Resin sheet
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WO2021026987A1 (en) * 2019-08-13 2021-02-18 瑞声声学科技(深圳)有限公司 Resin composition, prepreg, and related substrate
WO2021135789A1 (en) * 2019-12-31 2021-07-08 山东圣泉新材料股份有限公司 Novel poly(arylene ether) resin and preparation method therefor
CN114207021A (en) * 2019-07-17 2022-03-18 松下知识产权经营株式会社 Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board

Families Citing this family (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970705590A (en) * 1994-09-08 1997-10-09 샬크비즈크 피이터 코르넬리스; 페트 귄터 Containing epoxy resin composition comprising a copolymer of an ethylenically unsaturated anhydride and a vinyl compound (ALLYL-CONTAINING EPOXY RESIN COMPOSITION COMPRISING A COPOLYMER OF ANTHYLENICALLY UNSATURATED ANHYDRIDE AND A VINYL COMPOUND)
DE69629061T2 (en) * 1996-06-07 2004-05-13 Asahi Kasei Kabushiki Kaisha RESIN-CARRYING METAL FILM FOR MULTI-LAYER CIRCUIT BOARD, METHOD FOR THEIR PRODUCTION, MULTI-LAYER CIRCUIT BOARD, AND ELECTRONIC DEVICE
US6197898B1 (en) 1997-11-18 2001-03-06 General Electric Company Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent
CN1101420C (en) * 1997-11-25 2003-02-12 通用电气公司 Poly (phenylene ether) thermoset compositions
KR100356080B1 (en) * 1998-02-23 2002-10-12 아사히 가세이 가부시키가이샤 Thermosetting polyphenylene ether resin composition, cured resin composition obtained therefrom, and laminated structure
SG80588A1 (en) * 1998-04-04 2001-05-22 Gen Electric A curable polyphenylene ether-thermosetting resin composition and process
US6387990B1 (en) 1999-09-10 2002-05-14 General Electric Company Curable epoxy resin compositions with brominated triazine flame retardants
EP1218178B1 (en) * 1999-09-16 2004-01-07 Ga-Tek Inc. An adhesion promoting layer for use with epoxy prepregs
US6878782B2 (en) * 1999-12-01 2005-04-12 General Electric Thermoset composition, method, and article
US7235192B2 (en) 1999-12-01 2007-06-26 General Electric Company Capped poly(arylene ether) composition and method
US6627704B2 (en) 1999-12-01 2003-09-30 General Electric Company Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom
US6812276B2 (en) * 1999-12-01 2004-11-02 General Electric Company Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom
US6352782B2 (en) * 1999-12-01 2002-03-05 General Electric Company Poly(phenylene ether)-polyvinyl thermosetting resin
US6905637B2 (en) 2001-01-18 2005-06-14 General Electric Company Electrically conductive thermoset composition, method for the preparation thereof, and articles derived therefrom
US6521703B2 (en) 2000-01-18 2003-02-18 General Electric Company Curable resin composition, method for the preparation thereof, and articles derived thereform
JP4231976B2 (en) * 2000-03-30 2009-03-04 日本ゼオン株式会社 Curable composition and multilayer circuit board
US6306963B1 (en) 2000-05-08 2001-10-23 General Electric Co. Thermosetting resins and laminates
US6906120B1 (en) * 2000-06-20 2005-06-14 General Electric Poly(arylene ether) adhesive compositions
US6384176B1 (en) 2000-07-10 2002-05-07 General Electric Co. Composition and process for the manufacture of functionalized polyphenylene ether resins
US6897282B2 (en) * 2000-07-10 2005-05-24 General Electric Compositions comprising functionalized polyphenylene ether resins
JP2002265777A (en) 2001-03-12 2002-09-18 Matsushita Electric Works Ltd Polyphenylene oxide resin composition, prepreg, laminated board, printed wiring board and multi-layered printed wiring board
US6593391B2 (en) 2001-03-27 2003-07-15 General Electric Company Abrasive-filled thermoset composition and its preparation, and abrasive-filled articles and their preparation
US7022777B2 (en) * 2001-06-28 2006-04-04 General Electric Moldable poly(arylene ether) thermosetting compositions, methods, and articles
US20030078347A1 (en) 2001-08-28 2003-04-24 General Electric Company Triazine compounds, polymers comprising triazine structural units, and method
US6620885B2 (en) 2001-08-30 2003-09-16 General Electric Company Copolymers of functionalized polyphenylene ether resins and blends thereof
US6608166B2 (en) 2001-08-30 2003-08-19 General Electric Company Three-dimensional copolymers of polyphenylene ether resinsand sytrenic resins
US6500529B1 (en) 2001-09-14 2002-12-31 Tonoga, Ltd. Low signal loss bonding ply for multilayer circuit boards
US6783841B2 (en) 2001-09-14 2004-08-31 Tonoga, Inc. Low signal loss bonding ply for multilayer circuit boards
US6826830B2 (en) * 2002-02-05 2004-12-07 International Business Machines Corporation Multi-layered interconnect structure using liquid crystalline polymer dielectric
US20030215588A1 (en) * 2002-04-09 2003-11-20 Yeager Gary William Thermoset composition, method, and article
US6734259B1 (en) * 2002-10-24 2004-05-11 International Business Machines Corporation Resin composition with a polymerizing agent and method of manufacturing prepreg and other laminate structures therefrom
US7250330B2 (en) * 2002-10-29 2007-07-31 International Business Machines Corporation Method of making an electronic package
KR100709149B1 (en) * 2003-05-22 2007-04-18 아사히 가세이 케미칼즈 가부시키가이샤 Epoxy Resin Composition
US6905941B2 (en) * 2003-06-02 2005-06-14 International Business Machines Corporation Structure and method to fabricate ultra-thin Si channel devices
US7226980B2 (en) 2003-08-07 2007-06-05 General Electric Company Thermoset composition, method for the preparation thereof, and articles prepared therefrom
US7101923B2 (en) * 2003-10-03 2006-09-05 General Electric Company Flame-retardant thermoset composition, method, and article
US7148296B2 (en) * 2003-10-03 2006-12-12 General Electric Company Capped poly(arylene ether) composition and process
US7067595B2 (en) * 2003-10-03 2006-06-27 General Electric Company Poly (arylene ether) composition and method
US7211639B2 (en) * 2003-10-03 2007-05-01 General Electric Company Composition comprising functionalized poly(arylene ether) and ethylene-alkyl (meth)acrylate copolymer, method for the preparation thereof, and articles prepared therefrom
US6962965B2 (en) * 2004-02-20 2005-11-08 General Electric Company Functionalized poly(arylene ether) composition and process
US7329708B2 (en) * 2004-08-18 2008-02-12 General Electric Company Functionalized poly(arylene ether) composition and method
US20060038324A1 (en) * 2004-08-20 2006-02-23 Yeager Gary W Molding method for curable poly(arylene ether) composition and article thereby
US20060074151A1 (en) * 2004-09-28 2006-04-06 Polyclad Laminates, Inc. Low expansion dielectric compositions
US20080071000A1 (en) * 2006-09-15 2008-03-20 Christina Louise Braidwood Poly(arylene ether) composition and article
US20080071034A1 (en) * 2006-09-15 2008-03-20 Christina Louise Braidwood Poly(arylene ether) composition and method
US7582691B2 (en) * 2007-01-17 2009-09-01 Sabic Innovative Plastics Ip B.V. Poly(arylene ether) compositions and articles
JP5554500B2 (en) * 2007-01-25 2014-07-23 パナソニック株式会社 Prepreg, printed wiring board, multilayer circuit board, and method for manufacturing printed wiring board
US7655278B2 (en) 2007-01-30 2010-02-02 Sabic Innovative Plastics Ip B.V. Composite-forming method, composites formed thereby, and printed circuit boards incorporating them
US20080194724A1 (en) * 2007-02-12 2008-08-14 Pankaj Singh Gautam Method of forming a crosslinked poly(arylene ether) film, and film formed thereby
EP2113534B8 (en) * 2008-04-01 2011-09-21 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg and metal-foil-clad laminate
US8614155B2 (en) 2010-08-20 2013-12-24 International Business Machines Corporation Resin composition eliminating volatile loss of initiating species for the preparation of printed circuit board laminates
US9051465B1 (en) 2012-02-21 2015-06-09 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
US9243164B1 (en) 2012-02-21 2016-01-26 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
CN104995262B (en) * 2013-02-15 2019-09-03 三菱瓦斯化学株式会社 Resin composition for high dielectric constant material, molded article containing same, and masterbatch for coloring
US9296916B2 (en) * 2013-08-09 2016-03-29 Sabic Global Technologies B.V. Poly(phenylene ether)/epoxy homogeneous solid and powder coating composition incorporating same
US20150105505A1 (en) * 2013-10-11 2015-04-16 Isola Usa Corp. Varnishes and Prepregs and Laminates Made Therefrom
US10435368B2 (en) 2014-07-22 2019-10-08 Sabic Global Technologies B.V. High heat monomers and methods of use thereof
US9752051B2 (en) 2015-04-06 2017-09-05 Rohm And Haas Electronic Materials Llc Polyarylene polymers
CN110551257B (en) 2018-06-04 2021-10-08 台燿科技股份有限公司 Resin composition and its prepreg, metal foil laminate and printed circuit board
TWI686436B (en) 2018-08-28 2020-03-01 台燿科技股份有限公司 Halogen-free low dielectric resin composition, and pre-preg, metal-clad laminate, and printed circuit board using the same
TWI700332B (en) 2018-12-06 2020-08-01 台燿科技股份有限公司 Halogen-free low dielectric resin composition, and pre-preg, metal-clad laminate, and printed circuit board prepared using the same
CN111867239B (en) * 2019-04-24 2021-08-27 广东生益科技股份有限公司 Copper-clad laminate and printed circuit board
TWI725851B (en) 2020-05-15 2021-04-21 台燿科技股份有限公司 Resin composition, and pre-preg, metal-clad laminate, and printed circuit board prepared using the same
CN111718659A (en) * 2020-07-08 2020-09-29 铜陵华科电子材料有限公司 Preparation method of modified polybutadiene glue for producing high-frequency copper-clad plate
CN121311519A (en) * 2023-09-22 2026-01-09 可隆工业株式会社 Curing agent compositions and curing compositions comprising the same.
WO2025063498A1 (en) * 2023-09-22 2025-03-27 코오롱인더스트리 주식회사 Curing composition and curable composition comprising same
TWI860899B (en) 2023-11-24 2024-11-01 台燿科技股份有限公司 Prepreg and uses of the same

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4034136A (en) * 1969-06-30 1977-07-05 Fmc Corporation Flame-retardant resin compositions
CA927032A (en) * 1969-06-30 1973-05-22 H. Beacham Harry Flame-retardant resin compositions
JPS5869052A (en) * 1981-10-21 1983-04-25 旭化成株式会社 Novel laminated board and its molding method
US4533727A (en) * 1983-04-06 1985-08-06 Mitsubishi Gas Chemical Company, Inc. Process for producing a curable resin from cyanate ester compound and unsaturated 1,2-epoxy compound
JPS61287739A (en) * 1985-06-15 1986-12-18 松下電工株式会社 Laminated board
CA1285675C (en) * 1985-03-25 1991-07-02 Takaaki Sakamoto Method of preparing polyphenylene oxide composition and laminate using the composition
US4978715A (en) * 1985-08-02 1990-12-18 General Electric Company Solvent-resistant, compatible blends of polyphenylene ethers and linear polyesters
US4806297A (en) * 1986-02-11 1989-02-21 General Electric Company Solvent-resistant, compatible blends of polyphenylene ethers and linear polyesters
US4786664A (en) * 1987-03-26 1988-11-22 General Electric Company Compatible polyphenylene ether-linear polyester blends having improved coefficient of thermal expansion
JPS643223A (en) * 1987-06-25 1989-01-09 Mazda Motor Swirl chamber for internal combustion engine
US4912172A (en) * 1987-09-03 1990-03-27 General Electric Company Compositions comprising polyphenylene ethers, polyepoxides and aluminum or zinc diketone salt
EP0315829A3 (en) * 1987-11-10 1991-04-03 General Electric Company Drill back-up material for small bore drilling of circuit boards
CA1336464C (en) * 1988-07-14 1995-07-25 John Edward Hallgren Polyepoxide and polyphenylene ether-polyepoxide compositions useful in printed circuit board production
US4853423A (en) * 1988-07-14 1989-08-01 General Electric Company Curable polyphenylene ether-polyepoxide compositions useful in printed circuit board production
DE3931809C2 (en) * 1988-10-03 1998-09-17 Gen Electric Curable polyphenylene ether / polyepoxide preparations and their use
US5001010A (en) * 1988-10-11 1991-03-19 General Electric Company Curable polyphenylene ether-polyepoxide compositions from melt processed polyphenylene ethers, and laminates prepared therefrom
US5043367A (en) * 1988-12-22 1991-08-27 General Electric Company Curable dielectric polyphenylene ether-polyepoxide compositions useful in printed circuit board production
US5218030A (en) * 1989-02-08 1993-06-08 Asahi Kasei Kogyo Kabushiki Kaisha Curable polyphenylene ether resin composition and a cured resin composition obtainable therefrom
US5162450A (en) * 1989-02-17 1992-11-10 General Electric Company Curable dielectric polyphenylene ether-polyepoxide compositions
KR920701362A (en) * 1989-10-06 1992-08-11 아더 엠.킹 Polyphenylene Oxide / Hybrid Epoxy Resin System For Electrical Laminates

Cited By (9)

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CN100363425C (en) * 2001-03-27 2008-01-23 通用电气公司 Thermosetting poly(arylene ether)-containing composition in powder form, process for its preparation and articles made therefrom
CN101268522B (en) * 2005-09-21 2014-09-17 沙伯基础创新塑料知识产权有限公司 Electrical insulation method and insulated electrical conductor by coating poly(arylene ether) composition
TWI616475B (en) * 2012-11-19 2018-03-01 Nitto Denko Corporation Resin sheet
CN103467967A (en) * 2013-09-16 2013-12-25 广东生益科技股份有限公司 A kind of thermosetting resin composition and its application
CN109294215A (en) * 2018-08-08 2019-02-01 万华化学集团股份有限公司 A kind of polyurethane resin composition and use and a kind of high strength and high modulus polyurethane material
CN114207021A (en) * 2019-07-17 2022-03-18 松下知识产权经营株式会社 Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board
CN114207021B (en) * 2019-07-17 2024-06-11 松下知识产权经营株式会社 Resin composition, prepreg, film with resin, metal foil with resin, metal foil-clad laminate, and wiring board
WO2021026987A1 (en) * 2019-08-13 2021-02-18 瑞声声学科技(深圳)有限公司 Resin composition, prepreg, and related substrate
WO2021135789A1 (en) * 2019-12-31 2021-07-08 山东圣泉新材料股份有限公司 Novel poly(arylene ether) resin and preparation method therefor

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HK20597A (en) 1997-02-20
CN1036402C (en) 1997-11-12
KR920014881A (en) 1992-08-25
EP0494722A3 (en) 1993-07-21
DE69204689T2 (en) 1996-05-09
US5352745A (en) 1994-10-04
KR950013821B1 (en) 1995-11-16
EP0494722A2 (en) 1992-07-15
CN1174861A (en) 1998-03-04
DE69204689D1 (en) 1995-10-19
EP0494722B1 (en) 1995-09-13
CN1081658C (en) 2002-03-27

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