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CN106373903B - IC chip appearance detects belt-braiding device - Google Patents

IC chip appearance detects belt-braiding device Download PDF

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Publication number
CN106373903B
CN106373903B CN201610746640.6A CN201610746640A CN106373903B CN 106373903 B CN106373903 B CN 106373903B CN 201610746640 A CN201610746640 A CN 201610746640A CN 106373903 B CN106373903 B CN 106373903B
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China
Prior art keywords
chip
inspection
guide rail
tape
optical path
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CN201610746640.6A
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CN106373903A (en
Inventor
谢名富
吴成君
孙剑
张民贵
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FUZHOU PALIDE ELECTRONICS TECHNOLOGY Co Ltd
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FUZHOU PALIDE ELECTRONICS TECHNOLOGY Co Ltd
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Priority to CN201610746640.6A priority Critical patent/CN106373903B/en
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    • H10P74/203—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34—Sorting according to other particular properties
    • B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36—Sorting apparatus characterised by the means used for distribution
    • B07C5/361—Processing or control devices therefor, e.g. escort memory
    • B07C5/362—Separating or distributor mechanisms

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  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

本发明公开了集成电路芯片外观检测编带装置，包括初检部、复检部、芯片移送机构和工控机，所述初检部与复检部相邻，复检部与熔封工位相邻并把封装载带输送至熔封工位；当待测芯片的图像被初测光检模块检测为不合格品时，不良品从导轨上快速滑出，当待测芯片的图像被初测光检模块检测合格时，该待测芯片即识别为复测芯片；轨道挡板阻拦导轨上的复测芯片使之停于轨道挡板处，芯片移送机构把复测芯片移入复检部处的封装载带的封装格内；当复检芯片的图像被复测光检模块检测合格时，该复检芯片即识别为待封装品，置有待封装品的载带封装格被送至熔封工位完成编带熔封；本发明能把芯片外观检测、不良件剔除与编带封装作业进行集成。

The invention discloses a taping device for the appearance inspection of integrated circuit chips, comprising an initial inspection part, a re-inspection part, a chip transfer mechanism and an industrial computer. Adjacent and transport the package carrier tape to the melting and sealing station; when the image of the chip to be tested is detected as a non-conforming product by the initial detection light detection module, the defective product quickly slides out from the guide rail, and when the image of the chip to be tested is initially detected When the optical detection module is qualified, the chip to be tested is identified as a retest chip; the track baffle blocks the retest chip on the guide rail to stop it at the track baffle, and the chip transfer mechanism moves the retest chip into the retest chip. When the image of the re-inspected chip is detected by the re-inspection light detection module, the re-inspection chip is identified as the product to be packaged, and the carrier tape package with the product to be packaged is sent to the melting and sealing process. The braided sealing can be completed in one position; the invention can integrate the chip appearance inspection, the rejection of defective parts and the braided packaging operation.

Description

IC chip appearance detects belt-braiding device
Technical field
The present invention relates to chip manufacture equipment, especially IC chip appearances to detect belt-braiding device.
Background technique
Appearance detection is an important link of semiconductor chip production, is detected by appearance, can be to avoid outside by chip See chip functions defect caused by defect.Using realizing of Robot Vision chip appearance defects automatic detection can to avoid due to Human subjective's property bring error reduces the cost of labor of production, improves production efficiency；When chip carries out braid encapsulation, have When can because encapsulation plant movement to chip appearance caused by damage, if detected not in time, when carry sealing after just need spend compared with More times and cost could handle defective chip after dismantling sealing, it is therefore necessary to carry out to the chip in braid encapsulation process outer Detection is seen, how appearance is detected and is integrated with braid packaging operation, be a research direction.
Summary of the invention
The present invention propose IC chip appearance detect belt-braiding device, can chip appearance detect, bad part reject with Braid packaging operation is integrated.
The present invention uses following technical scheme.
IC chip appearance detects belt-braiding device, appearance detection is carried out before braid encapsulates for chip, encapsulation carries It takes and is equipped with encapsulation lattice, the detection belt-braiding device includes initial survey portion, reinspection portion, chip transfer mechanism and industrial personal computer, at the beginning of described Inspection portion is adjacent with reinspection portion, and reinspection portion is adjacent with sealing station and encapsulation carrier band is delivered to sealing station.
Initial survey portion includes guide assembly, initial survey optical path component, initial survey image-forming assembly and preliminary survey light inspection module, the guide rail group Part includes guide rail and track baffle, and when the work of initial survey portion, chip to be measured slides on guide rail, and track baffle is to chip on guide rail Sliding transmission controlled；The initial survey optical path component, chip transfer mechanism and initial survey image-forming assembly are adjacent with guide assembly, Top image and side image of the initial survey image-forming assembly through chip to be measured on initial survey optical path component acquisition guide rail；When core to be measured When the image of piece is detected as unqualified by preliminary survey light inspection module, which is identified as initial survey defective products, initial survey defective products Defective products rewinding container is slid onto through guide rail；When the image of chip to be measured is qualified by the inspection module detection of preliminary survey light, the core to be measured Piece is identified as repetition measurement chip；The repetition measurement chip that track baffle stops on guide rail is allowed to be stopped at track baffle, chip drag-over unit Structure moves into repetition measurement chip in the encapsulation lattice of the encapsulation carrier band at reinspection portion.
The reinspection portion includes braid transport mechanism, reinspection optical path component, reinspection image-forming assembly and repetition measurement light inspection module, is carried There is the carrier band of repetition measurement chip to be transmitted by braid transport mechanism to forward direction at sealing station, the reinspection optical path component, reinspection imaging Component is in close proximity to carrier band transmission path, and the reinspection image-forming assembly obtains repetition measurement chip in carrier tape package lattice through reinspection optical path component Top image；When the image of repetition measurement chip is detected as unqualified by repetition measurement light inspection module, which is identified as multiple Defective products is examined, braid transport mechanism, which carries out reverse transfer to carrier band, makes the carrier tape package lattice where rechecking defective products be recycled to core It is stopped at piece transfer mechanism, when chip transfer mechanism takes out reinspection defective products out of carrier tape package lattice and is built into encapsulation lattice After new repetition measurement chip, braid transport mechanism restores positive transmission, when the image of reinspection chip is closed by the inspection module detection of repetition measurement light When lattice, which is identified as product to be packaged, and the carrier tape package lattice for being equipped with product to be packaged are sent to sealing station and complete to compile Band sealing.
When repetition measurement light inspection module detects that braid transport mechanism carries out carrier band anti-there are when vacant encapsulation lattice on carrier band The encapsulation lattice for keeping this vacant to transmission are recycled at chip transfer mechanism and stop, when chip transfer mechanism is to the vacant encapsulation lattice After being built into repetition measurement chip, braid transport mechanism restores positive transmission.
The initial survey optical path component includes light source, chip front side light path mechanism and chip sides light path mechanism, the light source Above guide rail；The light entrance of the chip front side light path mechanism is directed toward the chip upper surface to be measured in guide rail；The core The light entrance of piece side light path mechanism is directed toward the pin face of the chip to be measured in guide rail；Chip front side light path mechanism and chip side The optical path outlet of face light path mechanism is directed to initial survey image-forming assembly.
Chip baffle is equipped at the initial survey image-forming assembly, when chip to be measured slides onto the guide rail at initial survey image-forming assembly When, chip to be measured is stopped at initial survey image-forming assembly by chip baffle, until preliminary survey light inspection module is completed to the chip to be measured After detection, chip baffle release chip slides chip continuation on guide rail.
It is equipped with blowning installation by the guide rail, high-speed flow is blown out in the blowning installation direction guiding rail transmission surface to promote core Sliding velocity of the piece on guide rail.
The braid transport mechanism carries out positive transmission to carrier band in a manner of intermittent movement, carries every time one mobile The distance for encapsulating lattice carries the inspection of mobile intermittent time and reinspection image-forming assembly, repetition measurement light inspection module to every repetition measurement chip Total duration is surveyed to match.
The chip transfer mechanism carries out pick-and-place operation to chip with sucker.
In the present invention, the detection belt-braiding device includes initial survey portion, reinspection portion, chip transfer mechanism and industrial personal computer, described Initial survey portion is adjacent with reinspection portion, and reinspection portion is adjacent with sealing station and encapsulation carrier band is delivered to sealing station；Initial survey portion includes Guide assembly, initial survey optical path component, initial survey image-forming assembly and preliminary survey light examine module；The reinspection portion include braid transport mechanism, It rechecks optical path component, reinspection image-forming assembly and repetition measurement light and examines module；The design uses the side of two re-detections in chip detection Formula, since guide rail can fast move progress initial survey at chip to initial survey image-forming assembly, the underproof chip of initial survey i.e. can be by guide rail Quickly discharge, to reduce the bad product rate of chip at carrier band so that carrier band will not the frequent rewinding because of excessive defective products, Detection efficiency is effectively promoted.
In the present invention, it is responsible for repetition measurement chip to move into the chip drag-over unit in the encapsulation lattice of the encapsulation carrier band at reinspection portion Structure, while being also responsible for replacing the defective products in carrier band, due to using same mechanism, reduce in equipment mobile range compared with Big movement mechanism quantity can effectively reduce equipment and shake the interference detected to chip, be conducive to improving stability, so that equipment Controlling mechanism is more succinct, also can effectively prevent the interference between multiple movement mechanisms.
In the present invention, the initial survey optical path component includes light source, chip front side light path mechanism and chip sides light path mechanism, The light source is set to above guide rail；The light entrance of the chip front side light path mechanism is directed toward table on the chip to be measured in guide rail Face；The light entrance of the chip sides light path mechanism is directed toward the pin face of the chip to be measured in guide rail；Chip front side optical path machine The outlet of the optical path of structure and chip sides light path mechanism is directed to initial survey image-forming assembly；The design so that this equipment at the beginning of carrying out chip When inspection, two parts image in chip front side and pin face can be obtained in primary shooting, improves detection efficiency.
Detailed description of the invention
The present invention is described in more detail with reference to the accompanying drawings and detailed description:
Attached drawing 1 is schematic diagram of the invention；
Attached drawing 2 is the partial enlargement diagram in initial survey portion of the invention；
Attached drawing 3 is the partial enlargement diagram in reinspection portion of the invention；
Attached drawing 4 is the schematic diagram of encapsulation carrier band when being not loaded into chip；
In figure: 1- initial survey image-forming assembly；2- guide rail；3- initial survey portion；4- chip transfer mechanism；5- carrier band；6- reinspection imaging Component；7- reinspection portion；8- track baffle；9- sucker；Encapsulation lattice on 10- carrier band；11- seals station；12- braid conveyer Structure.
Specific embodiment
As shown in Figure 1, 2, 3, IC chip appearance detects belt-braiding device, carries out before braid encapsulates for chip outer Detection is seen, encapsulation carrier band 5 is equipped with encapsulation lattice 10, and the detection belt-braiding device includes initial survey portion 3, reinspection portion 7, chip drag-over unit Structure 4 and industrial personal computer, the initial survey portion 3 is adjacent with reinspection portion 7, and reinspection portion 7 is adjacent with sealing station and encapsulation carrier band is delivered to Seal station 11.
Initial survey portion includes guide assembly, initial survey optical path component, initial survey image-forming assembly 1 and preliminary survey light inspection module, the guide rail Component 2 includes guide rail 2 and track baffle 8, and when the work of initial survey portion, chip to be measured slides on guide rail 2, and track baffle is led to 8 The sliding transmission of chip is controlled on rail 2；The initial survey optical path component, chip transfer mechanism and initial survey image-forming assembly 1 with lead Rail assembly is adjacent, top image and side view of the initial survey image-forming assembly through chip to be measured on initial survey optical path component acquisition guide rail Picture；When the image of chip to be measured is detected as unqualified by preliminary survey light inspection module, which is identified as initial survey defective products, Initial survey defective products slides onto defective products rewinding container through guide rail；When the image of chip to be measured is qualified by the inspection module detection of preliminary survey light When, which is identified as repetition measurement chip；The repetition measurement chip that track baffle stops on guide rail is allowed to be stopped at track baffle, Chip transfer mechanism moves into repetition measurement chip in the encapsulation lattice of the encapsulation carrier band at reinspection portion.
The reinspection portion 7 includes that braid transport mechanism 12, reinspection optical path component, reinspection image-forming assembly 6 and repetition measurement light examine mould Block, the carrier band 5 for being loaded with repetition measurement chip are transmitted by braid transport mechanism to forward direction at sealing station 11, the reinspection optical path component, Reinspection image-forming assembly is in close proximity to carrier band transmission path, and the reinspection image-forming assembly obtains in carrier tape package lattice through reinspection optical path component The top image of repetition measurement chip；When the image of repetition measurement chip is detected as unqualified by repetition measurement light inspection module, which is It is identified as reinspection defective products, braid transport mechanism makes the carrier tape package lattice quilt where reinspection defective products to carrier band progress reverse transfer It is recycled at chip transfer mechanism and stops, when chip transfer mechanism 4 out of carrier tape package lattice takes out reinspection defective products and to envelope After dress lattice are built into new repetition measurement chip, braid transport mechanism restores positive transmission, when the image of reinspection chip is examined by repetition measurement light When module detection is qualified, which is identified as product to be packaged, and the carrier tape package lattice for being equipped with product to be packaged are sent to sealing Station completes braid sealing.
When repetition measurement light inspection module detects that braid transport mechanism carries out carrier band there are when vacant encapsulation lattice 10 on carrier band The encapsulation lattice that reverse transfer keeps this vacant are recycled at chip transfer mechanism and stop, when chip transfer mechanism is to the vacant encapsulation After lattice are built into repetition measurement chip, braid transport mechanism restores positive transmission.
The initial survey optical path component includes light source, chip front side light path mechanism and chip sides light path mechanism, the light source Above guide rail；The light entrance of the chip front side light path mechanism is directed toward the chip upper surface to be measured in guide rail；The core The light entrance of piece side light path mechanism is directed toward the pin face of the chip to be measured in guide rail；Chip front side light path mechanism and chip side The optical path outlet of face light path mechanism is directed to initial survey image-forming assembly.
Chip baffle is equipped at the initial survey image-forming assembly, when chip to be measured slides onto the guide rail at initial survey image-forming assembly When, chip to be measured is stopped at initial survey image-forming assembly by chip baffle, until preliminary survey light inspection module is completed to the chip to be measured After detection, chip baffle release chip slides chip continuation on guide rail.
It is equipped with blowning installation by the guide rail, high-speed flow is blown out in the blowning installation direction guiding rail transmission surface to promote core Sliding velocity of the piece on guide rail.
The braid transport mechanism carries out positive transmission to carrier band in a manner of intermittent movement, carries every time one mobile The distance for encapsulating lattice carries the inspection of mobile intermittent time and reinspection image-forming assembly, repetition measurement light inspection module to every repetition measurement chip Total duration is surveyed to match.
The chip transfer mechanism 4 carries out pick-and-place operation to chip with sucker 9.

Claims (7)

1.集成电路芯片外观检测编带装置，用于芯片在编带封装前进行外观检测，封装载带上设有封装格，其特征在于：所述检测编带装置包括初检部、复检部、芯片移送机构和工控机，所述初检部与复检部相邻，复检部与熔封工位相邻并把封装载带输送至熔封工位；1. The integrated circuit chip appearance detection tape device is used for the appearance of the chip to be tested before the tape is packaged, and the package carrier tape is provided with a packaging grid. It is characterized in that: the detection tape device includes an initial inspection part and a re-inspection part. , a chip transfer mechanism and an industrial computer, the initial inspection part is adjacent to the re-inspection part, the re-inspection part is adjacent to the melting and sealing station, and the packaging carrier tape is transported to the melting and sealing station; 初检部包括导轨组件、初检光路组件、初检成像组件和初测光检模块，所述导轨组件包括导轨和轨道挡板，当初检部工作时，待测芯片在导轨上滑移，轨道挡板对导轨上芯片的滑移传输进行控制；所述初检光路组件、芯片移送机构和初检成像组件与导轨组件相邻，所述初检成像组件经初检光路组件获取导轨上待测芯片的顶面图像及侧面图像；当待测芯片的图像被初测光检模块检测为不合格时，该待测芯片即识别为初检不良品，初检不良品经导轨滑移至不良品收料容器；当待测芯片的图像被初测光检模块检测合格时，该待测芯片即识别为复测芯片；轨道挡板阻拦导轨上的复测芯片使之停于轨道挡板处，芯片移送机构把复测芯片移入复检部处的封装载带的封装格内；The initial inspection part includes a guide rail assembly, an initial inspection optical path assembly, an initial inspection imaging assembly and an initial inspection optical detection module. The guide rail assembly includes a guide rail and a track baffle. When the initial inspection part works, the chip to be tested slides on the guide rail, and the track The baffle controls the slip transmission of the chip on the guide rail; the preliminary inspection optical path assembly, the chip transfer mechanism and the preliminary inspection imaging assembly are adjacent to the guide rail assembly, and the preliminary inspection imaging assembly obtains the to-be-detected on the guide rail through the preliminary inspection optical path assembly The top image and side image of the chip; when the image of the chip to be tested is detected as unqualified by the initial detection light detection module, the chip to be tested is identified as a defective product in the initial inspection, and the defective product in the initial inspection is slipped to the defective product through the guide rail Receiving container; when the image of the chip to be tested is qualified by the initial detection light detection module, the chip to be tested is identified as a re-test chip; the track baffle blocks the re-test chip on the guide rail to stop it at the track baffle, The chip transfer mechanism moves the re-test chip into the packaging compartment of the packaging carrier tape at the re-inspection part; 所述复检部包括编带传送机构、复检光路组件、复检成像组件和复测光检模块，载有复测芯片的载带被编带传送机构向熔封工位处正向传输，所述复检光路组件、复检成像组件紧邻于载带传输路径，所述复检成像组件经复检光路组件获取封装格内复测芯片的顶面图像；当复测芯片的图像被复测光检模块检测为不合格时，该复测芯片即识别为复检不良品，编带传送机构对载带进行反向传输使复检不良品所在的封装格被回送至芯片移送机构处停留，当芯片移送机构把复检不良品从封装格内取出并向封装格内置入新的复测芯片后，编带传送机构恢复正向传输，当复检芯片的图像被复测光检模块检测合格时，该复检芯片即识别为待封装品，置有待封装品的封装格被送至熔封工位完成编带熔封。The re-inspection part includes a tape conveying mechanism, a re-inspection optical path assembly, a re-inspection imaging assembly and a re-inspection optical detection module, and the carrier tape carrying the re-inspection chip is forwardly transmitted to the melting and sealing station by the tape conveying mechanism, The re-inspection optical path assembly and the re-inspection imaging assembly are adjacent to the carrier tape transmission path, and the re-inspection imaging assembly obtains the top surface image of the re-inspection chip in the package cell through the re-inspection optical path assembly; when the image of the re-inspection chip is re-inspected When the optical detection module is detected as unqualified, the re-tested chip is identified as a re-inspected defective product, and the tape conveyor mechanism reversely transmits the carrier tape, so that the packaging compartment where the re-inspected defective product is located is returned to the chip transfer mechanism to stay. When the chip transfer mechanism takes out the re-inspected defective products from the packaging compartment and inserts a new re-inspected chip into the packaging compartment, the tape conveying mechanism resumes forward transmission. When the image of the re-inspected chip is qualified by the re-inspection optical detection module When the re-inspection chip is identified as the product to be packaged, the package cell on which the product to be packaged is placed is sent to the melting and sealing station to complete the tape welding. 2.根据权利要求1所述的集成电路芯片外观检测编带装置，其特征在于：当复测光检模块检测到载带上存在空置的封装格时，编带传送机构对载带进行反向传输使该空置的封装格被回送至芯片移送机构处停留，当芯片移送机构向该空置封装格内置入复测芯片后，编带传送机构恢复正向传输。2. The tape device for detecting the appearance of integrated circuit chips according to claim 1, wherein the tape conveying mechanism reverses the carrier tape when the re-measurement light detection module detects that there are vacant packaging compartments on the carrier tape. The transmission makes the empty packaging compartment return to the chip transfer mechanism for a stop. After the chip transfer mechanism inserts the re-test chip into the empty packaging compartment, the tape conveying mechanism resumes forward transmission. 3.根据权利要求1所述的集成电路芯片外观检测编带装置，其特征在于：所述初检光路组件包括光源、芯片正面光路机构和芯片侧面光路机构，所述光源设于导轨上方；所述芯片正面光路机构的光线入口指向导轨内的待测芯片上表面；所述芯片侧面光路机构的光线入口指向导轨内的待测芯片的引脚面；芯片正面光路机构和芯片侧面光路机构的光路出口均指向初检成像组件。3. The tape device for detecting the appearance of integrated circuit chips according to claim 1, wherein the initial inspection optical path assembly comprises a light source, a chip front optical path mechanism and a chip side optical path mechanism, and the light source is arranged above the guide rail; The light entrance of the optical path mechanism on the front side of the chip points to the upper surface of the chip to be tested in the guide rail; the light entrance of the optical path mechanism on the side of the chip points to the pin surface of the chip to be tested in the guide rail; the optical path of the chip front optical path mechanism and the chip side optical path mechanism The outlets all point to the initial inspection imaging unit. 4.根据权利要求1所述的集成电路芯片外观检测编带装置，其特征在于：所述初检成像组件处设有芯片挡板，当待测芯片滑移至初检成像组件处的导轨时，待测芯片被芯片挡板阻拦于初检成像组件处，直至初测光检模块完成对该待测芯片的检测后，芯片挡板释放芯片使芯片继续在导轨上滑移。4 . The tape device for detecting the appearance of integrated circuit chips according to claim 1 , wherein a chip baffle is provided at the initial inspection imaging assembly, and when the chip to be tested slides to the guide rail at the initial inspection imaging assembly. 5 . , the chip to be tested is blocked by the chip baffle at the initial inspection imaging assembly, until the initial inspection photodetection module completes the detection of the to-be-tested chip, the chip baffle releases the chip and the chip continues to slide on the guide rail. 5.根据权利要求1所述的集成电路芯片外观检测编带装置，其特征在于：所述导轨旁设有吹气装置，所述吹气装置向导轨传输面上吹出高速气流以提升芯片在导轨上的滑移速度。5 . The device for detecting the appearance of integrated circuit chips according to claim 1 , wherein an air blowing device is provided beside the guide rail, and the air blowing device blows a high-speed airflow to the transmission surface of the guide rail to lift the chip on the guide rail. 6 . slip speed on . 6.根据权利要求1所述的集成电路芯片外观检测编带装置，其特征在于：所述编带传送机构以间歇式移动的方式对载带进行正向传输，载带每次移动一个封装格的距离，载带移动的间歇时间与复检成像组件、复测光检模块对每颗复测芯片的检测总时长相匹配。6 . The tape device for detecting the appearance of integrated circuit chips according to claim 1 , wherein the tape conveying mechanism transmits the carrier tape in an intermittent manner, and the carrier tape moves one packaging grid at a time. 7 . The distance between the carrier tape and the movement of the carrier tape matches the total detection time of each re-test chip by the re-test imaging component and the re-test light detection module. 7.根据权利要求1所述的集成电路芯片外观检测编带装置，其特征在于：所述芯片移送机构以吸盘对芯片进行取放作业。7 . The tape device for detecting the appearance of integrated circuit chips according to claim 1 , wherein the chip transfer mechanism uses suction cups to pick and place chips. 8 .
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