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BRPI1007611A2 - compartimento de equipamento, instalação de centro de dados e centro de dados - Google Patents

compartimento de equipamento, instalação de centro de dados e centro de dados

Info

Publication number
BRPI1007611A2
BRPI1007611A2 BRPI1007611A BRPI1007611A BRPI1007611A2 BR PI1007611 A2 BRPI1007611 A2 BR PI1007611A2 BR PI1007611 A BRPI1007611 A BR PI1007611A BR PI1007611 A BRPI1007611 A BR PI1007611A BR PI1007611 A2 BRPI1007611 A2 BR PI1007611A2
Authority
BR
Brazil
Prior art keywords
data center
equipment bay
facility
center facility
bay
Prior art date
Application number
BRPI1007611A
Other languages
English (en)
Inventor
Chandrakant Patel
Cullen Bash
Robert Tozer
Original Assignee
Hewlett Packard Development Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co filed Critical Hewlett Packard Development Co
Publication of BRPI1007611A2 publication Critical patent/BRPI1007611A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
BRPI1007611A 2009-04-29 2010-04-28 compartimento de equipamento, instalação de centro de dados e centro de dados BRPI1007611A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/432,199 US7969727B2 (en) 2009-04-29 2009-04-29 Cooling
PCT/US2010/032824 WO2010127035A2 (en) 2009-04-29 2010-04-28 Improvements in or relating to cooling

Publications (1)

Publication Number Publication Date
BRPI1007611A2 true BRPI1007611A2 (pt) 2016-02-16

Family

ID=43030181

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1007611A BRPI1007611A2 (pt) 2009-04-29 2010-04-28 compartimento de equipamento, instalação de centro de dados e centro de dados

Country Status (5)

Country Link
US (1) US7969727B2 (pt)
EP (1) EP2425313B1 (pt)
CN (1) CN102414637B (pt)
BR (1) BRPI1007611A2 (pt)
WO (1) WO2010127035A2 (pt)

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US8746330B2 (en) 2007-08-09 2014-06-10 Coolit Systems Inc. Fluid heat exchanger configured to provide a split flow
US9453691B2 (en) 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
US9943014B2 (en) 2013-03-15 2018-04-10 Coolit Systems, Inc. Manifolded heat exchangers and related systems
US9496200B2 (en) 2011-07-27 2016-11-15 Coolit Systems, Inc. Modular heat-transfer systems
US8554390B2 (en) * 2010-11-16 2013-10-08 International Business Machines Corporation Free cooling solution for a containerized data center
US20120243177A1 (en) * 2011-03-21 2012-09-27 Hamilton Sundstrand Corporation Indirect bleed air cooling of a fan motor controller
JP5772315B2 (ja) * 2011-07-08 2015-09-02 富士通株式会社 電子機器の冷却システム
WO2014141162A1 (en) 2013-03-15 2014-09-18 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
WO2012162986A1 (zh) * 2011-09-23 2012-12-06 华为技术有限公司 一种集装箱数据中心系统和方法
US9408330B2 (en) 2012-04-18 2016-08-02 International Business Machines Coporation Apparatus to cool a computing device
US12366870B2 (en) 2013-03-15 2025-07-22 Coolit Systems, Inc. Flow-path controllers and related systems
JP6337547B2 (ja) * 2014-03-20 2018-06-06 富士通株式会社 電子機器筐体
CN106163216A (zh) * 2015-04-13 2016-11-23 苏州安瑞可机柜系统有限公司 带有烟囱的服务器机柜
US11255611B2 (en) 2016-08-02 2022-02-22 Munters Corporation Active/passive cooling system
US11839062B2 (en) 2016-08-02 2023-12-05 Munters Corporation Active/passive cooling system
US11497145B2 (en) * 2018-08-21 2022-11-08 National University Of Singapore Server rack and data center including a hybrid-cooled server
US11202394B1 (en) * 2018-10-26 2021-12-14 United Sendees Automobile Association (USAA) Data center cooling system
US11737238B1 (en) 2018-10-26 2023-08-22 United Services Automobile Association (Usaa) Data center cooling system
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
US10952353B1 (en) * 2019-08-21 2021-03-16 Schneider Electric It Corporation Thermal buffering module for equipment rack
CN113163635B (zh) * 2020-01-23 2025-10-17 华为技术有限公司 一种电子设备外罩及电子设备组件
US11395443B2 (en) 2020-05-11 2022-07-19 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
US11725886B2 (en) 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems
US12200914B2 (en) 2022-01-24 2025-01-14 Coolit Systems, Inc. Smart components, systems and methods for transferring heat
CN115297681A (zh) * 2022-08-03 2022-11-04 台达电子企业管理（上海）有限公司 车载功率装置与热管理系统
EP4152906A1 (en) * 2022-08-25 2023-03-22 Ovh Cooling assembly and method for cooling a plurality of heat-generating components

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US5323847A (en) * 1990-08-01 1994-06-28 Hitachi, Ltd. Electronic apparatus and method of cooling the same
JP3070787B2 (ja) * 1991-12-19 2000-07-31 株式会社日立製作所 電子装置
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US6657121B2 (en) * 2001-06-27 2003-12-02 Thermal Corp. Thermal management system and method for electronics system
US6904968B2 (en) * 2001-09-14 2005-06-14 Hewlett-Packard Development Company, L.P. Method and apparatus for individually cooling components of electronic systems
US6574104B2 (en) * 2001-10-05 2003-06-03 Hewlett-Packard Development Company L.P. Smart cooling of data centers
GB0207382D0 (en) 2002-03-28 2002-05-08 Holland Heating Uk Ltd Computer cabinet
US6804117B2 (en) * 2002-08-14 2004-10-12 Thermal Corp. Thermal bus for electronics systems
US6775997B2 (en) * 2002-10-03 2004-08-17 Hewlett-Packard Development Company, L.P. Cooling of data centers
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US6868682B2 (en) * 2003-01-16 2005-03-22 Hewlett-Packard Development Company, L.P. Agent based control method and system for energy management
US6747872B1 (en) * 2003-02-28 2004-06-08 Hewlett-Packard Development Company, L.P. Pressure control of cooling fluid within a plenum
US7031154B2 (en) * 2003-04-30 2006-04-18 Hewlett-Packard Development Company, L.P. Louvered rack
US7457118B1 (en) 2003-12-19 2008-11-25 Emc Corporation Method and apparatus for dispersing heat from high-power electronic devices
US7508663B2 (en) * 2003-12-29 2009-03-24 Rackable Systems, Inc. Computer rack cooling system with variable airflow impedance
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US7010392B2 (en) * 2004-05-26 2006-03-07 Hewlett-Packard Development Company, L.P. Energy efficient CRAC unit operation using heat transfer levels
US7209351B2 (en) * 2004-06-30 2007-04-24 Intel Corporation Telecom equipment chassis using modular air cooling system
US20060199508A1 (en) * 2005-01-28 2006-09-07 Nair Manu Kumar V Intensifier
US20060168975A1 (en) * 2005-01-28 2006-08-03 Hewlett-Packard Development Company, L.P. Thermal and power management apparatus
US7385810B2 (en) * 2005-04-18 2008-06-10 International Business Machines Corporation Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack
US7286351B2 (en) * 2005-05-06 2007-10-23 International Business Machines Corporation Apparatus and method for facilitating cooling of an electronics rack employing a closed loop heat exchange system
US7542287B2 (en) * 2005-09-19 2009-06-02 Chatsworth Products, Inc. Air diverter for directing air upwardly in an equipment enclosure
US7701714B2 (en) * 2006-05-26 2010-04-20 Flextronics Ap, Llc Liquid-air hybrid cooling in electronics equipment
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JP4679643B2 (ja) 2006-07-04 2011-04-27 富士通株式会社 放熱ユニットおよび放熱器並びに電子機器
US20080113603A1 (en) * 2006-10-19 2008-05-15 Atallah Jean G Computer system cooling system
US7394654B2 (en) * 2006-10-19 2008-07-01 Cisco Technology, Inc. Method and apparatus for providing thermal management in an electronic device
CN101211206A (zh) * 2006-12-26 2008-07-02 鸿富锦精密工业（深圳）有限公司 服务器机柜
US7813121B2 (en) * 2007-01-31 2010-10-12 Liquid Computing Corporation Cooling high performance computer systems
US20080266794A1 (en) * 2007-04-30 2008-10-30 Christopher Gregory Malone Processor control of cooling fluid
US20090009958A1 (en) 2007-07-02 2009-01-08 John Pflueger System and Method for Rack Mounted Information Handling System Supplemental Cooling
US8051672B2 (en) * 2007-08-30 2011-11-08 Afco Systems Fluid cooled cabinet for electronic equipment
US7643291B2 (en) * 2007-08-30 2010-01-05 Afco Systems Cabinet for electronic equipment

Also Published As

Publication number Publication date
CN102414637B (zh) 2014-12-10
US7969727B2 (en) 2011-06-28
EP2425313A4 (en) 2017-06-07
EP2425313A2 (en) 2012-03-07
EP2425313B1 (en) 2024-10-30
US20100277864A1 (en) 2010-11-04
WO2010127035A3 (en) 2011-02-03
CN102414637A (zh) 2012-04-11
WO2010127035A2 (en) 2010-11-04

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Legal Events

Date Code Title Description
B25A Requested transfer of rights approved

Owner name: HEWLETT PACKARD ENTERPRISE DEVELOPMENT, L.P. (US)

B25D Requested change of name of applicant approved

Owner name: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP (US)

B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements