CN104835896A - LED light-emitting device and bearing seat thereof - Google Patents

Abstract

An LED lighting device and its bearing seat, the LED lighting device includes a substrate, a circuit layer arranged on the substrate, two LED test pads, and two electrodes, and an LED chip and an LED driving element installed on the circuit layer . The two LED test pads can provide a detection current to separately detect the LED chips on the circuit layer. The two electrodes can provide another detection current to simultaneously detect the LED chip and the LED driving element, and the two electrodes can be used to electrically connect to an external driving power supply, so that the power provided by the external driving power supply passes through the circuit layer and the LED driving element And make the LED chip emit light. Thereby, the present invention can also effectively detect the LED chip after the LED chip is mounted on the circuit layer of the substrate.

Description

LED lighting device and its bearing seat

technical field

The invention relates to a light emitting device, and in particular to an LED light emitting device and a bearing seat thereof.

Background technique

In recent years, light-emitting diodes (LEDs) have been widely used, and with the continuous improvement of the technical field, high-power light-emitting diodes with high lighting brightness have been developed, which can replace traditional lighting sources.

However, due to the structural design of conventional LED lighting devices, after the LED chips and electronic components are installed on the circuit layer, the LED chips and electronic components can only be tested at the same time. caused by LED chips or electronic components.

Therefore, the inventor felt that the above-mentioned defects could be improved, so Naite devoted himself to research and combined with the application of theories, and finally proposed an invention with reasonable design and effective improvement of the above-mentioned defects.

Contents of the invention

The object of the present invention is to provide an LED lighting device and its bearing seat, which can individually detect the LED chips mounted on the circuit layer.

The invention provides an LED lighting device, comprising: a substrate; a circuit layer, which is arranged on the substrate, the circuit layer includes an LED crystal-bonding area and an electronic component crystal-bonding area, and the LED crystal-bonding area and the LED crystal-bonding area The crystal-bonding regions of electronic components are electrically connected to each other; an LED chip is installed in the crystal-bonding region of the LED to be electrically connected to the circuit layer; an LED driving element is installed in the crystal-bonding region of the electronic components to Electrically connected to the circuit layer; two LED test pads, which are electrically connected to the LED die-bonding area, and the two LED test pads can provide a detection current to flow through the LED die-bonding area to individually detect the LED the LED chip on the crystal-bonding area; and two electrodes, which are electrically connected to the crystal-bonding area of the electronic component, and the two electrodes can allow another detection current to flow through the crystal-bonding area of the LED and the crystal-bonding area of the electronic component, To simultaneously detect the LED chip on the LED die-bonding area and the LED driving element on the electronic component die-bonding area, and the two electrodes can be used to electrically connect to an external driving power supply, so that the external driving power supply provides Electric power makes the LED chip emit light through the circuit layer and the LED driving element.

The present invention also provides a bearing seat for an LED light-emitting device, comprising: a substrate; a circuit layer, which is arranged on the substrate, the circuit layer includes an LED crystal-bonding area and an electronic component crystal-bonding area, and the LED solid-state The crystal region is electrically connected to the electronic component crystal-bonding region; two LED test pads are electrically connected to the LED crystal-bonding region, and the two LED test pads can provide a detection current to only flow through the LED crystal-bonding region and two electrodes, which are electrically connected to the crystal-bonding area of the electronic component, and the two electrodes can allow another detection current to flow through the crystal-bonding area of the LED and the crystal-bonding area of the electronic component.

To sum up, the LED light-emitting device and its bearing seat provided by the present invention are formed with LED test pads for the detection current to flow through the LED die-bonding area, and then individually detect the LED chips on the LED die-bonding area. That is to say, after the LED chips and electronic components are installed on the circuit layer, it can be more clearly distinguished whether the defects are caused by the LED chips or the electronic components.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention. However, the attached drawings are only for reference and illustration, and are not used to make any claim on the scope of the present invention. limit.

Description of drawings

FIG. 1 is a schematic perspective view of the LED lighting device of the present invention.

FIG. 2 is an exploded schematic diagram of FIG. 1 .

FIG. 3 is an exploded schematic view from another perspective of FIG. 1 .

FIG. 4 is a schematic diagram of the present invention through the LED test pad so that the detection current only flows through the LED die-bonding area.

FIG. 5 is a schematic diagram of another detection current flowing through the LED die-bonding area through electrodes according to the present invention.

Fig. 6 is a schematic diagram of electrodes of the LED lighting device of the present invention connected to an external driving power supply.

Fig. 7 is a schematic diagram of the auxiliary electrode connection function of the heat dissipation plate of the LED lighting device of the present invention.

【Symbol Description】

100 LED lighting device

10 bearing seat

1 Substrate

11 Front

12 back

2 circuit layer

21 LED Die Bonding Area

22 Electronic component die-bonding area

3 LED test pads

4 Auxiliary test pads

5 electrodes

6 auxiliary electrodes

7 connection pad

20 LED chips

30 electronic components

301 LED drive components

302 rectifier element

303 power components

40 barrier wall

50 packages

200 testing equipment

300 external drive power

400 function cooling plate

I detection current

I’ another detection current

Detailed ways

Please refer to FIG. 1 , which is an embodiment of the present invention. It should be noted that this embodiment corresponds to the relevant quantities and shapes mentioned in the drawings, and is only used to specifically illustrate the implementation of the present invention, so as to facilitate understanding Its content is not intended to limit the scope of the claims of the present invention.

As shown in FIG. 2 and FIG. 3 , the present embodiment is an LED lighting device 100 , including a carrier 10 , a plurality of LED chips 20 , a plurality of electronic components 30 , a barrier wall 40 , and a package 50 . Wherein, the above-mentioned LED chips 20 and electronic components 30 are installed on the carrier 10, the barrier wall 40 is arranged on the carrier 10 and separates the LED chip 20 and the electronic component 30, and the package body 50 is filled between the barrier wall 40 and the carrier 10. The space surrounded by the carrier 10 is used to embed the LED chips 20 and the electronic components 30 therein.

The following will take the structure of the mounting base 10 of the LED lighting device 100 as the main axis of description, and during the process of explaining the structure of the mounting base 10 , other components of the LED lighting device 100 will be introduced in due course.

The carrier 10 has a substrate 1 , a circuit layer 2 , two LED test pads 3 , two auxiliary test pads 4 , two electrodes 5 , two auxiliary electrodes 6 , and two connection pads 7 . Wherein, the substrate 1 is roughly square (such as: rectangular or square) and has a front 11 and a back 12 on opposite sides, and the thickness of the circuit layer 2, LED test pad 3, electrode 5, and connection pad 7 is roughly The auxiliary test pads 4 and the auxiliary electrodes have substantially the same thickness and are located on the back surface 12 of the substrate 1 .

The circuit layer 2 includes an LED die-bonding area 21 and an electronic element die-bonding area 22 , and the LED die-bonding area 21 and the electronic element die-bonding area 22 are electrically connected to each other. Wherein, the electronic component die-bonding area 22 can be divided into two blocks, and the two blocks of the electronic component die-bonding area 22 are located on opposite sides of the LED die-bonding area 21 . Furthermore, the two blocks of the die-bonding area 22 of the electronic component are approximately located at two corners on the diagonal line of the substrate 1 (such as the left corner and the right corner of the substrate 1 in FIG. 2 ).

Furthermore, the LED chip 20 is installed in the LED die-bonding area 21 so as to be electrically connected to the above-mentioned circuit layer 2 . The electronic components 30 are divided into two groups, and the two groups of electronic components 30 are respectively installed in two blocks of the electronic component die-bonding area 22 so as to be electrically connected to the circuit layer 2 . Wherein, the above-mentioned LED chips 20 and electronic components 30 can be mounted on the circuit layer 2 by flipchip, reflow, ultrasonic, surface mount technology (SMT), or wire bonding ( wire bonding) and other methods are not limited here.

Wherein, the electronic component 30 is exemplified by including two groups of LED drive components 301, rectifier components 302 (such as bridge rectifiers), and power components 303 in this embodiment, but in practical applications, the electronic components The types and quantities of components included in 30 can be adjusted according to the needs of designers, but are not limited thereto. For example, in an unshown embodiment, the electronic element 30 may also include linear elements and nonlinear elements at the same time.

In addition, the LED chips 20 can be LED chips 20 of two different light emitting forms, and the LED chips 20 of the two different light emitting forms are respectively electrically connected to the two groups of LED driving elements 301, rectifying elements 302, and power element 303 . Furthermore, the form of the LED chip 20 may be a die structure or a packaged structure, which is not limited in this embodiment.

Thereby, the LED driving element 301, the rectifying element 302, and the power element 303 of the two groups can be used to drive the LED chips 20 of the above-mentioned two different light-emitting forms, so as to adjust the LED chips 20 of the above-mentioned two different light-emitting forms. Lighting ratio, and then achieve the effect of mixed light.

The structure of the two LED test pads 3 extending integrally with the LED die-bonding area 21 of the circuit layer 2, that is, the two LED test pads 3 are electrically connected to the LED die-bonding area 21, and the two LEDs The test pad 3 can allow a detection current I provided by the testing device 200 to flow through the LED die-bonding area 21 (as shown in FIG. 4 ), and then individually test the LED chips 20 on the LED die-bonding area 21 .

The two auxiliary test pads 4 are respectively electrically connected to the two LED test pads 3. Further, the positions of the two auxiliary test pads 4 on the substrate 1 are generally located on opposite sides of the two LED test pads 3, so as to A through hole (not marked) is formed between the corresponding LED test pad 3 and the auxiliary test pad 4 to pass through the front side 11 and the back side 12 of the substrate 1, and a conductive material (not marked) is filled in the through hole, so that the auxiliary test The pad 4 can be electrically connected to the corresponding LED test pad 3 through the conductive material in the through hole. In this way, the two auxiliary test pads 4 can also provide the detection current I provided by the detection device 200 to only flow through the LED die-bonding area 21 , so as to individually detect the LED chips 20 on the LED die-bonding area 21 .

The two electrodes 5 are respectively electrically connected to the two blocks of the above-mentioned electronic component die-bonding area 22, so that the two electrodes 5 can be used for another detection current I' provided by the testing device 200 to flow through the LED die-bonding area 21 and the electronic component die-bonding area 22 (as shown in Figure 5), so as to simultaneously detect the LED chip 20 on the above-mentioned LED die-bonding area 21 and the electronic components 30 on the electronic component die-bonding area 22 (such as: LED drive element 301, rectifier element 302 , and power element 303).

Moreover, the two electrodes 5 of the bearing base 10 can be used to electrically connect to an external driving power supply 300 (such as: a commercial socket), so that the power (such as: AC power) provided by the external driving power supply 300 can be passed through the circuit. Layer 2 and electronic components 30 (such as: LED drive components 301 , rectifier components 302 , and power components 303 ), so that the LED chips 20 on the circuit layer 2 emit light and can be used.

The two connection pads 7 are respectively electrically connected to the two auxiliary electrodes 6. Further, the positions of the two connection pads 7 on the substrate 1 are generally located on opposite sides of the two auxiliary electrodes 6, so as to connect Between the pad 7 and the auxiliary electrode 6, 12 through holes (not marked) penetrating the front side 11 and the back side of the substrate 1 are formed, and a conductive material (not marked) is filled in the through holes, so that the connection pad 7 can pass through the through hole. The conductive material in the hole is electrically connected with the corresponding auxiliary electrode 6 .

Furthermore, the two connection pads 7 are respectively adjacent to the two electrodes 5, and each connection pad 7 is spaced apart from the adjacent electrode 5, so that the two electrodes 5 can be selectively connected by wire bonding. It is connected to the above two connection pads 7 , and then electrically connected to the two auxiliary electrodes 6 through the two connection pads 7 . That is to say, when the auxiliary electrode 6 needs to be used, it is only necessary to connect the adjacent electrode 5 and the connection pad 7 through a bonding wire.

In this way, after the adjacent electrodes 5 and the connection pads 7 are connected to each other by wire bonding, the two auxiliary electrodes 6 can also allow another detection current I' provided by the detection device 200 to flow through the LED die-bonding area 21 and Electronic component die-bonding area 22 (not shown in the figure), and then simultaneously detect the LED chip 20 on the LED die-bonding area 21 and the electronic component 30 on the electronic component die-bonding area 22 (such as: LED drive element 301, rectifier element 302 , and power element 303).

Moreover, the two auxiliary electrodes 6 of the bearing base 10 can also be used to electrically connect to the external driving power supply 300 (such as: a mains socket), so that the power (such as: AC power) provided by the external driving power supply 300 can pass through the connection pads. 7. The electrodes 5, the circuit layer 2, and the electronic components 30 (such as: the LED driving component 301, the rectifying component 302, and the power component 303), and then make the LED chip 20 emit light and can be used.

In addition, the LED light-emitting device 100 can also be electrically connected to other devices through the two auxiliary electrodes 6 , thereby having more multiple ways of use. For example, please refer to FIG. 7 and refer to FIG. 2 and FIG. 3 in due course. The LED lighting device 100 of this embodiment can be fixed on a functional cooling plate 400 and electrically connected to the functional cooling plate through two auxiliary electrodes 6. 400.

Wherein, the above-mentioned functional cooling plate 400 has the function of dimming or other functions that can use the LED chips 20 of the LED lighting device 100 , so that the LED lighting device 100 can be flexibly used according to different requirements. In addition, the installation method between the LED lighting device 100 and its matching device (such as the functional heat sink 400 ) can be directly welded or fixed or other methods such as screw lock, buckle, adhesive, etc., which are not discussed here. be restricted.

It should be noted that after the LED chip 20 is mounted on the carrier 10, the LED chip 20 and the electronic component 30 will be located on the same plane (such as: the front surface 11 of the substrate 1), therefore, the distance between the LED chip 20 and the electronic component 30 Interference issues must be carefully considered. In view of this, in this embodiment, a barrier wall 40 is formed on the front surface 11 of the substrate 1 of the carrier 10 to isolate the LED chip 20 and the electronic component 30 , thereby reducing thermal interference and electromagnetic interference between the two.

As a side note, the substrate 1 of the bearing seat 10 in this embodiment is preferably a ceramic substrate rather than a metal plate. The reason is that the use of a metal plate is not conducive to the integration of the circuit layer 2, the LED test pad 3, the auxiliary test pad 4, and the electrode 5. , auxiliary electrodes 6, and connection pads 7 are formed on the surface of the metal plate. However, in practical application, the material of the substrate 1 is not limited thereto.

[Possible effects of the embodiment of the present invention]

To sum up, in the LED light-emitting device provided by the embodiment of the present invention, the LED test pad is formed on the supporting seat for the detection current to flow through the LED die-bonding area, and then the LED chips on the LED die-bonding area are individually tested. That is to say, after the LED chips and electronic components are installed on the circuit layer, it can be more clearly distinguished whether the defects are caused by the LED chips or the electronic components. Furthermore, the supporting seat of the LED lighting device is formed with auxiliary test pads, so that the testing equipment can individually detect the LED chip through the back of the supporting seat.

In addition, the bearing seat of the LED lighting device is formed with connection pads and auxiliary electrodes, so that the designer can selectively connect the electrodes to their adjacent connection pads by wire bonding according to requirements, thereby achieving the connection between the electrodes and the corresponding electrodes. The effect of the auxiliary electrodes being electrically connected to each other.

The above descriptions are only preferred feasible embodiments of the present invention, which are not intended to limit the patent scope of the present invention. All equivalent changes and modifications made according to the scope of the patent application of the present invention shall fall within the scope of the present invention.

Claims (10)

1. An LED lighting device, characterized in that, the LED lighting device comprises: a substrate; A circuit layer, the circuit layer is arranged on the substrate, the circuit layer includes an LED crystal-bonding area and an electronic component crystal-bonding area, and the LED crystal-bonding area and the electronic component crystal-bonding area are electrically connected to each other sexual connection; An LED chip, the LED chip is installed in the LED die-bonding area to be electrically connected to the circuit layer; An LED driving element, the LED driving element is installed in the die-bonding area of the electronic element, so as to be electrically connected to the circuit layer; Two LED test pads are electrically connected to the LED die-bonding area, and the LED test pads can supply a detection current to flow through the LED die-bonding area to individually detect the LED chips on the LED die-bonding area ;as well as Two electrodes are electrically connected to the die-bonding area of the electronic component, and the electrodes can allow another detection current to flow through the die-bonding area of the LED and the die-bonding area of the electronic component, so as to simultaneously detect the die-bonding of the LED The LED chip on the area and the LED driving element on the die-bonding area of the electronic component, and the electrode can be used to electrically connect to an external driving power supply, so that the power provided by the external driving power supply passes through the circuit layer and the LED driving element to make the LED chip emit light. 2. The LED lighting device according to claim 1, wherein the substrate has a front surface and a back surface, and the circuit layer, the LED test pad, and the electrodes are all located on the front surface of the substrate , the structure in which the LED die-bonding area of the circuit layer and the LED test pad extend integrally. 3. The LED light-emitting device according to claim 1, wherein the electronic component die-bonding area can be divided into two blocks, and the two blocks of the electronic component die-bonding area are located in the LED solid-state area. opposite sides of the crystal region. 4. The LED lighting device according to claim 3, wherein the substrate is in a square shape, and the two blocks of the electronic component die-bonding area are respectively located at two corners on the diagonal line of the substrate place. 5. The LED lighting device according to any one of claims 2 to 4, wherein the LED lighting device further comprises two auxiliary test pads, the auxiliary test pads are located on the back of the substrate and respectively Electrically connected to the LED test pad. 6. The LED lighting device according to any one of claims 2 to 4, wherein the LED lighting device further comprises two connection pads and two auxiliary electrodes, the connection pads are located on the substrate On the front side, the auxiliary electrodes are located on the back side of the substrate and are respectively electrically connected to the connection pads, the connection pads are spaced apart from the electrodes, and the electrodes can be connected to the connection pads. respectively electrically connected to the auxiliary electrodes. 7. A bearing seat of an LED lighting device, characterized in that, the bearing seat of the LED lighting device comprises: a substrate; A circuit layer, the circuit layer is arranged on the substrate, the circuit layer includes an LED crystal-bonding area and an electronic component crystal-bonding area, and the LED crystal-bonding area and the electronic component crystal-bonding area are electrically connected to each other sexual connection; Two LED test pads are electrically connected to the LED die-bonding area, and the LED test pads can supply a detection current to only flow through the LED die-bonding area; and The two electrodes are electrically connected to the crystal-bonding area of the electronic component, and the electrodes can provide another detection current to flow through the crystal-bonding area of the LED and the crystal-bonding area of the electronic component. 8. The carrying seat of an LED lighting device according to claim 7, wherein the substrate has a front side and a back side, and the circuit layer, the LED test pad, and the electrodes are all located on the On the front side of the substrate, the LED die-bonding area of the circuit layer and the LED test pad extend integrally. 9. The bearing seat of the LED lighting device according to claim 8, wherein the bearing seat of the LED lighting device further comprises two auxiliary test pads, the auxiliary test pads are located on the back of the substrate and respectively Electrically connected to the LED test pad. 10. The carrying seat of the LED lighting device according to claim 8, characterized in that, the carrying seat of the LED lighting device further comprises two connection pads and two auxiliary electrodes, and the connection pads are located on the bottom of the substrate. On the front side, the auxiliary electrodes are located on the back side of the substrate and are respectively electrically connected to the connection pads, the connection pads are spaced apart from the electrodes, and the electrodes can be connected to the connection pads respectively electrically connected to the auxiliary electrodes.