CN105448858B - The packaging and testing apparatus and method of fingerprint detection chip - Google Patents

Abstract

The invention discloses a packaging and testing device and method for a fingerprint detection chip, wherein the packaging and testing device for a fingerprint detection chip includes: a test board, the test board is arranged on the fingerprint detection chip to be tested, wherein the test board receives the fingerprint to be tested Detect the excitation signal of the chip so that the test board forms a coupling capacitance with multiple detection units in the fingerprint detection chip to be tested. The packaging of the fingerprint detection chip is tested. The packaging and testing device and method of the fingerprint detection chip in the embodiment of the present invention, by setting a test board on the fingerprint detection chip to be tested, the fingerprint detection chip to be tested obtains the capacitance value of a plurality of coupling capacitors, and the fingerprint detection chip to be tested according to the capacitance value The package is tested, which can quickly and effectively test whether the package of the fingerprint detection chip to be tested is qualified, and the yield rate is improved.

Description

Packaging and testing device and method for fingerprint detection chip

technical field

The invention relates to the technical field of fingerprint identification, in particular to a packaging and testing device and method for a fingerprint detection chip.

Background technique

With the continuous advancement of technology, fingerprint recognition has become more and more widely used, and has become one of the essential functions of high-end smart phones. At present, the detection of fingerprints is mainly realized by setting a capacitive fingerprint detection chip inside the mobile phone. As shown in Figure 1, the fingerprint detection chip can be composed of multiple detection units. As shown in Figure 2, the fingerprint detection chip can be packaged with plastic. Since fingerprint detection is a precision detection, the process requirements for plastic packaging are very high. The surface thickness of plastic packaging is generally required to be between 100 microns and 200 microns, and for the surface thickness of plastic packaging of the same type of product, the error requirement is 2 microns. within.

At present, the plastic packaging mainly has the following problems: uneven surface, uneven thickness, dew crystals, etc. Specifically, as shown in FIG. 3 , the plastic package is formed by injection molding. Due to the high temperature during injection molding, the surface of the plastic package will be uneven due to thermal expansion and contraction during the cooling and solidification process. As shown in Figure 4, in the injection molding process, certain process deviations will also occur in the control link, which will cause the thickness of the plastic package to be uneven. As shown in Figure 5, during the injection molding process, problems such as dew crystals (part of the chip area is not packaged and directly exposed on the surface) and bubbles in the plastic package may even occur.

Therefore, there is an urgent need for a test method for judging whether the plastic package of the fingerprint detection chip is good.

Contents of the invention

The present invention aims to solve the above-mentioned technical problems at least to a certain extent.

Therefore, the present invention needs to provide a packaging and testing device for a fingerprint detection chip, which can detect whether the packaging of the fingerprint detection chip to be tested is qualified.

In addition, the present invention also needs to provide a packaging and testing method for a fingerprint detection chip.

In order to solve at least one of the above-mentioned technical problems, according to the embodiment of the first aspect of the present invention, a packaging and testing device for a fingerprint detection chip is proposed, including: a test board, the test board is arranged on the fingerprint detection chip to be tested, wherein , the test board is conductive, wherein the test board receives the excitation signal of the fingerprint detection chip to be tested so that the test board and a plurality of detection units in the fingerprint detection chip to be tested form a coupling capacitance, the The fingerprint detection chip to be tested acquires the capacitance values of the plurality of coupling capacitors, and tests the packaging of the fingerprint detection chip to be tested according to the capacitance values of the plurality of coupling capacitors.

The packaging and testing device of the fingerprint detection chip according to the embodiment of the present invention, by setting a test board on the fingerprint detection chip to be tested, the fingerprint detection chip to be tested obtains the capacitance values of the plurality of coupling capacitors, and according to the capacitance value The packaging of the fingerprint detection chip is tested, which can quickly and effectively test whether the packaging of the fingerprint detection chip to be tested is qualified, thereby improving the yield rate.

The embodiment of the second aspect of the present invention provides another packaging and testing device for a fingerprint detection chip, including: a test board, the test board is arranged on the fingerprint detection chip to be tested, wherein the test board is conductive, and the test board is The test board is grounded, and the fingerprint detection chip to be tested applies an excitation signal to a plurality of detection units so that the test board and a plurality of detection units in the fingerprint detection chip to be tested form a coupling capacitance, and the fingerprint detection chip to be tested The chip acquires the capacitance values of the plurality of coupling capacitors, and tests the packaging of the fingerprint detection chip to be tested according to the capacitance values of the plurality of coupling capacitors.

The packaging and testing device of the fingerprint detection chip according to the embodiment of the present invention, by setting a test board on the fingerprint detection chip to be tested, and the test board is grounded, the fingerprint detection chip to be tested obtains the capacitance value of the plurality of coupling capacitors, and according to the capacitance value Testing the packaging of the fingerprint detection chip to be tested can quickly and effectively test whether the packaging of the fingerprint detection chip to be tested is qualified, thereby improving the rate of good products.

The embodiment of the third aspect of the present invention provides a packaging and testing method for a fingerprint detection chip, including: the test board receives the excitation signal of the fingerprint detection chip to be tested so that the test board and a plurality of the fingerprint detection chips to be tested The detection unit forms a coupling capacitor; the fingerprint detection chip to be tested obtains the capacitance values of the plurality of coupling capacitors, and tests the package of the fingerprint detection chip to be tested according to the capacitance values of the plurality of coupling capacitors.

In the packaging and testing method of the fingerprint detection chip according to the embodiment of the present invention, by setting a test board on the fingerprint detection chip to be tested, the fingerprint detection chip to be tested obtains the capacitance values of the plurality of coupling capacitors, and according to the capacitance value The packaging of the fingerprint detection chip is tested, which can quickly and effectively test whether the packaging of the fingerprint detection chip to be tested is qualified, thereby improving the yield rate.

The embodiment of the fourth aspect of the present invention provides another packaging and testing method for a fingerprint detection chip, including: the fingerprint detection chip to be tested applies an excitation signal to a plurality of detection units so that the test board and the plurality of fingerprint detection chips to be tested Each detection unit forms a coupling capacitor; the fingerprint detection chip to be tested acquires the capacitance values of the plurality of coupling capacitors, and tests the package of the fingerprint detection chip to be tested according to the capacitance values of the plurality of coupling capacitors.

In the packaging and testing method of the fingerprint detection chip in the embodiment of the present invention, a test board is arranged on the fingerprint detection chip to be tested, and the test board is grounded, and the fingerprint detection chip to be tested obtains the capacitance values of the plurality of coupling capacitors, and according to the capacitance value The packaging of the fingerprint detection chip to be tested is tested, which can quickly and effectively test whether the packaging of the fingerprint detection chip to be tested is qualified, thereby improving the yield rate.

Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Description of drawings

Figure 1 is a schematic diagram of the effect of a fingerprint detection chip composed of multiple detection units.

Fig. 2 is a schematic diagram of the effect of fingerprint detection in the prior art.

FIG. 3 is a schematic diagram showing the effect of unevenness on the surface of the plastic package.

FIG. 4 is a schematic diagram of the effect of uneven thickness of the plastic package.

Figure 5 is a schematic diagram of the effect of dew crystals and air bubbles in plastic packaging.

FIG. 6 is a schematic structural diagram of a packaging and testing device for a fingerprint detection chip according to an embodiment of the present invention.

Fig. 7 is a schematic structural diagram of a packaging and testing device for a fingerprint detection chip according to another embodiment of the present invention.

FIG. 8 is a flow chart of a packaging and testing method for a fingerprint detection chip according to an embodiment of the present invention.

FIG. 9 is a flow chart of a packaging and testing method for a fingerprint detection chip according to another embodiment of the present invention.

Detailed ways

Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

The device and method for packaging and testing a fingerprint detection chip according to an embodiment of the present invention will be described below with reference to the accompanying drawings.

FIG. 6 is a schematic structural diagram of a packaging and testing device for a fingerprint detection chip according to an embodiment of the present invention.

As shown in FIG. 6 , the packaging and testing device for the fingerprint detection chip includes: a test board 100 and a fingerprint detection chip 200 to be tested.

In the embodiment of the present invention, the test board 100 is arranged on the fingerprint detection chip 200 to be tested. Wherein, the test board 100 may be a high-hardness conductive plate, such as a metal plate such as a steel plate or a copper plate, or may be a conductive plate made of a soft material such as conductive rubber.

The specific testing process is as follows: the test board 100 can receive the excitation signal sent by the fingerprint detection chip 200 to be tested, and the excitation signal can make the test board 100 and multiple detection units in the fingerprint detection chip 200 to form coupling capacitors. Then, the fingerprint detection chip 200 to be tested can obtain capacitance values of multiple coupling capacitors, and test the packaging of the fingerprint detection chip 200 to be tested according to the capacitance values of the multiple coupling capacitors. Wherein, the packaging material can be plastic.

Specifically, the test board 100 may be a high-hardness conductive plate, such as a steel plate, a copper plate, and other metal plates, and its size can cover the surface of the fingerprint detection chip 200 to be tested. The capacitance value of the thinner package area is large, and the capacitance value of the thicker area is small, so as to judge whether the thickness of the package is uniform. Specifically, if some coupling capacitors have small capacitance values and some coupling capacitors have large capacitance values, it indicates that the package has uneven thickness or uneven surface, and it can be determined that the package is unqualified. Since the dielectric constant of air is very small, if there are bubbles in the package, the larger the bubbles, the smaller the capacitance, so as to judge whether there are bubbles or dew crystals in the package. If the capacitance value of some coupling capacitors is less than the preset threshold value, it means that the package has air bubbles or dew crystals, and it can be determined that the package is unqualified.

It should be understood that, in this embodiment, the fingerprint detection chip 200 to be tested sends an excitation signal to the test board 100 , and the principle of mutual capacitance detection is applied.

The packaging and testing device of the fingerprint detection chip according to the embodiment of the present invention, by setting a test board on the fingerprint detection chip to be tested, the fingerprint detection chip to be tested obtains the capacitance value of a plurality of coupling capacitors, and packages the fingerprint detection chip to be tested according to the capacitance value The test can quickly and effectively test whether the packaging of the fingerprint detection chip to be tested is qualified, thereby improving the yield rate.

FIG. 7 is a schematic structural diagram of a packaging and testing device for a fingerprint detection chip according to another embodiment of the present invention.

As shown in FIG. 7 , the packaging and testing device for the fingerprint detection chip includes: a test board 100 and a fingerprint detection chip 200 to be tested.

In the embodiment of the present invention, the test board 100 is arranged on the fingerprint detection chip 200 to be tested. Wherein, the test board 100 conducts electricity.

The specific test process is as follows: the test board 100 is grounded, and the fingerprint detection chip 200 to be tested applies an excitation signal to a plurality of detection units of itself, and the excitation signal can make the test board 100 and a plurality of detection units in the fingerprint detection chip 200 to form a coupling capacitance . Then, the fingerprint detection chip 200 to be tested can obtain capacitance values of multiple coupling capacitors, and test the packaging of the fingerprint detection chip 200 to be tested according to the capacitance values of the multiple coupling capacitors. Wherein, the packaging material can be plastic.

Specifically, the test board 100 may be a high-hardness conductive plate, such as a steel plate, a copper plate, and other metal plates, and its size can cover the surface of the fingerprint detection chip 200 to be tested. The capacitance value of the thinner package area is large, and the capacitance value of the thicker area is small, so as to judge whether the thickness of the package is uniform. Specifically, if some coupling capacitors have small capacitance values and some coupling capacitors have large capacitance values, it indicates that the package has uneven thickness or uneven surface, and it can be determined that the package is unqualified. Since the dielectric constant of air is very small, if there are bubbles in the package, the larger the bubbles, the smaller the capacitance, so as to judge whether there are bubbles or dew crystals in the package. If the capacitance value of some coupling capacitors is less than the preset threshold value, it means that the package has air bubbles or dew crystals, and it can be determined that the package is unqualified.

It should be understood that the fingerprint detection chip 200 to be tested in this embodiment applies an excitation signal to its multiple detection units, and the test board 100 is grounded, and the principle of self-capacitance detection is applied.

The packaging and testing device of the fingerprint detection chip according to the embodiment of the present invention, by setting a test board on the fingerprint detection chip to be tested, and the test board is grounded, the fingerprint detection chip to be tested obtains the capacitance values of a plurality of coupling capacitors, and treats them according to the capacitance values. The packaging of the fingerprint detection chip is tested, which can quickly and effectively test whether the packaging of the fingerprint detection chip to be tested is qualified, and the yield rate is improved.

To achieve the above object, the present invention also proposes a packaging and testing method for a fingerprint detection chip.

FIG. 8 is a flowchart of a packaging and testing method for a fingerprint detection chip according to an embodiment of the present invention.

As shown in Figure 8, the packaging and testing method of the fingerprint detection chip comprises the following steps:

S801. The test board receives an excitation signal from the fingerprint detection chip to be tested so that the test board forms a coupling capacitor with multiple detection units in the fingerprint detection chip to be tested.

In an embodiment of the present invention, the test board is arranged on the fingerprint detection chip to be tested. Wherein, the test plate may be a high-hardness conductive plate, such as a metal plate such as a steel plate or a copper plate, or may be a conductive plate made of a soft material such as conductive rubber.

Specifically, the test board can receive an excitation signal of the fingerprint detection chip to be tested, and the excitation signal can cause the test board to form a coupling capacitance with a plurality of detection units in the fingerprint detection chip to be tested. It should be understood that, in this embodiment, the fingerprint detection chip to be tested sends an excitation signal to the test board, and the principle of mutual capacitance detection is applied.

S802. The fingerprint detection chip to be tested acquires the capacitance values of multiple coupling capacitors, and tests the package of the fingerprint detection chip to be tested according to the capacitance values of the multiple coupling capacitors.

Specifically, the fingerprint detection chip to be tested can judge whether the packaging thickness of the fingerprint detection chip to be tested is uniform according to the capacitance values of the plurality of coupling capacitors, and judge whether the packaging is exposed. Wherein, the packaging material can be plastic.

Specifically, the test board can be a high-hardness conductive plate, such as a metal plate such as a steel plate or a copper plate, whose size can cover the surface of the fingerprint detection chip to be tested. The capacitance value of the thinner package area is large, and the capacitance value of the thicker area is small, so as to judge whether the thickness of the package is uniform. Specifically, if some coupling capacitors have small capacitance values and some coupling capacitors have large capacitance values, it indicates that the thickness of the package is uneven or the surface is uneven, and it can be determined that the package is unqualified. Since the dielectric constant of air is very small, if there are bubbles in the package, the larger the bubbles, the smaller the capacitance, so as to judge whether there are bubbles or dew crystals in the package. If the capacitance value of some coupling capacitors is less than the preset threshold value, it means that the package has air bubbles or dew crystals, and it can be determined that the package is unqualified.

In the packaging and testing method of the fingerprint detection chip in the embodiment of the present invention, by setting a test board on the fingerprint detection chip to be tested, the fingerprint detection chip to be tested obtains the capacitance values of a plurality of coupling capacitors, and packages the fingerprint detection chip to be tested according to the capacitance values The test can quickly and effectively test whether the packaging of the fingerprint detection chip to be tested is qualified, thereby improving the yield rate.

FIG. 9 is a flowchart of a packaging and testing method for a fingerprint detection chip according to another embodiment of the present invention.

As shown in Figure 9, the packaging and testing method of the fingerprint detection chip comprises the following steps:

S901. The fingerprint detection chip to be tested applies an excitation signal to multiple detection units so that the testing board forms a coupling capacitance with the multiple detection units in the fingerprint detection chip to be tested.

In an embodiment of the present invention, the test board is arranged on the fingerprint detection chip to be tested. Wherein, the test board conducts electricity.

Specifically, the test board is grounded, and the fingerprint detection chip to be tested applies an excitation signal to a plurality of detection units, and the excitation signal can cause the test board to form a coupling capacitance with the detection units in the fingerprint detection chip to be tested. It should be understood that the fingerprint detection chip to be tested in this embodiment applies excitation signals to its multiple detection units, and the test board is grounded, using the principle of self-capacitance detection.

S902. The fingerprint detection chip to be tested acquires the capacitance values of a plurality of coupling capacitors, and tests the packaging of the fingerprint detection chip to be tested according to the capacitance values of the plurality of coupling capacitors.

Specifically, the fingerprint detection chip to be tested can judge whether the packaging thickness of the fingerprint detection chip to be tested is uniform according to the capacitance values of the plurality of coupling capacitors, and judge whether the packaging is exposed. Wherein, the packaging material can be plastic.

Specifically, the test board can be a high-hardness conductive plate, such as a metal plate such as a steel plate or a copper plate, whose size can cover the surface of the fingerprint detection chip to be tested. The capacitance value of the thinner package area is large, and the capacitance value of the thicker area is small, so as to judge whether the thickness of the package is uniform. Specifically, if some coupling capacitors have small capacitance values and some coupling capacitors have large capacitance values, it indicates that the thickness of the package is uneven or the surface is uneven, and it can be determined that the package is unqualified. Since the dielectric constant of air is very small, if there are bubbles in the package, the larger the bubbles, the smaller the capacitance, so as to judge whether there are bubbles or dew crystals in the package. If the capacitance value of some coupling capacitors is less than the preset threshold value, it means that the package has air bubbles or dew crystals, and it can be determined that the package is unqualified.

In the packaging and testing method of the fingerprint detection chip in the embodiment of the present invention, a test board is arranged on the fingerprint detection chip to be tested, the test board is grounded, the fingerprint detection chip to be tested obtains the capacitance values of a plurality of coupling capacitors, and the fingerprints to be tested are tested according to the capacitance values. The packaging of the detection chip is tested, which can quickly and effectively test whether the packaging of the fingerprint detection chip to be tested is qualified, thereby improving the yield rate.

In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial", The orientation or positional relationship indicated by "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the referred device or element Must be in a particular orientation, be constructed in a particular orientation, and operate in a particular orientation, and therefore should not be construed as limiting the invention.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components or the interaction relationship between two components, unless otherwise specified limit. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In the present invention, unless otherwise clearly specified and limited, the first feature may be in direct contact with the first feature or the first and second feature may be in direct contact with the second feature through an intermediary. touch. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "beneath" and "beneath" the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.

In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structure, material or characteristic is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples and features of different embodiments or examples described in this specification without conflicting with each other.

Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention, those skilled in the art can make the above-mentioned The embodiments are subject to changes, modifications, substitutions and variations.

Claims (12)

1. A kind of 1. packaging and testing device of fingerprint detection chip, it is characterised in that including：

   Test board, the test board are arranged on fingerprint detection chip to be measured, wherein, the test board is conductive, wherein,

   The test board receives the pumping signal of the fingerprint detection chip to be measured so that the test board and the fingerprint to be measured Multiple detection units in detection chip form coupled capacitor, and the fingerprint detection chip to be measured obtains the multiple coupled capacitor Capacitance, and tested according to the encapsulation of the capacitance of the multiple coupled capacitor to the fingerprint detection chip to be measured.
2. 2. the packaging and testing device of fingerprint detection chip as claimed in claim 1, it is characterised in that when the multiple coupling electricity When the capacitance of appearance is inconsistent, then judge that the package thickness of the fingerprint detection chip to be measured is uneven；Or

   When the capacitance of the multiple coupled capacitor is less than predetermined threshold value, then judge that the encapsulation dew is brilliant.
3. 3. the packaging and testing device of fingerprint detection chip as claimed in claim 1, it is characterised in that the test board is metal Or conductive rubber.
4. 4. the packaging and testing device of fingerprint detection chip as claimed in claim 1, it is characterised in that the encapsulating material is modeling Material.
5. A kind of 5. packaging and testing device of fingerprint detection chip, it is characterised in that including：

   Test board, the test board are arranged on fingerprint detection chip to be measured, wherein, the test board is conductive, wherein,

   The test plate earthing, the fingerprint detection chip to be measured apply pumping signal so that the test to multiple detection units Plate forms coupled capacitor with multiple detection units in the fingerprint detection chip to be measured, and the fingerprint detection chip to be measured obtains The capacitance of the multiple coupled capacitor, and according to the capacitance of the multiple coupled capacitor to the fingerprint detection chip to be measured Encapsulation tested.
6. 6. the packaging and testing device of fingerprint detection chip as claimed in claim 5, it is characterised in that

   When the capacitance of the multiple coupled capacitor is inconsistent, then the package thickness of the fingerprint detection chip to be measured is judged not Uniformly；Or

   When the capacitance of the multiple coupled capacitor is less than predetermined threshold value, then judge that the encapsulation dew is brilliant.
7. 7. the packaging and testing device of fingerprint detection chip as claimed in claim 5, it is characterised in that the test board is metal Or conductive rubber.
8. 8. the packaging and testing device of fingerprint detection chip as claimed in claim 5, it is characterised in that the encapsulating material is modeling Material.
9. A kind of 9. packaging and testing method of fingerprint detection chip, it is characterised in that comprise the following steps：

   Test board receives the pumping signal of fingerprint detection chip to be measured so that the test board and the fingerprint detection chip to be measured In multiple detection units formed coupled capacitor；

   The fingerprint detection chip to be measured obtains the capacitance of the multiple coupled capacitor, and according to the multiple coupled capacitor Encapsulation of the capacitance to the fingerprint detection chip to be measured is tested.
10. 10. the packaging and testing method of fingerprint detection chip as claimed in claim 9, it is characterised in that described according to described more Encapsulation of the capacitance of individual coupled capacitor to the fingerprint detection chip to be measured is tested, including：

    When the capacitance of the multiple coupled capacitor is inconsistent, then the package thickness of the fingerprint detection chip to be measured is judged not Uniformly；Or

    When the capacitance of the multiple coupled capacitor is less than predetermined threshold value, then judge that the encapsulation dew is brilliant.
11. 11. the packaging and testing method of fingerprint detection chip as claimed in claim 9, it is characterised in that the test board is gold Category or conductive rubber.
12. 12. the packaging and testing method of fingerprint detection chip as claimed in claim 9, it is characterised in that the encapsulating material is Plastics.