CN1060008C - Printed board retaining structure - Google Patents
Printed board retaining structure Download PDFInfo
- Publication number
- CN1060008C CN1060008C CN95108657A CN95108657A CN1060008C CN 1060008 C CN1060008 C CN 1060008C CN 95108657 A CN95108657 A CN 95108657A CN 95108657 A CN95108657 A CN 95108657A CN 1060008 C CN1060008 C CN 1060008C
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- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- pcb
- claw type
- frame parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 210000000078 claw Anatomy 0.000 claims description 83
- 238000012216 screening Methods 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 230000004907 flux Effects 0.000 description 28
- 229910000679 solder Inorganic materials 0.000 description 28
- 230000035882 stress Effects 0.000 description 24
- 238000005336 cracking Methods 0.000 description 13
- 230000008602 contraction Effects 0.000 description 11
- 238000005452 bending Methods 0.000 description 8
- 239000004744 fabric Substances 0.000 description 8
- 238000003466 welding Methods 0.000 description 7
- 238000013459 approach Methods 0.000 description 6
- 230000014509 gene expression Effects 0.000 description 6
- 230000006872 improvement Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
The framework (10) serves to provide a screening function of a printed circuit board (17) of an electronic system that is mounted within the framework (10). The framework is in the form of plates that have a pressing operation carried out to form L shaped brackets (12). The circuit board has holes that locate onto the brackets and project through. The brackets are of the same thickness as the framework and a clearance (28) is provided on the underside. An electrical connection and a secure fixing is provided by soldering (20).
Description
The present invention relates to a kind of clamp structure of printed circuit board (PCB), in this structure, be inserted with a kind of printed circuit board (PCB) (for example printed circuit board (PCB) of electronic equipment), and this printed circuit board (PCB) is fixed to one as on the metal frame parts of barricade.
Wherein being inserted with a printed circuit board (for example printed circuit board (PCB) of electronic equipment) and this printed circuit board (PCB) at one is fixed in the structure as (shown in Figure 12 A and 12B) on the metal frame parts of barricade, one printed circuit board 3 is gripped by a plurality of claw type parts 2, and these claw types partly are to protrude in the frame that stretches to frame parts 1 and be bent inwardly towards printed circuit board (PCB) 3 from frame parts 1.
In the printed circuit board (PCB) clamp structure of this routine, the claw type part 2 (neck 4) that forms by a part of cutting frame parts 1 is short, and shown in Figure 12 B, claw type part 2 is bent downwardly and is soldered on the printed circuit board (PCB).Reference number 5 these welding portions of expression.
Yet, in the described in front prior art, for example, when this printed circuit board (PCB) clamp structure (for example from-20 ℃ to+60 ℃) (particularly when the power supply front and back of opening TV or VTR the very big temperature difference being arranged among TV and VTR in the winter time) when being applied among TV, the VTR etc. under the temperature that changes significantly, following problem occurs, the described temperature difference will be because the difference of the Thermal Contraction Coefficient of the claw type part 2 of frame parts 1 and printed circuit board (PCB) 3 will produce stress between the claw type part 2 of frame parts 1 and printed circuit board (PCB) 3.This stress causes that the claw type part 2 of frame parts 1 and the welding portion between the printed circuit board (PCB) 3 produce the crack.
In addition, because the distance that claw type part 2 length are short and the medial surface of the grounded part (not shown) of printed circuit board (PCB) and frame parts 1 is spaced is not wide, the result can not absorb whole thermal stress.Further, the claw type part 2 of ground connection has only a side soldered, often splits owing to this variations in temperature makes solder flux.
When crooked ground connection claw type part 2, change in size occurs, can cause moving of printed circuit board (PCB) 3 usually.Say that further claw type part 2 only is provided for ground connection, the result, being necessary for frame parts 1 provides printed circuit board (PCB) to receive the seating part (not shown) individually, so as in frame parts 1 supporting printing board 3.
In above-mentioned prior art, the distance that the inboard of the grounded part of printed circuit board (PCB) 3 and frame parts 1 is spaced is also not really wide, the result, as described in the example of a Figure 13 A and a different prior art among Figure 13 B, in the side plate 1a of described frame parts, form a big opening 7 (with oblique line represent that part of), the result, it is incomplete that shielding action just becomes, as a result, be active in the deterioration that radio wave has on every side caused electrical property.
First purpose of the present invention provides a kind of printed circuit board (PCB) clamp structure, in this structure, even this clamp structure still can prevent from when being used to electronic equipment (for example TV or VTR) under the ambient temperature that changes significantly crackle to occur in the claw type part of described frame parts and the welding portion between the described printed circuit board (PCB), and has also prevented the deterioration by the caused electrical property of radio wave around being active in therein at an easy rate.
Second purpose of the present invention provides a kind of printed circuit board (PCB) clamp structure, and this structure can absorb stress, makes it can resist the stronger external force that inwardly pushes away, and the stress that is produced by variations in temperature is almost few of to be added on the described solder flux thereby make.This structure is endowed three kinds of functions and comprises that grounding function, printed circuit board (PCB) lay function (support function) and prevent the function that printed circuit board (PCB) moves.This structure can also absorb the stress by the difference generation of Thermal Contraction Coefficient effectively.
The 3rd purpose of the present invention provides a kind of printed circuit board (PCB) clamp structure, in this structure, can obtain more firm mechanical fasteners effect to this structure, make and be added on the described solder flux by the stress that variation of temperature produced is almost few of, the result has just prevented the solder flux cracking, and in this structure by described claw type hook segment is prevented moving of printed circuit board (PCB) in the hole of described printed circuit board (PCB).
The 4th purpose of the present invention provides a kind of printed circuit board (PCB) clamp structure, vibrates the cracking that has prevented solder flux by absorbing in this structure.
The 5th purpose of the present invention provides a kind of printed circuit board (PCB) clamp structure that can improve welding performance.
For realizing the object of the invention, the printed circuit board (PCB) clamp structure comprises frame parts, printed circuit board (PCB), and claw type part, its characteristics are that described frame parts is top and bottom-open; Described claw type partly is arranged on the inboard of frame parts, forms whole upwards or down stretch out and its width equals the thickness of slab of described frame parts with described frame parts; Also comprise seating part, form by a part of cutting the framework side plate, and side-prominent in the framework that impales with side plate; Has a hole on the described printed circuit board (PCB), form a pad around the hole, the side with printed circuit board (PCB) of pad is faced the front end of the claw type part of frame parts, claw type partly is inserted in the hole simultaneously, and claw type part and pad are welded, so that printed circuit board (PCB) is fixed within the frame parts.
The claw type of printed circuit board (PCB) clamp structure partly is set on the seating part, and the front end that claw type partly is inserted in the hole is bent or reverses towards printed circuit board (PCB), so that printed circuit board (PCB) is fixed on the seating part; Seating part is along the bending of vertical line or horizontal line, be positioned at cutting plane upper support printed circuit board (PCB) that peristome forms below.
In aforementioned first kind of form of the present invention, the stress that is produced by the difference of the Thermal Contraction Coefficient between described frame parts and the described printed circuit board (PCB) can be absorbed, even make when this printed circuit board is used to electronic equipment (for example TV, VTR etc.) under the ambient temperature that changes significantly, the solder flux part between described claw type part and described printed circuit board (PCB) the crack can not occur yet.In addition, only need a hole (it is minimum that the size of notch portion reaches as far as possible) on the parts of the side of supporting described frame parts, thereby prevented that radio wave from propagating around, this has caused the improvement of electrical property.
Aforesaid of the present invention second and third, six and seven kind of form in, described claw type partly approaches, and a seating part, result are provided, described clamp structure can absorb stress and the stronger external force that inwardly pushes away of opposing, and this has just prevented the cracking of solder flux.
In addition, described clamp structure can be endowed three kinds of functions, and promptly grounding function, printed circuit board (PCB) are laid (support) function and prevented the function that printed circuit board (PCB) moves.Further, the feasible stress that can more effectively absorb of long seating part by the difference generation of Thermal Contraction Coefficient.
In aforementioned the 4th kind of form of the present invention, described claw type part is bent, so that fixing described printed circuit board (PCB), the result, can realize firm mechanical fasteners to described printed circuit board (PCB), by almost few of being added on the described solder flux of stress of variations in temperature generation, thereby make that might prevent solder flux ftractures.Because a microscler part cuts out and is bent to form described claw type part from the framework side plate, this claw type partly can be hooked in the hole in the described printed circuit board (PCB), move so that prevent described printed circuit board (PCB).
In aforementioned the 5th kind of form of the present invention,, absorption of vibrations can be fallen to prevent the solder flux cracking because the claw type part of sufficiently long described frame parts is provided.
In aforementioned the 8th kind of form of the present invention, particularly because described hole can be processed to circle, ellipse or elongate slot on described printed circuit board (PCB), so that form the littler opening of more conventional opening.
Below be to brief description of drawings.
Fig. 1 is the perspective view of the printed circuit board (PCB) clamp structure of first embodiment of the present invention before described printed circuit board (PCB) is fixed on the described frame parts;
Fig. 2 A, 2B and 2C are respectively a width of cloth front view, a width of cloth vertical cross sections of the printed circuit board (PCB) clamp structure of first embodiment of the present invention, and this moment, described printed circuit board (PCB) was fixed;
Fig. 3 is a kind of improved explanatory view of first embodiment of the present invention;
Fig. 4 is the another kind of improved explanatory view of first embodiment of the present invention;
Fig. 5 is the perspective view of the printed circuit board (PCB) clamp structure of second embodiment of the present invention before described printed circuit board (PCB) is fixed;
Fig. 6 is the vertical sectional view of the printed circuit board (PCB) clamp structure of second embodiment of the present invention, and described printed circuit board (PCB) is to be in the state of being fixed;
Fig. 7 is the perspective view of key part of frame parts that shows the printed circuit board (PCB) clamp structure of second embodiment of the present invention;
Fig. 8 A and Fig. 8 B are a width of cloth plane graph and the width of cloth front views of Fig. 7;
Fig. 9 is the perspective view of key part of frame parts of the printed circuit board (PCB) clamp structure of the 3rd embodiment of the present invention;
Figure 10 is the explanatory view of the printed circuit board (PCB) clamp structure of the 3rd embodiment of the present invention, and described printed circuit board (PCB) is to be in the state of being fixed;
Figure 11 is the key part perspective view of a kind of improved frame parts of the 3rd embodiment of the present invention;
Figure 12 A and Figure 12 B are a width of cloth front view and a width of cloth vertical sectional view of the printed circuit board (PCB) clamp structure of a routine, and described printed circuit board (PCB) is to be in the state of being fixed;
Figure 13 A and Figure 13 B are a width of cloth front view and a width of cloth vertical sectional view of another conventional printed circuit board (PCB) clamp structure, and described printed circuit board (PCB) is to be in the state that is fixed.
Below, we will be illustrated some embodiments of the present invention.
Be illustrated referring to figs. 1 through 4 couples of first embodiment of the present invention.
The frame parts of reference number top of 10 expressions and bottom-open; It makes a square cylinder by four blocks of side plates 11.This frame parts 10 has a side plate that is cut open and bends 11, forms a seating part 12 and some claw type parts 13 whereby.
Seating part 12 and claw type part 13 are made into L shaped with integral way, and claw type part 13 is formed on the front end of seating part 12.Seating part 12 is to form by a part of cutting side plate 11, and the width that the distance at two ends equals to be scheduled to its bending, makes the portion of being cut open vertically stretch out and inside side plate 11 towards frame parts 10.The end face 14 of seating part 12 can be laid a printed circuit board 17 (will be explained below).In Fig. 1, the sweep of seating part 12 extends in vertical direction.
Seating part 12 has some notch portion 16, and these notch portion are to be cut on the base plate of the both sides of seating part 12, and its depth difference seldom is equal to or greater than thickness of slab.
Shown in Fig. 1 and Fig. 2 C, on printed circuit board (PCB) 17, form a slotted eye 18, and on the top surface 17a of printed circuit board (PCB) 17, center on hole 18 formation pads 19.Hole 18 is not limited to ellipse and can is circle or elongated shape.
Below, will the method that in first embodiment printed circuit board (PCB) is fastened on the frame parts be illustrated.
As described in Figure 1, the surface of printed circuit board (PCB) 17 has the pad 19 of the front end of facing claw type part 13 formed thereon, and claw type part 13 is inserted in the hole 18, and shown in Fig. 2 A, 2B and 2C, claw type part 13 and pad 19 are fixing by solder flux 20.
As shown in Figure 3, in the improvement of first embodiment, the front end that is inserted into the claw type part 13 in the hole 18 is bent towards described printed circuit board (PCB), so that printed circuit board (PCB) 17 is fixed on the seating part 12.
As shown in Figure 4, in the another kind of first embodiment improved, the claw type part 13 of being stretched out by printed circuit board (PCB) 17 was inserted in the hole 18, and the front end of claw type part 13 bent, so that printed circuit board (PCB) 17 is fixed on the seating part 12.
In having first embodiment of so a kind of structure, because seating part 12 is by a side plate that cuts frame parts 10 and will be cut open that part of end face 14 that the part bending forms, so claw type part 13 approaches, and because seating part 12 is provided, so stress can be absorbed, the described structure of result can more effectively be resisted the external force that inwardly pushes away, thereby can avoid occurring the solder flux cracking.Can give described structure three kinds of functions, promptly grounding function, printed circuit board (PCB) are laid (support) function and are prevented the function that printed circuit board (PCB) moves.In addition, the length of increase seating part 12 can more effectively absorb the stress that is produced by thermal contraction.
Now, we are with reference to Fig. 5 to 8 explanation second embodiment of the present invention.
That one of reference number 30 expression has top and a bottom-open and (for example) is made into the frame parts 30 of the square column that is made of four side plates 31.The side plate 31 of frame parts 30 is cut open, and will be cut open part and be bent to form seating part 32 and claw type part 33.
Seating part 32 and claw type part 33 are made into the L type with integral way, and claw type part 33 is formed on the front end of seating part 32.Seating part 32 is that the part by cutting side plate 31 forms, and the distance between the two ends is a predetermined width, will be cut open the part bending, makes it almost vertically stretch out with the medial surface of the side plate 31 of frame parts 30 and inwardly.The plane 34 of seating part 32 is so a kind of component parts, and it can lay printed circuit board (PCB) 17.That is, the folding line of seating part 32 is to be on the horizontal direction.
Shown in Fig. 7 and Fig. 8 A, notch portion 36 is formed on the both sides base plate of seating part 32, and thickness ＂ a ＂ almost is equal to or greater than the thickness of frame parts 30.Form these notch portion 36 and make from frame parts 30 to printed circuit board (PCB) 17 line pattern and will increase to the distance that is used for claw type part 33 is welded to the solder flux part 20 on the printed circuit board (PCB) 17, the result, thermal stress can more easily be absorbed, and easier with seating part 32 inwardly towards frame parts 30 bending.
Below, we will be illustrated the method that described printed circuit board (PCB) is fastened on the described frame parts among second embodiment of the present invention.
As shown in Figure 5, that the surperficial 17a of printed circuit board (PCB) 17 has is formed thereon, in the face of the pad 19 of the front end of claw type part 33, and claw type part 33 is inserted in the hole 18, and as shown in Figure 6, claw type part 33 and pad 19 usefulness solder flux 20 are fixed together.
In having first and second embodiment of so a kind of structure, seating part 12 and 32 is that a part (forming frame parts 30) of passing through the part of incision side plate 11 (forming frame parts 10) side plate 31 respectively forms, as a result, the distance between the two ends equals a predetermined width.Notch portion 16 is formed on the seating part 12 both sides base plates, and its degree of depth approximates the thickness of slab of frame parts 10 greatly, and notch portion 36 is formed on the base plate of seating part 32 both sides, and its degree of depth approximates the thickness of slab of frame parts 30 greatly.This set scheme has been made sufficiently long claw type part 13 and 33 with framework 10 and 30 respectively, and the result can fall absorption of vibrations to prevent the solder flux cracking.
In first and second embodiment, because some seating part are arranged stretches out and is used for laying printed circuit board (PCB) 17 towards framework inside from the part of their corresponding frame partss 10 and 30, so claw type part 13 and 33 be approach and seating part 12 and 32 are provided, the result, described structure can absorb described stress and can resist the stronger external force of inside pressure, thereby can prevent the solder flux cracking.This structure can be endowed three kinds of functions, and promptly grounding function, printed circuit board (PCB) are laid (support) function and prevented the function that printed circuit board (PCB) moves.In addition, the length that increases seating part 12 and 32 makes the stress that can more effective absorption be produced by the Thermal Contraction Coefficient difference.
In first and second embodiment, because claw type part 13 and 33 is formed on their corresponding seating part, so they be approach and seating part 12 and 32 are provided, make described structure can absorb described stress and also can more effectively resist the external force that inwardly pushes away, thereby prevent the cracking of solder flux.This structure can be endowed three kinds of functions, and promptly grounding function, printed circuit board (PCB) are laid (support) function and prevented the function that printed circuit board (PCB) moves.In addition, increase the feasible stress that difference produced that can more effectively absorb of length of seating part 12 and 32 by Thermal Contraction Coefficient.
In second embodiment, claw type part 33 approaches, and seating part 32 is provided, and seating part 32 is side plates by cutting frame parts 30 and will be cut the part bending and forms in the mode that forms a plane 34.Therefore, this structure can absorb described stress and more effectively resist the external force that inwardly pushes away, and this just prevents the cracking of solder flux.This structure can also be endowed three kinds of functions, and promptly grounding function, printed circuit board (PCB) are laid (support) function and prevented the function that printed circuit board (PCB) moves.In addition, increase the feasible stress that difference produced that can more effectively absorb of length of seating part 32 by Thermal Contraction Coefficient.
Although need in first and second embodiment a printed circuit board (PCB) clamp structure with seating part as an example, we still will be illustrated with reference to 9 to 11 pairs of examples that do not have the clamp structure of seating part of figure now.
The unlimited frame parts of reference number top of 40 expressions and bottom, for example it is made into four square column that side plate 41 constitutes by frame parts 40.Some elongated portions from the side plate 41 of frame parts 40 cuts out make that its front end is an arc, so just provide a series of by the thin claw type part of embowment.Part round claw type part front end is such some parts, and they extend towards almost vertical direction as a result.The width of claw type part 42 approximates the thickness of slab of frame parts 10 greatly.
Printed circuit board (PCB) of reference number 17 expressions, it has a slotted eye 18 formed thereon.Pad 19 is formed on the hole 18 top surface 17a on every side of printed circuit board (PCB) 17.Hole 18 is not limited to ellipse, it can also be made circular port or elongate slot.
Now, we will be illustrated the method that among the 3rd embodiment of the present invention printed circuit board (PCB) is fastened on the frame parts.
When the surperficial 17a of printed circuit board (PCB) 17 had the pad 19 of formation front end, that face claw type part 42 thereon, claw type part 42 was inserted in the hole 18, and as shown in figure 10, claw type part 42 and pad 19 are fixed together by solder flux 20.
Although claw type part 42 is to form by a part of cutting each side plate 41 away from leading edge in the 3rd embodiment of the present invention, they also can form by cut each side plate 41 from leading edge as shown in the improvement of Figure 11.
Demonstrated already, in first embodiment, printed circuit board (PCB) is fixed on the frame parts can adopts following dual mode: a kind of is that the front end that will be inserted into the claw type part 13 in the hole 18 is folded on the direction of printed substrate, as in the improvement of the 3rd embodiment; A kind of is to insert and the front end of the claw type part 13 that bending is stretched out from printed circuit board (PCB) 17, as described in another of the 3rd embodiment improves.This can also be applied to of the present invention second and the 3rd embodiment.
In having each embodiment of so a kind of structure, described printed circuit board (PCB) clamp structure has a frame parts 10 respectively, 30 and 40 (each all has a unlimited top and bottom described frame parts), claw type part 13,33 and 42 (described claw type parts and they corresponding frame partss 10,30 and 40 form integral body, perhaps upwards or stretch out downwards, width approximates their corresponding frame partss 10 greatly, the thickness of 30 and 40 side plate) and printed circuit board (PCB) 17 (each piece of described printed circuit board (PCB) all has hole formed thereon 18 and all has around the hole 18 pads 19 formed thereon).The surperficial 17a of printed circuit board (PCB) 17 has the pad 19 of the front end of the claw type part 13,33 of facing corresponding frame parts 10,30 and 40 formed thereon and 42, simultaneously, each claw type part 13,33 and 42 is inserted in their corresponding holes 18, so that each claw type part 13,33 and 42 is welded with pad 19, so that each printed circuit board 17 is fixed among each frame parts 10,30 and 40.Like this, each clamp structure can be absorbed in frame parts 10,30 and 40 and printed circuit board (PCB) 17 between the stress that produces by the difference of the Thermal Contraction Coefficient between them, the result, even when under the ambient temperature that changes significantly, this printed circuit board (PCB) clamp structure being applied to electronic equipment (for example TV, VTR etc.), the crack can not occur in the solder flux part 20 between claw type part 13,33 and 42 (belonging to frame parts 10,30 and 40 respectively) and printed circuit board (PCB) 17 yet.In addition, only need process an aperture (the notch portion size is minimum as far as possible) in the parts side of frame parts 10,30 and 40, thereby prevent the radio wave propagation at an easy rate, this just makes electrical property improve.
In above-mentioned these embodiment, be inserted into claw type part 13,33 in the hole 18 and 42 front end by curved or folding is fixed on the printed circuit board (PCB) 17 to printed circuit board (PCB) 17 with described claw type part, the result can realize the firm mechanical fasteners to printed circuit board (PCB) 17, and almost be not added on the solder flux usually by the stress that variations in temperature causes, thereby make that might prevent solder flux ftractures.Because some microscler parts cut out and be bent to form claw type part 13,33 and 42 from framework side plate 11,21 and 41,, move so that prevent printed circuit board (PCB) 17 so claw type part 13,33 and 42 can be hooked in their corresponding holes of printed circuit board (PCB) 17.
In aforementioned each embodiment, the hole 18 on the printed circuit board (PCB) 17 is made into ellipse or elongated shape, and the gap is less than the gap of the clamp structure of routine as a result, and this makes welding performance improve.
In addition, in each embodiment, cut long part from frame facet and form claw type part 13,33 and 42, the ground connection claw type partly is inserted in their corresponding circles or the slotted eye, and with the whole periphery welding of claw type part 13,33 and 42, the solder flux cracking can appear in result hardly.
According to a kind of citation form of the present invention, can be absorbed by the stress that difference produced of Thermal Contraction Coefficient between described frame parts and the described printed circuit board (PCB).As a result, even the crack can not occur in the claw type part of described frame parts and the solder flux part between the described printed circuit board (PCB) under the ambient temperature of acute variation this clamp structure being used for electronic equipment (for example TV, VTR etc.) yet.In addition, only need at aperture of the parts side of frame parts 10,30 and 40 processing (incision size is minimum as far as possible), the result can prevent radio propagation, and this just makes electrical property improve.
Although do not get rid of other forms, but to adopt a kind of like this structure, in described structure, described claw type partly approaches, and a seating part is provided, has made this clamp structure can more effectively resist the external force that inwardly pushes away, this has just prevented the solder flux cracking.This structure comprises can give this clamp structure three kinds of functions, and promptly grounding function, printed circuit are laid (support) function and prevented the function that printed circuit board (PCB) moves.In addition, than the feasible stress that difference produced that can more effectively absorb of long seating part by Thermal Contraction Coefficient.
Can also adopt other structure, in this structure, described claw type part is bent so that fixed printed circuit board, this makes to finish described printed circuit board (PCB) is fixed to more firm mechanical fasteners on the described frame parts, and almost be not added on the described solder flux by the stress that variations in temperature produced, the result can prevent the solder flux cracking.In addition, cutting is the longer a part of framework side plate of bending also, forms described claw type part, and this makes described claw type part can be hooked in the hole on the described printed substrate, moves so that prevent printed substrate.
When the claw type part long enough of the frame parts that is provided, just can absorb vibration so that prevent the solder flux cracking.
Hole on described printed circuit board (PCB) is made into ellipse or elongated shape, and welding performance just can be improved during less than the gap of the clamp structure of routine in described gap.
Claims (4)
1. a printed circuit board (PCB) clamp structure comprises frame parts, printed circuit board (PCB), and the claw type part is characterized in that described frame parts is top and bottom-open; Described claw type partly is arranged on the inboard of frame parts, forms integral body with described frame parts, upwards or down stretches out and its width equals the thickness of slab of described frame parts; Also comprise seating part, it forms by the part of cutting the framework side plate, and side-prominent in the framework that impales with side plate; Has a hole on the described printed circuit board (PCB), form a pad around the hole, the side with printed circuit board (PCB) of pad is faced the front end of the claw type part of frame parts, claw type partly is inserted in the hole simultaneously, and claw type part and pad are welded, so that printed circuit board (PCB) is fixed within the frame parts.
2. printed circuit board (PCB) clamp structure as claimed in claim 1 is characterized in that the front end of described claw type part is bent or reverses towards printed circuit board (PCB), so that printed circuit board (PCB) is fixed on the seating part.
3. printed circuit board (PCB) clamp structure as claimed in claim 1 or 2 is characterized in that described seating part bends along vertical line, be positioned at cutting plane upper support printed circuit board (PCB) that peristome forms below.
4. printed circuit board (PCB) clamp structure as claimed in claim 1 or 2 is characterized in that described seating part bends along horizontal line.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP189510/94 | 1994-08-11 | ||
| JP189510/1994 | 1994-08-11 | ||
| JP18951094A JP3347888B2 (en) | 1994-08-11 | 1994-08-11 | Printed circuit board holding structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1122998A CN1122998A (en) | 1996-05-22 |
| CN1060008C true CN1060008C (en) | 2000-12-27 |
Family
ID=16242482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN95108657A Expired - Fee Related CN1060008C (en) | 1994-08-11 | 1995-08-11 | Printed board retaining structure |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3347888B2 (en) |
| CN (1) | CN1060008C (en) |
| DE (1) | DE19529671A1 (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09260884A (en) * | 1996-03-18 | 1997-10-03 | Alps Electric Co Ltd | Fixing structure of printed board |
| DE19730712C1 (en) * | 1997-07-17 | 1998-11-12 | Siemens Ag | Housing part of valve control device with contact pin e.g. for braking system control |
| FI114848B (en) | 1997-11-25 | 2004-12-31 | Filtronic Lk Oy | Frame structure, apparatus and method for manufacturing the apparatus |
| JP3446708B2 (en) * | 2000-02-28 | 2003-09-16 | ミツミ電機株式会社 | Electronic equipment shield case |
| ITMI20010868A1 (en) * | 2001-04-24 | 2002-10-24 | Abb Ricerca Spa | BOARD ASSEMBLY DEVICE FOR PRINTED CIRCUITS |
| JP3842615B2 (en) * | 2001-10-30 | 2006-11-08 | 株式会社ケンウッド | Method for electrically connecting printed circuit board and connecting piece |
| KR100612278B1 (en) | 2004-05-18 | 2006-08-11 | 삼성에스디아이 주식회사 | Plasma display device |
| DE102005004104B3 (en) | 2005-01-28 | 2006-06-14 | Fujitsu Siemens Computers Gmbh | Housing cage for accommodating installed modules e.g. for propulsion gear, has wall sections joined to wall of housing cage only at first side |
| JPWO2006106827A1 (en) * | 2005-03-31 | 2008-09-11 | パイオニア株式会社 | Case body and electrical equipment |
| EP2145375B1 (en) | 2007-04-10 | 2019-07-03 | SEW-EURODRIVE GmbH & Co. KG | Electric motor and fixing device for a printed circuit board |
| JP2012009471A (en) | 2010-06-22 | 2012-01-12 | Mitsumi Electric Co Ltd | High-frequency device and printed board holding structure |
| JP5647015B2 (en) * | 2011-01-18 | 2014-12-24 | パナソニック株式会社 | Substrate holding device |
| DE102013208984B4 (en) * | 2013-05-15 | 2022-06-30 | Zf Friedrichshafen Ag | control unit |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4076165A (en) * | 1976-06-03 | 1978-02-28 | Motorola, Inc. | Mounting arrangement for chassis and printed circuit board with method of assembly |
| EP0439122A2 (en) * | 1990-01-25 | 1991-07-31 | Tokyo Electric Co., Ltd. | Electric circuit apparatus |
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|---|---|---|---|---|
| DE1166857B (en) * | 1962-04-27 | 1964-04-02 | Telefunken Patent | Printed circuit board, which is provided on its edges with means to increase its strength |
| DE1195829C2 (en) * | 1962-11-28 | 1979-07-26 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | ELECTRICAL EQUIPMENT CHASSIS AND PROCESS FOR ITS MANUFACTURING |
| US3581160A (en) * | 1968-12-23 | 1971-05-25 | Gen Electric | Semiconductor rectifier assembly having high explosion rating |
| US4987517A (en) * | 1989-07-03 | 1991-01-22 | Kurz Arthur A | Affixation of mounting brackets to computer circuit boards |
-
1994
- 1994-08-11 JP JP18951094A patent/JP3347888B2/en not_active Expired - Fee Related
-
1995
- 1995-08-11 CN CN95108657A patent/CN1060008C/en not_active Expired - Fee Related
- 1995-08-11 DE DE1995129671 patent/DE19529671A1/en not_active Ceased
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4076165A (en) * | 1976-06-03 | 1978-02-28 | Motorola, Inc. | Mounting arrangement for chassis and printed circuit board with method of assembly |
| EP0439122A2 (en) * | 1990-01-25 | 1991-07-31 | Tokyo Electric Co., Ltd. | Electric circuit apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0856085A (en) | 1996-02-27 |
| CN1122998A (en) | 1996-05-22 |
| JP3347888B2 (en) | 2002-11-20 |
| DE19529671A1 (en) | 1996-02-15 |
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Granted publication date: 20001227 Termination date: 20130811 |