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CH366208A - Einscheiben-Läppmaschine zur Herstellung von Halbleiterscheiben - Google Patents

Einscheiben-Läppmaschine zur Herstellung von Halbleiterscheiben

Info

Publication number
CH366208A
CH366208A CH6645258A CH6645258A CH366208A CH 366208 A CH366208 A CH 366208A CH 6645258 A CH6645258 A CH 6645258A CH 6645258 A CH6645258 A CH 6645258A CH 366208 A CH366208 A CH 366208A
Authority
CH
Switzerland
Prior art keywords
production
semiconductor wafers
lapping machine
disc lapping
disc
Prior art date
Application number
CH6645258A
Other languages
English (en)
Inventor
Reimer Dipl Phys Emeis
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH366208A publication Critical patent/CH366208A/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/102—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H10P95/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CH6645258A 1957-11-29 1958-11-21 Einscheiben-Läppmaschine zur Herstellung von Halbleiterscheiben CH366208A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES56076A DE1110544B (de) 1957-11-29 1957-11-29 Einscheiben-Laeppmaschine fuer Halbleiterscheiben

Publications (1)

Publication Number Publication Date
CH366208A true CH366208A (de) 1962-12-15

Family

ID=7490856

Family Applications (1)

Application Number Title Priority Date Filing Date
CH6645258A CH366208A (de) 1957-11-29 1958-11-21 Einscheiben-Läppmaschine zur Herstellung von Halbleiterscheiben

Country Status (3)

Country Link
US (1) US2979868A (de)
CH (1) CH366208A (de)
DE (1) DE1110544B (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3090169A (en) * 1961-05-11 1963-05-21 Stephen A Boettcher Lapping machine fixture
US3093937A (en) * 1962-11-30 1963-06-18 Cavitron Ultrasonics Inc Ultrasonic lapping machines
US3233370A (en) * 1963-07-19 1966-02-08 Falk Production of parallel lapped surfaces
US3388506A (en) * 1964-11-16 1968-06-18 Speedlap Corp Lap limiting fixture means
US3374582A (en) * 1964-12-08 1968-03-26 Speedfam Corp Lapping machine
US3375614A (en) * 1964-12-09 1968-04-02 Speedfam Corp Lapping machine truing ring and fixture
US3505766A (en) * 1964-12-09 1970-04-14 Speedfam Corp Lapping machine truing ring
US3699722A (en) * 1970-11-23 1972-10-24 Radiation Inc Precision polishing of semiconductor crystal wafers
DE3020805C2 (de) * 1980-06-02 1984-12-13 Buehler Ltd., Evanston, Ill. Einrichtung zum Schleifen eines Körpers mit zwei mit sehr geringem Abstand zueinander verlaufenden ebenen Oberflächen
DE3127182C2 (de) * 1981-07-09 1987-03-19 Michael Grässner KG, 7031 Steinenbronn Einscheibenflachfläppmaschine
US4707948A (en) * 1981-11-27 1987-11-24 Unisys Corp. Float lapping fixture
FR2521895A1 (fr) * 1982-02-23 1983-08-26 Ansermoz Raymond Tasseau multiple pour le rodage, au lapidaire, de pieces en forme de lames minces
JPH0319336A (ja) * 1989-06-16 1991-01-28 Shin Etsu Handotai Co Ltd 半導体ウェーハの研磨方法
US5191738A (en) * 1989-06-16 1993-03-09 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafer
DE9015026U1 (de) * 1990-10-31 1991-02-07 Spinner GmbH Elektrotechnische Fabrik, 8000 München Poliervorrichtung für LWL-Steckerstifte
JPH07237120A (ja) * 1994-02-22 1995-09-12 Nec Corp ウェーハ研磨装置
US5422316A (en) * 1994-03-18 1995-06-06 Memc Electronic Materials, Inc. Semiconductor wafer polisher and method
JP2616736B2 (ja) * 1995-01-25 1997-06-04 日本電気株式会社 ウエーハ研磨装置
US5649849A (en) * 1995-03-24 1997-07-22 Eastman Kodak Company Method and apparatus for realtime monitoring and feedback control of the shape of a continuous planetary polishing surface
US5957763A (en) * 1997-09-19 1999-09-28 Speedfam Corporation Polishing apparatus with support columns supporting multiple platform members
US7399217B1 (en) 2007-02-05 2008-07-15 P.R. Hoffman Machine Products Lapping machine
FR2939061B1 (fr) * 2008-12-03 2012-01-20 Lam Plan Systeme de traitement de surface, par effet d'abrasion, de pieces mecaniques, notamment de rodage
US8500515B2 (en) 2010-03-12 2013-08-06 Wayne O. Duescher Fixed-spindle and floating-platen abrasive system using spherical mounts
US8602842B2 (en) * 2010-03-12 2013-12-10 Wayne O. Duescher Three-point fixed-spindle floating-platen abrasive system
US8647171B2 (en) * 2010-03-12 2014-02-11 Wayne O. Duescher Fixed-spindle floating-platen workpiece loader apparatus
US8740668B2 (en) * 2010-03-12 2014-06-03 Wayne O. Duescher Three-point spindle-supported floating abrasive platen
CN103962934A (zh) * 2013-01-25 2014-08-06 上海浦东汉威阀门有限公司 一种阀门密封面研磨机
CN107932309A (zh) * 2017-11-20 2018-04-20 西安航天动力测控技术研究所 一种保证安全机构零件装配面精度的自动研磨系统
DE102020113324A1 (de) * 2020-05-15 2021-11-18 Atm Qness Gmbh Labor-Tellerschleifgerät, Verfahren, Ersatzschleifscheibe und Verwendung einer Schleifscheibe
CN112676947A (zh) * 2020-12-28 2021-04-20 王兆举 一种用于智能平面精磨机中的工件轴自动对接定位机构

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2412306A (en) * 1944-08-25 1946-12-10 Western Electric Co Lapping apparatus
US2722089A (en) * 1952-04-18 1955-11-01 Crane Packing Co Method of and apparatus for lapping articles
US2779139A (en) * 1952-11-24 1957-01-29 Crane Packing Co Lapping machine
US2842906A (en) * 1955-10-26 1958-07-15 Lyle E Carter Work holder for lapping machine

Also Published As

Publication number Publication date
DE1110544B (de) 1961-07-06
US2979868A (en) 1961-04-18

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