CN106169530A - A kind of LED chip structure in band sidewall reflecting layer - Google Patents
A kind of LED chip structure in band sidewall reflecting layer Download PDFInfo
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- CN106169530A CN106169530A CN201610753662.5A CN201610753662A CN106169530A CN 106169530 A CN106169530 A CN 106169530A CN 201610753662 A CN201610753662 A CN 201610753662A CN 106169530 A CN106169530 A CN 106169530A
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- 239000007769 metal material Substances 0.000 description 4
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
- H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
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Abstract
本发明公开了一种带侧壁反射层的LED芯片结构,设置于发光层与水平反射层之间并处于水平反射层边缘的侧壁反射层,能够在不使用新的具有更高发光效率的发光材料的情况下,大大提高对光源的反射效率,从而能够增加光源的发光亮度,并且不需要提高LED芯片的电源功率就能得到更高的发光亮度,起到了节能的效果。
The invention discloses an LED chip structure with a side wall reflective layer. The side wall reflective layer arranged between the luminescent layer and the horizontal reflective layer and at the edge of the horizontal reflective layer can be used without using a new LED chip with higher luminous efficiency. In the case of luminescent materials, the reflection efficiency of the light source is greatly improved, thereby increasing the luminous brightness of the light source, and higher luminous brightness can be obtained without increasing the power supply of the LED chip, which has the effect of saving energy.
Description
技术领域technical field
本发明涉及一种带侧壁反射层的LED芯片结构,特别适用于高亮度要求的LED芯片。The invention relates to an LED chip structure with a side wall reflective layer, which is especially suitable for LED chips with high brightness requirements.
背景技术Background technique
目前,市场上一般的LED芯片只在水平方向上设置有反射层,反射效率不高,如果需要增加光源的发光亮度,则必须更换成具有更高发光效率的发光材料,或者使用提高电源功率的方法使得LED芯片具有更高的发光亮度,但这会造成增大耗能的情况,不满足节能的要求。At present, the general LED chip on the market is only equipped with a reflective layer in the horizontal direction, and the reflection efficiency is not high. If you need to increase the luminous brightness of the light source, you must replace it with a luminescent material with higher luminous efficiency, or use a device that increases the power supply. The method enables the LED chip to have higher luminance, but this will cause increased energy consumption, which does not meet the requirement of energy saving.
发明内容Contents of the invention
为解决上述问题,本发明的目的在于提供一种带侧壁反射层的LED芯片结构,设置于发光层与水平反射层之间并处于水平反射层边缘的侧壁反射层,能够在不使用新的具有更高发光效率的发光材料的情况下,大大提高对光源的反射效率,从而能够增加光源的发光亮度,并且不需要提高LED芯片的电源功率就能得到更高的发光亮度,起到节能的效果。In order to solve the above problems, the object of the present invention is to provide a LED chip structure with a sidewall reflective layer, the sidewall reflective layer disposed between the light-emitting layer and the horizontal reflective layer and at the edge of the horizontal reflective layer can be used without using a new In the case of a luminescent material with higher luminous efficiency, the reflection efficiency of the light source is greatly improved, so that the luminous brightness of the light source can be increased, and a higher luminous brightness can be obtained without increasing the power supply of the LED chip, which can save energy. Effect.
本发明解决其问题所采用的技术方案是:The technical scheme that the present invention solves its problem adopts is:
一种带侧壁反射层的LED芯片结构,包括衬底、设置于衬底中的发光层、设置于发光层下方用于反射由发光层发出的亮光的水平反射层、设置于水平反射层边缘用于反射由发光层发出的亮光的侧壁反射层和设置于反射层下方的芯片引脚。侧壁反射层能够在原本水平反射层的反射效率基础上进一步提高对光源的反射效率,因此能够在不改变LED芯片的使用环境就可以获得更高的光源发光亮度,起到了节能的效果。An LED chip structure with a sidewall reflective layer, comprising a substrate, a luminescent layer disposed in the substrate, a horizontal reflective layer disposed under the luminescent layer for reflecting bright light emitted by the luminescent layer, and a horizontal reflective layer disposed at the edge of the horizontal reflective layer The side wall reflective layer for reflecting the bright light emitted by the light emitting layer and the chip pins arranged under the reflective layer. The side wall reflective layer can further improve the reflective efficiency of the light source on the basis of the reflective efficiency of the original horizontal reflective layer, so that a higher luminous brightness of the light source can be obtained without changing the use environment of the LED chip, which has the effect of saving energy.
进一步,侧壁反射层与水平反射层形成钝角。形成钝角的侧壁反射层与水平反射层能够极大地增加反射面积,从而极大地反射由光源发出的亮光,提高反射效率。Further, the sidewall reflective layer forms an obtuse angle with the horizontal reflective layer. The side wall reflective layer and the horizontal reflective layer forming an obtuse angle can greatly increase the reflective area, thus greatly reflect the bright light emitted by the light source, and improve the reflective efficiency.
优选的,侧壁反射层与水平反射层为由DBR材料、Ag材料和AI材料中的一种构成的反射层。DBR材料具有很高的反射率,并且没有吸收光源的问题,十分适合应用于LED芯片的反射层;Ag材料是一种金属材料,在可见光范围内是最好的用于反射的金属,具有很好的反射率,适用于LED芯片的反射层;AI材料是一种金属材料,具有比较好的反射率,同样适用于LED芯片的反射层。Preferably, the sidewall reflective layer and the horizontal reflective layer are reflective layers made of one of DBR material, Ag material and AI material. DBR material has a high reflectivity and has no problem of absorbing light source, so it is very suitable for the reflective layer of LED chip; Ag material is a kind of metal material, which is the best metal for reflection in the visible light range, and has great Good reflectivity is suitable for the reflective layer of LED chips; AI material is a metal material with relatively good reflectivity, which is also suitable for the reflective layer of LED chips.
本发明的有益效果是:一种带侧壁反射层的LED芯片结构,其侧壁反射层能够在不使用新的具有更高发光效率的发光材料的情况下,大大提高对光源的反射效率,从而能够增加光源的发光亮度,并且不需要提高LED芯片的电源功率就能得到更高的发光亮度,起到了节能的效果。The beneficial effect of the present invention is: an LED chip structure with a side wall reflective layer, the side wall reflective layer can greatly improve the reflection efficiency of the light source without using a new luminous material with higher luminous efficiency, Therefore, the luminous brightness of the light source can be increased, and higher luminous brightness can be obtained without increasing the power supply of the LED chip, thereby achieving the effect of energy saving.
附图说明Description of drawings
下面结合附图和实例对本发明作进一步说明。The present invention will be further described below in conjunction with accompanying drawing and example.
图1是本发明带侧壁反射层的LED芯片结构的示意图。FIG. 1 is a schematic diagram of the structure of an LED chip with a sidewall reflective layer according to the present invention.
具体实施方式detailed description
参照图1,本发明的一种带侧壁反射层的LED芯片结构,包括衬底1、设置于衬底1中的发光层2、设置于发光层2下方用于反射由发光层2发出的亮光的水平反射层3、设置于水平反射层3边缘用于反射由发光层2发出的亮光的侧壁反射层4和设置于反射层下方的芯片引脚5。侧壁反射层4能够在原本水平反射层3的反射效率基础上进一步提高对光源的反射效率,因此能够在不改变LED芯片的使用环境就可以获得更高的光源发光亮度,起到了节能的效果。Referring to Fig. 1, a LED chip structure with a sidewall reflective layer of the present invention includes a substrate 1, a luminescent layer 2 arranged in the substrate 1, and is arranged below the luminescent layer 2 for reflecting light emitted by the luminescent layer 2. The horizontal reflective layer 3 for bright light, the side wall reflective layer 4 arranged at the edge of the horizontal reflective layer 3 for reflecting the bright light emitted by the light emitting layer 2 and the chip pins 5 arranged under the reflective layer. The side wall reflective layer 4 can further improve the reflective efficiency of the light source on the basis of the reflective efficiency of the original horizontal reflective layer 3, so that a higher luminous brightness of the light source can be obtained without changing the use environment of the LED chip, thereby achieving an energy-saving effect .
其中,侧壁反射层4与水平反射层3形成钝角。形成钝角的侧壁反射层4与水平反射层3能够极大地增加反射面积,从而极大地反射由光源发出的亮光,提高反射效率。Wherein, the side wall reflective layer 4 forms an obtuse angle with the horizontal reflective layer 3 . The side wall reflective layer 4 and the horizontal reflective layer 3 forming an obtuse angle can greatly increase the reflective area, thus greatly reflect the bright light emitted by the light source, and improve the reflective efficiency.
其中,侧壁反射层4与水平反射层3为由DBR材料、Ag材料和AI材料中的一种构成的反射层。DBR材料具有很高的反射率,并且没有吸收光源的问题,十分适合应用于LED芯片的反射层;Ag材料是一种金属材料,在可见光范围内是最好的用于反射的金属,具有很好的反射率,适用于LED芯片的反射层;AI材料是一种金属材料,具有比较好的反射率,同样适用于LED芯片的反射层。Wherein, the sidewall reflective layer 4 and the horizontal reflective layer 3 are reflective layers made of one of DBR material, Ag material and AI material. DBR material has a high reflectivity and has no problem of absorbing light source, so it is very suitable for the reflective layer of LED chip; Ag material is a kind of metal material, which is the best metal for reflection in the visible light range, and has great Good reflectivity is suitable for the reflective layer of LED chips; AI material is a metal material with relatively good reflectivity, which is also suitable for the reflective layer of LED chips.
本发明采用的一种带侧壁反射层的LED芯片结构,能够适用于各种需要提高发光亮度的LED芯片或者具有节能效果的LED芯片,不需要使用新的具有更高发光效率的发光材料,也不需要提高LED芯片的电源功率,就能够获得更高的发光亮度,能够起到节能的效果。The structure of an LED chip with a side wall reflective layer adopted in the present invention can be applied to various LED chips that need to improve luminous brightness or LED chips that have energy-saving effects, without using new luminescent materials with higher luminous efficiency, There is also no need to increase the power supply of the LED chip to obtain higher luminous brightness and achieve an energy-saving effect.
以上是对本发明的较佳实施进行了具体说明,但本发明并不局限于上述实施方式,熟悉本领域的技术人员在不违背本发明精神的前提下还可作出种种的等同变形或替换,这些等同的变形或替换均包含在本申请权利要求所限定的范围内。The above is a specific description of the preferred implementation of the present invention, but the present invention is not limited to the above-mentioned implementation, and those skilled in the art can also make various equivalent deformations or replacements without violating the spirit of the present invention. Equivalent modifications or replacements are all within the scope defined by the claims of the present application.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101207050A (en) * | 2006-12-21 | 2008-06-25 | Lg电子株式会社 | Light emitting device package and method of manufacturing the same |
| CN101859833A (en) * | 2009-04-07 | 2010-10-13 | 璨扬投资有限公司 | Light-emitting component with reflective layer and structure of reflective layer thereof |
| CN102472863A (en) * | 2009-07-16 | 2012-05-23 | 飞利浦拉米尔德斯照明设备有限责任公司 | Lighting device with light source positioned near the bottom surface of the waveguide |
| US20150136306A1 (en) * | 2013-11-18 | 2015-05-21 | Nichia Corporation | Method for manufacturing light distribution member, and method for manufacturing light emitting device |
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- 2016-08-29 CN CN201610753662.5A patent/CN106169530A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101207050A (en) * | 2006-12-21 | 2008-06-25 | Lg电子株式会社 | Light emitting device package and method of manufacturing the same |
| CN101859833A (en) * | 2009-04-07 | 2010-10-13 | 璨扬投资有限公司 | Light-emitting component with reflective layer and structure of reflective layer thereof |
| CN102472863A (en) * | 2009-07-16 | 2012-05-23 | 飞利浦拉米尔德斯照明设备有限责任公司 | Lighting device with light source positioned near the bottom surface of the waveguide |
| US20150136306A1 (en) * | 2013-11-18 | 2015-05-21 | Nichia Corporation | Method for manufacturing light distribution member, and method for manufacturing light emitting device |
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Application publication date: 20161130 |