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CH487504A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
CH487504A
CH487504A CH345869A CH345869A CH487504A CH 487504 A CH487504 A CH 487504A CH 345869 A CH345869 A CH 345869A CH 345869 A CH345869 A CH 345869A CH 487504 A CH487504 A CH 487504A
Authority
CH
Switzerland
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
CH345869A
Other languages
German (de)
Inventor
Funakawa Shigeru
Taisha Takashi
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CH487504A publication Critical patent/CH487504A/en

Links

Classifications

    • H10W40/611—
    • H10W40/47—
    • H10W76/138—
CH345869A 1968-03-09 1969-03-07 Semiconductor device CH487504A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1526268 1968-03-09

Publications (1)

Publication Number Publication Date
CH487504A true CH487504A (en) 1970-03-15

Family

ID=11883923

Family Applications (1)

Application Number Title Priority Date Filing Date
CH345869A CH487504A (en) 1968-03-09 1969-03-07 Semiconductor device

Country Status (3)

Country Link
CH (1) CH487504A (en)
DE (1) DE1912041A1 (en)
FR (1) FR2003573A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115863269A (en) * 2022-10-27 2023-03-28 遵义筑芯威半导体技术有限公司 High-heat-dissipation packaging structure and packaging process thereof

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3763402A (en) * 1970-11-09 1973-10-02 Gen Electric Fluid cooled rectifier holding assembly
US4008486A (en) * 1975-06-02 1977-02-15 International Rectifier Corporation Compression-assembled semiconductor device with nesting circular flanges and flexible locating ring
DE2640000C2 (en) * 1976-09-04 1986-09-18 Brown, Boveri & Cie Ag, 6800 Mannheim Cylindrical cooling box with opposing inlet and outlet openings for liquid-cooled power semiconductor components and a method for producing the same
CS190866B1 (en) * 1977-02-18 1979-06-29 Petr Novak High-capacity semiconductor detail
US4274106A (en) * 1977-11-07 1981-06-16 Mitsubishi Denki Kabushiki Kaisha Explosion proof vibration resistant flat package semiconductor device
US4392153A (en) * 1978-05-01 1983-07-05 General Electric Company Cooled semiconductor power module including structured strain buffers without dry interfaces
DE4103486A1 (en) * 1991-02-06 1992-08-20 Abb Patent Gmbh ARRANGEMENT FOR COOLING HEAT GENERATING COMPONENTS
DE4302816C2 (en) * 1993-01-28 1996-08-08 Aeg Westinghouse Transport Arrangement for cooling pressure contactable power disc semiconductors
DE102004057497B4 (en) * 2004-11-29 2012-01-12 Siemens Ag A heat exchange device and method of making the heat exchange device, and a device and heat exchange device assembly and method of making the assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115863269A (en) * 2022-10-27 2023-03-28 遵义筑芯威半导体技术有限公司 High-heat-dissipation packaging structure and packaging process thereof
CN115863269B (en) * 2022-10-27 2024-02-13 遵义筑芯威半导体技术有限公司 High-heat-dissipation packaging structure and packaging process thereof

Also Published As

Publication number Publication date
FR2003573A1 (en) 1969-11-07
DE1912041A1 (en) 1969-09-18

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Legal Events

Date Code Title Description
PL Patent ceased