CH495057A - Halbleiterbauelement mit gas- und feuchtigkeitsdichtem Gehäuse - Google Patents

Halbleiterbauelement mit gas- und feuchtigkeitsdichtem Gehäuse

Info

Publication number: CH495057A
Authority: CH; Switzerland
Prior art keywords: moisture; gas; semiconductor component; tight housing; tight
Prior art date: 1968-09-20

Application number

CH1211069A

Other languages

English (en)

Inventor

Horst Dr Schreiner

Haessler Heinrich Dr Dipl-Phys

Original Assignee

Siemens Ag

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1968-09-20

Filing date

1969-08-11

Publication date

1970-08-15

1969-08-11 Application filed by Siemens Ag filed Critical Siemens Ag

1970-08-15 Publication of CH495057A publication Critical patent/CH495057A/de

Classifications

- H10W74/111—
- H10W76/138—
- H10W76/40—
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
- Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material

CH1211069A 1968-09-20 1969-08-11 Halbleiterbauelement mit gas- und feuchtigkeitsdichtem Gehäuse CH495057A (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
DE19681789005 DE1789005A1 (de)	1968-09-20	1968-09-20	Eingekapseltes Halbleiterbauelement mit wenigstens teilweise aus Sintermetall und Kunststoff bestehenden Bauteilen
DE19681789014 DE1789014B2 (de)	1968-09-20	1968-09-21	Halbleiterbauelement mit gas- und feuchtigkeitsdichtem gehaeuse

Publications (1)

Publication Number	Publication Date
CH495057A true CH495057A (de)	1970-08-15

Family

ID=25755981

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
CH1211069A CH495057A (de)	1968-09-20	1969-08-11	Halbleiterbauelement mit gas- und feuchtigkeitsdichtem Gehäuse
CH1210969A CH495058A (de)	1968-09-20	1969-08-11	Gekapseltes Halbleiterbauelement mit wenigstens teilweise aus Sintermetall und Kunststoff bestehenden Bauteilen und Verfahren zu seiner Herstellung

Family Applications After (1)

Application Number	Title	Priority Date	Filing Date
CH1210969A CH495058A (de)	1968-09-20	1969-08-11	Gekapseltes Halbleiterbauelement mit wenigstens teilweise aus Sintermetall und Kunststoff bestehenden Bauteilen und Verfahren zu seiner Herstellung

Country Status (7)

Country	Link
US (2)	US3598896A (de)
BE (2)	BE738238A (de)
CH (2)	CH495057A (de)
DE (2)	DE1789005A1 (de)
FR (2)	FR2018581A1 (de)
GB (2)	GB1278841A (de)
NL (2)	NL6912308A (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE1803307A1 (de) *	1968-10-16	1970-05-21	Siemens Ag	Verfahren zum Herstellen einer festen Verbindung zwischen einem Kunststoff- und einem Metallkoerper
DE2014289A1 (de) *	1970-03-25	1971-10-14	Semikron Gleichrichterbau	Scheibenförmiges Halbleiterbauele ment und Verfahren zu seiner Herstellung
US3800192A (en) *	1970-08-11	1974-03-26	O Schaerli	Semiconductor circuit element with pressure contact means
US3885243A (en) *	1971-06-25	1975-05-20	Bbc Brown Boveri & Cie	Semiconductor device
US3992717A (en) *	1974-06-21	1976-11-16	Westinghouse Electric Corporation	Housing for a compression bonded encapsulation of a semiconductor device
JPS51140619A (en) *	1975-05-30	1976-12-03	Pioneer Electronic Corp	Vibration member for acoustic convertor
DE2556749A1 (de) *	1975-12-17	1977-06-23	Bbc Brown Boveri & Cie	Leistungshalbleiterbauelement in scheibenzellenbauweise
DE2840400C2 (de) *	1978-09-16	1982-04-08	Brown, Boveri & Cie Ag, 6800 Mannheim	Steuerbares Leistungs-Halbleiterbauelement
US4414562A (en) *	1980-07-24	1983-11-08	Thermal Associates, Inc.	Semiconductor heat sink assembly including thermally responsive means for increasing compression as the temperature of said assembly increases
DE3308661A1 (de) *	1983-03-11	1984-09-20	SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg	Halbleiterelement
JPH0749815Y2 (ja) *	1990-07-23	1995-11-13	シャープ株式会社	表面実装型光結合装置
SE501855C2 (sv) *	1990-11-19	1995-06-06	Skf Ab	Gjutgods med ingjuten armering, samt förfarande för framställning av ett sådant gjutgods
US5198958A (en) *	1991-06-03	1993-03-30	Amphenol Corporation	Transient suppression component
US5339222A (en) *	1993-04-06	1994-08-16	The Whitaker Corporation	Shielded printed circuit card holder
DE19934554A1 (de) *	1999-07-22	2001-01-25	Michael Stollenwerk	Wärmetauscher
DE10103669B4 (de) *	2001-01-27	2004-07-29	Ksb Ag	Verfahren zur Herstellung eines mit Kunststoff überzogenen Gußstücks
US6970360B2 (en) *	2004-03-18	2005-11-29	International Business Machines Corporation	Tamper-proof enclosure for a circuit card
US8019451B2 (en) *	2006-11-22	2011-09-13	Target Brands, Inc.	Financial transaction product with media player
US7841538B2 (en) *	2007-10-31	2010-11-30	Target Brands, Inc.	Transaction product with memory
DE102007055018B4 (de) *	2007-11-14	2021-05-12	Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.	Verfahren zum Verbinden einer Edelmetalloberfläche mit einem Polymer
JP2013540091A (ja) *	2010-09-23	2013-10-31	コーニングインコーポレイテッド	半導体材料の微細構造を変更する技法
CN104124215B (zh) *	2014-06-26	2017-02-15	江苏省宜兴电子器件总厂	一种焊接、键合和密封同步完成的封装结构和封装工艺

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3475662A (en) *	1967-11-22	1969-10-28	Westinghouse Electric Corp	Hermetically sealed electrical device

1968
- 1968-09-20 DE DE19681789005 patent/DE1789005A1/de active Pending
- 1968-09-21 DE DE19681789014 patent/DE1789014B2/de active Granted
1969
- 1969-08-11 CH CH1211069A patent/CH495057A/de not_active IP Right Cessation
- 1969-08-11 CH CH1210969A patent/CH495058A/de not_active IP Right Cessation
- 1969-08-13 NL NL6912308A patent/NL6912308A/xx unknown
- 1969-08-21 NL NL6912771A patent/NL6912771A/xx unknown
- 1969-08-29 BE BE738238D patent/BE738238A/xx unknown
- 1969-09-17 BE BE738957D patent/BE738957A/xx unknown
- 1969-09-18 FR FR6931871A patent/FR2018581A1/fr not_active Withdrawn
- 1969-09-19 FR FR6932050A patent/FR2018557A1/fr not_active Withdrawn
- 1969-09-19 GB GB46395/69A patent/GB1278841A/en not_active Expired
- 1969-09-19 GB GB46398/69A patent/GB1272251A/en not_active Expired
- 1969-09-22 US US859795A patent/US3598896A/en not_active Expired - Lifetime
- 1969-09-22 US US859794A patent/US3597524A/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
GB1278841A (en)	1972-06-21
DE1789014B2 (de)	1973-03-29
BE738238A (de)	1970-02-02
US3598896A (en)	1971-08-10
DE1789014C3 (de)	1973-10-11
US3597524A (en)	1971-08-03
CH495058A (de)	1970-08-15
NL6912771A (de)	1970-03-24
FR2018581A1 (de)	1970-05-29
BE738957A (de)	1970-03-02
DE1789005A1 (de)	1972-01-20
DE1789014A1 (de)	1972-04-06
GB1272251A (en)	1972-04-26
NL6912308A (de)	1970-03-24
FR2018557A1 (de)	1970-05-29

Publication	Publication Date	Title
CH495057A (de)	1970-08-15	Halbleiterbauelement mit gas- und feuchtigkeitsdichtem Gehäuse
BR6905338D0 (pt)	1973-03-07	Dispositivos e processos
AT310812B (de)	1973-10-25	Integriertes Halbleiterbauelement
CH506883A (de)	1971-04-30	Halbleiterbauelement
CH511511A (de)	1971-08-15	Halbleiter-Anordnung
CH496148A (de)	1970-09-15	Bauelement
CH492302A (de)	1970-06-15	Halbleiterbauelement
BR6909280D0 (pt)	1973-01-02	Dispositivo semicondutor com multiplos terminais
CH506199A (fr)	1971-04-15	Circuit supraconducteur
IT993515B (it)	1975-09-30	Multiselettore elettronico
CH508279A (de)	1971-05-31	Halbleiterbauelement
DE1949174B2 (de)	1971-09-23	Halbleiterbauelement
CH498474A (de)	1970-10-31	Elektrisches Bauelement
BR6908826D0 (pt)	1973-01-02	Dispositivo semicondutor e arranjo de circuito empregando o mesmo
FR1518075A (fr)	1968-03-22	Multiplicateur électronique
AT316652B (de)	1974-07-25	Stabilisiertes Halbleiterbauelement
AT328688B (de)	1976-04-12	Mehrschaliges bauelement
DE1903082B2 (de)	1971-09-30	Halbleiterbauelement
CH463069A (de)	1968-09-30	Lichtdurchlässiges Bauelement
CH463628A (de)	1968-10-15	Halbleiterbauteil
YU28343B (cs)	1970-02-09	Elektronski bezbedni tajmer
FI44639C (fi)	1971-12-10	Eletroninen laitteisto.
CH539341A (de)	1973-07-15	Halbleiterbauelement
CH461644A (de)	1968-08-31	Halbleiterbauelement
AT278907B (de)	1970-02-25	Halbleiterelement

Legal Events

Date	Code	Title	Description
1976-03-15	PL	Patent ceased