CN106373903A - Appearance inspection taping device of integrated circuit chip - Google Patents

Abstract

The invention discloses a taping device for integrated circuit chip appearance detection, which includes a preliminary inspection part, a re-inspection part, a chip transfer mechanism and an industrial computer. Adjacent to the package carrier tape and transported to the melting and sealing station; when the image of the chip to be tested is detected as a substandard product by the preliminary inspection optical detection module, the defective product slides out from the guide rail quickly, when the image of the chip to be tested is detected When the optical detection module passes the test, the chip to be tested is recognized as a retest chip; the track baffle blocks the retest chip on the guide rail to stop at the track baffle, and the chip transfer mechanism moves the retest chip into the retest section. When the image of the re-inspection chip is detected by the re-inspection optical inspection module, the re-inspection chip is identified as the product to be packaged, and the carrier tape package with the product to be packaged is sent to the melting sealer Taping fusion sealing is completed in one bit; the invention can integrate chip appearance inspection, defective part rejection and braiding and packaging operations.

Description

Taping device for integrated circuit chip appearance inspection

technical field

The invention relates to chip processing equipment, in particular to a taping device for detecting the appearance of an integrated circuit chip.

Background technique

Appearance inspection is an important link in the production of semiconductor chips. Through appearance inspection, chip function defects caused by chip appearance defects can be avoided. Using machine vision to realize automatic detection of chip appearance defects can avoid errors caused by manual subjectivity, reduce labor costs in production, and improve production efficiency; when chips are taped and packaged, sometimes the appearance of the chip will be affected by the package insertion action. If the damage is not detected in time, it will take a lot of time and cost to disassemble the fusing seal after the carrier tape is melted and sealed to deal with the defective chips. The integration of detection and taping and packaging operations is a research direction.

Contents of the invention

The invention proposes an integrated circuit chip appearance detection and braiding device, which can integrate the chip appearance detection, defective part rejection, and taping and packaging operations.

The present invention adopts the following technical solutions.

The integrated circuit chip appearance detection tape device is used for the appearance inspection of the chip before the tape is packaged. The package carrier tape is provided with a packaging grid. The detection tape device includes a preliminary inspection department, a re-inspection department, a chip transfer mechanism and an industrial control machine, the initial inspection part is adjacent to the re-inspection part, and the re-inspection part is adjacent to the fusing and sealing station and transports the package carrier tape to the fusing and sealing station.

The initial inspection section includes a guide rail assembly, an initial inspection optical path assembly, an initial inspection imaging assembly, and an initial inspection optical detection module. The guide rail assembly includes a guide rail and a track baffle. The baffle controls the sliding transmission of the chip on the guide rail; the initial inspection optical path assembly, the chip transfer mechanism and the initial inspection imaging assembly are adjacent to the guide rail assembly, and the initial inspection imaging assembly is obtained by the initial inspection optical path assembly on the guide rail to be tested The top image and side image of the chip; when the image of the chip to be tested is detected as unqualified by the optical inspection module of the initial inspection, the chip to be tested is identified as a defective product in the initial inspection, and the defective product in the initial inspection slides to the defective product through the guide rail Receiving container; when the image of the chip to be tested is qualified by the initial test light detection module, the chip to be tested is identified as a retest chip; the track baffle blocks the retest chip on the guide rail to stop at the track baffle, The chip transfer mechanism moves the retested chip into the packaging grid of the packaging carrier tape at the retesting part.

The re-inspection section includes a tape transmission mechanism, a re-inspection optical path assembly, a re-inspection imaging assembly, and a re-inspection optical detection module, and the carrier tape carrying the re-inspection chip is forwardly transported to the melting and sealing station by the tape transmission mechanism. The re-inspection optical path assembly and the re-inspection imaging assembly are adjacent to the carrier tape transmission path, and the re-inspection imaging assembly obtains the top surface image of the retest chip in the tape package through the re-inspection optical path assembly; when the image of the re-inspection chip is When the retesting optical detection module detects that it is unqualified, the retesting chip is identified as a retesting defective product, and the tape transmission mechanism reversely transmits the carrier tape so that the carrier tape package where the retesting defective product is located is returned to the chip transfer When the chip transfer mechanism takes out the re-inspected defective products from the carrier tape package and inserts a new retest chip into the package, the tape transmission mechanism resumes forward transmission. When the image of the re-inspection chip is reproduced When the photometry and detection module passes the test, the re-inspection chip is identified as a product to be packaged, and the carrier tape packaging grid containing the product to be packaged is sent to the fusing and sealing station to complete the tape fusing and sealing.

When the retesting photodetector module detects that there is an empty package on the carrier tape, the braided conveying mechanism reversely transports the carrier tape so that the empty package is sent back to the chip transfer mechanism to stay. When the chip transfer mechanism moves to the After the retest chip is placed in the vacant package, the tape transmission mechanism resumes forward transmission.

The optical path assembly of the initial inspection includes a light source, a chip front optical path mechanism and a chip side optical path mechanism, the light source is arranged above the guide rail; the light entrance of the chip front optical path mechanism points to the upper surface of the chip to be tested in the guide rail; the chip side The light entrance of the light path mechanism points to the pin surface of the chip to be tested in the guide rail; the light path exits of the chip front light path mechanism and the chip side light path mechanism point to the primary inspection imaging component.

A chip baffle is provided at the primary inspection imaging component, and when the chip to be tested slides to the guide rail at the primary detection imaging component, the chip to be tested is blocked by the chip baffle at the primary detection imaging component until the initial detection photodetection module After the detection of the chip to be tested is completed, the chip baffle releases the chip so that the chip continues to slide on the guide rail.

An air blowing device is arranged beside the guide rail, and the air blowing device blows a high-speed airflow to the transport surface of the guide rail to increase the sliding speed of the chip on the guide rail.

The braided conveying mechanism carries out forward transmission to the carrier tape in the mode of intermittent movement, and the distance of the carrier tape is moved by one package cell at a time, and the intermittent time of the carrier tape movement is related to the re-inspection of the imaging component and the re-inspection photodetection module for each Match the total detection time of each retest chip.

The chip transfer mechanism uses a suction cup to pick and place chips.

In the present invention, the detection braiding device includes a preliminary inspection part, a re-inspection part, a chip transfer mechanism and an industrial computer, the initial inspection part is adjacent to the re-inspection part, and the re-inspection part is adjacent to the melting and sealing station and The packaging carrier tape is transported to the fusing and sealing station; the initial inspection section includes guide rail components, initial inspection optical path assemblies, initial inspection imaging assemblies, and initial inspection optical inspection modules; Inspection of imaging components and re-testing optical detection module; this design adopts a double detection method for chip detection. Since the guide rail can quickly move the chip to the initial inspection imaging component for initial inspection, the chips that fail the initial inspection will be removed by the guide rail. Rapid discharge, thereby reducing the defective rate of chips on the carrier tape, so that the carrier tape will not be rewound frequently due to too many defective products, effectively improving the detection efficiency.

In the present invention, the chip transfer mechanism is responsible for moving the retested chip into the package grid of the package carrier tape at the retest department, and is also responsible for replacing the defective products in the carrier tape. Due to the use of the same mechanism, the movement on the equipment is reduced. The large number of motion mechanisms can effectively reduce the interference of device vibration on chip detection, improve stability, make the device control mechanism simpler, and effectively prevent interference between multiple motion mechanisms.

In the present invention, the optical path assembly of the initial inspection includes a light source, a chip front optical path mechanism and a chip side optical path mechanism, the light source is arranged above the guide rail; the light entrance of the chip front optical path mechanism points to the upper surface of the chip to be tested in the guide rail; The light entrance of the optical path mechanism on the side of the chip points to the pin surface of the chip to be tested in the guide rail; the optical path exits of the optical path mechanism on the front of the chip and the optical path mechanism on the side of the chip both point to the initial inspection imaging component; this design makes the device perform the initial inspection of the chip At this time, two images of the front side of the chip and the pin side can be obtained in one shot, which improves the detection efficiency.

Description of drawings

Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:

Accompanying drawing 1 is the schematic diagram of the present invention;

Accompanying drawing 2 is the partially enlarged schematic view of the preliminary inspection part of the present invention;

Accompanying drawing 3 is the partially enlarged schematic view of the re-inspection part of the present invention;

Accompanying drawing 4 is the schematic diagram of the encapsulation carrier tape when not packing into chip;

In the figure: 1-initial inspection imaging component; 2-guide rail; 3-initial inspection part; 4-chip transfer mechanism; 5-carrier tape; 6-re-inspection imaging component; 9-suction cup; 10-encapsulation grid on carrier tape; 11-melting sealing station; 12-braiding transmission mechanism.

detailed description

As shown in Figures 1, 2, and 3, the integrated circuit chip appearance detection tape device is used for the appearance detection of the chip before the tape is packaged. The packaging carrier tape 5 is provided with a packaging grid 10, and the detection tape device includes an initial The inspection part 3, the re-inspection part 7, the chip transfer mechanism 4 and the industrial computer. Seal station 11.

The initial inspection section includes a guide rail assembly, an initial inspection optical path assembly, an initial inspection imaging assembly 1, and an initial inspection optical detection module. The guide rail assembly 2 includes a guide rail 2 and a track baffle 8. Sliding upward, the track baffle controls the sliding transmission of chips on the 8 guide rails 2; the initial inspection optical path assembly, chip transfer mechanism and initial inspection imaging assembly 1 are adjacent to the guide rail assembly. The optical inspection path component obtains the top image and side image of the chip to be tested on the guide rail; when the image of the chip to be tested is detected as unqualified by the optical detection module of the initial inspection, the chip to be tested is identified as a defective product in the initial inspection, and the initial inspection fails. The good product slides to the receiving container of the defective product through the guide rail; when the image of the chip to be tested is detected by the optical detection module of the initial test, the chip to be tested is recognized as a retest chip; the track baffle blocks the retest chip on the guide rail from being used Stop at the track baffle, and the chip transfer mechanism moves the retested chip into the packaging grid of the packaging carrier tape at the retesting part.

The re-inspection section 7 includes a braiding transmission mechanism 12, a re-inspection optical path assembly, a re-inspection imaging assembly 6, and a re-inspection optical detection module. Forward transmission at the position, the re-inspection optical path assembly and the re-inspection imaging assembly are adjacent to the carrier tape transmission path, and the re-inspection imaging assembly obtains the top surface image of the re-test chip in the carrier tape package through the re-inspection optical path assembly; When the image of the test chip is detected as unqualified by the re-test light detection module, the re-test chip is identified as a re-inspection defective product. After being sent back to the chip transfer mechanism to stop, when the chip transfer mechanism 4 takes out the re-inspected defective products from the carrier tape package and inserts a new retest chip into the package, the tape transfer mechanism resumes forward transmission. When the image of the inspection chip is detected by the re-inspection optical inspection module, the re-inspection chip is identified as a product to be packaged, and the carrier tape packaging grid containing the product to be packaged is sent to the fusing and sealing station to complete the tape fusing and sealing.

When the retesting photodetection module detects that there is an empty package grid 10 on the carrier tape, the braided tape transmission mechanism reversely transmits the carrier tape so that the empty package grid is sent back to the chip transfer mechanism to stay. After the retest chip is placed in the vacant package, the tape transmission mechanism resumes forward transmission.

The optical path assembly of the initial inspection includes a light source, a chip front optical path mechanism and a chip side optical path mechanism, the light source is arranged above the guide rail; the light entrance of the chip front optical path mechanism points to the upper surface of the chip to be tested in the guide rail; the chip side The light entrance of the light path mechanism points to the pin surface of the chip to be tested in the guide rail; the light path exits of the chip front light path mechanism and the chip side light path mechanism point to the primary inspection imaging component.

A chip baffle is provided at the primary inspection imaging component, and when the chip to be tested slides to the guide rail at the primary detection imaging component, the chip to be tested is blocked by the chip baffle at the primary detection imaging component until the initial detection photodetection module After the detection of the chip to be tested is completed, the chip baffle releases the chip so that the chip continues to slide on the guide rail.

An air blowing device is arranged beside the guide rail, and the air blowing device blows a high-speed airflow to the transport surface of the guide rail to increase the sliding speed of the chip on the guide rail.

The braided conveying mechanism carries out forward transmission to the carrier tape in the mode of intermittent movement, and the distance of the carrier tape is moved by one package cell at a time, and the intermittent time of the carrier tape movement is related to the re-inspection of the imaging component and the re-inspection photodetection module for each Match the total detection time of each retest chip.

The chip transfer mechanism 4 uses a suction cup 9 to pick and place chips.

Claims (7)

1. IC chip outward appearance detection belt-braiding device, carries out outward appearance detection, encapsulation carrier band for chip before braid encapsulation Be provided with encapsulation lattice it is characterised in that: described detection belt-braiding device include initial survey portion, reinspection portion, chip transfer mechanism and industry control Machine, described initial survey portion is adjacent with reinspection portion, and reinspection portion is adjacent with sealing by fusing station and encapsulation carrier band is delivered to sealing by fusing station；

Initial survey portion includes guide assembly, initial survey optical path component, initial survey image-forming assembly and first light-metering inspection module, described guide assembly bag Include guide rail and track baffle plate, when initial survey portion works, chip to be measured sliding on guide rail, the cunning to chip on guide rail for the track baffle plate Move transmission to be controlled；Described initial survey optical path component, chip transfer mechanism and initial survey image-forming assembly are adjacent with guide assembly, described Initial survey image-forming assembly obtains the top image of chip to be measured and side image on guide rail through initial survey optical path component；When chip to be measured When image is detected as unqualified by first light-metering inspection module, this chip to be measured is identified as initial survey defective products, and initial survey defective products is through leading Rail slides onto defective products rewinding container；When the image of chip to be measured is detected qualified by first light-metering inspection module, this chip to be measured is It is identified as repetition measurement chip；The repetition measurement chip that track baffle plate stops on guide rail is allowed to be stopped at track baffle plate, chip transfer mechanism handle Repetition measurement chip moves in the encapsulation lattice of the encapsulation carrier band at reinspection portion；

Described reinspection portion includes braid connecting gear, rechecks optical path component, rechecks image-forming assembly and repetition measurement light inspection module, is loaded with multiple Survey carrier band positive transmission at sealing by fusing station by braid connecting gear of chip, described reinspection optical path component, reinspection image-forming assembly It is in close proximity to carrier band transmission path, described reinspection image-forming assembly obtains the top of repetition measurement chip in carrier tape package lattice through rechecking optical path component Face image；When the image of repetition measurement chip is detected as unqualified by repetition measurement light inspection module, this repetition measurement chip is identified as rechecking not Non-defective unit, braid connecting gear carries out reverse transfer to carrier band makes the carrier tape package lattice that reinspection defective products is located be recycled to chip shifting Send and stop at mechanism, when chip transfer mechanism takes out in carrier tape package lattice and is built into encapsulation lattice new rechecking defective products After repetition measurement chip, the positive transmission of braid connecting gear recovery, when the image rechecking chip is detected qualified by repetition measurement light inspection module, This reinspection chip is identified as product to be packaged, be equipped with product to be packaged carrier tape package lattice be sent to sealing by fusing station complete braid melt Envelope.

2. IC chip outward appearance according to claim 1 detection belt-braiding device it is characterised in that: when repetition measurement light examines mould Block detects when there are vacant encapsulation lattice on carrier band, and braid connecting gear carries out reverse transfer to carrier band makes this vacant encapsulation Lattice are recycled to and stop at chip transfer mechanism, after chip transfer mechanism is built into repetition measurement chip to this vacant encapsulation lattice, compile Tape transport recovers positive transmission.

3. IC chip outward appearance according to claim 1 detection belt-braiding device it is characterised in that: described initial survey light path Assembly includes light source, chip front side light path mechanism and chip sides light path mechanism, and described light source is above guide rail；Described chip The light entrance of front light path mechanism points to the chip upper surface to be measured in guide rail；The light of described chip sides light path mechanism enters The pin face of the chip to be measured in mouth sensing guide rail；The light way outlet of chip front side light path mechanism and chip sides light path mechanism is equal Point to initial survey image-forming assembly.

4. IC chip outward appearance according to claim 1 detection belt-braiding device it is characterised in that: described initial survey imaging It is provided with chip baffle plate, when chip to be measured slides onto the guide rail at initial survey image-forming assembly, chip to be measured is by chip baffle plate at assembly Stop at initial survey image-forming assembly, until after first light-metering inspection module completes the detection to this chip to be measured, chip baffle plate discharges core Piece makes chip continue sliding on guide rail.

5. IC chip outward appearance according to claim 1 detection belt-braiding device it is characterised in that: set by described guide rail There is blowning installation, on described blowning installation direction guiding rail transmission face, blowout high velocity air is to lift sliding speed on guide rail for the chip Degree.

6. IC chip outward appearance according to claim 1 detection belt-braiding device it is characterised in that: described braid transmission Mechanism carries out positive transmission in the way of batch (-type) is mobile to carrier band, and carrier band moves the distance of encapsulation lattice every time, and carrier band moves The dynamic intermittent time is matched to the detection total duration of every repetition measurement chip with reinspection image-forming assembly, repetition measurement light inspection module.

7. IC chip outward appearance according to claim 1 detection belt-braiding device it is characterised in that: described chip transfer Mechanism carries out picking and placeing operation to chip with sucker.